STMICROELECTRONICS VN5E016AH-E

VN5E016AH-E
16 mΩ high-side driver with analog current sense
for automotive applications
Features
Max supply voltage
VCC
41V
Operating voltage range
VCC 4.5 to 28V
Max on-state resistance (per ch.)
RON
16 mΩ
Current limitation (typ)
ILIMH
73 A
Off-state supply current
IS
2 µA(1)
1. Typical value with all loads connected.
■
■
■
General
– Inrush current active management by
power limitation
– Very low standby current
– 3.0 V CMOS compatible inputs
– Optimized electromagnetic emissions
– Very low electromagnetic susceptibility
– In compliance with the 2002/95/EC
European directive
Diagnostic functions
– Proportional load current sense
– High current sense precision for wide
current range
– Current sense disable
– Off-state open-load detection
– Output short to VCC indication
– Overload and short to ground (power
limitation) indication
– Thermal shutdown indication
Protections
– Undervoltage shutdown
– Overvoltage clamp
– Load current limitation
– Self limiting of fast thermal transients
– Protection against loss of ground and loss
of VCC
– Overtemperature shutdown with auto
restart (thermal shutdown)
August 2010
– Reverse battery protected
– Electrostatic discharge protection
Applications
■
All types of resistive, inductive and capacitive
loads
■
Suitable as LED driver
Description
The VN5E016AH-E is a single channel high-side
driver manufactured in the ST proprietary
VIPower™ M0-5 technology and housed in the
tiny HPak package. The VN5E016AH-E is
designed to drive 12 V automotive grounded
loads delivering protection, diagnostics and easy
3 V and 5 V CMOS compatible interface with any
microcontroller.
The device integrates advanced protective
functions such as load current limitation, inrush
and overload active management by power
limitation, overtemperature shut-off with auto
restart and overvoltage active clamp.
A dedicated analog current sense pin is
associated with every output channel to provide
enhanced diagnostic functions. These functions
include fast detection of overload and short-circuit
to ground through power limitation indication,
overtemperature indication, short-circuit to VCC
diagnosis and ON-state and OFF-state open-load
detection.
The current sensing and diagnostic feedback of
the whole device can be disabled by pulling the
CS_DIS pin high to allow sharing of the external
sense resistor with other similar devices.
Doc ID 15994 Rev 4
1/37
www.st.com
1
Contents
VN5E016AH-E
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.4
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.5
Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1
GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 24
3.1.1
Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 24
3.1.2
Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . 25
3.2
Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.3
MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.4
Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.4.1
3.5
4
Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 28
Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1
5
Short to VCC and OFF-state open-load detection . . . . . . . . . . . . . . . . . 27
HPak thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.1
ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.2
Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
6
Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2/37
Doc ID 15994 Rev 4
VN5E016AH-E
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching (VCC = 13 V, Tj = 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Logic Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Current sense (8 V < VCC < 18 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Open-load detection (8 V < VCC < 18 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Doc ID 15994 Rev 4
3/37
List of figures
VN5E016AH-E
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
Figure 24.
Figure 25.
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Figure 30.
Figure 31.
Figure 32.
Figure 33.
Figure 34.
Figure 35.
Figure 36.
Figure 37.
Figure 38.
Figure 39.
Figure 40.
Figure 41.
4/37
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) not in scale. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Open-load Off-state delay timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Delay response time between rising edge of output current and rising edge of current sense
(CS enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Output voltage drop limitation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
IOUT/ISENSE vs IOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Maximum current sense ratio drift vs load current(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Overload or Short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Intermittent overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
OFF-state open-load with external circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Short to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
TJ evolution in overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Input clamp level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
ILIMH vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
CS_DIS high level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
CS_DIS low level voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Maximum turn off current versus inductance(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 29
HPak thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Thermal fitting model of a single channel HSD in HPak(1) . . . . . . . . . . . . . . . . . . . . . . . . . 30
Package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Doc ID 15994 Rev 4
VN5E016AH-E
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
VCC
Signal Clamp
Undervoltage
IN
Control & Diagnostic
Power
Clamp
DRIVER
VON
Limitation
Over
temp.
Current
Limitation
OFF State
Open load
CS_
DIS
VSENSEH
CS
Current
Sense
OUT
OVERLOAD PROTECTION
(ACTIVE POWER LIMITATION)
LOGIC
GND
Table 1.
Pin functions
Name
VCC
OUTPUT
GND
INPUT
CURRENT
SENSE
CS_DIS
Function
Battery connection
Power output (1)
Ground connection
Voltage controlled input pin with hysteresis, CMOS compatible. Controls output
switch state
Analog current sense pin, delivers a current proportional to the load current
Active high CMOS compatible pin, to disable the current sense pin
1. Pins 1 and 7 must be externally tied together.
Doc ID 15994 Rev 4
5/37
Block diagram and pin description
Figure 2.
Table 2.
6/37
VN5E016AH-E
Configuration diagram (top view) not in scale
1
2
3
4
5
OUT
GND
IN
Vcc
6
7
CS CS_DIS OUT
Suggested connections for unused and not connected pins
Connection / pin
Current sense
Output
Input
CS_DIS
Floating
Not allowed
X
X
X
To ground
Through 1 kΩ
resistor
Through 22 kΩ
resistor
Through 10 kΩ
resistor
Through 10 kΩ
resistor
Doc ID 15994 Rev 4
VN5E016AH-E
2
Electrical specifications
Electrical specifications
Figure 3.
Current and voltage conventions
IS
VCC
IOUT
ICSD
OUTPUT
CS_DIS
VCSD
ISENSE
IIN
VIN
INPUT
VOUT
VCC
CURRENT
SENSE
GND
VSENSE
IGND
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.
Table 3.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
VCC
DC supply voltage
41
V
-VCC
Reverse DC supply voltage
0.3
V
IGND
DC reverse ground pin current
200
mA
IOUT
DC output current
Internally
limited
A
-IOUT
Reverse DC output current
20
A
DC input current
-1 to 10
mA
DC current sense disable input current
-1 to 10
mA
VCC-41
+VCC
V
V
350
mJ
IIN
ICSD
VCSENSE Current sense maximum voltage (VCC>0)
EMAX
Maximum switching energy (single pulse)
(L = 1.55 mH; RL = 0Ω; Vbat = 13.5V; Tjstart = 150ºC;
IOUT = IlimL(Typ.))
Doc ID 15994 Rev 4
7/37
Electrical specifications
Table 3.
Absolute maximum ratings (continued)
Symbol
Value
Unit
VESD
Electrostatic discharge (human body model: R = 1.5KΩ;
C = 100pF)
– Input
– Current sense
– CS_DIS
– Output
– VCC
4000
2000
4000
5000
5000
V
V
V
V
V
VESD
Charge device model (CDM-AEC-Q100-011)
750
V
Junction operating temperature
-40 to 150
°C
Storage temperature
-55 to 150
°C
Tj
Tstg
2.2
Parameter
Thermal data
Table 4.
Symbol
8/37
VN5E016AH-E
Thermal data
Parameter
Max. value
Unit
Rthj-case Thermal resistance junction-case
0.63
°C/W
Rthj-amb
69.3
°C/W
Thermal resistance junction-ambient
Doc ID 15994 Rev 4
VN5E016AH-E
2.3
Electrical specifications
Electrical characteristics
Values specified in this section are for 8 V < VCC < 28 V, -40 °C < Tj < 150 °C, unless
otherwise specified.
Table 5.
Power section
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
VCC
Operating supply voltage
4.5
13
28
V
VUSD
Undervoltage shutdown
-
3.5
4.5
V
VUSDhyst
Undervoltage shutdown
hysteresis
-
0.5
-
V
IOUT = 5 A; Tj = 25 °C
-
-
16
IOUT = 5 A; Tj = 150 °C
-
-
32
IOUT = 5 A; VCC = 5 V; Tj = 25 °C
-
-
20
Output - VCC diode
voltage
-IOUT = 5A; Tj = 150°C
-
-
0.7
V
Clamp Voltage
Icc = 20 mA; IOUT = 0A
41
46
52
V
Off-state; VCC = 13V; Tj = 25°C;
VIN = VOUT = VSENSE = 0V
-
2
5
µA
On-state; VCC = 13V; VIN = 5V;
IOUT = 0A
-
1.5
3
mA
VIN = VOUT = 0V; VCC = 13V;
Tj = 25°C
0
0.01
3
VIN = VOUT = 0V; VCC = 13V;
Tj = 125°C
0
RON
VF
Vclamp
IS
IL(off1)
On-state resistance
Supply current
Off-state output current
Table 6.
Symbol
mΩ
µA
-
5
Switching (VCC = 13 V, Tj = 25 °C)
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on delay time
RL = 2.6 Ω (see Figure 6)
-
15
-
µs
td(off)
Turn-off delay time
RL = 2.6 Ω (see Figure 6)
-
45
-
µs
(dVOUT/dt)on Turn-on voltage slope RL = 2.6 Ω
-
0.2
-
V/µs
(dVOUT/dt)off Turn-off voltage slope RL = 2.6 Ω
-
0.2
-
V/µs
WON
Switching energy
losses at turn-on
(twon)
RL = 2.6 Ω (see Figure 6)
-
1.4
-
mJ
WOFF
Switching energy
losses at turn-off
(twoff)
RL = 2.6 Ω (see Figure 6)
-
0.8
-
mJ
Doc ID 15994 Rev 4
9/37
Electrical specifications
Table 7.
VN5E016AH-E
Logic Inputs
Symbol
Parameter
Test conditions
VIL
Input low level voltage
IIL
Low level input current
VIH
Input high level voltage
IIH
High level input current
VI(hyst)
Input hysteresis voltage
VICL
Min.
Typ.
Max.
Unit
-
-
0.9
V
1
-
-
µA
2.1
-
-
V
-
-
10
µA
0.25
-
-
V
IIN = 1mA
5.5
-
7
IIN = -1mA
-
-0.7
-
-
-
0.9
V
1
-
-
µA
2.1
-
-
V
-
-
10
µA
0.25
-
-
V
ICSD = 1mA
5.5
-
7
ICSD = -1mA
-
-0.7
-
VIN = 0.9V
Input clamp voltage
VCSDL
CS_DIS low level voltage
ICSDL
Low level CS_DIS current
VCSDH
CS_DIS high level voltage
ICSDH
High level CS_DIS current
VIN = 2.1V
V
VCSD = 0.9V
VCSD = 2.1V
VCSD(hyst) CS_DIS hysteresis voltage
VCSCL
CS_DIS clamp voltage
Table 8.
Symbol
Protection and diagnostics (1)
Parameter
Test conditions
IlimH
Short circuit current
VCC = 13V
5V<VCC<28V
IlimL
Short circuit current
during thermal cycling
VCC = 13V; TR<Tj<TTSD
TTSD
Shutdown temperature
TR
Reset temperature
TRS
Thermal reset of status
THYST
VDEMAG
VON
V
Thermal hysteresis
(TTSD-TR)
Turn-off output voltage
clamp
IOUT = 2A; VIN = 0; L =
6mH
Output voltage drop
limitation
IOUT = 0.5A;
Tj = -40°C...150°C
Min.
Typ.
Max.
Unit
54
73
108
108
A
A
-
18
-
A
150
175
200
°C
TRS + 1
TRS + 5
-
°C
135
-
-
°C
-
7
-
°C
VCC -41
VCC -46
VCC -52
V
-
25
-
mV
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles
10/37
Doc ID 15994 Rev 4
VN5E016AH-E
Electrical specifications
Table 9.
Symbol
K0
K1
dK1/K1(1)
K2
dK2/K2(1)
K3
dK3/K3(1)
ISENSE0
Current sense (8 V < VCC < 18 V)
Parameter
Test conditions
IOUT/ISENSE
IOUT = 0.25A; VSENSE = 0.5V
Tj = -40°C...150°C
IOUT/ISENSE
IOUT = 5A; VSENSE = 0.5V
Tj = -40°C...150°C
Tj = 25°C...150°C
IOUT = 5A; VSENSE = 0.5V;
Current sense ratio drift VCSD = 0V;
TJ = -40 °C to 150 °C
IOUT = 10A; VSENSE = 4V
Tj = -40°C...150°C
Tj = 25°C...150°C
IOUT/ISENSE
IOUT = 10 A; VSENSE = 4 V;
Current sense ratio drift VCSD = 0V;
TJ = -40 °C to 150 °C
IOUT = 25A; VSENSE = 4V
Tj = -40°C...150°C
Tj = 25°C...150°C
IOUT/ISENSE
IOUT = 25 A; VSENSE = 4 V;
Current sense ratio drift VCSD = 0V;
TJ = -40 °C to 150 °C
Analog sense leakage
current
Min.
Typ.
Max.
Unit
2950 6490 9400
-
4540 5130 6230
4540 5130 5720
-
- 11
+ 11
%
4640 4980 5570
4640 4980 5300
-
-8
-
-
+8
4650 4860 5150
4600 4860 5090
-4
-
+4
IOUT = 0A; VSENSE = 0V;
VCSD = 5V; VIN = 0V;
Tj = -40°C...150°C
0
-
1
IOUT = 0A; VSENSE = 0V;
VCSD = 0V; VIN = 5V;
Tj = -40°C...150°C
0
-
2
IOUT = 2A; VSENSE = 0V;
VCSD = 5V; VIN = 5V;
Tj = -40°C...150°C
-
-
1
%
-
%
µA
IOL
Openload ON-state
current detection
threshold
VIN = 5V;
ISENSE = 5 µA
5
-
70
mA
VSENSE
Max analog sense
output voltage
IOUT = 18A; RSENSE = 3.9KΩ
5
-
-
V
VSENSEH(2)
Analog sense output
V = 13V; RSENSE = 3.9KΩ
voltage in fault condition CC
-
8
-
V
ISENSEH(2)
Analog sense output
V = 13V; VSENSE = 5V
current in fault condition CC
-
9
-
mA
tDSENSE1H
Delay response time
from falling edge of
CS_DIS pin
-
50
100
µs
VSENSE<4V, 1.5A<Iout<25A
ISENSE = 90% of ISENSE max
(see Figure 4.)
Doc ID 15994 Rev 4
11/37
Electrical specifications
Table 9.
VN5E016AH-E
Current sense (8 V < VCC < 18 V) (continued)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
tDSENSE1L
Delay response time
from rising edge of
CS_DIS pin
VSENSE<4V, 1.5A<Iout<25A
ISENSE = 10% of ISENSE max
(see Figure 4)
-
5
20
µs
tDSENSE2H
Delay response time
from rising edge of
INPUT pin
VSENSE<4V, 1.5A<Iout<25A
ISENSE = 90% of ISENSE max
(see Figure 4)
-
270
600
µs
VSENSE < 4V,
ISENSE = 90% of ISENSEMAX,
IOUT = 90% of IOUTMAX
IOUTMAX = 3A (see Figure 7)
-
-
280
µs
VSENSE<4V, 1.5A<Iout<25A
ISENSE = 10% of ISENSE max
(see Figure 4)
-
100
250
µs
Delay response time
between rising edge of
ΔtDSENSE2H
output current and rising
edge of current sense
tDSENSE2L
Delay response time
from falling edge of
INPUT pin
1. Parameter guaranteed by design, it is not tested.
2. Fault condition includes: power limitation, overtemperature and open-load OFF-state detection.
Table 10.
Symbol
VOL
Open-load detection (8 V < VCC < 18 V)
Parameter
Test conditions
Open-load OFF-state
voltage detection
threshold
Typ.
2
See
Figure 5
4
V
See Figure 5
180
-
1200
µs
VIN = 0V
Output short circuit to
tDSTKON VCC detection delay at
turn Off
12/37
Min.
Max. Unit
IL(off2)r
Off-state output current
at VOUT = 4V
VIN = 0V; VSENSE = 0V
VOUT rising from 0V to 4V
-120
-
0
µA
IL(off2)f
Off-state output current
at VOUT = 2V
VIN = 0V; VSENSE = VSENSEH;
VOUT falling from VCC to 2V
-50
-
90
µA
td_vol
Delay response from
output rising edge to
VSENSE rising edge in
open-load
VOUT = 4 V; VIN = 0V
VSENSE = 90% of VSENSEH
-
-
20
µs
Doc ID 15994 Rev 4
VN5E016AH-E
Electrical specifications
Figure 4.
Current sense delay characteristics
INPUT
CS_DIS
LOAD CURRENT
SENSE CURRENT
tDSENSE2H
Figure 5.
tDSENSE1L
tDSENSE1H
tDSENSE2L
Open-load Off-state delay timing
OUTPUT STUCK TO VCC
VIN
VOUT > VOL
VSENSEH
VCS
tDSTKON
Figure 6.
Switching characteristics
VOUT
tWon
tWoff
90%
80%
dVOUT/dt(off)
dVOUT/dt(on)
tr
10%
tf
t
INPUT
td(on)
td(off)
t
Doc ID 15994 Rev 4
13/37
Electrical specifications
Figure 7.
VN5E016AH-E
Delay response time between rising edge of output current and rising
edge of current sense (CS enabled)
VIN
ΔtDSENSE2H
t
IOUT
IOUTMAX
90% IOUTMAX
t
ISENSE
ISENSEMAX
90% ISENSEMAX
t
Figure 8.
Output voltage drop limitation
Vcc-Vout
Tj=150oC
Tj=25oC
Tj=-40oC
Von
Iout
Von/Ron(T)
14/37
Doc ID 15994 Rev 4
VN5E016AH-E
Electrical specifications
Figure 9.
IOUT/ISENSE vs IOUT
Iout / Isense
6400
6200
max Tj = -40 °C to 150 °C
6000
5800
5600
5400
max Tj = 25 °C to 150 °C
5200
5000
typical value
4800
4600
min Tj = -40 °C to 150 °C
min Tj = 25 °C to 150 °C
4400
4200
4000
5
10
15
20
25
IOUT (A)
Figure 10. Maximum current sense ratio drift vs load current(1)
dk/k(%)
20
15
10
5
0
-5
-10
-15
-20
5
10
15
IOUT (A)
20
25
1. Parameter guaranteed by design; it is not tested.
Doc ID 15994 Rev 4
15/37
Electrical specifications
Table 11.
VN5E016AH-E
Truth table
Input
Output
Sense (VCSD=0V)(1)
Normal operation
L
H
L
H
0
Nominal
Overtemperature
L
H
L
L
0
VSENSEH
Undervoltage
L
H
L
L
0
0
H
X
(no power limitation)
Cycling
(power limitation)
Nominal
Conditions
Overload
H
VSENSEH
Short circuit to GND
(power limitation)
L
H
L
L
0
VSENSEH
Open-load OFF-state
(with external pull-up)
L
H
VSENSEH
Short circuit to VCC
(external pull-up
disconnected)
L
H
H
H
VSENSEH
< Nominal
Negative output voltage
clamp
L
L
0
1. If the VCSD is high, the SENSE output is at a high impedance, its potential depends on leakage currents
and external circuit.
16/37
Doc ID 15994 Rev 4
VN5E016AH-E
Electrical specifications
Table 12.
Electrical transient requirements (part 1)
ISO 7637-2:
2004(E)
Test levels
Number of
pulses or
test times
Burst cycle/pulse
repetition time
Delays and
Impedance
Test pulse
III
IV
1
-75 V
-100 V
5000
pulses
0.5 s
5s
2 ms, 10 Ω
2a
+37 V
+50 V
5000
pulses
0.2 s
5s
50 µs, 2 Ω
3a
-100 V
-150 V
1h
90 ms
100 ms
0.1 µs, 50 Ω
3b
+75 V
+100 V
1h
90 ms
100 ms
0.1µs, 50 Ω
4
-6 V
-7 V
1 pulse
-
100 ms,
0.01Ω
5b (2)
+65 V
+87 V
1 pulse
-
400 ms, 2 Ω
Table 13.
Electrical transient requirements (part 2)
Test level results(1)
ISO 7637-2:
2004(E)
Test pulse
III
IV
1
C
C
2a
C
C
3a
C
C
3b
C
C
4
C
C
5b(2)
C
C
1. The above test levels must be considered referred to VCC = 13.5V except for pulse 5b
2. Valid in case of external load dump clamp: 40V maximum referred to ground.
Table 14.
Electrical transient requirements (part 3)
Class
Contents
C
All functions of the device are performed as designed after exposure to disturbance.
E
One or more functions of the device are not performed as designed after exposure to
disturbance and cannot be returned to proper operation without replacing the device.
Doc ID 15994 Rev 4
17/37
Electrical specifications
2.4
VN5E016AH-E
Waveforms
Figure 11.
Normal operation
Normal operation
INPUT
Nominal load
Nominal load
IOUT
VSENSE
VCS_DIS
Figure 12. Overload or Short to GND
Overload or Short to GND
INPUT
ILimH >
Power Limitation
Thermal cycling
ILimL >
IOUT
VSENSE
VCS_DIS
18/37
Doc ID 15994 Rev 4
VN5E016AH-E
Electrical specifications
Figure 13. Intermittent overload
Overload or Short to GND
INPUT
ILimH >
Power Limitation
Thermal cycling
ILimL >
IOUT
VSENSE
VCS_DIS
Figure 14. OFF-state open-load with external circuitry
OFF-State Open Load
with external circutry
INPUT
VOUT > VOL
VOUT
VOL
IOUT
VSENSEH >
tDSTK(on)
VSENSE
VCS_DIS
Doc ID 15994 Rev 4
19/37
Electrical specifications
VN5E016AH-E
Figure 15. Short to VCC
Short to VCC
Resistive
Short to VCC
Hard
Short to VCC
VOUT > VOL
VOL
VOUT
IOUT
tDSTK(on)
tDSTK(on)
VCS_DIS
Figure 16. TJ evolution in overload or short to GND
TJ evolution in
Overload or Short to GND
INPUT
Self-limitation of fast thermal transients
TTSD
THYST
TR
TJ_START
TJ
ILimH >
Power Limitation
< ILimL
IOUT
20/37
Doc ID 15994 Rev 4
VN5E016AH-E
2.5
Electrical specifications
Electrical characteristics curves
Figure 17. Off-state output current
Figure 18. High level input current
Iloff [nA]
Iih [uA]
4000
5
3500
4.5
Vin= 2.1V
4
3000
3.5
2500
3
2000
2.5
1500
2
1.5
1000
1
500
0
-50
0.5
-25
0
25
50
75
100
125
150
175
0
-50
-25
0
25
Tc [°C]
100
125
150
175
100
125
150
175
150
175
Figure 20. Input low level
Vicl [V]
Vil [V]
7
2
6.8
1.8
Iin= 1m A
1.6
6.4
1.4
6.2
1.2
6
1
5.8
0.8
5.6
0.6
5.4
0.4
5.2
0.2
5
-50
75
Tc [°C]
Figure 19. Input clamp level
6.6
50
0
-25
0
25
50
75
100
125
150
175
-50
-25
0
25
50
75
Tc [°C]
Tc [°C]
Figure 21. Input high level
Figure 22. Input hysteresis voltage
Vih [V]
Vihyst [V]
4
1
3.5
0.9
0.8
3
0.7
2.5
0.6
2
0.5
1.5
0.4
0.3
1
0.2
0.5
0
-50
0.1
-25
0
25
50
75
100
125
150
175
0
-50
Tc [°C]
-25
0
25
50
75
100
125
Tc [°C]
Doc ID 15994 Rev 4
21/37
Electrical specifications
VN5E016AH-E
Figure 23. On-state resistance vs Tcase
Figure 24. On-state resistance vs VCC
Ron [m Ohm ]
Ron [m Ohm ]
100
40
90
80
30
70
Tc= 150°C
Tc= 125°C
Iout= 5A
Vcc= 13V
60
50
20
40
Tc= 25°C
30
Tc= -40°C
10
20
10
0
-50
0
-25
0
25
50
75
100
125
150
175
0
5
10
15
Tc [°C]
20
25
30
35
40
Vcc [V]
Figure 25. Undervoltage shutdown
Figure 26. Turn-on voltage slope
(dVout/dt)On [V/m s]
Vusd [V]
1000
16
900
14
800
12
Vcc= 13V
Rl= 2.6Ω
700
10
600
8
500
400
6
300
4
200
2
0
-50
100
-25
0
25
50
75
100
125
150
175
0
-50
-25
0
25
50
75
100
125
150
175
125
150
175
Tc [°C]
Tc [°C]
Figure 27. ILIMH vs Tcase
Figure 28. Turn-off voltage slope
Ilimh [A]
(dVout/dt)Off [V/m s]
100
1000
900
Vcc= 13V
90
800
Vcc= 13V
Rl= 2.6Ω
700
80
600
70
500
400
60
300
200
50
100
40
-50
-25
0
25
50
75
100
125
150
175
0
-50
Tc [°C]
22/37
-25
0
25
50
75
Tc [°C]
Doc ID 15994 Rev 4
100
VN5E016AH-E
Electrical specifications
Figure 29. CS_DIS high level voltage
Figure 30. CS_DIS clamp voltage
Vcsdcl [V]
Vcsdh [V]
4
10
3.5
9
7
2.5
6
2
5
1.5
4
3
1
2
0.5
0
-50
Iin= 1m A
8
3
1
-25
0
25
50
75
100
125
150
175
0
-50
Tc [°C]
-25
0
25
50
75
100
125
150
175
Tc [°C]
Figure 31. CS_DIS low level voltage
Vcsdl [V]
4
3.5
3
2.5
2
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
150
175
Tc [°C]
Doc ID 15994 Rev 4
23/37
Application information
3
VN5E016AH-E
Application information
Figure 32. Application schematic
+5V
VCC
Rprot
CS_DIS
Dld
μC
Rprot
IINPUT
OUTPUT
Rprot
CURRENT SENSE
GND
RSENSE
Cext
VGND
RGND
DGND
3.1
GND protection network against reverse battery
3.1.1
Solution 1: resistor in the ground line (RGND only)
This can be used with any type of load.
The following is an indication on how to dimension the RGND resistor.
1.
RGND ≤ 600mV / (IS(on)max).
2.
RGND ≥ (−VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power dissipation in RGND (when VCC<0: during reverse battery situations) is:
Equation 1
PD= (-VCC)2/RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not shared by the device ground then the
RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output
24/37
Doc ID 15994 Rev 4
VN5E016AH-E
Application information
values. This shift will vary depending on how many devices are ON in the case of several
high side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).
3.1.2
Solution 2: a diode (DGND) in the ground line
A resistor (RGND=1kΩ) should be inserted in parallel to DGND if the device drives an
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift (≈600mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.
3.2
Load dump protection
Dld is necessary (voltage transient suppressor) if the load dump peak voltage exceeds the
VCC max DC rating. The same applies if the device is subject to transients on the VCC line
that are greater than the ones shown in the ISO T/R 7637/1 table.
3.3
MCU I/Os protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to
prevent the μC I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os.
Equation 2
VCCpeak/Ilatchup ≤ Rprot ≤ (VOHμC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak = -100V; Ilatchup ≥ 20mA; VOHμC ≥ 4.5V
5kΩ ≤ Rprot ≤ 65kΩ.
Recommended values: Rprot = 10kΩ, CEXT = 10nF.
Doc ID 15994 Rev 4
25/37
Application information
3.4
VN5E016AH-E
Current sense and diagnostic
The current sense pin performs a double function (see Figure 33: Current sense and
diagnostic):
●
Current mirror of the load current in normal operation, delivering a current
proportional to the load one according to a know ratio KX.
The current ISENSE can be easily converted to a voltage VSENSE by means of an
external resistor RSENSE. Linearity between IOUT and VSENSE is ensured up to 5V
minimum (see parameter VSENSE in Table 9: Current sense (8 V < VCC < 18 V)). The
current sense accuracy depends on the output current (refer to current sense electrical
characteristics Table 9: Current sense (8 V < VCC < 18 V)).
●
Diagnostic flag in fault conditions, delivering a fixed voltage VSENSEH up to a
maximum current ISENSEH in case of the following fault conditions (refer to Truth table):
–
Power limitation activation
–
Overtemperature
–
Short to VCC in OFF-state
–
Open-load in OFF-state with additional external components.
A logic level high on CS_DIS pin sets at the same time all the current sense pins of the
device in a high impedance state, thus disabling the current monitoring and diagnostic
detection. This feature allows multiplexing of the microcontroller analog inputs by sharing of
sense resistance and ADC line among different devices.
Figure 33. Current sense and diagnostic
VPU
VBAT
VCC
Main MOSn
41V
PU_CMD
Overtemperature
IOUT/KX
RPU
+
OL OFF
ISENSEH
VOL
Pwr_Lim
CS_DIS
OUTn
ILoff2r
ILoff2f
INPUTn
VSENSEH
CURRENT
SENSEn
RPROT
To uC ADC
26/37
RSENSE
GND
Load
RPD
VSENSE
Doc ID 15994 Rev 4
VN5E016AH-E
3.4.1
Application information
Short to VCC and OFF-state open-load detection
Short to VCC
A short circuit between VCC and output is indicated by the relevant current sense pin set to
VSENSEH during the device off-state. Small or no current is delivered by the current sense
during the on-state depending on the nature of the short circuit.
OFF-state open-load with external circuitry
Detection of an open-load in off mode requires an external pull-up resistor RPU connecting
the output to a positive supply voltage VPU.
It is preferable VPU to be switched off during the module standby mode in order to avoid the
overall standby current consumption to increase in normal conditions, i.e. when load is
connected.
An external pull down resistor RPD connected between output and GND is mandatory to
avoid misdetection in case of floating outputs in off-state (see Figure 33: Current sense and
diagnostic).
RPD must be selected in order to ensure VOUT < VOLmin unless pulled up by the external
circuitry:
Equation 3
VOUT
Pull − up _ OFF
= RPD ⋅ I L ( off 2) f < VOL min = 2V
RPD ≤ 22 KΩ is recommended.
For proper open-load detection in off-state, the external pull-up resistor must be selected
according to the following formula:
Equation 4
VOUT
Pull − up _ ON
=
RPD ⋅ VPU − RPU ⋅ RPD ⋅ I L ( off 2) r
RPU + RPD
> VOL max = 4V
For the values of VOLmin,VOLmax, IL(off2)r and IL(off2)f see Table 10: Open-load detection
(8 V < VCC < 18 V).
Doc ID 15994 Rev 4
27/37
Application information
3.5
VN5E016AH-E
Maximum demagnetization energy (VCC = 13.5V)
Figure 34. Maximum turn off current versus inductance(1)
100
A
B
C
I (A)
10
1
0,1
1
L (mH)
10
100
A: Tjstart = 150°C single pulse
B: Tjstart = 100°C repetitive pulse
C: Tjstart = 125°C repetitive pulse
VIN, IL
Demagnetization
Demagnetization
Demagnetization
t
1. Values are generated with RL = 0Ω.
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed
the temperature specified above for curves A and B.
28/37
Doc ID 15994 Rev 4
VN5E016AH-E
Package and PC board thermal data
4
Package and PC board thermal data
4.1
HPak thermal data
Figure 35. PC board(1)
1. Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 1.8 mm, Cu thickness = 70 µm, Copper areas: from minimum pad lay-out to 8 cm2).
Figure 36. Rthj-amb Vs. PCB copper area in open box free air condition
RTHjamb
75
70
65
60
55
RTHjamb
50
45
40
35
30
0
2
4
Doc ID 15994 Rev 4
6
8
10
29/37
Package and PC board thermal data
VN5E016AH-E
Figure 37. HPak thermal impedance junction ambient single pulse
Equation 5: pulse calculation formula
Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )
where δ = tP/T
Figure 38. Thermal fitting model of a single channel HSD in HPak(1)
1. The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded
protections (power limitation or thermal cycling during thermal shutdown) are not triggered.
30/37
Doc ID 15994 Rev 4
VN5E016AH-E
Package and PC board thermal data
Table 15.
Thermal parameter
Area/island (cm2)
Footprint
4
8
R1 (°C/W)
0.1
-
-
R2 (°C/W)
0.2
-
-
R3 (°C/W)
2
-
-
R4 (°C/W)
8
-
-
R5 (°C/W)
28
22
12
R6 (°C/W)
31
25
16
C1 (W.s/°C)
0.0001
-
-
C2 (W.s/°C)
0.002
-
-
C3 (W.s/°C)
0.05
-
-
C4 (W.s/°C)
0.4
-
-
C5 (W.s/°C)
0.8
1.4
3
C6 (W.s/°C)
3
6
9
Doc ID 15994 Rev 4
31/37
Package and packing information
VN5E016AH-E
5
Package and packing information
5.1
ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 39. Package dimension
32/37
Doc ID 15994 Rev 4
VN5E016AH-E
Package and packing information
Table 16.
Package mechanical data
Data book mm
Ref. dim
Nom.
Min.
Max.
A
-
2.20
2.40
A1
-
0.90
1.10
A2
-
0.03
0.23
b
-
0.45
0.60
b4
-
5.20
5.40
c
-
0.45
0.60
c2
-
0.48
0.60
D
-
6.00
6.20
D1
5.10
-
-
E
-
6.40
6.60
E1
5.20
-
-
e
0.85
-
-
e1
-
1.60
1.80
e2
-
3.30
3.50
e3
-
5.00
5.20
H
-
9.35
10.10
L
-
1
-
(L1)
2.80
-
-
L2
0.80
-
-
L4
-
0.60
1.00
R
0.20
-
-
V2
-
0°
8°
Doc ID 15994 Rev 4
33/37
Package and packing information
5.2
VN5E016AH-E
Packing information
The devices can be packed in tube or tape and reel shipments (see Table 17: Device
summary).
Figure 40. HPAK tube shipment (no suffix)
A
Base q.ty
Bulk q.ty
Tube length (± 0.5)
A
B
C (± 0.1)
C
B
75
3000
532
6
21.3
0.6
All dimensions are in mm.
Figure 41. HPAK tape and reel (suffix “TR”)
REEL DIMENSIONS
All dimensions are in mm.
Base q.ty
Bulk q.ty
A (max)
B (min)
C (± 0.2)
F
G (+ 2 / -0)
N (min)
T (max)
2500
2500
330
1.5
13
20.2
16.4
60
22.4
TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width
Tape hole spacing
Component spacing
Hole diameter
Hole diameter
Hole position
Compartment depth
Hole spacing
W
P0 (± 0.1)
P
D (+ 0.1/-0)
D1 (min)
F (± 0.05)
K (max)
P1 (± 0.1)
All dimensions are in mm.
16
4
8
1.5
1.5
7.5
2.75
2
End
Start
Top
cover
tape
No components
Components
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
34/37
Doc ID 15994 Rev 4
No components
500mm min
VN5E016AH-E
6
Order codes
Order codes
Table 17.
Device summary
Order codes
Package
7 pins H-pack
Tube
Tape and reel
VN5E016AH-E
VN5E016AHTR-E
Doc ID 15994 Rev 4
35/37
Revision history
7
VN5E016AH-E
Revision history
Table 18.
36/37
Document revision history
Date
Revision
Changes
07-Jul-2009
1
Initial release.
29-Oct-2009
2
Added Section 5.2: Packing information.
01-Jun-2010
3
Updated Table 16: Package mechanical data.
04-Aug-2010
4
Table 9: Current sense (8 V < VCC < 18 V):
– Updated dK1/K1 test conditions
Doc ID 15994 Rev 4
VN5E016AH-E
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2010 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID 15994 Rev 4
37/37