SN74ALVCH16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES024J – JULY 1995 – REVISED OCTOBER 2004 FEATURES • • • • • • • • DGG OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus™ Family UBT™ Transceiver Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Modes Operates From 1.65 V to 3.6 V Max tpd of 3.9 ns at 3.3 V ±24-mA Output Drive at 3.3 V Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) OEAB LEAB A1 GND A2 A3 VCC A4 A5 A6 GND A7 A8 A9 A10 A11 A12 GND A13 A14 A15 VCC A16 A17 GND A18 OEBA LEBA DESCRIPTION/ORDERING INFORMATION This 18-bit universal bus transceiver is designed for 1.65-V to 3.6-V VCC operation. Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 31 27 30 28 29 GND CLKAB B1 GND B2 B3 VCC B4 B5 B6 GND B7 B8 B9 B10 B11 B12 GND B13 B14 B15 VCC B16 B17 GND B18 CLKBA GND Data flow for B to A is similar to that of A to B, but uses OEBA, LEBA, and CLKBA. The output enables are complementary (OEAB is active high, and OEBA is active low). ORDERING INFORMATION PACKAGE (1) TA SSOP - DL -40°C to 85°C TSSOP - DGG VFBGA - GQL VFBGA - ZQL (Pb-free) (1) ORDERABLE PART NUMBER Tube SN74ALVCH16501DL Tape and reel SN74ALVCH16501DLR Tape and reel SN74ALVCH16501DGGR Tape and reel SN74ALVCH16501KR 74ALVCH16501ZQLR TOP-SIDE MARKING ALVCH16501 ALVCH16501 VH501 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, UBT are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2004, Texas Instruments Incorporated SN74ALVCH16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES024J – JULY 1995 – REVISED OCTOBER 2004 DESCRIPTION/ORDERING INFORMATION (CONTINUED) To ensure the high-impedance state during power up or power down, OEBA should be tied to VCC through a pullup resistor, and OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. GQL OR ZQL PACKAGE (TOP VIEW) 1 2 3 4 5 6 A B C D E F G H J K TERMINAL ASSIGNMENTS 2 1 2 3 4 5 6 A A1 LEAB OEAB GND CLKAB B1 B A3 A2 GND GND B2 B3 C A5 A4 VCC VCC B4 B5 D A7 A6 GND GND B6 B7 E A9 A8 B8 B9 F A10 A11 B11 B10 G A12 A13 GND GND B13 B12 H A14 A15 VCC VCC B15 B14 J A16 A17 GND GND B17 B16 K A18 OEBA LEBA GND CLKBA B18 SN74ALVCH16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES024J – JULY 1995 – REVISED OCTOBER 2004 FUNCTION TABLE (1) INPUTS (1) (2) (3) OEAB LEAB CLKAB A OUTPUT B L X X X Z H H X L L H H X H H H L ↑ L L H L ↑ H H H L H X B0 (2) H L L X B0 (3) A-to-B data flow is shown; B-to-A flow is similar, but uses OEBA, LEBA, and CLKBA. Output level before the indicated steady-state input conditions were established, provided that CLKAB was high before LEAB went low Output level before the indicated steady-state input conditions were established space LOGIC DIAGRAM (POSITIVE LOGIC) OEAB CLKAB LEAB LEBA CLKBA OEBA A1 1 55 2 28 30 27 3 1D C1 CLK 54 B1 1D C1 CLK To 17 Other Channels Pin numbers shown are for the DGG and DL packages. 3 SN74ALVCH16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES024J – JULY 1995 – REVISED OCTOBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range MIN MAX -0.5 4.6 Except I/O ports (2) -0.5 4.6 I/O ports (2) (3) -0.5 VCC + 0.5 -0.5 VCC + 0.5 UNIT V VI Input voltage range VO Output voltage range (2) (3) IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through each VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range DGG package 64 DL package 56 GQL/ZQL package (1) (2) (3) (4) V V °C/W 42 -65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 UNIT V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL Low-level input voltage VCC = 2.3 V to 2.7 V 0.7 VI Input voltage 0 VCC V VO Output voltage 0 VCC V VCC = 2.7 V to 3.6 V IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) 4 V 0.8 VCC = 1.65 V -4 VCC = 2.3 V -12 VCC = 2.7 V -12 VCC = 3 V -24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 -40 mA mA 10 ns/V 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74ALVCH16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES024J – JULY 1995 – REVISED OCTOBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 µA 1.65 V to 3.6 V 1.65 V IOH = -6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = -24 mA 3V 2 IOL = 100 µA IOH = -12 mA II(hold) V 1.65 V to 3.6 V 0.2 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 IOL = 24 mA II 1.2 IOL = 4 mA IOL = 12 mA 2.7 V 0.4 3V 0.55 3.6 V VI = 0.58 V 1.65 V 25 VI = 1.07 V 1.65 V -25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V -45 VI = 0.8 V 3V 75 3V -75 VI = 0 V to 3.6 VO = VCC or GND ICC VI = VCC or GND, ∆ICC One input at VCC - 0.6 V, Other inputs at VCC or GND µA µA 3.6 V ±500 3.6 V ±10 µA 3.6 V 40 µA 3 V to 3.6 V 750 µA V (2) IOZ (3) V ±5 VI = VCC or GND VI = 2 V UNIT VCC - 0.2 IOH = -4 mA VOH VOL MIN TYP (1) MAX VCC IO = 0 Ci Control inputs VI = VCC or GND 3.3 V 4 pF Cio A or B ports 3.3 V 8 pF (1) (2) (3) VO = VCC or GND All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. For I/O ports, the parameter IOZ includes the input leakage current. TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 2.5 V ± 0.2 V MIN fclock Clock frequency tw Pulse duration tsu Setup time Hold time MIN 150 MAX VCC = 3.3 V ± 0.3 V MIN 150 3.3 3.3 3.3 CLK high or low 3.3 3.3 3.3 Data before LE↓ 2.2 2.1 1.7 CLK high 1.9 1.6 1.5 CLK low 1.3 1.1 1 0.6 0.6 0.7 1.4 1.7 1.4 Data after CLK↑ Data after LE↓ CLK high or low UNIT MAX 150 LE high Data before CLK↑ th MAX VCC = 2.7 V MHz ns ns ns 5 SN74ALVCH16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES024J – JULY 1995 – REVISED OCTOBER 2004 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) A or B B or A fmax tpd VCC = 2.5 V ± 0.2 V MIN MAX 150 LE A or B CLK VCC = 3.3 V ± 0.3 V VCC = 2.7 V MIN MAX 150 MIN UNIT MAX 150 MHz 1 4.8 4.5 1 3.9 1.1 5.7 5.3 1.3 4.6 1.2 6.1 5.6 1.4 4.9 ns ten OEAB B 1 5.8 5.3 1 4.6 ns tdis OEAB B 1.5 6.2 5.7 1.4 5 ns ten OEBA A 1.3 6.3 6 1.1 5 ns tdis OEBA A 1.3 5.3 4.6 1.3 4.2 ns OPERATING CHARACTERISTICS TA = 25°C PARAMETER Cpd 6 Power dissipation capacitance TEST CONDITIONS Outputs enabled Outputs disabled CL = 50 pF, f = 10 MHz VCC = 2.5 V VCC = 3.3 V TYP TYP 44 54 6 6 UNIT pF SN74ALVCH16501 18-BIT UNIVERSAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS www.ti.com SCES024J – JULY 1995 – REVISED OCTOBER 2004 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V tw VI Timing Input VM VM VM 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VM VM 0V tPLH Output Control (low-level enabling) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPHL VM VI VM tPZL VI Input VOLTAGE WAVEFORMS PULSE DURATION th VI Data Input VM 0V 0V tsu Output VI VM Input Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VOH VM VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ALVCH16501DGGRG4 ACTIVE TSSOP DGG 56 74ALVCH16501DLG4 ACTIVE SSOP DL 56 74ALVCH16501DLRG4 ACTIVE SSOP DL 74ALVCH16501ZQLR ACTIVE BGA MI CROSTA R JUNI OR SN74ALVCH16501DGGR ACTIVE SN74ALVCH16501DL MSL Peak Temp (3) CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16501DLR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16501KR ACTIVE GQL 56 1000 SNPB Level-1-240C-UNLIM BGA MI CROSTA R JUNI OR 2000 Green (RoHS & no Sb/Br) Lead/Ball Finish 20 20 TBD (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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