TI SN74CBTLV16211DL

SN74CBTLV16211
LOW-VOLTAGE 24-BIT FET BUS SWITCH
SCDS043E – DECEMBER 1997 – REVISED APRIL 1999
D
D
D
D
D
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
5-Ω Switch Connection Between Two Ports
Isolation Under Power-Off Conditions
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Latch-Up Performance Exceeds 250 mA Per
JESD 17
Package Options Include Plastic Thin
Shrink Small-Outline (DGG), Thin Very
Small-Outline (DGV), and 300-mil Shrink
Small-Outline (DL) Packages
NC
1A1
1A2
1A3
1A4
1A5
1A6
GND
1A7
1A8
1A9
1A10
1A11
1A12
2A1
2A2
VCC
2A3
GND
2A4
2A5
2A6
2A7
2A8
2A9
2A10
2A11
2A12
description
The SN74CBTLV16211 provides 24 bits of
high-speed bus switching. The low on-state
resistance of the switch allows connections to be
made with minimal propagation delay.
The device is organized as dual 12-bit bus
switches with separate output-enable (OE)
inputs. It can be used as two 12-bit bus switches
or one 24-bit bus switch. When OE is low, the
associated 12-bit bus switch is on and port A is
connected to port B. When OE is high, the switch
is open, and the high-impedance state exists
between the two ports.
To ensure the high-impedance state during power
up or power down, OE should be tied to VCC
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
1OE
2OE
1B1
1B2
1B3
1B4
1B5
GND
1B6
1B7
1B8
1B9
1B10
1B11
1B12
2B1
2B2
2B3
GND
2B4
2B5
2B6
2B7
2B8
2B9
2B10
2B11
2B12
NC – No internal connection
The SN74CBTLV16211 is characterized for
operation from –40°C to 85°C.
FUNCTION TABLE
(each 12-bit bus switch)
INPUT
OE
FUNCTION
L
A port = B port
H
Disconnect
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN74CBTLV16211
LOW-VOLTAGE 24-BIT FET BUS SWITCH
SCDS043E – DECEMBER 1997 – REVISED APRIL 1999
logic diagram (positive logic)
2
1A1
54
1B1
SW
14
1A12
1OE
2A1
42
1B12
SW
56
15
41
SW
28
2A12
2B1
29
2B12
SW
55
2OE
simplified schematic, each FET switch
B
A
(OE)
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 4.6 V
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74CBTLV16211
LOW-VOLTAGE 24-BIT FET BUS SWITCH
SCDS043E – DECEMBER 1997 – REVISED APRIL 1999
recommended operating conditions (see Note 3)
VCC
Supply voltage
VIH
High level control input voltage
High-level
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VIL
Low level control input voltage
Low-level
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
MIN
MAX
2.3
3.6
1.7
UNIT
V
V
2
0.7
0.8
V
TA
Operating free-air temperature
–40
85
°C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
II
VCC = 3 V,
VCC = 3.6 V,
II = –18 mA
VI = VCC or GND
Ioff
ICC
VCC = 0,
VCC = 3.6 V,
VI or VO= 0 to 3.6 V
IO = 0,
VCC = 3.6 V,
VI = 3.3 V or 0
One input at 3 V,
VO = 3.3 V or 0,
OE = VCC
∆ICC‡
Ci
Control inputs
Control inputs
Cio(OFF)
MIN
TYP†
VI = VCC or GND
Other inputs at VCC or GND
MAX
–1.2
V
±1
µA
10
µA
10
µA
300
µA
4.5
2 3 V,
V
VCC = 2.3
TYP at VCC = 2.5 V
ron§
VCC = 3 V
UNIT
pF
6.5
pF
VI = 0
II = 64 mA
II = 24 mA
5
8
5
8
VI = 1.7 V,
II = 15 mA
27
40
VI = 0
II = 64 mA
II = 24 mA
5
7
5
7
Ω
VI = 2.4 V,
II = 15 mA
10
15
† All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
‡ This is the increase in supply current for each input that is at the specified voltage level rather than VCC or GND.
§ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figures 1 and 2)
FROM
(INPUT)
TO
(OUTPUT)
tpd¶
A or B
B or A
ten
OE
A or B
PARAMETER
VCC = 2.5 V
± 0.2 V
MIN
VCC = 3.3 V
± 0.3 V
MAX
MIN
0.15
1
7
1
UNIT
MAX
0.25
ns
6.2
ns
tdis
OE
A or B
1
7.2
1
7.7
ns
¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN74CBTLV16211
LOW-VOLTAGE 24-BIT FET BUS SWITCH
SCDS043E – DECEMBER 1997 – REVISED APRIL 1999
PARAMETER MEASUREMENT INFORMATION
VCC = 2.5 V ± 0.2 V
2 × VCC
500 Ω
From Output
Under Test
S1
Open
GND
CL = 30 pF
(see Note A)
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
500 Ω
Output
Control
(low-level
enabling)
LOAD CIRCUIT
VCC
VCC/2
0V
tPLZ
tPZL
VCC
VCC/2
Input
VCC/2
0V
tPLH
VCC/2
VCC
VCC/2
VCC/2
VOL
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.15 V
VOL
tPHZ
tPZH
VOH
Output
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC/2
VOH
VOH – 0.15 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN74CBTLV16211
LOW-VOLTAGE 24-BIT FET BUS SWITCH
SCDS043E – DECEMBER 1997 – REVISED APRIL 1999
PARAMETER MEASUREMENT INFORMATION
VCC = 3.3 V ± 0.3 V
6V
S1
500 Ω
From Output
Under Test
GND
CL = 50 pF
(see Note A)
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
Open
500 Ω
Output
Control
(low-level
enabling)
LOAD CIRCUIT
3V
1.5 V
0V
tPZL
3V
Input
1.5 V
1.5 V
0V
tPLH
tPHL
VOH
Output
1.5 V
1.5 V
VOL
Output
Waveform 1
S1 at 6 V
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
1.5 V
tPLZ
3V
1.5 V
tPZH
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH
VOH – 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 2. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
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Copyright  1999, Texas Instruments Incorporated