STMICROELECTRONICS DIP1524-01D3

DIP1524-01D3
GPS/GLONASS and 2.4 GHz diplexer
Features
■
Low insertion loss
■
High attenuation levels
■
Input power for GPS: 25 dBm max
■
Input power for WLAN: 28 dBm max
■
High power capacity
■
Lead-free, Flip-Chip package
■
Small footprint
■
Very low profile (< 630 µm thickness)
■
High RF performance
Flip-Chip package 4 bumps
Figure 1.
Schematic diagram (top view)
Applications
■
Multi-band power amplifier module
■
Multi-band front end module
■
Multi-band GSM/WCDMA mobile phone
■
PC (netbooks, tablet) and smartphones
Rx Antenna
WLAN, BTE
LTE Band VII
P3
GPS/GLONASS
Rx
Description
P1
P2
The DIP1524-01D3 is a diplexer designed to
separate the RF received signals of the
GPS-GLONASS from the RF received signals in
the 2.4 to 2.7 GHz band.
The DIP1524-01D3 has been designed using
STMicroelectronics IPD (Integrated Passive
Device) technology on non conductive glass
substrate to optimize RF performance.
February 2012
Doc ID 022548 Rev 1
1/9
www.st.com
9
Characteristics
DIP1524-01D3
1
Characteristics
Table 1.
Absolute maximum rating (limiting values)
Value
Symbol
Parameter
Unit
Min.
PIN
Typ.
Max.
Input power P1
28
Input power P2 (GPS)
25
dBm
VESD (HBM) Human body model, JESD22-A114-B, all I/O
300
V
VESD (MM)
100
V
500
V
+85
ºC
Machine model, JESD22-A115-A, all I/O
VESD (CDM) Charge device model, JESD22-C101-C, all I/O
TOP
Table 2.
Operating temperature range
-30
Electrical characteristics and RF performance (Tamb = 25° C)
Value
Symbol
Parameter
Test condition
Unit
Min
f1
WLAN, BT, LTE BAND VII
Pass band range
f2
P1-P3
IL
GPS: 1573.42 – 1577.42 MHz
GLONASS: 1597.55 – 1605.89 MHz
Typ
Max
2400
2700
MHz
1573.42
1605.89
MHz
In f1: WLAN, BT, LTE BAND VII
0.85
0.90
In f2: GPS
0.60
0.65
In f2: GLONASS
0.65
0.75
P2-P3
P1-P3
In f2
20
P2-P3
In f1
18
P1
In f1
-10
Return loss P2
In f2
-20
In f1 and f2
-9.5
Attenuation
dB
P3
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DIP1524-01D3
1.1
Characteristics
RF measurement
Measurements performed at component level.
Figure 2.
P1-P3 and P2-P3 - S13 and S23
forward transmission
Figure 3.
S13, S23 (dB)
0
P1-P3 - S13 insertion loss in f1
band
S13 (dB)
-0.70
m1
F = 2.400 GHz
S13 = -0.861 dB
-5
m2
F = 2.700 GHz
S13 = -0.812 dB
-0.75
-10
S13
S23
-15
m2
-0.80
-20
-25
m1
-0.85
-30
F (GHz)
F (GHz)
-0.90
-35
0
1
Figure 4.
-0.50
2
3
4
5
2.40
6
P2-P3 - S23 insertion loss in f2
band (GPS)
S23 (dB)
Figure 5.
2.45
2.50
2.55
2.60
2.65
2.70
P2-P3 - S23 insertion loss in f2
band (GLONASS)
S23 (dB)
-0.50
m3
F = 1.575 GHz
S23 = -0.580 dB
m4
m5
F = 1.595 GHz
F = 1.605 GHz
S23 = -0.603 dB S23 = -0.624 dB
-0.55
-0.55
m3
-0.60
-0.60
-0.65
-0.65
m4
m5
F (GHz)
F (GHz)
-0.70
-0.70
1.570
1.572
Figure 6.
-15
1.574
1.576
1.578
1.595
1.580
P1-P3 - S13 attenuation in f2 band
S13 (dB)
Figure 7.
-15
m7
m6
F = 1.605 GHz
F = 1.575 GHz
S13 = -23.141 dB S13 = -27.723 dB
1.605
1.610
P2-P3 - S23 attenuation in f1 band
S23 (dB)
m8
-20
1.600
m8
m9
F = 2.400 GHz
F = 2.700 GHz
S23 = -19.084 dB S23 = -24.617 dB
-20
m6
m9
-25
-25
m7
-30
-30
F (GHz)
-35
1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610
-35
F (GHz)
2.40
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2.45
2.50
2.55
2.60
2.65
2.70
3/9
Characteristics
Figure 8.
0
DIP1524-01D3
P1, P2, P3 - Sxx reflection
coefficient
Figure 9.
S11, S22, S33 (dB)
-5
-5
S11
S22
S33
-15
-20
m11
-15
-20
-25
-25
-30
0
1
2
3
4
5
6
Figure 10. P2 - S22 return loss in f2 band
S22 (dB)
-35
2.40
-15
-20
-20
m13
m12
2.60
2.65
Figure 12. P3 - S33 return loss in f2 band
S33 (dB)
-25
m14
m15
F = 2.400 GHz
F = 2.700 GHz
S33 = -11.442 dB S33 = -10.102 dB
-35
2.40
2.45
2.50
2.55
2.60
F (GHz)
2.65
2.70
Figure 13. P1-P2 - S12 isolation
0
m16
m17
F = 1.575 GHz
F = 1.605 GHz
S33 = -24.600 dB S33 = -22.469 dB
2.70
m15
-30
-35
1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610
-10
2.55
S33 (dB)
F (GHz)
-5
2.50
-10m14
-15
-25
2.45
F (GHz)
Figure 11. P3 - S33 return loss in f1 band
-5
m12
m13
F = 1.575 GHz
F = 1.605 GHz
S22 = -31.730 dB S22 = -27.778 dB
-10
m10
m11
F = 2.400 GHz
F = 2.700 GHz
S11 = -13.229 dB S11 = -11.059 dB
-30
F (GHz)
-35
-30
S11 (dB)
-10m10
-10
-5
P1 - S11 return loss in f1 band
S12 (dB)
-5
-10
-15
-15
-20
m17
m16
-20
-25
-25
-30
F (GHz)
-35
1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610
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-30
F (GHz)
-35
0
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DIP1524-01D3
Ordering information scheme
Figure 14. P1-P2 - S12 isolation in f1 band
-15
S12 (dB)
-15
m20
m21
F = 2.400 GHz
F = 2.700 GHz
S23 = -19.224 dB S23 = -24.375 dB
m20
-20
Figure 15. P1-P2 - S12 isolation in f2 band
S12 (dB)
-20
m18
m19
F = 1.575 GHz
F = 1.605 GHz
S12 = -22.399 dB S12 = -24.812 dB
m18
m21
-25
-30
-30
F (GHz)
-35
2.40
2
m19
-25
2.45
2.50
2.55
2.60
2.65
2.70
F (GHz)
-35
1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610
Ordering information scheme
Figure 16. Ordering information scheme
DIP
15
24
01
D3
IPD family
Diplexer
f1 band
f2 band
Design version
1st version
Package
D3 = glass substrate
Doc ID 022548 Rev 1
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Package information
3
DIP1524-01D3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 17. Package dimensions
630 µm
400 µm
GND
P3
1360 µm
P1
P2
840 µm
Figure 18. Footprint
Figure 19. Marking
Copper pad diameter:
220 µm recommended
260 µm maximum
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)
Solder mask opening:
300 µm minimum
Solder stencil opening:
220 µm recommended
6/9
Doc ID 022548 Rev 1
x x z
y ww
DIP1524-01D3
Package information
Figure 20. Tape and reel specifications
Dot identifying Pin A1 location
2.0
Ø 1.50
4.0
8.0
3.5
1.46
1.75
0.20
ST
ST
ST
xxz
yww
xxz
yww
xxz
yww
0.94
4.0
0.75
All dimensions are typical values in mm
Note:
User direction of unreeling
More information is available in the application note:
AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use”
Doc ID 022548 Rev 1
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Ordering information
4
Ordering information
Table 3.
5
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
DIP1524-01D3
RT
Flip Chip
1.35 mg
5000
Tape and reel (7”)
Revision history
Table 4.
8/9
DIP1524-01D3
Document revision history
Date
Revision
14-Feb-2012
1
Changes
Initial release
Doc ID 022548 Rev 1
DIP1524-01D3
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