DIP1524-01D3 GPS/GLONASS and 2.4 GHz diplexer Features ■ Low insertion loss ■ High attenuation levels ■ Input power for GPS: 25 dBm max ■ Input power for WLAN: 28 dBm max ■ High power capacity ■ Lead-free, Flip-Chip package ■ Small footprint ■ Very low profile (< 630 µm thickness) ■ High RF performance Flip-Chip package 4 bumps Figure 1. Schematic diagram (top view) Applications ■ Multi-band power amplifier module ■ Multi-band front end module ■ Multi-band GSM/WCDMA mobile phone ■ PC (netbooks, tablet) and smartphones Rx Antenna WLAN, BTE LTE Band VII P3 GPS/GLONASS Rx Description P1 P2 The DIP1524-01D3 is a diplexer designed to separate the RF received signals of the GPS-GLONASS from the RF received signals in the 2.4 to 2.7 GHz band. The DIP1524-01D3 has been designed using STMicroelectronics IPD (Integrated Passive Device) technology on non conductive glass substrate to optimize RF performance. February 2012 Doc ID 022548 Rev 1 1/9 www.st.com 9 Characteristics DIP1524-01D3 1 Characteristics Table 1. Absolute maximum rating (limiting values) Value Symbol Parameter Unit Min. PIN Typ. Max. Input power P1 28 Input power P2 (GPS) 25 dBm VESD (HBM) Human body model, JESD22-A114-B, all I/O 300 V VESD (MM) 100 V 500 V +85 ºC Machine model, JESD22-A115-A, all I/O VESD (CDM) Charge device model, JESD22-C101-C, all I/O TOP Table 2. Operating temperature range -30 Electrical characteristics and RF performance (Tamb = 25° C) Value Symbol Parameter Test condition Unit Min f1 WLAN, BT, LTE BAND VII Pass band range f2 P1-P3 IL GPS: 1573.42 – 1577.42 MHz GLONASS: 1597.55 – 1605.89 MHz Typ Max 2400 2700 MHz 1573.42 1605.89 MHz In f1: WLAN, BT, LTE BAND VII 0.85 0.90 In f2: GPS 0.60 0.65 In f2: GLONASS 0.65 0.75 P2-P3 P1-P3 In f2 20 P2-P3 In f1 18 P1 In f1 -10 Return loss P2 In f2 -20 In f1 and f2 -9.5 Attenuation dB P3 2/9 Doc ID 022548 Rev 1 DIP1524-01D3 1.1 Characteristics RF measurement Measurements performed at component level. Figure 2. P1-P3 and P2-P3 - S13 and S23 forward transmission Figure 3. S13, S23 (dB) 0 P1-P3 - S13 insertion loss in f1 band S13 (dB) -0.70 m1 F = 2.400 GHz S13 = -0.861 dB -5 m2 F = 2.700 GHz S13 = -0.812 dB -0.75 -10 S13 S23 -15 m2 -0.80 -20 -25 m1 -0.85 -30 F (GHz) F (GHz) -0.90 -35 0 1 Figure 4. -0.50 2 3 4 5 2.40 6 P2-P3 - S23 insertion loss in f2 band (GPS) S23 (dB) Figure 5. 2.45 2.50 2.55 2.60 2.65 2.70 P2-P3 - S23 insertion loss in f2 band (GLONASS) S23 (dB) -0.50 m3 F = 1.575 GHz S23 = -0.580 dB m4 m5 F = 1.595 GHz F = 1.605 GHz S23 = -0.603 dB S23 = -0.624 dB -0.55 -0.55 m3 -0.60 -0.60 -0.65 -0.65 m4 m5 F (GHz) F (GHz) -0.70 -0.70 1.570 1.572 Figure 6. -15 1.574 1.576 1.578 1.595 1.580 P1-P3 - S13 attenuation in f2 band S13 (dB) Figure 7. -15 m7 m6 F = 1.605 GHz F = 1.575 GHz S13 = -23.141 dB S13 = -27.723 dB 1.605 1.610 P2-P3 - S23 attenuation in f1 band S23 (dB) m8 -20 1.600 m8 m9 F = 2.400 GHz F = 2.700 GHz S23 = -19.084 dB S23 = -24.617 dB -20 m6 m9 -25 -25 m7 -30 -30 F (GHz) -35 1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610 -35 F (GHz) 2.40 Doc ID 022548 Rev 1 2.45 2.50 2.55 2.60 2.65 2.70 3/9 Characteristics Figure 8. 0 DIP1524-01D3 P1, P2, P3 - Sxx reflection coefficient Figure 9. S11, S22, S33 (dB) -5 -5 S11 S22 S33 -15 -20 m11 -15 -20 -25 -25 -30 0 1 2 3 4 5 6 Figure 10. P2 - S22 return loss in f2 band S22 (dB) -35 2.40 -15 -20 -20 m13 m12 2.60 2.65 Figure 12. P3 - S33 return loss in f2 band S33 (dB) -25 m14 m15 F = 2.400 GHz F = 2.700 GHz S33 = -11.442 dB S33 = -10.102 dB -35 2.40 2.45 2.50 2.55 2.60 F (GHz) 2.65 2.70 Figure 13. P1-P2 - S12 isolation 0 m16 m17 F = 1.575 GHz F = 1.605 GHz S33 = -24.600 dB S33 = -22.469 dB 2.70 m15 -30 -35 1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610 -10 2.55 S33 (dB) F (GHz) -5 2.50 -10m14 -15 -25 2.45 F (GHz) Figure 11. P3 - S33 return loss in f1 band -5 m12 m13 F = 1.575 GHz F = 1.605 GHz S22 = -31.730 dB S22 = -27.778 dB -10 m10 m11 F = 2.400 GHz F = 2.700 GHz S11 = -13.229 dB S11 = -11.059 dB -30 F (GHz) -35 -30 S11 (dB) -10m10 -10 -5 P1 - S11 return loss in f1 band S12 (dB) -5 -10 -15 -15 -20 m17 m16 -20 -25 -25 -30 F (GHz) -35 1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610 4/9 -30 F (GHz) -35 0 Doc ID 022548 Rev 1 1 2 3 4 5 6 DIP1524-01D3 Ordering information scheme Figure 14. P1-P2 - S12 isolation in f1 band -15 S12 (dB) -15 m20 m21 F = 2.400 GHz F = 2.700 GHz S23 = -19.224 dB S23 = -24.375 dB m20 -20 Figure 15. P1-P2 - S12 isolation in f2 band S12 (dB) -20 m18 m19 F = 1.575 GHz F = 1.605 GHz S12 = -22.399 dB S12 = -24.812 dB m18 m21 -25 -30 -30 F (GHz) -35 2.40 2 m19 -25 2.45 2.50 2.55 2.60 2.65 2.70 F (GHz) -35 1.570 1.575 1.580 1.585 1.590 1.595 1.600 1.605 1.610 Ordering information scheme Figure 16. Ordering information scheme DIP 15 24 01 D3 IPD family Diplexer f1 band f2 band Design version 1st version Package D3 = glass substrate Doc ID 022548 Rev 1 5/9 Package information 3 DIP1524-01D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 17. Package dimensions 630 µm 400 µm GND P3 1360 µm P1 P2 840 µm Figure 18. Footprint Figure 19. Marking Copper pad diameter: 220 µm recommended 260 µm maximum Dot, ST logo ECOPACK grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended 6/9 Doc ID 022548 Rev 1 x x z y ww DIP1524-01D3 Package information Figure 20. Tape and reel specifications Dot identifying Pin A1 location 2.0 Ø 1.50 4.0 8.0 3.5 1.46 1.75 0.20 ST ST ST xxz yww xxz yww xxz yww 0.94 4.0 0.75 All dimensions are typical values in mm Note: User direction of unreeling More information is available in the application note: AN2348, “IPAD™ 400 µm Flip Chip: package description and recommendations for use” Doc ID 022548 Rev 1 7/9 Ordering information 4 Ordering information Table 3. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode DIP1524-01D3 RT Flip Chip 1.35 mg 5000 Tape and reel (7”) Revision history Table 4. 8/9 DIP1524-01D3 Document revision history Date Revision 14-Feb-2012 1 Changes Initial release Doc ID 022548 Rev 1 DIP1524-01D3 Please Read Carefully: Information in this document is provided solely in connection with ST products. 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