ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 14-BIT, 190 MSPS ADC WITH DDR LVDS/CMOS OUTPUTS FEATURES • • • • • • • • • • • • • • • • • Maximum Sample Rate: 190 MSPS 14-Bit Resolution No Missing Codes Total Power Dissipation 1.1 W Internal Sample and Hold 73.2-dBFS SNR at 70-MHz IF 87-dBc SFDR at 70-MHz IF, 0 dB gain Double Data Rate (DDR) LVDS and Parallel CMOS Output Options Programmable Gain up to 6 dB for SNR/SFDR Trade-Off at High IF Reduced Power Modes at Lower Sample Rates Supports input clock amplitude down to 400 mVPP Clock Duty Cycle Stabilizer No External Reference Decoupling Required Internal and External Reference Support Programmable Output Clock position to ease data capture 3.3-V Analog and Digital Supply 48-QFN Package (7 mm × 7 mm) APPLICATIONS • • Wireless Communications Infrastructure Software Defined Radio • • • • • • Power Amplifier Linearization 802.16d/e Test and Measurement Instrumentation High Definition Video Medical Imaging Radar Systems DESCRIPTION ADS5546 is a high performance 14-bit, 190-MSPS A/D converter. It offers state-of-the art functionality and performance using advanced techniques to minimize board space. Using an internal sample and hold and low jitter clock buffer, the ADC supports both high SNR and high SFDR at high input frequencies. It features programmable gain options that can be used to improve SFDR performance at lower full-scale analog input ranges. In a compact 48-pin QFN, the device offers fully differential LVDS DDR (Double Data Rate) interface while parallel CMOS outputs can also be selected. Flexible output clock position programmability is available to ease capture and trade-off setup for hold times. At lower sampling rates, the ADC can be operated at scaled down power with no loss in performance. ADS5546 includes an internal reference, while eliminating the traditional reference pins and associated external decoupling. The device also supports an external reference mode. The device is specified over temperature range (-40°C to 85°C). the industrial Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2006, Texas Instruments Incorporated ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. CLKP DRGND DRVDD AGND AVDD ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. CLKOUTP CLOCKGEN CLKM CLKOUTM D0_D1_P D0_D1_M D2_D3_P D2_D3_M D4_D5_P D4_D5_M Digital Encoder and Serializer INP 14-Bit ADC SHA INM D6_D7_P D6_D7_M D8_D9_P D8_D9_M D10_D11_P D10_D11_M VCM Control Interface Reference D12_D13_P D12_D13_M OVR MODE OE DFS RESET SEN SDATA SCLK IREF ADS5546 LVDS MODE B0095-01 PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGELEAD ADS5546 QFN-48 (2) (1) (2) 2 PACKAGE DESIGNATOR RGZ SPECIFIED TEMPERATURE RANGE –40°C to 85°C PACKAGE MARKING AZ5546 ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS5546IRGZT Tape and Reel, 250 ADS5546IRGZR Tape and Reel, 2500 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. For thermal pad size on the package, see the mechanical drawings at the end of this data sheet. θJA = 25.41°C/W (0 LFM air flow), θJC = 16.5°C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in x 3 in PCB. Submit Documentation Feedback ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VALUE UNIT Supply voltage range, AVDD –0.3 V to 3.9 V Supply voltage range, DRVDD –0.3 V to 3.9 V Voltage between AGND and DRGND -0.3 to 0.3 V Voltage between AVDD to DRVDD -0.3 to 3.3 V Voltage applied to VCM pin (in external reference mode) -0.3 to 1.8 V –0.3 V to minimum (3.6, AVDD + 0.3 V) V Voltage applied to analog input pins, INP and INM Voltage applied to input clock pins, CLKP and CLKM TA Operating free-air temperature range TJ Operating junction temperature range Tstg Storage temperature range (1) -0.3 V to AVDD + 0.3 V V –40 to 85 °C 125 °C –65 to 150 °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT Analog supply voltage, AVDD 3 3.3 3.6 V Digital supply voltage, DRVDD 3 3.3 3.6 V SUPPLIES ANALOG INPUTS Differential input voltage range 2 VPP 1.5 ±0.1 Input common-mode voltage Voltage applied on VCM in external reference mode 1.45 1.5 V 1.55 V 50 190 MSPS 1 60 CLOCK INPUT Input clock sample rate DEFAULT SPEED mode LOW SPEED mode Input clock amplitude differential (V(CLKP) - V(CLKM)) Sine wave, ac-coupled 1.5 VPP LVPECL, ac-coupled 1.6 VPP LVDS, ac-coupled 0.7 VPP LVCMOS, single-ended, ac-coupled 3.3 V Input clock duty cycle (See Figure 34) 0.4 35% 50% 65% DIGITAL OUTPUTS CL Maximum external load capacitance from each output pin to DRGND (LVDS and CMOS modes) RL Differential load resistance between the LVDS output pairs (LVDS mode) Operating free-air temperature 5 Ω 100 –40 Submit Documentation Feedback pF 85 °C 3 ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 ELECTRICAL CHARACTERISTICS Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = DRVDD = 3.3 V, sampling rate = 190 MSPS, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0dB gain, DDR LVDS data output (unless otherwise noted) PARAMETER TEST CONDITIONS MIN RESOLUTION TYP MAX UNIT 14 bits Differential input voltage range 2 VPP Differential input capacitance 7 pF ANALOG INPUT Analog input bandwidth –3 dB, source impedance 50 Ω Analog input common mode current (per input pin) 500 MHz 310 µA REFERENCE VOLTAGES V(REFB) Internal reference bottom voltage Internal reference mode 0.5 V V(REFT) Internal reference top voltage Internal reference mode 2.5 V VCM Common mode output voltage Internal reference mode 1.5 V VCM output current capability Internal reference mode ±4 mA DC ACCURACY No Missing Codes DNL Differential non-linearity INL Integral non-linearity Specified Offset error 0.5 2.5 LSB –5 ±3 5 LSB 5 Offset temperature coefficient mV 0.002 ppm/°C ±1 Gain error Gain temperature coefficient PSRR –0.9 DC Power supply rejection ratio %FS 0.01 ∆%/°C 0.6 mV/V POWER SUPPLY I(AVDD) I(DRVDD) ICC 4 Analog supply current Digital supply current 291 mA LVDS mode, IO = 3.5 mA, RL = 100 Ω, CL = 5 pF 51 mA CMOS mode, FIN = 2.5 MHz, CL = 5 pF 43 mA mA Total supply current LVDS mode 342 Total power dissipation LVDS mode 1.13 1.29 W Standby power In STANDBY mode with clock running 100 150 mW Clock stop power With input clock stopped 100 150 mW Submit Documentation Feedback ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 ELECTRICAL CHARACTERISTICS Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = DRVDD = 3.3 V, sampling rate = 190 MSPS, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0dB gain, DDR LVDS data output (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT AC CHARACTERISTICS FIN = 10 MHz 73.8 FIN = 40 MHz 73.6 FIN = 70 MHz SNR Signal to noise ratio 73 FIN = 150 MHz 72.2 FIN = 300 MHz 0 dB gain, 2 VPP FS (1) 71 3 dB gain, 1.4 VPP FS 69.8 0 dB gain, 2 VPP FS 69 Inputs tied to common-mode 1.1 FIN = 10 MHz 90 77 FIN = 100 MHz FIN = 300 MHz 84 0 dB gain, 2 VPP FS 75 3 dB gain, 1.4 VPP FS 78 0 dB gain, 2 VPP FS 72 3 dB gain, 1.4 VPP FS 73.5 FIN = 40 MHz 73.1 FIN = 70 MHz 71 FIN = 100 MHz Signal to noise and distortion ratio FIN = 300 MHz 71.8 0 dB gain, 2 VPP FS Second harmonic 68.5 0 dB gain, 2 VPP FS 67.8 3 dB gain, 1.4 VPP FS 67.5 FIN = 10 MHz 92 FIN = 40 MHz 91 90 89 FIN = 150 MHz 87 FIN = 300 MHz (1) 77 FIN = 100 MHz FIN = 225 MHz dBFS 69 3 dB gain, 1.4 VPP FS FIN = 70 MHz HD2 72.8 72.1 FIN = 150 MHz FIN = 225 MHz dBc 75 FIN = 10 MHz SINAD 87 84 FIN = 150 MHz FIN = 225 MHz LSB 89 FIN = 70 MHz Spurious free dynamic range dBFS 70 3 dB gain, 1.4 VPP FS FIN = 40 MHz SFDR 73.5 FIN = 100 MHz FIN = 225 MHz RMS output noise 71.5 0 dB gain, 2 VPP FS 76 3 dB gain, 1.4 VPP FS 79 0 dB gain, 2 VPP FS 73 3 dB gain, 1.4 VPP FS 75 dBc FS = Full scale range Submit Documentation Feedback 5 ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 ELECTRICAL CHARACTERISTICS (continued) Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = DRVDD = 3.3 V, sampling rate = 190 MSPS, sine wave input clock, 1.5 VPP differential clock amplitude, 50% clock duty cycle, –1 dBFS differential analog input, internal reference mode, 0dB gain, DDR LVDS data output (unless otherwise noted) PARAMETER TEST CONDITIONS MIN FIN = 10 MHz 84 84 0 dB gain, 2 VPP FS 75 3 dB gain, 1.4 VPP FS 78 0 dB gain, 2 VPP FS 72 3 dB gain, 1.4 VPP FS 74 FIN = 10 MHz 93 FIN = 40 MHz 92 FIN = 70 MHz 91 FIN = 100 MHz 90 FIN = 150 MHz 89 FIN = 225 MHz 87 FIN = 300 MHz 87 FIN = 10 MHz 85 FIN = 40 MHz 85 FIN = 70 MHz THD Total harmonic distortion IMD PSRR 6 Effective number of bits Two-tone intermodulation distortion 75 81 FIN = 150 MHz 80 FIN = 225 MHz 72 FIN = 10 MHz FIN1 = 50.09 MHz, FIN2 = 46.09 MHz, -7 dBFS each tone dBc dBc 83 FIN = 100 MHz FIN = 300 MHz ENOB 87 FIN = 150 MHz FIN = 300 MHz Worst harmonic (other than HD2, HD3) 77 FIN = 100 MHz FIN = 225 MHz UNIT 89 FIN = 70 MHz Third harmonic MAX 90 FIN = 40 MHz HD3 TYP dBc 68 11.8 bits 95 dBFS FIN1 = 135.08 MHz, FIN2 = 130.08 MHz, -7 dBFS each tone 89 AC power supply rejection ratio 30 MHz, 200 mVPP signal on 3.3-V supply 35 dBc Voltage overload recovery time Recovery to 1% (of final value) for 6-dB overload with sine-wave input at Nyquist frequency 1 Clock cycles Submit Documentation Feedback ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 DIGITAL CHARACTERISTICS (1) The DC specifications refer to the condition where the digital outputs are not switching, but are permanently at a valid logic level 0 or 1 AVDD = DRVDD = 3.3 V, IO = 3.5 mA, RL = 100 Ω (2) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT DIGITAL INPUTS High-level input voltage 2.4 V Low-level input voltage 0.8 V High-level input current 33 µA Low-level input current –33 µA 4 pF High-level output voltage 3.3 V Low-level output voltage 0 V 2 pF 1375 mV 1025 mV 350 mV 1200 mV 2 pF Input capacitance DIGITAL OUTPUTS – CMOS MODE Output capacitance Output capacitance inside the device, from each output to ground DIGITAL OUTPUTS – LVDS MODE High-level output voltage Low-level output voltage Output differential voltage, |VOD| 225 VOS Output offset voltage, single-ended Common-mode voltage of OUTP and OUTM Output capacitance Output capacitance inside the device, from either output to ground (1) (2) All LVDS and CMOS specifications are characterized, but not tested at production. IO refers to the LVDS buffer current setting, RL is the differential load resistance between the LVDS output pair. TIMING CHARACTERISTICS – LVDS AND CMOS MODES (1) Typical values are at 25°C, min and max values are across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = DRVDD = 3.3 V, sampling frequency = 190 MSPS, sine wave input clock, 1.5 VPP clock amplitude, CL = 5 pF (2), IO = 3.5 mA, RL = 100 Ω (3), no internal termination, unless otherwise noted. For timings at lower sampling frequencies, see the Output Timing section in the APPLICATION INFORMATION of this data sheet. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ta Aperture delay 1.2 ns tj Aperture jitter 150 fs rms Wake-up time Time to valid data after coming out of STANDBY mode 100 Time to valid data after stopping and restarting the input clock 100 µs Latency 14 clock cycles DDR LVDS MODE (4) Data setup time (5) Data valid 1.2 1.7 ns th Data hold time (5) Zero-cross of CLKOUTP to data becoming invalid (6) 0.4 0.9 ns tPDI Clock propagation delay Input clock rising edge zero-cross to output clock rising edge zero-cross 4 4.7 tsu (1) (2) (3) (4) (5) (6) (6) to zero-cross of CLKOUTP 5.4 ns Timing parameters are specified by design and characterization and not tested in production. CL is the effective external single-ended load capacitance between each output pin and ground. IO refers to the LVDS buffer current setting; RL is the differential load resistance between the LVDS output pair. Measurements are done with a transmission line of 100 Ω characteristic impedance between the device and the load. Setup and hold time specifications take into account the effect of jitter on the output data and clock. These specifications also assume that the data and clock paths are perfectly matched within the receiver. Any mismatch in these paths within the receiver would appear as reduced timing margin. Data valid refers to logic high of +50 mV and logic low of –50 mV. Submit Documentation Feedback 7 ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 TIMING CHARACTERISTICS – LVDS AND CMOS MODES (continued) For timings at lower sampling frequencies, see the Output Timing section in the APPLICATION INFORMATION of this data sheet. PARAMETER TEST CONDITIONS MIN TYP MAX 45% 50% 55% UNIT LVDS bit clock duty cycle Duty cycle of differential clock, (CLKOUTP-CLKOUTM) 80 ≤ Fs ≤ 190 MSPS tr , tf Data rise time, Data fall time Rise time measured from –50 mV to 50 mV Fall time measured from 50 mV to –50 mV 1 ≤ Fs ≤ 190 MSPS 50 100 200 ps tCLKRISE, tCLKFALL Output clock rise time, Output clock fall time Rise time measured from –50 mV to 50 mV Fall time measured from 50 mV to –50 mV 1 ≤ Fs ≤ 190 MSPS 50 100 200 ps tOE Output enable (OE) to valid data delay Time to valid data after OE becomes active 1 µs PARALLEL CMOS MODE tsu (5) (5) Data valid (7) to 50% of CLKOUT rising edge 2.2 3 ns 50% of CLKOUT rising edge to data becoming invalid (7) 0.5 0.9 ns 2.4 3.2 th Data hold time tPDI Clock propagation delay Input clock rising edge zero-cross to 50% of CLKOUT rising edge Output clock duty cycle Duty cycle of output clock (CLKOUT) 80 ≤ Fs ≤ 190 MSPS tr, tf Data rise time, Data fall time Rise time measured from 20% to 80% of DRVDD Fall time measured from 80% to 20% of DRVDD 1 ≤ Fs ≤ 190 MSPS 0.8 tCLKRISE, tCLKFALL Output clock rise time, Output clock fall time Rise time measured from 20% to 80% of DRVDD Fall time measured from 80% to 20% of DRVDD 1 ≤ Fs ≤ 190 MSPS 0.4 tOE Output enable (OE) to valid data delay Time to valid data after OE becomes active (7) 8 Data setup time Data valid refers to logic high of 2 V and logic low of 0.8 V Submit Documentation Feedback 4 ns 1.5 2 ns 0.8 1.2 ns 50 ns 45% ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 N+4 N+3 N+2 N+1 Sample N N+17 N+16 N+15 N+14 Input Signal ta Input Clock CLKP CLKM CLKOUTM CLKOUTP tsu Output Data DXP, DXM E E O E – Even Bits D0,D2,D4,D6,D8,D10,D12 O – Odd Bits D1,D3,D5,D7,D9,D11,D13 O N–14 E O N–13 E E O N–12 tPDI th 14 Clock Cycles DDR LVDS E O N–11 E O N–10 O E O N N–1 E E O O N+2 N+1 tPDI CLKOUT tsu Parallel CMOS 14 Clock Cycles Output Data D0–D13 N–13 N–14 N–12 th N–11 N–10 N N–1 N+1 N+2 Figure 1. Latency Input Clock CLKM CLKP tPDI Output Clock CLKOUTP CLKOUTM tsu th tsu Output Data Pair (1) (2) Dn Dn_Dn+1_P, Dn_Dn+1_M th Dn (1) Dn+1 (2) – Bits D0, D2, D4, D6, D8, D10, D12 Dn+1 – Bits D1, D3, D5, D7, D9, D11, D13 T0106-01 Figure 2. LVDS Mode Timing Submit Documentation Feedback 9 ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 CLKM Input Clock CLKP tPDI Output Clock CLKOUT th tsu Output Data Dn Dn (1) (1) Dn – Bits D0–D13 T0107-01 Figure 3. CMOS Mode Timing 10 Submit Documentation Feedback ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 DEVICE PROGRAMMING MODES ADS5546 offers flexibility with several programmable features that are easily configured. The device can be configured independently using either a parallel interface control or a serial interface programming. In addition, the device supports a third mode, where both the parallel interface and the serial control registers are used. In this mode, the priority between the parallel and serial interfaces is determined by a priority table (Table 2). If this additional level of flexibility is not required, the user can select either the serial interface programming or the parallel interface control. USING PARALLEL INTERFACE CONTROL ONLY To control the device using the parallel interface, keep RESET tied to high (DRVDD). Pins DFS, MODE, SEN, SCLK, and SDATA are used to directly control certain modes of the ADC. The device is configured by connecting the parallel pins to the correct voltage levels (as described in Table 4 to Table 7). There is no need to apply reset. In this mode, SEN, SCLK, and SDATA function as parallel interface control pins. Frequently used functions are controlled in this mode—standby, selection between LVDS/CMOS output format, internal/external reference, two's complement/straight binary output format, and position of the output clock edge. Table 1 has a description of the modes controlled by the four parallel pins. Table 1. Parallel Pin Definition PIN DFS MODE CONTROL MODES DATA FORMAT and the LVDS/CMOS output interface Internal or external reference SEN CLKOUT edge programmability SCLK LOW SPEED mode control for low sampling frequencies (< 50 MSPS) SDATA STANDBY mode – Global (ADC, internal references and output buffers are powered down) USING SERIAL INTERFACE PROGRAMMING ONLY To program using the serial interface, the internal registers must first be reset to their default values, and the RESET pin must be kept low. In this mode, SEN, SDATA, and SCLK function as serial interface pins and are used to access the internal registers of ADC. The registers are reset either by applying a pulse on the RESET pin, or by a high setting on the <RST> bit (D1 in register 0x6C). The serial interface section describes the register programming and register reset in more detail. Since the parallel pins DFS and MODE are not used in this mode, they must be tied to ground. USING BOTH THE SERIAL INTERFACE AND PARALLEL CONTROLS For increased flexibility, a combination of serial interface registers and parallel pin controls (DFS, MODE) can also be used to configure the device. The serial registers must first be reset to their default values, and the RESET pin must be kept low. In this mode SEN, SDATA, and SCLK function as serial interface pins and are used to access the internal registers of ADC. The registers are reset either by applying a pulse on RESET pin or by a high setting on the <RST> bit (D1 in register 0x6C). The serial interface section describes the register programming and register reset in more detail. The parallel interface control pins DFS and MODE are used, and their function is determined by the appropriate voltage levels as described in Table 6 and Table 7. The voltage levels are derived by using a resistor string as illustrated in Figure 4. Since some functions are controlled using both the parallel pins and serial registers, the priority between the two is determined by a priority table (Table 2). Submit Documentation Feedback 11 ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 Table 2. Priority Between Parallel Pins and Serial Registers PIN MODE FUNCTIONS SUPPORTED PRIORITY Internal/External reference When using the serial interface, bit <REF> (register 0x6D, bit D4) controls this mode, ONLY if the MODE pin is tied low. DATA FORMAT When using the serial interface, bit <DF> (register 0x63, bit D3) controls this mode, ONLY if the DFS pin is tied low. LVDS/CMOS When using the serial interface, bit <ODI> (register 0x6C, bits D3-D4) controls LVDS/CMOS selection independent of the state of DFS pin DFS AVDD (2/3) AVDD R (2/3) AVDD GND R AVDD (1/3) AVDD (1/3) AVDD R To Parallel Pin Figure 4. Simple Scheme to Configure Parallel Pins 12 Submit Documentation Feedback ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 DESCRIPTION OF PARALLEL PINS Table 3. SCLK Control Pin SCLK (Pin 29) 0 DRVDD DESCRIPTION DEFAULT SPEED - Must be used for sampling frequency > 50 MSPS LOW SPEED - Must be used for sampling frequency <= 50 MSPS Table 4. SDATA Control Pin SDATA (Pin 28) 0 DRVDD DESCRIPTION Normal operation (Default) STANDBY. This is a global power down, where ADC, internal references and the output buffers are powered down. Table 5. SEN Control Pin SEN (Pin 27) CMOS mode: CLKOUT edge later by (3/12)Ts (1); LVDS mode: CLKOUT edge aligned with data transition (1/3)DRVDD CMOS mode: CLKOUT edge later by (2/12)Ts (1); LVDS mode: CLKOUT edge aligned with data transition (2/3)DRVDD CMOS mode: CLKOUT edge later by (1/12)Ts (1); LVDS mode: CLKOUT edge earlier by (1/12)Ts DRVDD (1) DESCRIPTION 0 (1) Default CLKOUT position Ts = 1/Sampling Frequency Table 6. DFS Control Pin DFS (Pin 6) 0 DESCRIPTION 2's complement data and DDR LVDS output (Default) (1/3)DRVDD 2's complement data and parallel CMOS output (2/3)DRVDD Offset binary data and parallel CMOS output DRVDD Offset binary data and DDR LVDS output Table 7. MODE Control Pin MODE (Pin 23) DESCRIPTION 0 Internal reference (1/3)AVDD External reference (2/3)AVDD External reference AVDD Internal reference SERIAL INTERFACE The ADC has a set of internal registers, which can be accessed through the serial interface formed by pins SEN (Serial interface Enable), SCLK (Serial Interface Clock), SDATA (Serial Interface Data) and RESET. After device power-up, the internal registers must be reset to their default values by applying a high-going pulse on RESET (of width greater than 10 ns). Serial shift of bits into the device is enabled when SEN is low. Serial data SDATA is latched at every falling edge of SCLK when SEN is active (low). The serial data is loaded into the register at every 16th SCLK falling edge when SEN is low. If the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data is loaded in multiples of 16-bit words within a single active SEN pulse. The first 8 bits form the register address and the remaining 8 bits form the register data. Submit Documentation Feedback 13 ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 REGISTER INITIALIZATION After power-up, the internal registers must be reset to their default values. This is done in one of two ways: 1. Either through hardware reset by applying a high-going pulse on RESET pin (of width greater than 10 ns) as shown in Figure 5. OR 2. By applying software reset. Using the serial interface, set the <RST> bit (D1 in register 0x6C) to high. This initializes the internal registers to their default values and then self-resets the <RST> bit to low. In this case the RESET pin is kept low. Register Address SDATA A7 A6 A5 A4 A3 A2 Register Data A1 A0 D7 t(SCLK) D6 D5 D4 D3 D2 D1 D0 t(DH) t(DSU) SCLK t(SLOADH) t(SLOADS) SEN RESET T0109-01 Figure 5. Serial Interface Timing Diagram SERIAL INTERFACE TIMING CHARACTERISTICS Typical values at 25°C, min and max values across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = DRVDD = 3.3 V (unless otherwise noted) MIN tSCLK SCLK period TYP 50 SCLK duty cycle MAX UNIT ns 50% tSLOADS SEN to SCLK setup time 25 ns tSLOADH SCLK to SEN hold time 25 ns tDSU SDATA setup time 25 ns tDH SDATA hold time 25 ns 14 Submit Documentation Feedback ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 RESET TIMING Typical values at 25°C, min and max values across the full temperature range TMIN = –40°C to TMAX = 85°C, AVDD = DRVDD = 3.3 V (unless otherwise noted) PARAMETER TEST CONDITIONS t1 Power-on delay Delay from power-up of AVDD and DRVDD to RESET pulse active MIN t2 Reset pulse width t3 tPO TYP MAX UNIT 5 ms Pulse width of active RESET signal 10 ns Register write delay Delay from RESET disable to SEN active 25 ns Power-up time Delay from power-up of AVDD and DRVDD to output stable 6.5 ms Power Supply AVDD, DRVDD t1 RESET t2 t3 SEN T0108-01 NOTE: A high-going pulse on RESET pin is required in serial interface mode in case of initialization through hardware reset. For parallel interface operation, RESET has to be tied permanently HIGH. Figure 6. Reset Timing Diagram Submit Documentation Feedback 15 ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 DESCRIPTION OF SERIAL REGISTERS Table 8 gives a summary of all the modes that can be programmed through the serial interface. Table 8. Serial Interface Register Map REGISTER ADDRESS A7 A6 A5 A4 A3 A2 REGISTER DATA A1 A0 D7 D6 D5 D4 D3 D2 D1 DESCRIPTION D0 <STBY> – Global Power Down 0 1 1 0 0 0 1 1 0 0 0 1 1 0 0 0 1 1 1 0 0 0 0 0 0 0 NORMAL converter operation (Default after reset) 0 0 0 0 0 0 STANDBY 1 0 Resets all registers to default values <RST> – Software Reset 0 1 1 0 1 1 0 0 0 0 0 0 0 0 <DF> – Output Data Format 0 1 1 0 0 0 1 1 0 0 0 0 0 0 0 0 2's complement output format (Default after reset) 0 1 1 0 0 0 1 1 0 0 0 0 1 0 0 0 Straight binary output format <ODI> – Output Data Interface 0 1 1 0 1 1 0 0 0 0 0 0 1 0 0 0 DDR LVDS outputs (D4:D3 defaults to 00 after reset) 0 1 1 0 1 1 0 0 0 0 0 1 1 0 0 0 Parallel CMOS outputs <REF> –Internal/External reference mode 0 1 1 0 1 1 0 1 0 0 0 0 0 0 0 0 Internal reference (Default after reset) 0 1 1 0 1 1 0 1 0 0 0 1 0 0 0 0 External reference – Force voltage on VCM pin 0 1 1 0 0 1 0 1 0 0 0 0 0 0 0 0 Normal operation (Default after reset) 0 1 1 0 0 1 0 1 0 0 1 0 0 0 0 0 All zeros 0 1 1 0 0 1 0 1 0 1 0 0 0 0 0 0 All ones 0 1 1 0 0 1 0 1 0 1 1 0 0 0 0 0 Toggle pattern Alternate 1s and 0s on each data output and across the data outputs. 0 1 1 0 0 1 0 1 1 0 0 0 0 0 0 0 Ramp pattern – Output data ramps from 0x0000 to 0x3FFF every clock cycle 0 1 1 0 0 1 0 1 1 0 1 0 0 0 0 0 Custom pattern. Write the custom pattern in CUSTOM PATTERN registers A and B. 0 1 1 0 0 1 0 1 X X X 0 0 0 0 0 NOT USED <TEST PATTERN> – Output test pattern on data outputs <CUSTOM PATTERN> – Output custom pattern on data outputs 0 1 1 0 1 0 0 1 D7 D6 D5 D4 D3 D2 D1 D0 CUSTOM PATTERN D7-D0 0 1 1 0 1 0 1 0 0 0 D13 D12 D11 D10 D9 D8 CUSTOM PATTERN D13-D8 <CLK GAIN> – Clock Buffer gain programmability, Gain decreases monotonically from Gain 4 to Gain 0 0 1 1 0 1 0 1 1 0 0 1 1 0 0 1 0 Gain 4 0 1 1 0 1 0 1 1 0 0 1 0 1 0 1 0 Gain 3 0 1 1 0 1 0 1 1 0 0 1 0 0 1 1 0 Gain 2 0 1 1 0 1 0 1 1 0 0 1 0 0 0 0 0 Gain 1 (Default after reset) 0 1 1 0 1 0 1 1 0 0 1 0 0 0 1 1 Gain 0 Minimum gain <POWER SCALING> Power scaling vs sampling frequency. The ADC can be operated at reduced power at lower sampling rates with no loss in performance. 16 0 1 1 0 1 1 0 1 0 0 1 0 0 0 0 0 Default Fs > 150 MSPS (Default after reset) 0 1 1 0 1 1 0 1 1 0 1 0 0 0 0 0 Power Mode 1 – 105 < Fs ≤ 150 MSPS 0 1 1 0 1 1 0 1 0 1 1 0 0 0 0 0 Power Mode 2 – 50 < Fs ≤ 105 MSPS 0 1 1 0 1 1 0 1 1 1 1 0 0 0 0 0 Power Mode 3 – Fs ≤ 50 MSPS Submit Documentation Feedback ADS5546 www.ti.com SLWS183C – NOVEMBER 2005 – REVISED OCTOBER 2006 Table 8. Serial Interface Register Map (continued) REGISTER ADDRESS A7 A6 A5 A4 A3 A2 REGISTER DATA A1 A0 D7 D6 D5 D4 D3 D2 D1 DESCRIPTION D0 <GAIN> Gain programming - Channel gain can be programmed from 0 to 6 dB for SFDR/SNR trade-off. For each gain setting, the input full-scale range has to be proportionally scaled. For 6 dB gain, the full-scale range will be 1 VPP compared to 2 VPP at 0 dB gain. 0 1 1 0 1 0 0 0 0 0 0 0 1 0 0 0 0 dB (Default after reset) 0 1 1 0 1 0 0 0 0 0 0 0 1 0 0 1 1 dB 0 1 1 0 1 0 0 0 0 0 0 0 1 0 1 0 2 dB 0 1 1 0 1 0 0 0 0 0 0 0 1 0 1 1 3 dB 0 1 1 0 1 0 0 0 0 0 0 0 1 1 0 0 4 dB 0 1 1 0 1 0 0 0 0 0 0 0 1 1 0 1 5 dB 0 1 1 0 1 0 0 0 0 0 0 0 1 1 1 0 6 dB <LVDS CURRENT> – LVDS Output data and clock buffers nominal current programmability 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 3.5 mA (Default after reset) 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 2.5 mA 0 1 1 1 1 1 1 0 0 0 0 0 0 0 1 0 4.5 mA 0 1 1 1 1 1 1 0 0 0 0 0 0 0 1 1 1.75 mA <CURRENT DOUBLE> – The output data and clock buffer currents are doubled from the value selected by the <LVDS CURRENT> register. 0 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 value specified by <LVDS CURRENT> (Default after reset) 0 1 1 1 1 1 1 1 0 1 0 0 0 0 0 0 2x data, 2x clock currents 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 1x data, 2x clock currents 0 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 2x data, 4x clock currents <DATA TERM> Internal termination - Option to terminate the LVDS DATA buffers inside the ADC to improve signal integrity. By default, internal termination is disabled. 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 No termination (Default after reset) 0 1 1 1 1 1 1 0 0 0 1 0 0 0 0 0 325 Ω 0 1 1 1 1 1 1 0 0 1 0 0 0 0 0 0 200 Ω 0 1 1 1 1 1 1 0 0 1 1 0 0 0 0 0 125 Ω 0 1 1 1 1 1 1 0 1 0 0 0 0 0 0 0 170 Ω 0 1 1 1 1 1 1 0 1 0 1 0 0 0 0 0 120 Ω 0 1 1 1 1 1 1 0 1 1 0 0 0 0 0 0 100 Ω 0 1 1 1 1 1 1 0 1 1 1 0 0 0 0 0 75 Ω <CLK TERM> Internal termination - Option to terminate the LVDS CLK buffers inside the ADC to improve signal integrity. By default, internal termination is disabled. 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 No termination (Default after reset) 0 1 1 1 1 1 1 0 0 0 0 0 0 1 0 0 325 Ω 0 1 1 1 1 1 1 0 0 0 0 0 1 0 0 0 200 Ω 0 1 1 1 1 1 1 0 0 0 0 0 1 1 0 0 125 Ω 0 1 1 1 1 1 1 0 0 0 0 1 0 0 0 0 170 Ω 0 1 1 1 1 1 1 0 0 0 0 1 0 1 0 0 120 Ω 0 1 1 1 1 1 1 0 0 0 0 1 1 0 0 0 100 Ω 0 1 1 1 1 1 1 0 0 0 0 1 1 1 0 0 75 Ω <CLK