bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com 2-Series, 3-Series, and 4-Series Li-Ion Battery Pack Manager Check for Samples: bq3050 FEATURES 1 • • • • • • • • • • • Fully Integrated 2-Series, 3-Series, and 4-Series Li-Ion or Li-Polymer Cell Battery Pack Manager and Protection Advanced Compensated End-of-Discharge Voltage (CEDV) Gauging High Side N-CH Protection FET Drive Integrated Pre-Charge FET Integrated Cell Balancing Low Power Modes – Low Power: < 180 µA – Sleep < 76 µA Full Array of Programmable Protection Features – Voltage – Current – Temperature Sophisticated Charge Algorithms – JEITA – Enhanced Charging – Adaptive Charging Supports Two-Wire SMBus v1.1 Interface SHA-1 Authentication Compact Package: 38-Lead TSSOP DESCRIPTION The bq3050 device is a fully integrated, single-chip, pack-based solution that provides a rich array of features for gas gauging, protection, and authentication for 2-series, 3-series, and 4-series cell Li-Ion and Li-Polymer battery packs. Using its integrated high-performance analog peripherals, the bq3050 device measures and maintains an accurate record of available capacity, voltage, current, temperature, and other critical parameters in Li-Ion or Li-Polymer batteries, and reports this information to the system host controller over an SMBus v1.1 compatible interface. The bq3050 provides software-based 1st-level and 2nd-level safety protection for overvoltage, undervoltage, overtemperature, and overcharge conditions, as well as hardware-based protection for overcurrent in discharge and short circuit in charge and discharge conditions. SHA-1 authentication with secure memory for authentication keys enables identification of genuine battery packs beyond any doubt. The compact 38-lead TSSOP package minimizes solution cost and size for smart batteries while providing maximum functionality and safety for battery gauging applications. APPLICATIONS • • • Notebook/Netbook PCs Medical and Test Equipment Portable Instrumentation 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION TA PART NUMBER –40°C to 85°C bq3050 (1) (2) (3) PACKAGE PACKAGE DESIGNATOR PACKAGE MARKING TSSOP-38 DBT bq3050 ORDERING INFORMATION (1) TUBE (2) TAPE AND REEL (3) bq3050DBT bq3050DBTR For the most current package and ordering information, see the Package Option Addendum at the end of the document, or see the TI website at www.ti.com. A single tube quantity is 50 units. A single reel quantity is 2000 units. THERMAL INFORMATION bq3050 THERMAL METRIC (1) TSSOP UNITS 38 PINS θJA, High K Junction-to-ambient thermal resistance (2) θJC(top) Junction-to-case(top) thermal resistance θJB Junction-to-board thermal resistance ψJT Junction-to-top characterization parameter ψJB Junction-to-board characterization parameter (3) (4) (5) (6) (7) 2 16.5 (4) 31.2 (5) (6) θJC(bottom) (1) (2) 64.2 (3) Junction-to-case(bottom) thermal resistance (7) 0.3 °C/W 26.9 n/a For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com TYPICAL IMPLEMENTATION VLED 0.1 μF 0.1 μF 10 kΩ PACK + 300 Ω 3 MΩ 3 MΩ 0.1 μF 10 kΩ PCHGIN PACK LED5 LED3 LED4 LED2 LED1 VCC 0.1 μF 5.1 kΩ DSG BAT PCR 20 kΩ FUSE 20 kΩ CHG 5.1 kΩ 0.1 μF 220 kΩ GPOD 1 kΩ 1 μF FUSE Control Internal PCHG FET High Side N-CH FET Drive LED Drive Charging Algorithms Cell Balancing AFE H/W Control Watchdog SHA-1 Authentication System Control RBI VC1 0.1 μF CD VH 1 kΩ 100 Ω 0.1 μF REG25 1 μF VC2 OUT 0.22 μF VDD 2nd VM Level Protector VL 0.1 μF REG33 100 Ω 1 kΩ 0.1 μF Cell Voltage Mux/ Translation CEDV Gauging H/W Overcurrent/ Shortcircuit Protection Voltage Measurement Overvoltage/ Undervoltage Protection Overtemperature Protection Coulomb Counting Overcurrent Protection Temperature Measurement VC3 1 kΩ VC4 VB 1 kΩ 0.1 nF SMBD 100 Ω 0.1 μF GND 1 μF 2.5V LDO 3.3V LDO TEST 200 Ω 100 Ω 200 Ω 100 Ω SMBC DISP 100 Ω 0.1 μF SMBD SMBC DISP SMBus 1.1 PRES PRES 0.1 μF 0.1 μF 100 Ω 0.1 μF TS2 SRN 10 kΩ SRP TS1 VSS 10 kΩ 10 kΩ 100 Ω 5.6 V 1 kΩ 0.1 nF 100 Ω 5 mΩ PACK- Figure 1. bq3050 Implementation Copyright © 2011, Texas Instruments Incorporated 3 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com Pin-Out Diagram CHG 1 38 DSG PCR 2 37 PACK BAT 3 36 GPOD VC1 4 35 VCC VC2 5 34 PCHGIN VC3 6 33 FUSE VC4 7 32 TEST VSS 8 31 REG33 VSS 9 30 VSS TS1 10 29 VSS SRP 11 28 REG25 NC 12 27 RBI SRN 13 26 LED1 NC 14 25 LED2 TS2 15 24 LED3 PRES ¯¯¯¯¯ 16 23 LED4 SMBD 17 22 LED5 NC 18 21 NC SMBC 19 20 ¯¯¯¯ DISP Figure 2. bq3050 Pin-Out Diagram PIN FUNCTIONS PIN NAME PIN NUMBER TYPE (1) DESCRIPTION bq3050-DBT (1) 4 CHG 1 O Charge N-FET gate drive PCR 2 O Internal Pre-Charge FET output BAT 3 P Alternate power source VC1 4 I Sense input for positive voltage of top most cell in stack and cell balancing input for top most cell in stack VC2 5 I Sense input for positive voltage of third lowest cell in stack and cell balancing input for third lowest cell in stack VC3 6 I Sense input for positive voltage of second lowest cell in stack and cell balancing input for second lowest cell in stack VC4 7 I Sense input for positive voltage of lowest cell in stack and cell balancing input for lowest cell in stack VSS 8 P Device ground VSS 9 P Device ground TS1 10 AI Temperature sensor 1 thermistor input SRP 11 AI Differential Coulomb Counter input NC 12 — Not internally connected, connect to VSS SRN 13 AI Differential Coulomb Counter input NC 14 — Not internally connected, connect to VSS TS2 15 AI Temperature sensor 2 thermistor input PRES 16 I SMBD 17 I/OD Host system present input SMBus v1.1 data line P = Power Connection, O = Digital Output, AI = Analog Input, I = Digital Input, I/OD = Digital Input/Output Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com PIN FUNCTIONS (continued) PIN NAME PIN NUMBER TYPE (1) DESCRIPTION bq3050-DBT NC 18 — SMBC 19 I/OD DISP 20 I Not internally connected, connect to VSS SMBus v1.1 clock line Display active input NC 21 — Not internally connected, connect to VSS LED5 22 O LED display constant current sink LED4 23 O LED display constant current sink LED3 24 O LED display constant current sink LED2 25 O LED display constant current sink LED1 26 O LED display constant current sink RBI 27 P RAM backup REG25 28 P 2.5-V regulator output VSS 29 P Device ground VSS 30 P Device ground REG33 31 P 3.3-V regulator output TEST 32 — Test pin, connect to VSS through 10-kΩ resistor FUSE 33 O Fuse drive PCHGIN 34 I Internal Pre-Charge FET input VCC 35 P Power supply voltage GPOD 36 I/OD PACK 37 P Alternate power source DSG 38 O Discharge N-FET gate drive Copyright © 2011, Texas Instruments Incorporated High voltage general purpose I/O 5 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range (unless otherwise noted) (1) DESCRIPTION PINS VALUE Supply voltage range, VMAX VCC, PCHGIN, PCR, TEST, PACK w.r.t. Vss –0.3 V to 34 V Input voltage range, VIN VC1, BAT VVC2 – 0.3 V to VVC2 + 8.5 V or 34 V , whichever is lower VC2 VVC3 – 0.3 V to VVC3 + 8.5 V VC3 VVC4 – 0.3 V to VVC4 + 8.5 V VC4 VSRP – 0.3 V to VSRP + 8.5 V SRP, SRN –0.3 V to 0.3 V LED1, LED2, LED3, LED4, LED5, SMBC, SMBD VSS – 0.3 V to 6.0 V DISP,TS1, TS2, PRES –0.3 V to VREG25 + 0.3 V DSG –0.3 V to VPACK + 20 V or VSS + 34 V, whichever is lower CHG –0.3 V to VBAT + 20 V or VSS + 34 V, whichever is lower GPOD, FUSE –0.3 V to 34 V RBI, REG25 –0.3 V to 2.75 V REG33 –0.3 V to 5.0 V Output voltage range, VO Maximum VSS current, ISS 50 mA Current for cell balancing, ICB ESD Rating 10 mA HBM, VCx Only 1 kV Functional Temperature, TFUNC –40 to 110°C Storage temperature range, TSTG –65 to 150°C Lead temperature (soldering, 10 s), TSOLDER 300°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) MIN Supply voltage VCC, PACK, PCHGIN, PCR VSTARTUP VIN Input voltage range TYP MAX UNIT 25 V BAT 3.8 Start up voltage at PACK 3.0 5.5 V VC1, BAT VVC2 VVC2 + 5.0 V VC2 VVC3 VVC3 + 5.0 VC3 VVC4 VVC4 + 5.0 VC4 VSRP VSRP + 5.0 0 5.0 VCn – VC(n+1), (n=1, 2, 3, 4) PACK SRP to SRN VVC2 + 5.0 25 –0.2 0.2 V CREG33 External 3.3V REG capacitor 1 µF CREG25 External 2.5V REG capacitor 1 µF TOPR Operating temperature 6 –40 85 °C Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: Supply Current Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER ICC TEST CONDITIONS MIN TYP MAX UNIT Normal CHG on, DSG on, no Flash write 410 µA Sleep CHG on, DSG on, no SBS communication 160 µA CHG off, DSG off, no SBS communication 80 µA Shutdown 1 µA ELECTRICAL CHARACTERISTICS: Power On Reset (POR) Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) MIN TYP MAX UNIT VIT– Negative-going voltage input PARAMETER At REG25 TEST CONDITIONS 1.9 2.0 2.1 V VHYS POR Hysteresis At REG25 65 125 165 mV ELECTRICAL CHARACTERISTICS: WAKE FROM SLEEP Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER VWAKE VWAKE Threshold MIN TYP MAX UNIT VWAKE = 1.2 mV TEST CONDITIONS 0.2 1.2 2.0 mV VWAKE = 2.4 mV 0.4 2.4 3.6 VWAKE = 5 mV 2.0 5.0 6.8 VWAKE = 10 mV 5.3 10 13 VWAKE_TCO Temperature drift of VWAKE accuracy 0.5 tWAKE Time from application of current and wake of bq3050 0.2 %/°C 1 ms ELECTRICAL CHARACTERISTICS: RBI RAM Backup Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN VRBI > V(RBI)MIN, VCC < VIT I(RBI) RBI data-retention input current V(RBI) RBI data-retention voltage TYP MAX UNIT 20 1100 nA VRBI > V(RBI)MIN, VCC < VIT, TA= 0°C to 70°C 500 1 V ELECTRICAL CHARACTERISTICS: 3.3V Regulator Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER VREG33 Regulator output voltage IREG33 Regulator output current ΔV(VDDTEMP) Regulator output change with temperature Copyright © 2011, Texas Instruments Incorporated TEST CONDITIONS MIN 3.8 V < VCC or BAT ≤ 5 V, ICC ≤4 mA 2.4 5V < VCC or BAT ≤ 6.8 V, ICC ≤13 mA 3.1 6.8 V < VCC or BAT ≤ 20 V, ICC ≤ 30 mA 3.1 TYP MAX UNIT 3.5 V 3.3 3.5 V 3.3 3.5 V 2 VCC or BAT = 14.4 V, IREG33 = 2 mA mA 0.2 % 7 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: 3.3V Regulator (continued) Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) TYP MAX UNIT ΔV(VDDLINE) Line regulation PARAMETER VCC or BAT = 14.4 V, IREG33 = 2 mA 1 13 mV ΔV(VDDLOAD) Load regulation VCC or BAT = 14.4 V, IREG33 = 2 mA 5 18 mV I(REG33MAX) Current limit TEST CONDITIONS MIN VCC or BAT = 14.4 V, VREG33 = 3 V 70 VCC or BAT = 14.4 V, VREG33 = 0 V 33 mA ELECTRICAL CHARACTERISTICS: 2.5V Regulator Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS IREG25 = 10 mA MIN TYP MAX 2.35 2.5 2.55 UNIT VREG25 Regulator output voltage IREG25 Regulator Output Current ΔV(VDDTEMP) Regulator output change with temperature VCC or BAT = 14.4 V, IREG25 = 2 mA ΔV(VDDLINE) Line regulation VCC or BAT = 14.4 V, IREG25 = 2 mA 1 4 mV ΔV(VDDLOAD) Load regulation VCC or BAT = 14.4 V, IREG25 = 2 mA 20 40 mV I(REG33MAX) Current limit 3 V mA 0.25 % VCC or BAT = 14.4 V, VREG25 = 2.3 V 65 VCC or BAT = 14.4 V, VREG25 = 0 V 23 mA ELECTRICAL CHARACTERISTICS: DISP, PRES, SMBD, SMBC Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX VIH High-level input DISP, PRES, SMBD, SMBC VIL Low-level input DISP, PRES, SMBD, SMBC 2.0 0.8 VOL Low-level output voltage SMBD, SMBC 0.4 CIN Input capacitance DISP, PRES, SMBD, SMBC ILKG Input leakage current DISP, PRES, SMBD, SMBC IWPU Weak Pull Up Current PRES, VOH = VREG25 – 0.5 V, 60 I(DISP) DISP source currents DISP active, DISP = VREG25 – 0.6 V –3 ILKG(DISP) DISP leakage current DISP inactive RPD(SMBx) SMBC, SMBD Pull-Down TA = –40 to 100˚C V 5 V V pF 1 120 μA μA mA –0.22 550 UNIT 775 0.22 μA 1000 kΩ ELECTRICAL CHARACTERISTICS: CHG, DSG FET Drive Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER V(FETON) V(FETOFF) 8 Output voltage, charge, and discharge FETs on Output voltage, charge and discharge FETs off TEST CONDITIONS MIN TYP MAX UNIT VO(FETONDSG) = V(DSG) – VPACK, VGS connect 10 MΩ, VCC 3.8 V to 8.4 V 8.0 9.7 12 V VO(FETONDSG) = V(DSG) – VPACK, VGS connect 10 MΩ, VCC > 8.4 V 9.0 11 12 V VO(FETONCHG) = V(CHG) – VBAT, VGS connect 10 MΩ, VCC 3.8 V to 8.4 V 8.0 9.7 12 V VO(FETONCHG) = V(CHG) – VBAT, VGS connect 10 MΩ, VCC > 8.4 V 9.0 11 12 V VO(FETOFFDSG) = V(DSG) – VPACK –0.4 0.4 V VO(FETOFFCHG) = V(CHG) – VBAT –0.4 0.4 V Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: CHG, DSG FET Drive (continued) Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER tr Rise time tf Fall time TYP MAX UNIT CL= 4700 pF RG= 5.1 kΩ VCC < 8.4 VDSG: VBAT to VBAT + 4 V VCHG: VPACK to VPACK + 4 V TEST CONDITIONS MIN 800 1400 μs CL = 4700 pF RG = 5.1 kΩ VCC > 8.4 VDSG: VBAT to VBAT + 4 V VCHG: VPACK to VPACK + 4 V 200 500 μs CL= 4700 pF RG= 5.1 kΩ VDSG: VBAT + VO(FETONDSG) to VBAT +1V VCHG: VPACK + VO(FETONCHG) to VPACK + 1 V 80 200 μs ELECTRICAL CHARACTERISTICS: INTERNAL PRE-CHARGE LIMITING Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER IPCHGMAX RPCHG_RDS Maximum Pre-charge current Internal Pre-charge FET RDSON ON TEST CONDITIONS MIN TYP VDS(PRECHG) ≥ 1 V, VCC < 8.4 V 30 55 VDS(PRECHG) ≥ 1 V, VCC ≥ 8.4 V 15 30 3-cell and 4-cell configuration MAX UNIT 100 mA 85 Ω 55 Ω ELECTRICAL CHARACTERISTICS: GPOD Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER VPU_GPOD GPOD Pull-Up Voltage VOL_GPOD GPOD Output Voltage Low TEST CONDITIONS IOL = 1 mA MIN TYP MAX UNIT VCC V 0.3 V ELECTRICAL CHARACTERISTICS: FUSE Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER VOH(FUSE) High Level FUSE Output VIH(FUSE) Weak pull-up current in off state (1) tR(FUSE) FUSE Output Rise Time ZO(FUSE) FUSE Output Impedance (1) TEST CONDITIONS MIN VCC = 3.8 V to 9 V 2.4 VCC = 9 V to 25 V 7 TYP 8 MAX UNIT 8.5 V 9 V 2.8 V 100 CL = 1 nF, VCC = 9 V to 25 V, VOH(FUSE) = 0 V to 5 V nA 5 20 μs 2 5 kΩ Verified by design. Not production tested. Copyright © 2011, Texas Instruments Incorporated 9 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: LED5, LED4, LED3, LED2, LED1 Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER CIN Input capacitance ILKG Input leakage current IOL ILEDx Low-level output current TEST CONDITIONS MIN TYP MAX 5 UNIT pF 1 μA 3.5 4.5 mA 3.0 4.5 6.0 mA 3.5 5.5 7.5 mA VOL = 0.4 V, 3 mA setting 2.5 VOL = 0.4 V, 4 mA setting VOL = 0.4 V, 5 mA setting Current matching between LEDx 0.1 mA ELECTRICAL CHARACTERISTICS: COULOMB COUNTER Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER VIN TEST CONDITIONS Input voltage range SRP – SRN Conversion time Single conversion Resolution (no missing codes) MIN TYP –0.20 MAX 0.25 250 Single conversion, signed Offset error Post calibrated Bits µV 10 –0.8% Full-scale error Bits 15 Offset error drift 0.3 0.5 0.2% 0.8% Full-scale error drift 150 Effective input resistance V ms 16 Effective resolution UNIT 2.5 µV/°C PPM/°C mΩ ELECTRICAL CHARACTERISTICS: VC1, VC2, VC3, VC4 Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER VIN TEST CONDITIONS Input voltage range VC4 – VC3, VC3 – VC2, VC2 – VC1, VC1 – VSS Conversion time Single conversion Resolution (no missing codes) R(BAL) MIN TYP –0.20 MAX UNIT 8 V 32 ms 16 Bits Bits Effective resolution Single conversion, signed 15 RDS(ON) for internal FET at VDS > 2V VDS = VC4 – VC3, VC3 – VC2, VC2 – VC1, VC1 – VSS 200 310 430 Ω RDS(ON) for internal FET at VDS > 4V VDS = VC4 – VC3, VC3 – VC2, VC2 – VC1, VC1 – VSS 60 125 230 Ω ELECTRICAL CHARACTERISTICS: TS1, TS2 Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER R Internal Pull Up Resistor RDRIFT Internal Pull Up Resistor Drift From 25°C RPAD Internal Pin Pad resistance 10 TEST CONDITIONS MIN TYP MAX UNIT 16.5 17.5 19.0 KΩ 200 PPM/°C 84 Ω Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: TS1, TS2 (continued) Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER Input voltage range TEST CONDITIONS TS1 – VSS, TS2 – VSS MIN TYP –0.20 Conversion Time VIN MAX UNIT 0.8 × VREG25 V 16 Resolution (no missing codes) 16 Effective resolution 11 ms Bits 12 Bits ELECTRICAL CHARACTERISTICS: Internal Temperature Sensor Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS Temperature sensor voltage V(TEMP) MIN TYP MAX UNIT –1.9 –2.0 –2.1 mV/°C Conversion Time 16 Resolution (no missing codes) 16 Effective resolution 11 ms Bits 12 Bits ELECTRICAL CHARACTERISTICS: Internal Thermal Shutdown Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT °C TMAX1 Maximum PCHG temperature 110 150 TMAX2 Maximum REG33 temperature 125 175 TRECOVER Recovery hysteresis temperature 10 °C tPROTECT Protection time 5 µs ELECTRICAL CHARACTERISTICS: High Frequency Oscillator Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER f(OSC) f(EIO) Frequency error (1) (2) t(SXO) Start-up time (3) (1) (2) (3) TEST CONDITIONS MIN TYP Operating frequency of CPU Clock MAX 4.194 MHz TA = –20°C to 70°C –2% ±0.25% 2% TA = –40°C to 85°C –3% ±0.25% 3% 3 6 TA = –25°C to 85°C UNIT ms The frequency error is measured from 4.194 MHz. The frequency drift is included and measured from the trimmed frequency at VREG25 = 2.5V, TA = 25°C. The startup time is defined as the time it takes for the oscillator output frequency to be ±3% when the device is already powered. ELECTRICAL CHARACTERISTICS: Low Frequency Oscillator Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER f(LOSC) Operating frequency f(LEIO) Frequency error (1) (2) t(LSXO) Start-up time (3) (1) (2) (3) TEST CONDITIONS MIN TYP MAX 32.768 kHz TA = –20°C to 70°C –1.5% ±0.25% 1.5% TA = –40°C to 85°C –2.5% ±0.25% 2.5% TA = –25°C to 85°C UNIT 100 μs The frequency drift is included and measured from the trimmed frequency at VCC = 2.5V, TA = 25°C. The frequency error is measured from 32.768 kHz. The startup time is defined as the time it takes for the oscillator output frequency to be ±3%. Copyright © 2011, Texas Instruments Incorporated 11 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: Internal Voltage Reference Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER VREF Internal Reference Voltage VREF_DRIFT Internal Reference Voltage Drift TEST CONDITIONS MIN TYP MAX UNIT 1.215 1.225 1.230 V TA = –25°C to 85°C ±80 PPM/°C TA = 0°C to 60°C ±50 PPM/°C ELECTRICAL CHARACTERISTICS: Flash Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER (1) TEST CONDITIONS Data retention Flash programming write-cycles MIN TYP MAX UNIT 10 Years Data Flash 20k Cycles Instruction Flash 1k Cycles ICC(PROG_DF) Data Flash-write supply current TA = –40°C to 85°C 3 4 mA ICC(ERASE_DF) Data Flash-erase supply current TA = –40°C to 85°C 3 18 mA (1) Verified by design. Not production tested. ELECTRICAL CHARACTERISTICS: OCD Current Protection Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OCD detection threshold voltage range, typical RSNS = 0 50 200 mV RSNS = 1 25 100 mV ΔV(OCDT) OCD detection threshold voltage program step RSNS = 0 V(OFFSET) OCD offset –10 10 V(Scale_Err) OCD scale error –10 10 % t(OCDD) Over Current in Discharge Delay 1 31 ms t(OCDD_STEP) OCDD Step options t(DETECT) Current fault detect time VSRP – SRN = VTHRESH + 12.5 mV tACC Over Current and Short Circuit delay time accuracy Accuracy of typical delay time V(OCD) 10 RSNS = 1 mV 5 mV 2 –20 mV ms 160 µs 20 % ELECTRICAL CHARACTERISTICS: SCD1 Current Protection Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN V(SDC1) SCD1 detection threshold voltage range, typical ΔV(SCD1T) SCD1 detection threshold voltage program step RSNS = 0 50 RSNS = 1 25 V(OFFSET) SCD1 offset V(Scale_Err) SCD1 scale error t(SCD1D) Short Circuit in Discharge Delay t(SCD1D_STEP) SCD1D Step options t(DETECT) Current fault detect time 12 100 RSNS = 1 50 TYP RSNS = 0 –10 MAX UNIT 450 mV 225 mV mV mV 10 mV –10 10 % AFE.STATE_CNTL[SCDDx2] = 0 0 915 µs AFE.STATE_CNTL[SCDDx2] = 1 0 1830 µs AFE.STATE_CNTL[SCDDx2] = 0 61 AFE.STATE_CNTL[SCDDx2] = 1 122 VSRP – SRN = VTHRESH + 12.5 mV µs µs 160 µs Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: SCD1 Current Protection (continued) Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER tACC Over Current and Short Circuit delay time accuracy TEST CONDITIONS MIN Accuracy of typical delay time –20 TYP MAX UNIT 20 % ELECTRICAL CHARACTERISTICS: SCD2 Current Protection Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN MAX UNIT 100 TYP 450 mV RSNS = 1 50 225 mV V(SDC2) SCD2 detection threshold voltage range, typical RSNS = 0 ΔV(SCD2T) SCD2 detection threshold voltage program step RSNS = 0 50 RSNS = 1 25 V(OFFSET) SCD2 offset V(Scale_Err) SCD2 scale error –10 mV mV 10 mV –10 10 % AFE.STATE_CNTL[SCDDx2] = 0 0 458 µs AFE.STATE_CNTL[SCDDx2] = 1 0 915 µs t(SCD1D) Short Circuit in Discharge Delay t(SCD2D_STEP) SCD2D Step options t(DETECT) Current fault detect time VSRP – SRN = VTHRESH + 12.5 mV tACC Over Current and Short Circuit delay time accuracy Accuracy of typical delay time AFE.STATE_CNTL[SCDDx2] = 0 30.5 AFE.STATE_CNTL[SCDDx2] = 1 61 –20 µs µs 160 µs 20 % ELECTRICAL CHARACTERISTICS: SCC Current Protection Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN –100 RSNS = 1 –50 TYP MAX UNIT –300 mV –225 mV V(SCCT) SCC detection threshold voltage range, typical RSNS = 0 ΔV(SCCDT) SCC detection threshold voltage program step RSNS = 0 –50 mV RSNS = 1 –25 mV V(OFFSET) SCC offset –10 10 V(Scale_Err) SCC scale error –10 10 % t(SCCD) Short Circuit in Charge Delay 0 915 ms t(SCCD_STEP) SCCD Step options t(DETECT) Current fault detect time VSRP – SRN = VTHRESH + 12.5 mV tACC Over Current and Short Circuit delay time accuracy Accuracy of typical delay time 61 –20 mV ms 160 µs 20 % ELECTRICAL CHARACTERISTICS: SBS Timing Characteristics Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) TEST CONDITIONS MIN SMBus operating frequency PARAMETER Slave mode, SMBC 50% duty cycle 10 fMAS SMBus master clock frequency Master mode, no clock low slave extend tBUF Bus free time between start and stop 4.7 µs tHD:STA Hold time after (repeated) start 4.0 µs fSMB Copyright © 2011, Texas Instruments Incorporated TYP 51.2 MAX UNIT 100 kHz kHz 13 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS: SBS Timing Characteristics (continued) Typical values stated where TA = 25ºC and VCC = 14.4 V, Min/Max values stated where TA= –40ºC to 85ºC and VCC = 3.8 V to 25 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 4.7 µs Stop setup time 4.0 µs Data hold time 300 ns tSU:DAT Data setup time 250 tTIMEOUT Error signal/detect tLOW Clock low period tHIGH Clock high period See (2) tHIGH Clock high period See (2) tLOW:SEXT Cumulative clock low slave extend time tLOW:MEXT tSU:STA Repeated start setup time tSU:STO tHD:DAT See (1) ns 25 35 ms µs 4.7 Disabled 50 µs See (3) 25 ms Cumulative clock low master extend time See (4) 10 ms tF Clock/data fall time See (5) 300 ns tR Clock/data rise time See (6) 1000 ns (1) (2) (3) (4) (5) (6) 4.0 The bq3050 times out when any clock low exceeds tTIMEOUT. tHIGH, Max, is the minimum bus idle time. SMBC = 1 for t > 50 µs causes reset of any transaction involving bq3050 that is in progress. This specification is valid when the THIGH_VAL=0. If THIGH_VAL = 1, then the value of THIGH is set by THIGH_1,2 and the timeout is not SMBus standard. tLOW:SEXT is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop. tLOW:MEXT is the cumulative time a master device is allowed to extend the clock cycles in one message from initial start to the stop. Rise time tR = VILMAX – 0.15) to (VIHMIN + 0.15) Fall time tF = 0.9 VDD to (VILMAX – 0.15) tR tSU(STOP) tF tF tDH(STA) T(BUF) tW(H) SMBC SMBC SMBD SMBD P tR S tW(L) tHD(DATA) tSU(DATA) tSU(STA) t(TIMEOUT) SMBC SMBC SMBD SMBD S Figure 3. SMBus Timing Diagram 14 Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com FEATURE SET Primary (1st Level) Safety Features The bq3050 supports a wide range of battery and system protection features that can easily be configured. The primary safety features include: • • • • • Cell Overvoltage/Undervoltage Protection Charge and Discharge Overcurrent Short-Circuit Charge and Discharge Over-Temperature AFE Watchdog Secondary (2nd Level) Safety Features The secondary safety features of the bq3050 can be used to indicate more serious faults via the FUSE pin. This pin can be used to blow an in-line fuse to permanently disable the battery pack from charging or discharging. The secondary safety protection features include: • Safety Overvoltage • Safety Overcurrent in Charge and Discharge • Safety Over-Temperature in Charge and Discharge • Charge FET, Discharge FET, and Pre-Charge FET Faults • Cell Imbalance Detection • Fuse Blow by Secondary Voltage Protection IC • AFE Register Integrity Fault (AFE_P) • AFE Communication Fault (AFE_C) Charge Control Features The bq3050 charge control features include: • • • • • • • Supports JEITA temperature ranges. Reports charging voltage and charging current according to the active temperature range Handles more complex charging profiles. Allows for splitting the standard temperature range into two sub-ranges and allows for varying the charging current according to the cell voltage Reports the appropriate charging current needed for constant current charging and the appropriate charging voltage needed for constant voltage charging to a smart charger using SMBus broadcasts Reduce the charge difference of the battery cells in fully charged state of the battery pack gradually using a voltage-based cell balancing algorithm during charging. A voltage threshold can be set up for cell balancing to be active. This prevents fully charged cells from overcharging and causing excessive degradation and also increases the usable pack energy by preventing premature charge termination. Supports pre-charging/zero-volt charging Supports charge inhibit and charge suspend if battery pack temperature is out of temperature range Reports charging fault and also indicate charge status via charge and discharge alarms Gas Gauging The bq3050 uses the CEDV algorithm to measure and calculate the available capacity in battery cells. The bq3050 accumulates a measure of charge and discharge currents and compensates the charge current measurement for the temperature and state-of-charge of the battery. The bq3050 estimates self-discharge of the battery and also adjusts the self-discharge estimation based on temperature. See the bq3050 Technical Reference Manual (SLUU440) for further details. Lifetime Data Logging Features The bq3050 offers limited lifetime data logging for the following critical battery parameters: • Lifetime Maximum Temperature • Lifetime Minimum Temperature Copyright © 2011, Texas Instruments Incorporated 15 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 • • www.ti.com Lifetime Maximum Battery Cell Voltage Lifetime Minimum Battery Cell Voltage Authentication • • The bq3050 supports authentication by the host using SHA-1. SHA-1 authentication by the gas gauge is required for unsealing and full access. Power Modes The bq3050 supports three power modes to reduce power consumption: • In Normal Mode, the bq3050 performs measurements, calculations, protection decisions, and data updates in 0.25-second intervals. Between these intervals, the bq3050 is in a reduced power stage. • In Sleep Mode, the bq3050 performs measurements, calculations, protection decisions, and data updates in adjustable time intervals. Between these intervals, the bq3050 is in a reduced power stage. The bq3050 has a wake function that enables exit from Sleep mode when current flow or failure is detected. • In Shutdown Mode, the bq3050 is completely disabled. Configuration Oscillator Function The bq3050 fully integrates the system oscillators and does not require any external components to support this feature. System Present Operation The bq3050 checks the PRES pin periodically (1s). If PRES input is pulled to ground by the external system, the bq3050 detects this as system present. 2-, 3-, or 4-Cell Configuration In a 2-cell configuration, VC1 is shorted to VC2 and VC3. In a 3-cell configuration, VC1 is shorted to VC2. Cell Balancing The device supports cell balancing by bypassing the current of each cell during charging or at rest. If the device's internal bypass is used, up to 10 mA can be bypassed and multiple cells can be bypassed at the same time. Higher cell balance current can be achieved by using an external cell balancing circuit. In external cell balancing mode, only one cell at a time can be balanced. The cell balancing algorithm determines the amount of charge needed to be bypassed to balance the capacity of all cells. Internal Cell Balancing When internal cell balancing is configured, the cell balance current is defined by the external resistor RVC at the VCx input. 16 Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com RVC VC1 RVC VC2 RVC VC3 RVC VC4 VSS External Cell Balancing When external cell balancing is configured, the cell balance current is defined by RB. Only one cell at a time can be balanced. RVC VC1 RVC VC2 RVC VC3 RVC VC4 RB RB RB RB VSS Copyright © 2011, Texas Instruments Incorporated 17 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com BATTERY PARAMETER MEASUREMENTS Charge and Discharge Counting The bq3050 uses an integrating delta-sigma analog-to-digital converter (ADC) for current measurement, and a second delta-sigma ADC for individual cell and battery voltage and temperature measurement. The integrating delta-sigma ADC measures the charge/discharge flow of the battery by measuring the voltage drop across a small-value sense resistor between the SR1 and SR2 pins. The integrating ADC measures bipolar signals from –0.25 V to 0.25 V. The bq3050 detects charge activity when VSR = V(SRP) – V(SRN) is positive, and discharge activity when VSR = V(SRP) – V(SRN) is negative. The bq3050 continuously integrates the signal over time, using an internal counter. The fundamental rate of the counter is 0.65 nVh. Voltage The bq3050 updates the individual series cell voltages at 0.25-second intervals. The internal ADC of the bq3050 measures the voltage, and scales and calibrates it appropriately. This data is also used to calculate the impedance of the cell for the CEDV gas-gauging. Current The bq3050 uses the SRP and SRN inputs to measure and calculate the battery charge and discharge current using a 5-mΩ to 20-mΩ typ. sense resistor. Auto Calibration The bq3050 provides an auto-calibration feature to cancel the voltage offset error across SRN and SRP for maximum charge measurement accuracy. The bq3050 performs auto-calibration when the SMBus lines stay low continuously for a minimum of 5 s. Temperature The bq3050 has an internal temperature sensor and inputs for two external temperature sensors. All three temperature sensor options are individually enabled and configured for cell or FET temperature. Two configurable thermistor models are provided to allow the monitoring of cell temperature in addition to FET temperature, which may be of a higher temperature type. Communications The bq3050 uses SMBus v1.1 with Master Mode and packet error checking (PEC) options per the SBS specification. SMBus On and Off State The bq3050 detects an SMBus off state when SMBC and SMBD are low for two or more seconds. Clearing this state requires that either SMBC or SMBD transition high. The communication bus will resume activity within 1ms. SBS Commands See the bq3050 Technical Reference Manual (SLUU440) for further details. 18 Copyright © 2011, Texas Instruments Incorporated bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com APPLICATION SCHEMATIC Copyright © 2011, Texas Instruments Incorporated 19 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 kΩ www.ti.com 20 Copyright © 2011, Texas Instruments Incorporated bq3050 www.ti.com Copyright © 2011, Texas Instruments Incorporated SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 21 bq3050 SLUSA92A – JANUARY 2011 – REVISED JUNE 2011 www.ti.com REVISION HISTORY Changes from Original (January 2011) to Revision A Page • Changed Block Diagram ....................................................................................................................................................... 3 • Changed TS2 pin number ..................................................................................................................................................... 4 • Changed TEST pin resistor value ......................................................................................................................................... 5 • Changed schematic ............................................................................................................................................................ 20 22 Copyright © 2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) BQ3050DBT ACTIVE TSSOP DBT 38 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR BQ3050DBTR ACTIVE TSSOP DBT 38 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Feb-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device BQ3050DBTR Package Package Pins Type Drawing TSSOP DBT 38 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 6.9 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.2 1.8 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 9-Feb-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ3050DBTR TSSOP DBT 38 2000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated