TI TPS22920YZPT

TPS22920
SLVSAY8 – JUNE 2011
www.ti.com
Ultra-Low On-Resistance, 4-A Integrated Load Switch with Controlled Turn-on
Check for Samples: TPS22920
FEATURES
DESCRIPTION
•
•
•
•
The TPS22920 is a small, ultra-low rON load switch
with controlled turn on. The device contains a
N-channel MOSFET that can operate over an input
voltage range of 0.75 V to 3.6 V and switch currents
up to 4-A. An integrated charge pump biases the
NMOS switch in order to achieve a minimum switch
ON resistance (rON). The switch is controlled by an
on/off input (ON), which is capable of interfacing
directly with low-voltage control signals.
1
Integrated Load Switch
Input Voltage Range: 0.75-V to 3.6-V
Integrated Pass-FET rDSON = 2mΩ (typ) at 3.6-V
Ultra-Low ON-Resistance
– rON = 5.3-mΩ at 3.6-V
– rON = 5.4-mΩ at 2.5-V
– rON = 5.5-mΩ at 1.8-V
– rON = 5.8-mΩ at 1.2-V
– rON = 6.1-mΩ at 1.05-V
– rON = 7.3-mΩ at 0.75-V
Ultra Small CSP-8 package 0.9mm×1.9mm,
0.5mm pitch
4-A Maximum Continuous Switch Current
Shutdown Current 5.5-µA max
Low Threshold Control Input
Controlled slew- rate to avoid inrush current
Quick Output Discharge Transistor
ESD Performance Tested Per JESD 22
– 4000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
•
•
•
•
•
•
•
The TPS22920 has a 1250-Ω on-chip load resistor for
quick output discharge when the switch is turned off.
The TPS22920 has an internally controlled rise time
in order to reduce inrush current. The TPS22920
features a rise time of 880μS at 3.6-V.
The TPS22920 is available in an ultra-small, spacesaving 8-pin CSP package and is characterized for
operation over the free-air temperature range
of –40°C to 85°C.
CIN
VOUT
ON ON
CL
RL
OFF
TPS22920
APPLICATIONS
•
•
•
•
•
VIN
SMPS
GND
GND
Figure 1. Typical Application
Notebook / Netbook Computer
Tablet PC
PDAs / Smartphones
GPS Navigation Devices
MP3 Players
FEATURE LIST
TPS22920
(1)
rON (typ)
at 3.6 V
RISE TIME
(typ) at 3.6V
QUICK OUTPUT
DISCHARGE (1)
MAXIMUM OUTPUT CURRENT
ENABLE
5.3- mΩ
880 µS
Yes
4-A
Active High
This feature discharges the output of the switch to ground through a 1250-Ω resistor, preventing the output from floating. See
Application section ‘Output Pull-Down’
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TPS22920
SLVSAY8 – JUNE 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
(2)
YZP (0.5mm pitch)
ORDERABLE PART NUMBER
Reel
TPS22920YZPR
Tape
TPS22920YZPT
TOP-SIDE MARKING/ STATUS
(2)
_ _ _6Z_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
The actual top-side marking has two preceding characters to denote year, month and one following character to designate the wafer
fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, ● = Pb-free).
YZP PACKAGE
D
D
C
C
B
B
A
A
2
1
LAZER MARKING
VIEW
1
2
BUMP VIEW
Figure 2. Bump Assignments
Bump Assignments (YZP Package)
D
GND
ON
C
VOUT
VIN
B
VOUT
VIN
A
VOUT
VIN
1
2
Pin Description
TPS22920
YZP
2
PIN NAME
D1
GND
D2
ON
A1, B1, C1
VOUT
A2, B2, C2
VIN
DESCRIPTION
Ground
Switch control input, active high. Do not leave floating
Switch output
Switch input, bypass this input with a ceramic capacitor to ground
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FUNCTIONAL BLOCK DIAGRAM
VIN
Charge
Pump
Control
Logic
ON
VOUT
GND
FUNCTION TABLE
(1)
VOUT to GND (1)
ON
VIN to VOUT
L
OFF
ON
H
ON
OFF
See Application section ‘Output Pull-Down’
ABSOLUTE MAXIMUM RATINGS (1)
VALUE
UNIT
VIN
Input voltage range
–0.3 to 4
V
VOUT
Output voltage range
VIN + 0.3
V
VON
Input voltage range
–0.3 to 4
V
IMAX
Maximum Continuous Switch Current
4
A
IPLS
Maximum Pulsed Switch Current, pulse <300µS, 2% duty cycle
TA
Operating free-air temperature range
TJ
Maximum junction temperature
TSTG
Storage temperature range
TLEAD
Maximum lead temperature (10-s soldering time)
ESD
(1)
Electrostatic discharge protection
6
A
–40 to 85
°C
125
°C
–65 to 150
°C
300
°C
Human-Body Model (HBM)
4000
Charged Device Model (CDM)
1000
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress only, and
functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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TPS22920
SLVSAY8 – JUNE 2011
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THERMAL INFORMATION
TPS22920
THERMAL METRIC (1)
CS130P (8 PINS)
θJA
Junction-to-ambient thermal resistance
130
θJCtop
Junction-to-case (top) thermal resistance
54
θJB
Junction-to-board thermal resistance
51
ψJT
Junction-to-top characterization parameter
1
ψJB
Junction-to-board characterization parameter
50
θJCbot
Junction-to-case (bottom) thermal resistance
n/a
(1)
UNITS
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
VIN
Input voltage range
MIN
MAX
0.75
3.6
V
VIN
V
VOUT Output voltage range
VIH
High-level input voltage, ON
VIL
Low-level input voltage, ON
CIN
Input Capacitor
(1)
UNIT
VIN = 2.5-V to 3.6 V
1.2
3.6
V
VIN = 0.75-V to 2.49 V
0.9
3.6
V
0.6
V
VIN = 2.5-V to 3.6 V
VIN = 0.75-V to 2.49 V
0.4
1 (1)
V
µF
See Input Capacitor section in Application Information.
ELECTRICAL CHARACTERISTICS
VIN = 0.75 V to 3.6 V (unless otherwise noted)
PARAMETER
IIN
Quiescent Current
IIN(leak)
Off Supply Current (After Pull Down)
MIN TYP (1)
MAX
VIN = 3.6 V
68
160
VIN = 2.5 V
40
70
TEST CONDITIONS
IOUT = 0, VIN = VON
VIN = 1.8 V
25
350
103
200
VIN = 1.05 V
78
110
VIN = 0.75 V
37
70
VIN = 1.2 V
VON = GND, VOUT = 0
VIN = 3.6 V, IOUT = –200 mA
VIN = 2.5 V, IOUT = –200 mA
VIN = 1.8 V, IOUT = –200 mA
rON
TA
On-Resistance
VIN = 1.2 V, IOUT = –200 mA
VIN = 1.05 V, IOUT = –200 mA
VIN = 0.75 V, IOUT = –200 mA
Full
Full
25°C
Full
25°C
25°C
25°C
5.5
5.8
VIN = 3.3 V, VON = 0, IOUT = 3 mA
Full
ON input leakage current
VON = 0.9 V to 3.6 V or GND
Full
9.4
10.4
6.1
9.7
10.8
7.3
Full
ION
9.1
10.1
Full
25°C
8.9
9.9
Full
Output pull down resistance (2)
4
5.4
Full
25°C
8.8
9.8
Full
RPD
(1)
(2)
5.5
5.3
11.0
12.4
1250
UNIT
µA
µA
µA
µA
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
1500
Ω
0.1
µA
Typical values are at VIN = 3.3 V and TA = 25°C.
See Output Pulldown in Application Information.
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SWITCHING CHARACTERISTICS
VIN = 3.6 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF, VIN = 3.6 V
970
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF, VIN = 3.6 V
3
tr
VOUT Rise time
RL = 10 Ω, CL = 0.1 µF, VIN = 3.6 V
880
tf
VOUT Fall time
RL = 10 Ω, CL = 0.1 µF, VIN = 3.6 V
2
MAX
UNIT
µs
VIN = 0.9 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITION
MIN
TYP
tON
Turn-ON time
RL = 10 Ω, CL = 0.1 µF, VIN = 0.9 V
840
tOFF
Turn-OFF time
RL = 10 Ω, CL = 0.1 µF, VIN = 0.9 V
16
tr
VOUT Rise time
RL = 10 Ω, CL = 0.1 µF, VIN = 0.9 V
470
tf
VOUT Fall time
RL = 10 Ω, CL = 0.1 µF, VIN = 0.9 V
5
MAX
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UNIT
µs
5
TPS22920
SLVSAY8 – JUNE 2011
www.ti.com
PARAMETRIC MEASUREMENT INFORMATION
VIN
VOUT
CIN = 1 mF
ON
(A)
OFF
+
-
CL
ON
TPS22920
RL
GND
GND
GND
TEST CIRCUIT
VON
50%
50%
tf
tr
tOFF
tON
90%
VOUT
50%
50%
90%
VOUT
10%
10%
tON/tOFF WAVEFORMS
(A) Rise and fall times of the control signal is 100 ns.
Figure 3. Test Circuit and tON/tOFF Waveforms
6
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TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE vs
INPUT VOLTAGE
ON-STATE RESISTANCE vs
TEMPERATURE
11
11
−40C
25C
85C
9
9
8
8
7
7
6
5
6
5
4
4
3
3
2
2
1
1
0
0
0.5
1
1.5
2
2.5
Voltage (V)
3
3.5
VIN = 0.75
VIN = 1.05
VIN = 1.2
VIN = 1.8V
VIN = 2.5
VIN = 3.6
10
Ron (mΩ)
Ron (mΩ)
10
0
−40
4
−15
10
35
Temperature (°C)
60
85
G000
G000
Figure 4.
Figure 5.
INPUT CURRENT, QUIESCENT vs
INPUT VOLTAGE
INPUT CURRENT, LEAK vs
INPUT VOLTAGE
3600
220
−40C
25C
85C
200
−40C
25C
85C
3200
180
2800
160
2400
IIN_Leak (nA)
IIN_Q (µA)
140
120
100
80
2000
1600
1200
60
800
40
400
20
0
0
1
2
Voltage (V)
3
4
0
0
0.5
1
1.5
2
2.5
Voltage (V)
3
3.5
G000
Figure 6.
4
G000
Figure 7.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME vs
TEMPERATURE
ON INPUT THRESHOLD
4
4
VIN = 0.75
VIN = 1.05
VIN = 1.2
VIN = 1.8V
VIN = 2.5
VIN = 3.6
3.5
3
3.5
3
2.5
tOff (µs)
VOUT (V)
2.5
2
2
1.5
1.5
1
1
0.5
0.5
VIN = 3.6V, CL = 0.1 µF, RL = 10 Ohms
0
0
0.2
0.4
0.6
VON (V)
0.8
1
0
−40
1.2
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 8.
Figure 9.
TURN-OFF TIME vs
TEMPERATURE
RISE TIME vs
TEMPERATURE
1300
1100
1200
1000
1100
900
1000
800
900
700
tRise (µs)
tOn (µs)
800
700
600
500
600
500
400
400
300
300
200
200
100
0
−40
100
VIN = 3.6V, CL = 0.1 µF, RL = 10 Ohms
−15
10
35
Temperature (°C)
VIN = 3.6V, CL = 0.1 µF, RL = 10 Ohms
60
85
0
−40
−15
10
35
Temperature (°C)
G000
Figure 10.
8
60
85
G000
Figure 11.
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TYPICAL CHARACTERISTICS (continued)
FALL TIME vs
TEMPERATURE
TURN-ON TIME vs
TEMPERATURE
2
1200
1.8
1100
1000
1.6
900
1.4
800
tOn (µs)
tFall (µs)
1.2
1
700
600
500
0.8
400
0.6
300
0.4
200
0.2
100
VIN = 3.6V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
VIN = 0.9V, CL = 0.1 µF, RL = 10 Ohms
60
0
−40
85
−15
10
35
Temperature (°C)
60
G000
85
G000
Figure 12.
Figure 13.
TURN-OFF TIME vs
TEMPERATURE
RISE TIME vs
TEMPERATURE
60
800
VIN = 0.9V, CL = 0.1 µF, RL = 10 Ohms
55
700
50
45
600
40
tRise (µs)
tOff (µs)
500
35
30
25
400
300
20
15
200
10
100
5
VIN = 0.9V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
Temperature (°C)
60
85
0
−40
−15
10
35
Temperature (°C)
60
G000
Figure 14.
85
G000
Figure 15.
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TYPICAL CHARACTERISTICS (continued)
FALL TIME vs
TEMPERATURE
RISE TIME vs
INPUT VOLTAGE
1800
7
6.5
VIN = 0.9V, CL = 0.1 µF, RL = 10 Ohms
CL = 0.1 µF, RL = 10 Ohms, VON = 1.8V
1600
6
5.5
1400
5
1200
4
tRise (µs)
tFall (µs)
4.5
3.5
3
2.5
1000
800
600
2
400
1.5
1
−40C
25C
85C
200
0.5
0
−40
−15
10
35
Temperature (°C)
60
0
85
0
0.5
1
1.5
2
VIN (V)
G000
2.5
3
3.5
4
G000
Figure 16.
Figure 17.
RISE TIME vs
INPUT VOLTAGE
1600
CL = 20 µF, RL = 10 Ohms, VON = 1.8V
1400
1200
tRise (µs)
1000
800
600
400
−40C
25C
85C
200
0
0
0.5
1
1.5
2
VIN (V)
2.5
3
3.5
4
G000
Figure 18.
10
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TYPICAL CHARACTERISTICS (continued)
VIN
TURN-ON RESPONSE
= 0.9V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
TURN-OFF RESPONSE
VIN = 0.9V, TA = 25°C, CIN = 1µF, CL =0.1µF, RL = 10Ω
Figure 19.
Figure 20.
TURN-ON RESPONSE
VIN = 0.9V, TA = 25°C, CIN = 47µF, CL = 20µF, RL = 10Ω
TURN-OFF RESPONSE
VIN = 0.9V, TA = 25°C, CIN = 47µF, CL = 20µF, RL = 10Ω
Figure 21.
Figure 22.
TURN-ON RESPONSE
VIN = 3.6V, TA = 25°C, CIN = 1µF, CL =0.1µF, RL = 10Ω
TURN-OFF RESPONSE
VIN = 3.6V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 23.
Figure 24.
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TYPICAL CHARACTERISTICS (continued)
VIN
TURN-ON RESPONSE
= 3.6V, TA = 25°C, CIN = 47µF, CL = 20µF, RL = 10Ω
TURN-OFF RESPONSE
VIN = 3.6V, TA = 25°C, CIN = 47µF, CL = 20µF, RL = 10Ω
Figure 25.
12
Figure 26.
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APPLICATION INFORMATION
ON/OFF CONTROL
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a
low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard
GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs.
INPUT CAPACITOR
To limit the voltage drop on the input supply caused by transient inrush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce
the voltage drop.
OUTPUT CAPACITOR
Due to the integral body diode in the NMOS switch, a CIN greater than CL is highly recommended. A CL greater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow
through the body diode from VOUT to VIN. A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip
caused by inrush currents during startup.
OUTPUT PULL-DOWN
The output pulldown is active when the user is turning off the main pass FET. The pulldown discharges the
output rail to approximately 10% of the rail, and then the output pulldown is automatically disconnected to
optimize the shutdown current.
BOARD LAYOUT
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects
along with minimizing the case to ambient thermal impedance.
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Jul-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS22920YZPR
ACTIVE
DSBGA
YZP
8
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22920YZPT
ACTIVE
DSBGA
YZP
8
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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