SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
features
typical applications
D Supply Current of 40 µA (Max)
D Battery Supply Current of 100 nA (Max)
D Precision Supply-Voltage Monitor,
D
D
D
D
D
D
D
D
D
1.8 V, 5 V; Other Options on Request
D Watchdog Timer With 800-ms Time-Out
D Backup-Battery Voltage Can Exceed VDD
D Power-On Reset Generator With Fixed
D
D
D
D
D
D
D
100-ms Reset Delay Time
Battery-OK Output
Voltage Monitor for Power-Fail or
Low-Battery Monitoring
Manual Switchover to Battery-Backup
Mode
Chip-Enable Gating . . . 3 ns (at VDD = 5 V)
Max Propagation Delay
Battery-Freshness Seal
14-pin TSSOP Package
Temperature Range . . . –40°C to 85°C
Fax Machines
Set-Top Boxes
Advanced Voice Mail Systems
Portable Battery-Powered Equipment
Computer Equipment
Advanced Modems
Automotive Systems
Portable Long-Time Monitoring Equipment
Point of Sale Equipment
TPS3610
TSSOP (PW) Package
(TOP VIEW)
VOUT
VDD
GND
MSWITCH
CEIN
BATTON
PFI
typical operating circuit
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VBAT
RESET
WDI
LOWLINE
CEOUT
BATTOK
PFO
ACTUAL SIZE
(5,10mm x 6,60mm)
Address
Decoder
Power
Supply
0.1 µF
External
Source
CEIN
Rx
Ry
CEOUT
VDD
VBAT
TPS3610
PFI
Backup
Battery
uC
8
RESET
RESET
WDI
I/O
PFO
I/O
BATTOK
I/O
BATTON
LOWLINE
MSWITCH V
OUT
GND
CE
CMOS
RAM
VCC
Address Bus
Switchover
Capacitor
0.1 µF
CE
CMOS
RAM
VCC
RealTime
Clock
VCC
8
Data Bus
16
I/O
I/O
VCC
GND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
!"# $ %& '# "$ (&)*%"# +"#',
+&%#$ % ! # $('%%"#$ (' #-' #' !$ '."$ $# &!'#$
$#"+" + /" "#0, +&%# ( %'$$1 +'$ # '%'$$" *0 %*&+'
#'$#1 "** (" "!'#' $,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
description
The TPS3610 family of supervisory circuits monitors and controls processor activity by providing backup-battery
switchover for data retention of CMOS RAM. Other features include an additional power-fail comparator,
low-line indication, watchdog function, battery-status indicator, manual switchover, and write protection for
CMOS RAM.
The TPS3610 family allow usage of 3-V or 3.6-V lithium batteries as the backup supply in systems with, e.g.,
VDD = 1.8 V. During power-on, RESET is asserted when the supply voltage (VDD or VBAT) becomes higher than
1.1 V. Thereafter, the supply-voltage supervisor monitors VDD and keeps RESET output active as long as VDD
remains below the threshold voltage VIT. An internal timer delays the return of the output to the inactive state
(high) to ensure proper system reset. The delay time starts after VDD has risen above the threshold voltage VIT.
When the supply voltage drops below the threshold voltage VIT, the output becomes active (low) again.
The product spectrum is designed for supply voltages of 1.8 V and 5 V. The circuits are available in a 14-pin
TSSOP package. TPS3610 devices are characterized for operation over a temperature range of –40°C to 85°C.
standard and application-specific versions (see Note 1)
TPS3610U
18
PW
R
Tape and Reel
TI Package Designator
Nominal Supply Voltage
Nominal Battok Threshold Voltage
APPLICATION-SPECIFIC VERSIONS,
NOMINAL SUPPLY AND BATTOK VOLTAGE
TA
40°C to 85°C
–40°C
NOMINAL SUPPLY
VOLTAGE, VDD(NOM)
(V)
1.8
NOMINAL BATTOK
THRESHOLD VOLTAGE,
VIT(BOK) (V)
1.6
5
2.4
PACKAGED DEVICES
TSSOP (PW)†
TPS3610U18PWR
TPS3610T50PWR
† The PW package is only available taped and reeled (indicated by the R suffix on the device type).
NOTE 1: For other NOMINAL and BATTOK voltage versions, contact your local TI sales office for availability and order lead time.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
TRUTH TABLES
INPUTS
VDD > VLL
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
VDD > VIT
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
OUTPUTS
VDD > VBAT
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
MSWITCH
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
BATTOK
VBAT > VBOK
0
1
Condition: VDD > VIT
VOUT
VBAT
VBAT
VBAT
VBAT
VDD
VDD
VBAT
VBAT
VDD
VDD
VBAT
VBAT
VDD
VDD
VBAT
VBAT
VDD
VDD
VBAT
VBAT
VDD
VDD
VBAT
VBAT
BATTON
LOWLINE
RESET
CEOUT
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
DIS
DIS
DIS
DIS
DIS
DIS
DIS
DIS
DIS
EN
DIS
EN
DIS
EN
DIS
EN
DIS
EN
DIS
EN
DIS
EN
DIS
EN
POWER-FAIL
CHIP-ENABLE
BATTOK
PFI > V(PFI)
PFO
CEIN
CEOUT
0
1
0
1
0
1
0
1
0
1
Condition: VDD > VDDmin
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
Condition: Enabled
3
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
functional block diagram
MSWITCH
VBAT
+
_
Switch
Control
VOUT
Internal
Power Supply
VDD
BATTON
+
_
Reference
Voltage
of 1.15 V
_
RESET
Logic
+
Timer
+
GND
BATTOK
RESET
+
_
LOWLINE
Oscillator
_
PFI
WDI
PFO
+
Transition
Detector
Watchdog
Logic + Control
VOUT
40 kΩ
CEOUT
CEIN
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
timing diagram
VBAT
VLL
VIT
VBOK
VDD
VOUT
t
BATTOK
1
t
VBAT
0
t
RESET
td
td
t
BATTON
t
LOWLINE
t
† MSWITCH = 0
Timing diagram shown under operation, not in freshness seal mode.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
Terminal Functions
TERMINAL
NAME
I/O
NO.
DESCRIPTION
BATTOK
9
O
Battery status output
BATTON
6
O
Logic output/external bypass switch driver output
CEIN
5
I
Chip-enable input
CEOUT
10
O
Chip-enable output
GND
3
I
Ground
LOWLINE
11
O
Early power-fail warning output
MSWITCH
4
I
Manual switch to force device into battery-backup mode
VOUT
PFI
1
O
Supply output
7
I
Power-fail comparator input
PFO
8
O
Power-fail comparator output
RESET
13
O
Active-low reset output
VBAT
VDD
14
I
Backup-battery input
2
I
Input supply voltage
WDI
12
I
Watchdog timer input
detailed description
battery freshness seal
The battery freshness seal of the TPS3610 family disconnects the backup battery from internal circuitry until
it is needed. This function ensures that the backup battery connected to VBAT is fresh when the final product
is put to use. The following steps explain how to enable the freshness seal mode:
1. Connect VBAT (VBAT > VBATmin)
2. Ground PFO
3. Connect PFI to VDD (PFI = VDD)
4. Connect VDD to power supply (VDD > VIT) and keep connected for 5 ms < t < 35 ms
The battery freshness seal mode is disabled by the positive-going edge of RESET when VDD is applied.
BATTOK output
BATTOK is a logic feedback of the device to indicate the status of the backup battery. The supervisor checks
the battery voltage every 200 ms with a voltage divider load of approximately 100 kΩ and a measurement cycle
on-time of 25 µs. The measurement cycle starts after the reset is released. If the battery voltage VBAT is below
the negative-going threshold voltage VIT(BOK), the indicator BATTOK does a high-to-low transition. Otherwise
it retains its status to VDD level.
IBAT
25 µs
200 ms
100 µA
t
Figure 1. BATTOK Timing
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
detailed description (continued)
chip-enable signal gating
The internal gating of chip-enable signals, CE, prevents erroneous data from corrupting CMOS RAM during an
undervoltage condition. The TPS3610 use a series transmission gate from CEIN to CEOUT. During normal
operation (reset not asserted), the CE transmission gate is enabled and passes all CE transitions. When reset
is asserted, this path becomes disabled, preventing erroneous data from corrupting the CMOS RAM. The short
CE propagation delay from CEIN to CEOUT enables TPS3610 devices to be used with most processors.
The CE transmission gate is disabled and CEIN is high-impedance (disable mode) while reset is asserted.
During a power-down sequence, when VDD crosses the reset threshold, the CE transmission gate is disabled
and CEIN immediately becomes high impedance if the voltage at CEIN is high. If CEIN is low while reset is
asserted, the CE transmission gate is disabled at the same time CEIN goes high, or 15 µs after RESET asserts,
whichever occurs first. This allows the current write cycle to complete during power-down. When the CE
transmission gate is enabled, the impedance of CEIN appears as a resistor in series with the load at CEOUT.
The overall device propagation delay through the CE transmission gate depends on VOUT, the source
impedance of the device connected to CEIN and the load at CEOUT. To achieve minimum propagation delay,
the capacitive load at CEOUT should be minimized, and a low-output-impedance driver should be used.
During disable mode, the transmission gate is off and an active pullup connects CEOUT to VOUT. The pullup
turns off when the transmission gate is enabled.
CEIN
t
CEOUT
15 µs
t
RESET
t
Figure 2. Chip-Enable Timing
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
detailed description (continued)
power-fail comparator (PFI and PFO)
An additional comparator is provided to monitor voltages other than the nominal supply voltage. The
power-fail-input (PFI) is compared with an internal voltage reference of 1.15 V. If the input voltage falls below
the power-fail threshold VIT(PFI) of typical 1.15 V, the power-fail output (PFO) goes low. If VIT(PFI) goes above
V(PFI), plus about 12-mV hysteresis, the output returns to high. By connecting two external resistors, it is
possible to supervise any voltages above V(PFI). The sum of both resistors should be about 1 MΩ, to minimize
power consumption and also to assure that the current in the PFI pin can be neglected compared with the current
through the resistor network. The tolerance of the external resistors should be not more than 1% to ensure
minimal variation of sensed voltage. If the power-fail comparator is unused, PFI should be connected to ground
and PFO left unconnected.
LOWLINE
The lowline comparator monitors VDD with a threshold voltage typically 2% above the reset threshold (VIT). For
normal operation (VDD above the reset threshold), LOWLINE is pulled to VDD. LOWLINE can be used to provide
a nonmaskable interrupt (NMI) to the processor when power begins to fall. In most battery-operated portable
systems, reserve energy in the battery provides enough time to complete the shutdown routine once the low-line
warning is encountered and before reset asserts. If the system must also contend with a more rapid VDD fall
time, such as when the main battery is disconnected or a high-side switch is opened during normal operation,
a capacitor can be used on the VDD line to provide enough time for executing the shutdown routine. First, the
worst-case settling time (tsd) required for the system to perform its shutdown routine needs to be defined. Then,
using the worst-case load current (IL) that can be drained from the capacitor, and the minimum reset threshold
voltage (VITmin), the capacitor value (CH) can be calculated as follows:
CH +
I L t sd
V ITmin 0.012
BATTON
Most often BATTON is used as a gate drive for an external pass transistor for high-current applications. In
addition, it can be used as a logic output to indicate the battery switchover status. BATTON is high when VOUT
is connected to VBAT.
BATTON can be connected directly to the gate of a PMOS transistor (see Figure 3). No current-limiting resistor
is required. If a PMOS transistor is used, it must be connected in the reverse of the traditional method (see
Figure 3), which orients the body diode from VDD to VOUT and prevents the backup battery from discharging
through the FET when its gate is high.
PMOS FET
Body Diode
D
S
G
VDD BATTON VOUT
TPS3610
GND
Figure 3. Driving an External MOSFET Transistor With BATTON
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
detailed description (continued)
backup-battery switchover
In case of a brownout or power failure, it may be necessary to preserve the contents of RAM. If a backup-battery
is installed at VBAT, the device automatically switches the connected RAM to backup power when VDD fails. In
order to allow the backup-battery (e.g., a 3.6-V lithium cell) to have a higher voltage than VDD, these supervisors
do not connect VBAT to VOUT when VBAT is greater than VDD. VBAT only connects to VOUT (through a 15-Ω switch)
when VDD falls below VIT and VBAT is greater than VDD. When VDD recovers, switchover is deferred either until
VDD crosses VBAT, or until VDD rises above the reset threshold VIT. VOUT connects to VDD through a 1-Ω (max)
PMOS switch when VDD crosses the reset threshold.
VDD – Normal Supply Voltage – V
FUNCTION TABLE
VDD > VBAT
1
VDD > VIT
1
VOUT
VDD
1
0
0
1
VDD
VDD
0
0
VBAT
VDD Mode
VIT Hysteresis
VBAT Mode
VBSW Hysteresis
Undefined
VBAT – Backup-Battery Supply Voltage – V
Figure 4. Normal Supply Voltage vs Backup-Battery Supply Voltage
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
detailed description (continued)
manual switchover (MSWITCH)
While operating in the normal mode from VDD, the device can be forced manually to operate in battery-backup
mode by connecting MSWITCH to VDD. Refer to Table 1 for different switchover modes.
Table 1. Switchover Modes
MSWITCH
GND
VDD mode
VDD
GND
Batter back p mode
Battery-backup
VDD
STATUS
VDD mode
Switch to battery-backup mode
Battery-backup mode
Battery-backup mode
If the manual switchover feature is not used, MSWITCH must be connected to ground.
watchdog
In a microprocessor- or DSP-based system, it is important not only to supervise the supply voltage, but also to
ensure correct program execution. The task of a watchdog is to ensure that the program is not stalled in an
indefinite loop. The microprocessor, microcontroller or DSP has to toggle the watchdog input within typically
0.8 s to avoid the occurence of a time-out. Either a low-to-high or a high-to-low transition resets the internal
watchdog timer. If the input is unconnected, the watchdog is disabled and is retriggered internally.
saving current while using the watchdog
The watchdog input is internally driven low during the first 7/8 of the watchdog time-out period, then the input
momentarily pulses high, resetting the watchdog counter. For minimum watchdog input current (minimum
overall power consumption), WDI should be left low for the majority of the watchdog time-out period, and pulsed
low-high-low once within 7/8 of the watchdog time-out period to reset the watchdog timer. If instead WDI is
externally driven high for the majority of the timeout period, a current of, e.g., 5 V/40 kΩ ≈ 125 µA, can flow into
WDI.
VOUT
VIT
WDI
t(tout)
RESET
td
td
Undefined
Figure 5. Watchdog Timing
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
td
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VDD (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
All other pins (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 7 V
Continuous output current at VOUT, IO(VOUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA
Continuous output current (all other pins) IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±10 mA
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 2: All voltage values are with respect to GND. For reliable operation the device must not be operated at 7 V for more than t=1000h
continuously.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
PW
700 mW
5.6 mW/°C
448 mW
364 mW
recommended operating conditions
Supply voltage, VDD
Battery supply voltage, VBAT
Input voltage, VI
High-level input voltage, VIH
MIN
MAX
1.65
5.5
V
1.5
5.5
V
0
VDD+0.3
V
0.7xVDD
Low-level input voltage, VIL
V
0.3×VDD
300
Continuous output current at VOUT, IO
Input transition rise and fall rate at WDI, MSWITCH, ∆t/∆V
Slew rate at VDD or VBAT
Operating free-air temperature range, TA
–40
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
V
mA
100
ns/V
1
V/µs
85
°C
11
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
RESET,
BATTOK
BATTON
VOH
High-level output voltage
O
LOWLINE,
PFO
CEOUT,
CEOUT
Enable mode,
CEIN = VOUT
CEOUT,
Disable mode
RESET, PFO,
RESET
PFO
BATTOK,
LOWLINE
VOL
Low-level
Low
level out
output
ut voltage
BATTON
CEOUT
CEOUT,
Enable mode,
CEIN = 0 V
Power-up reset voltage (see Note 3)
Normal mode
VOUT
Battery backup mode
Battery-backup
IOH = –400 µA
IOH = –2 mA
VDD = 5 V,
VOUT = 1.8 V,
IOH = –3 mA
IOH = –400 µA
VOUT = 3.3 V,
VOUT = 5 V,
IOH = –2 mA
IOH = –3 mA
VDD = 1.8 V,
VDD = 3.3 V,
IOH = –20 µA
IOH = –80 µA,
VDD = 5 V,
VOUT = 1.8 V,
IOH = –120 µA
IOH = –1 mA
VOUT = 3.3 V,
VOUT = 5 V,
IOH = –2 mA
IOH = –5 mA
VOUT–0.3
03V
VOUT = 3.3 V,
IOH = –0.5 mA
VOUT–0.4 V
VDD = 1.8 V,
VDD = 3.3 V,
IOL = 400 µA
IOL = 2 mA
VDD = 5 V,
VOUT = 1.8 V,
IOL = 3 mA
IOL = 500 µA
VOUT = 3.3 V,
VOUT = 5 V,
IOL = 3 mA
IOL = 5 mA
VOUT = 1.8 V,
VOUT = 3.3 V,
IOL = 1 mA
IOL = 2 mA
VOUT = 5 V,
IOL = 5 mA
VBAT > 1.1 V,
OR
VDD > 1.1 V,
IOL = 20 µA,
IO = 8.5 mA,
VBAT = 0 V
VDD = 1.8 V,
IO = 125 mA,
VBAT = 0 V
VDD = 3.3 V,
IO = 200 mA,
VBAT = 0 V
VDD = 5 V,
IO = 0.5 mA,
VBAT = 1.5 V
IO = 7.5 mA,
VBAT = 3.3 V
VDD = 0 V,
VDD = 0 V,
NOTE 3: The lowest supply voltage at which RESET becomes active. tr, VDD ≥ 15 µs/V
12
MIN
VDD = 1.8 V,
VDD = 3.3 V,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TYP
MAX
UNIT
VDD–0.2 V
04V
VDD–0.4
VOUT–0.2 V
VOUT–0.4
04V
VDD–0.3 V
V
VDD–0.4
04V
VOUT–0.2 V
0.2
04
0.4
0.2
04
0.4
V
0.2
03
0.3
0.4
V
VDD–50 mV
VDD–150 mV
VDD–200 mV
VBAT–20 mV
VBAT–113 mV
V
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted) (continued)
PARAMETER
VIT
V(PFI)
Negative-going
Negative
going input
in ut threshold
voltage
g ((see Note 4))
V(BOK)
MIN
TYP
MAX
TPS3610U18
TEST CONDITIONS
1.68
1.71
1.74
TPS3610T50
4.46
4.55
4.64
PFI
1.13
1.15
1.17
2.33
2.4
2.47
TA = –40°C
40 C to 85°C
85 C
TPS3610T50
TPS3610U18
V(LL)
LOWLINE
1.55
1.6
1.65
VIT+1.2%
VIT+2%
20
VIT+2.8%
1.65 V < VIT < 2.5 V
VIT
LOWLINE
Vh
s
hys
Hysteresis
BATTOK
2.5 V < VIT < 3.5 V
40
3.5 V < VIT < 5.5 V
60
1.65 V < V(LL) < 2.5 V
20
2.5 V < V(LL) < 3.5 V
40
3.5 V < V(LL) < 5.5 V
60
1.65 V < V(BOK) < 2.5 V
20
2.5 V < V(BOK) < 3.5 V
40
3.5 V < V(BOK)< 5.5 V
60
PFI
V
V
mV
12
VBSW
(see Note 5)
IIH
IIL
High-level input current
II
Input current
PFI,
MSWITCH
IOS
Short-circuit output current
PFO
Low-level input current
UNIT
WDI
(see Note 6)
VDD = 1.8 V
55
WDI = VDD = 5 V
WDI = 0 V,
150
VDD = 5 V
–150
–25
PFO = 0 V
25
VDD = 1.8 V
VDD = 3.3 V
–0.3
VDD = 5 V
–2.4
–1.1
VOUT = VDD
40
VOUT = VBAT
40
IDD
Supply current at VDD
IBAT
Supply current at VBAT
Ilkg
Leakage current at CEIN
Disable mode,
rDS(on)
DS( )
VDD to VOUT on-resistance
VBAT to VOUT on-resistance
VDD = 5 V
VBAT = 3.3 V
VOUT = VDD
–0.1
0.1
VOUT = VBAT
0.5
±1
VI < VDD
0.6
1
8
15
µA
nA
mA
µA
µA
µA
Ω
Ci
Input capacitance
VI = 0 V to 5 V
5
pF
NOTES: 4. To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 µF) should be placed near to the supply terminals.
5. For VDD < 1.6 V, VOUT switches to VBAT regardless of VBAT
6. For details on how to optimize current consumption when using WDI. Refer to detailed description section, watchdog.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
timing requirements at RL = 1 MΩ, CL = 50 pF, TA = –40°C to 85°C
PARAMETER
tw
TEST CONDITIONS
At VDD
Pulse width
VIH = VIT + 0.2 V, VIL = VIT –0.2 V
VDD = VIT + 0.2 V, VIL = 0.3 × VDD, VIH = 0.7 × VDD
At WDI
MIN
TYP
MAX
UNIT
6
µs
100
ns
switching characteristics at RL = 1 MΩ, CL = 50 pF, TA =–40°C to 85°C
PARAMETER
td
t(tout)
tPLH
TEST CONDITIONS
Delay time
VDD > VIT +0.2 V
(see timing diagram
Watchdog timeout
Propagation (delay) time, low-tohigh-level output
tPHL
tt
Propagation (delay) time
time, high-tolow-level output
Transition time
VDD to RESET
TYP
MAX
UNIT
60
100
140
ms
0.48
0.8
1.12
s
µs
15
50% RESET to 50% CEOUT
50% CEIN to 50% CEOUT,,
F only
l ((see N
CL = 50 pF
Note 7))
MIN
VDD = 1.8 V
VDD = 3.3 V
VDD = 5 V
VIL = VIT–0.2 V,
VIH = VIT+0.2 V
PFI to PFO
VIL = V(PFI)–0.2 V,
VIH = V(PFI)+0.2 V
VDD to BATTON
VIH = VBAT + 200 mV,
VIL = VBAT – 200 mV,
VBAT < VIT
5
15
1.6
5
1
3
2
5
3
5
ns
µss
µs
3
NOTE 7: Specified by design
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Static drain-source on-state resistance (VDD to VOUT)
rDS(on)
IDD
VIT
Static drain-source on-state resistance (VBAT to VOUT)
6
vs Output current
vs Input voltage at CEIN
8
Supply current
vs Supply voltage
9
Normalized threshold at RESET
vs Free-air temperature
High-level output voltage at RESET
VOH
VOL
High-level output voltage at PFO
10
11, 12
vs High-level
High level output
out ut current
13, 14
High-level output voltage at CEOUT
15, 16, 17, 18
Low-level output voltage at RESET
19, 20
Low-level output voltage at CEOUT
vs Low-level
Low level output
out ut current
Low-level output voltage at BATTON
14
7
Static drain-source on-state resistance
21, 22
23, 24
tp(min)
Minimum Pulse Duration at VDD
vs Threshold overdrive at VDD
25
tp(min)
Minimum Pulse Duration at PFI
vs Threshold overdrive at PFI
26
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
1000
VDD = 3.3 V
VBAT = GND
MSWITCH = GND
900
TA = 85°C
800
TA = 25°C
700
TA = 0°C
TA = –40°C
600
500
50
75
100
125
150
175
200
– Static Drain-Source On-State Resistance – Ω
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
(VDD to VOUT)
vs
OUTPUT CURRENT
rDS(on)
rDS(on)
– Static Drain-Source On-State Resistance – mΩ
TYPICAL CHARACTERISTICS
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
(VBAT to VOUT)
vs
OUTPUT CURRENT
20
VBAT = 3.3 V
MSWITCH = GND
17.5
15
TA = 85°C
12.5
TA = 25°C
TA = 0°C
10
7.5
5
2.5
TA = –40°C
4.5
IO – Output Current – mA
6.5
8.5
10.5
12.5
IO – Output Current – mA
Figure 7
Figure 6
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
(CEIN to CEOUT)
vs
INPUT VOLTAGE AT CEIN
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
40
30
35
TA = 85°C
30
25
20
TA = 0°C
15
TA = –40°C
10
ICEOUT = 5 mA
VDD = 5 V
MSWITCH = GND
5
1
2
3
4
VI(CEIN) – Input Voltage at CEIN – V
20
VDD Mode
VBAT = GND
MSWITCH = GND
TA = 25°C
TA = 0°C
TA = 85°C
15
TA = –40°C
10
5
0
0
VBAT Mode
VBAT = 2.6 V
or
MSWITCH = GND
25
TA = 25°C
I DD– Supply Current – µ A
rDS(on) – Static Drain Source On-State Resistance
(CEIN to CEOUT) – Ω
14.5
5
0
0
1
Figure 8
2
3
4
VDD – Supply Voltage – V
5
6
Figure 9
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
TYPICAL CHARACTERISTICS
TPS3610T50
VIT – Normalized Threshold Voltage at RESET – V
NORMALIZED THRESHOLD AT RESET
vs
FREE-AIR TEMPERATURE
1.001
1
0.999
0.998
0.997
0.996
0.995
–40 –30 –20 –10 0 10 20 30 40 50 60 70 80
TA – Free-Air Temperature – °C
Figure 10
HIGH-LEVEL OUTPUT VOLTAGE AT RESET
vs
HIGH-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT VOLTAGE AT RESET
vs
HIGH-LEVEL OUTPUT CURRENT
5.1
VDD = 5 V
VBAT = GND
MSWITCH = GND
5
VOH – High-Level Output Voltage at RESET – V
VOH– High-Level Output Voltage at RESET – V
6
TA = –40°C
TA = 25°C
4
TA = 0°C
3
2
TA = 85°C
1
Expanded View
5
TA = –40°C
4.9
TA = 25°C
TA = 0°C
4.8
4.7
TA = 85°C
VDD = 5 V
VBAT = GND
MSWITCH = GND
4.6
4.5
0
0
–5
–10
–15
–20
–25
–30
IOH – High-Level Output Current – mA
–35
0
–0.5 –1 –1.5
Figure 11
16
–2 –2.5 –3 –3.5 –4 –4.5 –5
IOH – High-Level Output Current – mA
Figure 12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
TYPICAL CHARACTERISTICS
HIGH-LEVEL OUTPUT VOLTAGE AT PFO
vs
HIGH-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT VOLTAGE AT PFO
vs
HIGH-LEVEL OUTPUT CURRENT
5.55
5
VOH – High-Level Output Voltage at PFO – V
VOH – High-Level Output Voltage at PFO – V
6
TA = –40°C
TA = 25°C
4
TA = 0°C
3
TA = 85°C
2
VDD = 5.5 V
PFI = 1.4 V
VBAT = GND
MSWITCH = GND
1
0
0
Expanded View
5.50
TA = –40°C
5.45
TA = 0°C
5.40
5.35
5.30
TA = 85°C
5.25
5.20
5.15
5.10
–0.5
–1
–1.5
–2
IOH – High-Level Output Current – mA
TA = 25°C
–2.5
VDD = 5.5 V
PFI = 1.4 V
VBAT = GND
MSWITCH = GND
0 –20 –40 –60 –80 –100 –120 –140 –160 –180 –200
IOH – High-Level Output Current – µA
Figure 13
Figure 14
HIGH-LEVEL OUTPUT VOLTAGE AT CEOUT
vs
HIGH-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT VOLTAGE AT CEOUT
vs
HIGH-LEVEL OUTPUT CURRENT
3.35
V(CEIN)= 3.3 V
VDD = 5 V
MSWITCH = GND
Enable Mode
3
TA = –40°C
2.5
TA = 25°C
2
TA = 0°C
1.5
1
TA = 85°C
0.5
0
VOH – High-Level Output Voltage at CEOUT – V
VOH – High-Level Output Voltage at CEOUT – V
3.5
V(CEIN) = 3.3 V
VDD = 5 V
MSWITCH = GND
Expanded View
Enable Mode
3.30
TA = –40°C
TA = 25°C
TA = 0°C
3.25
TA = 85°C
3.20
3.15
3.10
–10
–30
–50 –70 –90 –110 –130 –150
IOH – High-Level Output Current – mA
0 –0.5 –1 –1.5 –2 –2.5 –3 –3.5 –4 –4.5 –5
IOH – High-Level Output Current – mA
Figure 15
Figure 16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
TYPICAL CHARACTERISTICS
HIGH-LEVEL OUTPUT VOLTAGE AT CEOUT
vs
HIGH-LEVEL OUTPUT CURRENT
3.5
3.5
3
VOH – High-Level Output Voltage at CEOUT – V
VOH – High-Level Output Voltage at CEOUT – V
HIGH-LEVEL OUTPUT VOLTAGE AT CEOUT
vs
HIGH-LEVEL OUTPUT CURRENT
TA = –40°C
2.5
TA = 25°C
TA = 0°C
2
1.5
TA = 85°C
1
Disable Mode
V(CEIN) = open
VDD = 1.65 V
MSWITCH = GND
0.5
0
0
–0.5 –1
–1.5
–2
–2.5
–3
–3.5
3.3
TA = –40°C
3.2
TA = 25°C
TA = 0°C
3.1
TA = 85°C
3
2.9
2.8
2.7
0 –0.1 –0.2 –0.3 –0.4 –0.5 –0.6 –0.7 –0.8 –0.9 –1
–4 –4.5
IOH – High-Level Output Current – mA
IOH – High-Level Output Current – mA
Figure 17
Figure 18
LOW-LEVEL OUTPUT VOLTAGE AT RESET
vs
LOW-LEVEL OUTPUT CURRENT
500
3.5
VOL – Low-Level Output Voltage at RESET – mV
VOL – Low-Level Output Voltage at RESET – V
LOW-LEVEL OUTPUT VOLTAGE AT RESET
vs
LOW-LEVEL OUTPUT CURRENT
VDD = 3.3 V
VBAT = GND
MSWITCH = GND
3
2.5
TA = 0°C
2
TA = 25°C
1.5
TA = 85°C
1
TA = –40°C
0.5
0
0
5
10
15
20
IOL – Low-Level Output Current – mA
25
Expanded View
TA = 25°C
300
TA = 0°C
200
TA = –40°C
100
0
0
1
2
3
4
IOL – Low-Level Output Current – mA
Figure 20
POST OFFICE BOX 655303
TA = 85°C
VDD = 3.3 V
VBAT = GND
MSWITCH = GND
400
Figure 19
18
V(CEIN) = open
VDD = 1.65 V
MSWITCH = GND
Expanded View
Disable Mode
3.4
• DALLAS, TEXAS 75265
5
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
TYPICAL CHARACTERISTICS
LOW-LEVEL OUTPUT VOLTAGE AT CEOUT
vs
LOW-LEVEL OUTPUT CURRENT
LOW-LEVEL OUTPUT VOLTAGE AT CEOUT
vs
LOW-LEVEL OUTPUT CURRENT
VOL– Low-Level Output Voltage at CEOUT – mV
VOL– Low-Level Output Voltage at CEOUT – V
3.5
Enable Mode
V(CEIN) = GND
VDD = 5 V
MSWITCH = GND
3
2.5
TA = 85°C
2
TA = 25°C
TA = 0°C
1.5
TA = –40°C
1
0.5
140
V(CEIN) = GND
VDD = 5 V
MSWITCH = GND
120
TA = 85°C
100
TA = 25°C
80
TA = 0°C
60
TA = –40°C
40
20
0
0
0
10 20 30 40 50 60 70 80 90
IOL – Low-Level Output Current – mA
0
100
1
VOL – Low-Level Output Voltage at BATTON – mV
VOL – Low-Level Output Voltage at BATTON – V
Enable Mode
VDD = 3.3 V
VBAT = GND
MSWITCH = GND
TA = 85°C
TA = 0°C
TA = 25°C
1.5
1
TA = –40°C
0.5
0
0
5
4
5
LOW-LEVEL OUTPUT VOLTAGE AT BATTON
vs
LOW-LEVEL OUTPUT CURRENT
3.5
2
3
Figure 22
LOW-LEVEL OUTPUT VOLTAGE AT BATTON
vs
LOW-LEVEL OUTPUT CURRENT
2.5
2
IOL – Low-Level Output Current – mA
Figure 21
3
Enable Mode
Expanded View
10
15
20
25
IOL – Low-Level Output Current – mA
30
400
VDD = 3.3 V
VBAT = GND
MSWITCH = GND
350
Enable Mode
Expanded View
TA = 85°C
300
TA = 25°C
250
TA = 0°C
200
150
TA = –40°C
100
50
0
0
1
2
3
4
5
IOL – Low-Level Output Current – mA
Figure 23
Figure 24
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
19
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
TYPICAL CHARACTERISTICS
TPS3610T50
MINIMUM PULSE DURATION AT VDD
vs
THRESHOLD OVERDRIVE AT VDD
Minimum Pulse Duration at VDD – µ s
10
9
8
7
6
5
4
3
2
1
0
0
0.1
0.2
0.3
0.4 0.5
0.6 0.7 0.8 0.9
1
Threshold Overdrive at VDD – V
Figure 25
TPS3610T50
MINIMUM PULSE DURATION AT PFI
vs
THRESHOLD OVERDRIVE AT PFI
Minimum Pulse Duration at PFI – µ s
5
4.6
VDD = 1.65 V
4.2
3.8
3.4
3
2.6
2.2
1.8
1.4
1
0.6
0
0.1
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Threshold Overdrive at PFI – V
Figure 26
20
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLVS327B – DECEMBER 2000 – REVISED DECEMBER 2002
MECHANICAL DATA
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–ā8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
21
PACKAGE OPTION ADDENDUM
www.ti.com
11-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS3610T50PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3610T50PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3610T50PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3610T50PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3610U18PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3610U18PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3610U18PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3610U18PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
7-May-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS3610T50PWR
PW
14
TAI
330
12
6.67
5.4
1.6
8
12
Q1
TPS3610U18PWR
PW
14
TAI
330
12
6.67
5.4
1.6
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TPS3610T50PWR
PW
14
TAI
535.4
167.7
48.3
TPS3610U18PWR
PW
14
TAI
535.4
167.7
48.3
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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