HITACHI 2SD655

2SD655
Silicon NPN Epitaxial
Application
Low frequency power amplifier, Muting
Outline
TO-92 (1)
1. Emitter
2. Collector
3. Base
3
2
1
2SD655
Absolute Maximum Ratings (Ta = 25°C)
Item
Symbol
Ratings
Unit
Collector to base voltage
VCBO
30
V
Collector to emitter voltage
VCEO
15
V
Emitter to base voltage
VEBO
5
V
Collector current
IC
0.7
A
Collector peak current
iC(peak)
1.0
A
Collector power dissipation
PC
500
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
–55 to +150
°C
Electrical Characteristics (Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test conditions
Collector to base breakdown
voltage
V(BR)CBO
30
—
—
V
I C = 10 µA, IE = 0
Collector to emitter breakdown V(BR)CEO
voltage
15
—
—
V
I C = 1 mA, RBE = ∞
Emitter to base breakdown
voltage
V(BR)EBO
5
—
—
V
I E = 10 µA, IC = 0
Collector cutoff current
I CBO
—
—
1.0
µA
VCB = 20 V, IE = 0
Base to emitter voltage
VBE
—
—
1.0
V
VCE = 1 V, IC = 150 mA
Collector to emitter saturation
voltage
VCE(sat)
—
0.15
0.5
V
I C = 500 mA, IB = 50 mA*2
DC current transfer ratio
hFE*1
250
—
1200
Gain bandwidth product
fT
—
250
—
Notes: 1. The 2SD655 is grouped by h FE as follows.
2. Pulse test
D
E
F
250 to 500
400 to 800
600 to 1200
2
VCE = 1 V, IC = 150 mA*2
MHz
VCE = 1 V, IC = 150 mA
2SD655
Typical Output Characteristics
50
0.04
600
Collector Current IC (mA)
Collector Power Dissipation Pc (mW)
Maximum Collector Dissipation Curve
400
200
0.035
40
0.03
0.025
30
0.02
20
0.015
0.01
10
0.005 mA
IB = 0
0
2
4
6
8
10
Collector to Emitter Voltage VCE (V)
0
50
100
150
Ambient Temperature Ta (°C)
DC Current Transfer Ratio vs.
Collector Current
Typical Transfer Characteristics
10,000
VCE = 1 V
300
DC Current Transfer Ratio hFE
Collector Current IC (mA)
1,000
100
30
10
3
1
VCE = 1 V
Pulse
3,000
1,000
300
100
30
10
0
0.2
0.4
0.6
0.8
Base to Emitter Voltage VBE (V)
1.0
1
3
10
30
100 300
Collector Current IC (mA)
1,000
3
2SD655
Gain Bandwidth Product vs.
Collector Current
3,000
3.0
Gain Bandwidth Product fT (MHz)
Collector to Emitter Saturation Voltage
VCE (sat) (V)
Collector to Emitter Saturation Voltage vs.
Collector Current
IC = 10 IB
1.0
0.3
0.1
0.03
0.01
0.003
3
10
30
100 300 1,000 3,000
Collector Current IC (mA)
VCE = 1 V
1,000
300
100
30
10
3
0.3
1.0
3
10
30
100
Collector Current IC (mA)
Collector Output Capacitance Cob (pF)
Collector Output Capacitance vs.
Collector to Base Voltage
50
f = 1 MHz
IE = 0
20
10
5
2
1
1
4
2
5
10
20
50
Collector to Base Voltage VCB (V)
300
Unit: mm
4.8 ± 0.3
0.7
0.60 Max
0.5 ± 0.1
12.7 Min
2.3 Max
5.0 ± 0.2
3.8 ± 0.3
0.5
1.27
2.54
Hitachi Code
JEDEC
EIAJ
Weight (reference value)
TO-92 (1)
Conforms
Conforms
0.25 g
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
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