TPS60150 www.ti.com.................................................................................................................................................. SLVS888A – DECEMBER 2008 – REVISED APRIL 2009 TPS60150 5V/140mA Charge Pump Device FEATURES 1 • • • • • • • DESCRIPTION 2.7V to 5.5V Input Voltage Range Fixed Output Voltage of 5.0V X2 Charge Pump 1.5 MHz Switching Frequency Maximum Output Current : 140mA 2X2 QFN With 0.8mm Height Typical 90µA Quiescent Current at no Load Condition (Skip mode) Hardware En/Disable Function Built-in Soft Start Built-in Under Voltage Lock Out Protection Thermal and Over Current Protection • • • • The TPS60150 is a switched capacitor voltage converter which produces a regulated, low noise, and low-ripple output voltage (5V) from an unregulated input voltage. The 5V output can supply a minimum of 140mA current with a small 2X2 QFN package. TPS60150 operates in skip mode when the load current falls below 8mA under typical condition. In skip mode operation, quiescent current is reduced to 90µA. Only 3-external capacitors are needed to generate the output voltage, therefore saving PCB space. Inrush current is limited by the soft start function during power on and power transient states. APPLICATIONS • • • • • • • USB OTG HDMI Portable Communication Devices Personal Digital Assistance PCMCIA Cards Cellular Phones Handheld Meters VIN VOUT (5.0V) C3 2.2μF GND ENA VIN CP- VOUT CP+ ENABLE /DISABLE C2 2.2μF C1 4.7μF Figure 1. Typical Application Circuit ORDERING INFORMATION TA PART NUMBER (1) OUTPUT VOLTAGE PACKAGE (2) PACKAGE DESIGNATOR ORDERING PKG MARKING –40°C to 85°C TPS60150 5.0V SON 2x2-6 DRV TPS60150DRV CGO (1) (2) The DRV (2-mm x 2-mm 6-terminal SON) package is available in tape on reel. Add R suffix to order quantities of 3000 parts per reel and T suffix to order quantities with 250 parts per reel. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2009, Texas Instruments Incorporated TPS60150 SLVS888A – DECEMBER 2008 – REVISED APRIL 2009.................................................................................................................................................. www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE VI Input voltage range (all pins) HBM ESD Rating (2) CDM ESD Rating (3) MM ESD Rating (4) TA Operating temperature range TJ Maximum operating junction temperature Tst Storage temperature (1) UNIT –0.3 to 7 V 2 kV 500 V 200 V –40 to 85 °C 150 °C –55 to 150 °C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The Human body model (HBM) is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The testing is done according JEDECs EIA/JESD22-A114. Charged Device Model Machine Model (MM) is a 200pF capacitor discharged through a 500nH inductor with no series resistor into each pin. The testing is done according JEDECs EIA/JESD22-A115. (2) (3) (4) DISSIPATION RATINGS (1) (2) PACKAGE THERMAL RESISTANCE RΘJA TA = 25°C POWER RATING DERATING FACTOR ABOVE TA = 25°C TA = 85°C POWER RATING Low-K(1) DRV 140°C/W 715 mW 7.1 mW/°C 285 mW High-K(2) DRV 65°C/W 1540 mW 15.4 mW/°C 615 mW (1) (2) The JEDEC low-K (1s) board used to derive this data was a 3inx3in, two-layer board with 2-ounce copper traces on top of the board. The JEDEC high-K (2s2p) board used to derive this data was a 3inx3in, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom of the board. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT VIN Input voltage range 2.7 5.5 V TA Operating ambient temperature TJ Operating junction temperature –40 85 °C –40 125 Cin Input capacitor 2.2 µF Co Output capacitor 2.2 µF Cf Flying capacitor 1.0 µF °C ELECTRICAL CHARACTERISTICS VIN=3.6V, TA = –40°C to 85°C, typical values are at TA = 25°C, C1 = C3 = 2.2µF, C2 = 1.0µF (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT POWER STAGE VIN Input voltage range VUVLO Undervoltage lockout threshold IQ Operating quiescent current IOUT = 140 mA, Enable = VIN 4.7 mA IQskip Skip mode operating quiescent current IOUT = 0 mA, Enable=VIN (No switching) 80 µA IOUT = 0 mA, Enable = VIN(Minimum switching) 90 µA ISD Shut down current 2.7 V ≤ VIN ≤ 5.5 V, Enable = 0 V VOUT Output voltage (1) IOUT ≤ 50 mA, 2.7 V ≤ VIN < 5.5V VOUT(skip) Skip mode output voltage IOUT = 0 mA, 2.7 V ≤ VIN ≤ 5.5 V FSW Switching frequency (1) 2 2.7 5.5 1.9 4.8 5.0 VOUT+0.1 1.5 V 2.1 1 µA 5.2 V V MHz When in skip mode, Output voltage can exceed VOUT spec because VOUT(skip)=VOUT+0.1. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 TPS60150 www.ti.com.................................................................................................................................................. SLVS888A – DECEMBER 2008 – REVISED APRIL 2009 ELECTRICAL CHARACTERISTICS (continued) VIN=3.6V, TA = –40°C to 85°C, typical values are at TA = 25°C, C1 = C3 = 2.2µF, C2 = 1.0µF (unless otherwise noted) PARAMETER SSTIME TEST CONDITIONS Soft-start time MIN TYP From the rising edge of enable to 90% output MAX UNIT µs 150 OUTPUT CURRENT IOUT_nom IOUT_short Maximum output current Short circuit current (2) VOUT remains between 4.8 V and 5.2 V, 3.1 V ≤ VIN ≤ 5.5 V 120 3.3 V < VIN < 5.5 V 140 mA VOUT = 0 V 80 mA IOUT = 140 mA 30 mV RIPPLE VOLTAGE VR Output ripple voltage ENABLE CONTROL VHI Logic high input voltage VLI Logic low input voltage IHI ILI 2.7 V ≤ VIN ≤ 5.5 V 1.3 VIN –0.2 0.4 V V Logic high input current 1 µA Logic low input current 1 µA THERMAL SHUTDOWN TSD Shutdown temperature 160 °C TRC Shutdown recovery 140 °C (2) TPS60150 has internal protection circuit to protect IC when VOUT shorted to GND. EN VOUT t 5.0V 4.5V 4.2V Vout t Current Limit 300mA IOUT_MAX Output current Output Short circuit current 50mA(min) t0 t1 t t2 Soft Start Vout is short to GND Figure 2. Maximum Output Current Capability and Short Circuit protection Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 3 TPS60150 SLVS888A – DECEMBER 2008 – REVISED APRIL 2009.................................................................................................................................................. www.ti.com DEVICE INFORMATION PIN ASSIGNMENTS (TOP VIEW) QFN (2x2) (TOP VIEW) GND ENA VIN CP- VOUT CP+ PIN FUNCTIONS PIN NAME I/O DESCRIPTION NO. GND 1 – Ground VIN 2 I Supply voltage input VOUT 3 O Output, Connect to the output capacitor CP+ 4 – Connect to the flying capacitor CP– 5 – Connect to the flying capacitor ENA 6 I Hardware Enable/Disable Pin (High = Enable) FUNCTIONAL BLOCK DIAGRAM CF CPTPS60150 VIN CP+ 5 4 2 TSD UVLO Regulation Current Limit Soft Start Φ1 Φ2 Φ1 VREF Bias circuit Φ2 VOUT 3 ErrorAmp R1 + Control ENA 6 Enable IC R2 OSC 1.5 MHz + Skip Comp 1 GND Figure 3. Functional Block Diagram 4 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 TPS60150 www.ti.com.................................................................................................................................................. SLVS888A – DECEMBER 2008 – REVISED APRIL 2009 TYPICAL CHARACTERISTICS Table of Graphs TITLE DESCRIPTION FIGURE Load Regulation Curve Output voltage vs output current, VIN = Variable, IOUT = Sweep, Temperature = 25°C Figure 4 Line Regulation Curve Output voltage vs input voltage, VIN = Sweep, IOUT = Variable, Temperature = 25°C Figure 5 Efficiency Curve Efficiency vs input voltage, VIN = Sweep, IOUT = Variable, Temperature = 25°C Figure 6 Quiescent Current Curve Quiescent current vs input voltage, VIN = Sweep, IOUT = 0, Temperature = Variable Figure 7 Maximum Output Current Curve Maximum output current vs input voltage, VIN = Sweep, Temperature = Variable Figure 8 Load Transient Curve Output voltage vs load current Figure 9 Figure 10 Figure 11 Output ripple voltage (Skip mode) Figure 12 Output Ripple Figure 13 Output ripple voltage (Normal mode) Figure 14 Figure 15 Power ON Power on start up Enable / Disable Soft start when enable TSD Operation VIN = 5.5V, RLOAD = 20Ω Figure 16 Figure 17 Figure 18 Figure 19 OUTPUT VOLTAGE vs OUTPUT CURRENT OUTPUT VOLTAGE vs INPUT VOLTAGE 5.10 5.25 TA = 25°C TA = 25°C 5.2 5.05 10 mA VO - Output Voltage - V VO - Output Voltage - V 5.15 5.1 5.05 3.6 V 4.2 V 5V 5.5 V 5 4.95 50 mA 5.00 150 mA 4.95 120 mA 4.90 100 mA 4.85 4.9 2.7 V 4.85 0 0.05 0.1 0.15 IO - Output Current - A 0.2 4.80 2.7 Figure 4. 3.2 3.7 4.2 4.7 VI - Input Voltage - V 5.2 Figure 5. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 5 TPS60150 SLVS888A – DECEMBER 2008 – REVISED APRIL 2009.................................................................................................................................................. www.ti.com EFFICIENCY vs INPUT VOLTAGE QUIESCENT CURRENT vs INPUT VOLTAGE 120 100 TA = 25°C 150 mA 80 Efficiency - % 70 No load No Switching 110 120 mA 50 mA Input Current - µA 90 100 mA 60 10 mA 50 40 100 -85°C 90 80 30 -40°C 25°C 20 70 10 0 2.7 3.2 3.7 4.2 4.7 VI - Input Voltage - V 60 2.7 5.2 4.2 3.7 4.7 VI - Input Voltage - V 3.2 Figure 6. 5.2 Figure 7. MAXIMUM OUTPUT CURRENT vs INPUT VOLTAGE AT TEMPERATURE 0.3 TA = -40°C IO - Max Output Current - A 0.25 0.2 TA = 25°C TA = 85°C 0.15 0.1 0.05 0 2.7 3.2 3.7 4.2 4.7 VI - Input Voltage - V 5.2 Figure 8. 6 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 TPS60150 www.ti.com.................................................................................................................................................. SLVS888A – DECEMBER 2008 – REVISED APRIL 2009 LOAD TRANSIENT RESPONSE VIN = 2.7 V, Io = 30 mA to 50 mA LOAD TRANSIENT RESPONSE VIN = 3.6 V, Io = 60 mA to 100 mA 20 ms/div 20 ms/div Figure 9. Figure 10. OUTPUT RIPPLE VOLTAGE (SKIP MODE) VIN = 2.7 V, Io = 0 mA OUTPUT RIPPLE VOLTAGE (SKIP MODE) VIN = 3.6 V, Io = 0 mA 5 ms/div 5 ms/div Figure 11. Figure 12. OUTPUT RIPPLE VOLTAGE (NORMAL MODE) VIN = 2.7 V, Io = 50 mA OUTPUT RIPPLE (NORMAL MODE) VIN = 3.6 V, Io = 100 mA 500 ns/div 500 ns/div Figure 13. Figure 14. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 7 TPS60150 SLVS888A – DECEMBER 2008 – REVISED APRIL 2009.................................................................................................................................................. www.ti.com POWER ON VIN = 2.7 V, Io = 50 mA POWER ON VIN = 3.6 V, Io = 100 mA 1 ms/div 1 ms/div Figure 15. Figure 16. ENABLE / DISABLE VIN = 2.7 V, Io = 50 mA ENABLE / DISABLE VIN = 3.6 V, Io = 100 mA 200 ms/div 200 ms/div Figure 17. Figure 18. THERMAL SHUT DOWN OPERATION VIN = 5.5 V, RLOAD=20Ω 50 ms/div Figure 19. 8 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 TPS60150 www.ti.com.................................................................................................................................................. SLVS888A – DECEMBER 2008 – REVISED APRIL 2009 APPLICATION INFORMATION APPLICATION OVERVIEW Most of today’s battery-powered portable electronics allow and/or require data transfer with a PC. One of the fastest data transfer protocols is via USB On the Go (OTG). As Figure 20 shows, the USB OTG circuitry in the portable device requires a 5-V power rail and up to 140mA of current. The TPS60150 may be utilized to provide a 5-V power rail in a battery powered system. Alternatively, low-cost portable electronics with small LCD displays require a low-cost solution for providing the WLED backlight. As shown in Figure 21, the TPS60150 can also be used to drive several WLEDs in parallel, with the help of ballast resistors. GND ENA VIN CP- VOUT CP+ VIN = 2.7 V - 5.5 V 140mA (VIN > 3.3V) 50mA (VIN > 2.7V) C2 1 mF C3 C1 2.2 mF 2.2 mF 5V Controller VBUS GND ID USB Transceiver D+ Comparator D- Figure 20. Application Circuit for OTG System VIN = 2.7 V~5.5 V 140mA (VIN > 3.3V) GND ENA VIN CP- VOUT CP+ 50mA (VIN > 2.7V) ENABLE C2 1 mF C3 C1 2.2 mF 2.2 mF Figure 21. Application Circuit for Driving White LEDs BASIC OPERATION PRINCIPLE The TPS60150, regulated charge pump, provides a regulated output voltage for various input voltages. The TPS60150 regulates the voltage across the flying capacitor to 2.5V and controls the voltage drop of Q1 and Q2 while a conversion clock with 50% duty cycle drives the FETs. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 9 TPS60150 SLVS888A – DECEMBER 2008 – REVISED APRIL 2009.................................................................................................................................................. www.ti.com VIN Q2 Q1 OFF ON 2.5V - + Q3 CF Q4 OFF ON VOUT COUT Figure 22. Charging Mode During the first half cycle, Q2 and Q3 transistors are turned on and flying capacitor, CF, will be charged to 2.5V ideally. VIN Q1 Q2 OFF VQ1 ON 2.5V - + Q3 OFF CF Q4 ON VOUT COUT Figure 23. Discharging Mode During the second half cycle, Q1 and Q4 transistors are turned on. Capacitor CF will then be discharged to output. The output voltage can be calculated as follows: Vout = VIN - VQ1 + V(CF) - VQ4 = VIN - VQ1 + 2.5V - VQ4 = 5 V. (Ideal) The output voltage is regulated by output feedback and an internally compensated voltage control loop. 10 Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 TPS60150 www.ti.com.................................................................................................................................................. SLVS888A – DECEMBER 2008 – REVISED APRIL 2009 NORMAL MODE AND SKIP MODE OPERATION 4.7 mA Quiescent Current 90 mA 50 mA t Load current No load t VOUT 5 V +0.1 V 5V t Gate Waveform Of Q1 Transistor t Skip Mode at Normal Mode at Skip Mode at No Load Condition 50 mA Load Current No Load Condition Start up Waveform Figure 24. Normal Mode and Skip Mode Operation The TPS60150 has skip mode operation as shown in Figure 24. The TPS60150 enters skip mode if the output voltage reaches 5V+0.1V and the load current is below 8mA(typ). In Skip Mode, the TPS60150 disables the oscillator and decreases the pre_bias current of the output stage to reduce the power consumption. Once the output voltage dips below threshold voltage, 5V+0.1V, the TPS60150 begins switching to increase output voltage until the output reaches 5V+0.1V. When the output voltage dips below 5V, the TPS60150 returns to normal PWM mode; thereby re-enabling the oscillator and increasing the pre_bias current of the output stage to supply output current. The skip threshold voltage and current depend on input voltage and output current conditions. SHORT CIRCUIT PROTECTION The TPS60150 has internal short circuit protection to protect the IC when the output is shorted to ground. To avoid damage when output is shorted to ground, the short circuit protection circuitry senses output voltage and clamps the maximum output current to 80mA(typ). THERMAL SHUT DOWN PROTECTION The regulator has thermal shutdown circuitry that protects it from damage caused by overload conditions. The thermal protection circuitry disables the output when the junction temperature reached approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is automatically re-enabled. Continuously running the regulator into thermal shutdown can degrade reliability. The regulator also provides current limit to protect itself and the load. Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 11 TPS60150 SLVS888A – DECEMBER 2008 – REVISED APRIL 2009.................................................................................................................................................. www.ti.com SHUTDOWN MODE An enable pin on the regulator may be used to place the device into an energy-saving shutdown mode. In this mode, the output is disconnected from the input and the input quiescent current is reduced to 1µA maximum. CAPACITOR SELECTION For minimum output voltage ripple, the output capacitor (COUT) should be a surface-mount ceramic capacitor. Tantalum capacitors generally have a higher Effective Series Resistance (ESR) and may contribute to higher output voltage ripple. Leaded capacitors also increase ripple due to the higher inductance of the package itself. To achieve the best operation with low input voltage and high load current, the input and flying capacitors (CIN and CF, respectively) should also be surface-mount ceramic types. VIN VOUT (5 V) GND ENA VIN CP- VOUT COUT ENABLE /DISABLE CF CP+ CIN Figure 25. Capacitors Generally, CFLY can be calculated by simple equation as follows, Qcharging = c ´ v = CFLY ´ D VCFLY , æT ö Qdischarging = idischarge ´ t = 2 ´ ILO AD(MAX) ´ ç ÷ , half duty. è2ø (1) æTö \ 2 ´ ILOAD(MAX) ´ ç ÷ = CFLY ´ DVCFLY è 2ø Both equation should be same, \ CFLY æTö 2 ´ ILOAD(MAX) ´ ç ÷ è 2 ø = ILOAD(MAX) ³ DVCFLY DVCFLY ´ ¦ (2) If ILOAD = 140 mA, f = 1.5MHZ, and ΔVCFLY = 100mV, the minimum value of the flying capacitor should be 1µF. Output capacitance, COUT, is also strongly related to output ripple voltage and loop stability, ILOAD(MAX) + 2I ´ ESRCOUT VOUT(RIPPLE) = (2 ´ f ´ COUT ) LOAD(MAX) (3) The minimum output capacitance for all output levels is 2.2µF due to control stability. Larger ceramic capacitors or low ESR capacitors can be used to lower the output ripple voltage. Suggested Capacitors (Input / Output / Flying Capacitor) Manufacturer Part number Value Tolerance Dielectric material 4.7uF 2.2uF 12 X7R Submit Documentation Feedback Package Size Rated working voltage 6.3V Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 TPS60150 www.ti.com.................................................................................................................................................. SLVS888A – DECEMBER 2008 – REVISED APRIL 2009 The efficiency of the charge pump regulator varies with the output voltage, the applied input voltage and the load current. The approximate efficiency in normal operating mode is given by: V ´ IOUT PD(out) Efficiency(%) = ´ 100 = OUT ´ 100 , IIN = 2 ´ IOUT + IQ PD(in) VIN ´ IIN Efficiency(%) = VOUT 2 × VIN × 100 (IIN = 2 ´ IOUT ) (4) Quiescent current was neglected. (5) PCB LAYOUT Large transient currents flow in the VIN, VOUT, and GND traces. To minimize both input and output ripple, keep the capacitors as close as possible to the regulator using short, direct circuit traces. C2 Figure 26. Recommended PCB Layout Submit Documentation Feedback Copyright © 2008–2009, Texas Instruments Incorporated Product Folder Link(s): TPS60150 13 PACKAGE OPTION ADDENDUM www.ti.com 8-Apr-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS60150DRVR ACTIVE SON DRV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS60150DRVT ACTIVE SON DRV 6 250 CU NIPDAU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS60150DRVR SON DRV 6 3000 330.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 TPS60150DRVT SON DRV 6 250 180.0 12.4 2.2 2.2 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS60150DRVR SON DRV 6 3000 346.0 346.0 29.0 TPS60150DRVT SON DRV 6 250 190.5 212.7 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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