SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 features TQFP-48 PowerPAD PACKAGE (TOP VIEW) M2 M1 AVSS ABPb AVDD ARPr AVSS AGY AVDD COMP FSADJ VREF D Triple 10-bit D/A Converters D Minimum 80 MSPS Operation D Direct Drive of Doubly-Terminated 75-Ω Load Into Standard Video Levels D 3×10 Bit 4:4:4, 2×10 Bit 4:2:2 or 1×10 Bit D D D D 48 47 46 45 44 43 42 41 40 39 38 37 4:2:2 (ITU-BT.656) Multiplexed YPbPr/GBR Input Modes Bi-Level (EIA) or Tri-Level (SMPTE) Sync Generation With 7:3 Video/Sync Ratio Integrated Insertion of Sync-On-Green/ Luminance or Sync-On-All Channels Configurable Blanking Level Internal Voltage Reference BPb9 BPb8 BPb7 BPb6 BPb5 BPb4 BPb3 BPb2 BPb1 BPb0 DVSS DVDD applications D High-Definition Television (HDTV) Set-Top 36 2 35 3 34 4 33 5 32 6 31 7 30 8 29 9 28 10 27 11 26 12 25 GY0 GY1 GY2 GY3 GY4 GY5 GY6 GY7 GY8 GY9 CLK SYNC_T 13 14 15 16 17 18 19 20 21 22 23 24 RPr0 RPr1 RPr2 RPr3 RPr4 RPr5 RPr6 RPr7 RPr8 RPr9 BLANK SYNC D D D Boxes/Receivers High-Resolution Image Processing Desktop Publishing Direct Digital Synthesis/I-Q Modulation 1 See ALSO: THS8134 (8 bit, pin-compatible) description The THS8133 is a general-purpose triple high-speed D/A converter (DAC) optimized for use in video/graphics applications. The device operates from a 5-V analog supply and a 3-V to 5-V range digital supply. The THS8133 has a sampling rate up to 80 MSPS. The device consists of three 10-bit D/A converters and additional circuitry for bi-level/tri-level sync and blanking level generation in video applications. THS8133 is also well suited in applications where multiple well-matched and synchronously operating DACs are needed; for example, I-Q modulation and direct-digital synthesis in communications equipment. The current-steering DACs can be directly terminated in resistive loads to produce voltage outputs. The device provides a flexible configuration of maximum output current drive. Its output drivers are specifically designed to produce standard video output levels when directly connected to a single-ended doubly-terminated 75 Ω coaxial cable. Full-scale video/sync are generated in a 7:3 ratio, compliant with SMPTE standards for GBR and YPbPr signals. Furthermore, the THS8133 can generate both a traditional bi-level sync or a tri-level sync signal, as per the SMPTE standards, via a digital control interface. The sync signal is inserted on one of the analog output channels (sync-on-green/luminance) or on all output channels. Also, a blanking control signal sets the outputs to defined levels during the nonactive video window. Finally the input format can be either 3×10 bit 4:4:4, 2×10 bit 4:2:2, or 1×10 bit 4:2:2. This enables a direct interface to a wide range of video DSP/ASICs including parts generating ITU-BT.656 formatted output data. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. Copyright 2000, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 1 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 AVAILABLE OPTIONS PACKAGE TA TQFP-48 PowerPAD THS8133CPHP† THS8133ACPHP‡ THS8133BCPHP‡ 0°C 0 C to 70 70°C C † In the THS8133CPHP, the KIMBAL maximum specification is assured over full temperature range and the KIMBAL(SYNC) maximum specification is assured at 25°C. The position of the blanking level is as shown in Table 1. ‡ In the THS8133ACPHP and the THS8133BCPHP, both the KIMBAL maximum speciffication and the KIMBAL(SYNC) maximum specification are assured over the full temperature range. The position of the blanking level is as shown in Table 1. Terminal Functions TERMINAL NAME PIN I/O DESCRIPTION Analog red, green and blue respectively Pr, Y and Pb current outputs, capable of directly driving a doubly terminated 75-Ω 75- coaxial cable. ABPb 45 O AGY 41 O ARPr 43 O AVDD AVSS 40,44 I Analog power supply (5 V ±10%). All AVDD terminals must be connected. 42,46 I Analog ground BLANK 23 I Blanking control input, active low. A rising edge on CLK latches BLANK. When asserted, the ARPr, AGY and ABPb outputs are driven to the blanking level, irrespective of the value on the data inputs. SYNC takes precedence over BLANK, so asserting SYNC (low) while BLANK is active (low) will result in sync generation. 10−1 I Blue or Pb pixel data input bus. Index 0 denotes the least significant bit. Refer to functional description for different operating modes. CLK 26 I Clock input. A rising edge on CLK latches RPr0-9, GY0-9, BPb0-9, BLANK, SYNC, and SYNC_T. The M2 input is latched by a rising edge on CLK also, but only when additional conditions are satisfied, as explained in its terminal description. COMP 39 O Compensation terminal. A 0.1 µF capacitor must be connected between COMP and AVDD. DVDD 12 I Digital power supply (3-V to 5-V range) DVSS 11 I Digital ground FSADJ 38 I Full-scale adjust control. The full-scale current drive on each of the output channels is determined by the value of a resistor RFS connected between this terminal and AVSS. The nominal value of RFS is 430 Ω, corresponding to 26.67 mA full-scale current. The relationship between RFS and the full-scale current level for each operation mode is explained in the functional description. 36−27 I Green or Y pixel data input bus. Index 0 denotes the least significant bit. Refer to functional description for different operating modes. M1 47 I Operation mode control 1. M1 is directly interpreted by the device (it is not latched by CLK). M1 configures device according to Table 1. M2 48 I Operation mode control 2. The second rising edge on CLK after a transition on SYNC latches M2. The interpretation is dependent on the polarity of the last SYNC transition: SYNC L to H: latched as M2_INT SYNC H to L: latched as INS3_INT Together with M1, M2_INT configures the device as shown in Table 1. When INS3_INT is high, the sync output is inserted on all DAC outputs; a low will insert it only on the AGY output. See also Figure 2 and Table 2. The value of M2 at power up is undetermined. Therefore at least 1 L −>H transition on SYNC is required to set M2. BPb0−BPb9 GY0−GY9 2 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 Terminal Functions (Continued) TERMINAL NAME PIN I/O DESCRIPTION RPr0−PRr9 13−22 I Red or Pr pixel data input bus. Index 0 denotes the least significant bit. Refer to functional description for different operating modes SYNC 24 I Sync control input, active low. A rising edge on CLK latches SYNC. When asserted, only the AGY output (INS3_INT=L, see terminal M2) or ARPr, AGY and ABPb outputs (INS3_INT=H, see terminal M2) are driven to the sync level, irrespective of the values on the data or BLANK inputs. Consequently, SYNC should remain low for the whole duration of sync, which is in the case of a tri-level sync both the negative and positive portion (see Figure 7). I Sync tri-level control, active high. A rising edge on CLK latches SYNC_T. When asserted, a positive sync (higher than blanking level) is generated when SYNC is low. When disabled, a negative sync (lower than blanking level) is generated when SYNC is low. When generating a tri-level (negative-to-positive) sync, a L → H transition on this signal positions the start of the positive transition. See Figure 6 for timing control. SYNC_T 25 The value on SYNC_T is ignored when SYNC is not asserted (high). VREF 37 I/O Voltage reference for DACs. An internal voltage reference of nominally 1.35 V is provided, which requires an external 0.1 µF ceramic capacitor between VREF and AVSS. However, the internal reference can be overdriven by an externally supplied reference voltage. FSADJ COMP VREF DVDD DVSS Bandgap Reference RPr[9:0] Input Formatter GY[9:0] BPb[9:0] CLK M1 M2 R/Pr Register DAC ARPr G/Y Register DAC AGY B/Pb Register DAC ABPb Configuration Control SYNC/BLANK Control SYNC BLANK SYNC_T AVDD AVSS Figure 1. THS8133 Block Diagram • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 3 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 (continued) device configuration Input data to the device can be supplied from a 3x10b GBR/YPbPr input port. If the device is configured to take data from all three channels, the data is clocked in at each rising edge of CLK. All three DACs operate at the full clock speed of CLK. device configuration (continued) In the case of 4:2:2 sampled data (for YPbPr) the device can be fed over either a 2x10 bit or 1x10 bit multiplexed input port. An internal demultiplexer will route input samples to the appropriate DAC: Y at the rate of CLK, Pb and Pr each at rate of one-half CLK. According to ITU-BT.656 the sample sequence is Pb-Y-Pr over a 1x10 bit interface (Y-port). The sample sequence starts at the first rising edge of CLK after BLANK has been taken high (inactive). In this case the frequency of CLK is two times the Y conversion speed and four times the conversion speed of both Pr and Pb. With a 2x10 bit input interface, both the Y-port and the Pr-port are sampled on every CLK rising edge. The Pr-port carries the sample sequence Pb-Pr. The sample sequence starts at the first rising edge of CLK after BLANK has been taken high (inactive). In this case the frequency of CLK is equal to the conversion speed of Y and 2x the conversion speed of both Pr and Pb. The device’s operation mode is set by the M1 and M2 mode selection terminals, according to Table 1. The operation mode also determines the blanking level, as explained below in the sync/blanking generation sections. Table 1. THS8133 Configuration M1 M2_INT L L CONFIGURATION GBR 3x10b−4:4:4 GBR mode 4:4:4. Data clocked in on each rising edge of CLK from G, B, and R input channels. For the definition of the analog output levels during blanking, see note 1. DESCRIPTION L H YPbPr 3x10b−4:4:4 YPbPr mode 4:4:4. Data clocked in on each rising edge of CLK from Y, Pb and Pr input channels. (see Note 1). For the definition of the analog output levels during blanking, see note 1. H L YPbPr 2x10b−4:2:2 YPbPr mode 4:2:2 2x10 bit. Data clocked in on each rising edge of CLK from Y & Pr input channels. A sample sequence of Pb−Pr−... should be applied to the Pr port. At the first rising edge of CLK after BLANK is taken high, Pb should be present on this port. For the definition of the analog output levels during blanking, see note 1. H H YPbPr 1x10b−4:2:2 YPbPr mode 4:2:2 1x10 bit (ITU-BT.656 compliant). Data clocked in on each rising edge of CLK from Y input channel. For the definition of the analog output levels during blanking, see note 1. NOTE 1: In all device versions, the blanking level on the AGY channel output corresponds to input code 0 of the DAC. 4 S In the THS8133CPHP and the THS8133ACPHP versions, the blanking level on the ABPb and ARPr channel outputs corresponds to the 512 input code of the DAC, when sync is inserted on all three channels (INS3_INT=H) and to the 0 input code of the DAC, when sync is only inserted on the Y channel (INS3_INT=L) S In the THS8133BCPHP version, the blanking level on the ABPb and ARPr channel outputs corresponds to the 512 input code of the DAC irrespective if sync is inserted on all three channels (INS3_INT=H), or if sync is inserted only on the Y channel (INS3_INT=L) • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 Table 2. INS3_INT/M2_INT Selection on M2 LAST EVENT ON SYNC SYNC_T M1 M2 (see Note 2) H→L L or H X INS3_INT Sync insertion active: SYNC low enables sync generation on 1 (INS3_INT=L) or all 3 (INS3_INT=H) DAC outputs. SYNC_T determines the sync polarity. L→H X X M2_INT Device mode programming active: The DAC outputs reflect the DAC inputs (BLANK=H) or are forced to the blanking level (BLANK=L). M2 is interpreted according to Table 1. DESCRIPTION X = don’t care NOTE 2: M1 and M2 start configuring the device as soon as they are interpreted, which is continuously for M1 (static pin) or on the second rising edge on CLK after a transition on SYNC for M2. M2 is interpreted as either INS3_INT or M2_INT, as shown in Table 2. programming example Configuration of the device will normally be static in a given application. If M2_INT and INS3_INT need to be both low or high, the M2 pin is simply tied low or high. If M2_INT and INS3_INT need to have different levels, these can be easily derived from the signal on the SYNC pin, as shown in Table 3 and Figure 2. Table 3. Generating M2 From SYNC In order to have: Apply to M2: M2_INT INS3_INT L H ...SYNC delayed by 2 CLK periods H L ...inverted SYNC delayed by 2 CLK periods The input formats and latencies are shown in Figures 3−5 for each operation mode. CLK SYNC M2 [=SYNC_delayed] INS3_INT if (M2 = SYNC_delayed) ⇒ M2_INT = L and INS3_INT = H) M2_INT M2 [=NOT SYNC_delayed] INS3_INT if (M2 = NOT SYNC_delayed) ⇒ M2_INT = H and INS3_INT = L) M2_INT Figure 2. Generating INS3_INT and M2_INT from M2 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 5 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 programming example (continued) T0 CLK T1 T2 T3 T4 T5 T6 T7 T8 RPr[9−0] RPr(0) RPr(1) RPr(2) RPr(3) RPr(4) RPr(5) RPr(6) RPr(7) RPr(8) GY[9−0] GY(0) GY(1) GY(2) GY(3) GY(4) GY(5) GY(6) GY(7) GY(8) BPb[9−0] BPb(0) BPb(1) BPb(2) BPb(3) BPb(4) BPb(5) BPb(6) BPb(7) BPb(8) ARPr, AGY, ABPb output corresponding to RPr(0), GY(0), BPb(0) data path latency = 7 CLK cycles RPr(0), GY(0), BPb(0) registered Figure 3. Input Format and Latency YPbPr 4:4:4 and GBR 4:4:4 Modes T0 T1 BLANK T2 T3 T4 T5 T6 T7 T8 T9 First registered sample on RPr[9−0] after L->H on BLANK is interpreted as Pb[9−0] RPr[9−0] Pb(0) Pr(0) Pb(2) Pr(2) Pb(4) Pr(4) Pb(6) Pr(6) Pb(8) Pr(8) GY[9−0] Y(0) Y(1) Y(2) Y(3) Y(4) Y(5) Y(6) Y(7) Y(8) Y(9) BPb[9−0] ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ data path latency = 8 CLK cycles Pb(0), Y(0) registered Pr(0), Y(1) registered Figure 4. Input Format and Latency YPbPr 4:2:2 2×10 Bit Mode 6 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • ARPr, AGY, ABPb output corresponding to Pr(0), Y(0), Pb(0) SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 programming example (continued) T0 BLANK RPr[9−0] GY[9−0] BPb[9−0] T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 First registered sample on GYr[9−0] after L->H on BLANK is interpreted as Pb[9−0] ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Pb(0) Y(0) Pr(0) Y(2) Pb(4) Y(4) Pr(4) Y(6) Pb(8) data path latency = 9 CLK cycles Pb(0) registered Y(0) registered Pr(0) registered Y(8) Pr(8) ARPr, AGY, ABPb output corresponding to Pr(0), Y(0), Pb(0) Figure 5. Input Format and Latency YPbPr 4:2:2 1×10 Bit Mode sync generation Additional control inputs SYNC and SYNC_T enable the superposition of an additional current onto the AGY channel or on all three channels, depending on the setting of INS3_INT. By combining the SYNC and SYNC_T control inputs, either bi-level negative going pulses or tri-level pulses can be generated. Depending on the timing controls for these signals, both horizontal and vertical sync signals can be generated. Assertion of SYNC (active low) will identify the sync period, while assertion of SYNC_T (active high) within this period will identify the positive excursion of a tri-level sync. Refer to the application information section for practical examples on the use of these control inputs for sync generation. blanking generation An additional control input BLANK is provided that will fix the output amplitude on all channels to the blanking level, irrespective of the value on the data input ports. However, sync generation has precedence over blanking; that is, if SYNC is low, the level of BLANK is don’t care. The absolute amplitude of the blanking level with respect to active video is determined by the GBR or YPbPr operation mode of the device. Refer to the application information section for practical examples on the use of this control input for blank generation. Figure 6 shows how to control SYNC, SYNC_T, and BLANK signals to generate tri-level sync levels and blanking at the DAC output. A bi-level (negative) sync is generated similarly by avoiding the positive transition on SYNC_T during SYNC low. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 7 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 blanking generation (continued) CLK ts SYNC th td(D) td(D) td(D) td(D) ÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SYNC_T BLANK D(0) RPr[9−0] GY[9−0] BPb[9−0] D(1) Value Corresponds to D(0) Figure 6. Sync and Blanking Generation DAC operation The analog output drivers generate a current of which the drive level can be user-modified by choice of an appropriate resistor value RFS, connected to the FSADJ terminal. Refer to the paragraph on output amplitude control for details on how the output drive is affected by the operation mode of the device. All current sources derive their amplitudes from an internal generator that produces a 1.35-V reference level. All current source amplitudes (video, blanking, sync) also come from this reference so that the relative amplitudes of sync/blank/video are always equal to their nominal relationships. For increased stability on the absolute levels, the user can overdrive the reference by directly driving the VREF input terminal. output amplitude control The current drive on all three output channels and on the internal sync generator is controlled by a resistor RFS that must be connected between FSADJ and AVSS. In all operation modes the relative amplitudes of the current drivers are maintained irrespective of the RFS value, as long as a maximum current drive capability is not exceeded. The sync generator is composed of different current sources that are internally routed to a corresponding DAC output. Depending on the setting of INS3_INT during SYNC low, the sync current drive is added to either only the green channel output (sync-on-green) if INS3_INT = L or all three channel outputs INS3_INT = H. In either case the relative current levels, as defined below, are maintained. 8 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 output amplitude control (continued) The exact relationship between RFS and the current drive level on each channel is dependent on the operation mode of the device (see Table 4). In GBR mode, the output drive is identical on the three channels, while in YPbPr mode, a level shift is implemented on Pb and Pr channels. Refer to the application information section for details on the current drive levels in each mode. The device has an internal voltage reference derived from a bandgap reference of 1.35 V. The relationship between the full-scale current drive level and RFS is given by: IFS [A] = α x VREF [V] ÷ RFS [Ω] where α is dependent on the operation mode of the device. Typical operation modes are shown in Table 4 for the nominal RFS value. This value will produce the full-scale current levels mentioned in Table 4 and, when terminated, voltages of standard video levels, as shown in the applications section. The resistor value is variable provided the maximum current level on each of the DAC outputs is not exceeded. Table 4. THS8133 Nominal Full-Scale Currents AGY OPERATION MODE DESCRIPTION M1 M2_INT INS3_INT IFS (mA) GBR with sync-on-green L L L L L GBR with sync-on-all YPbPr with sync-on-Y (L,H), (H,L) or (HH), according to Tables 1 and 2 YPbPr with sync-on-all ARPr ABPb α IFS (mA) α IFS (mA) α 26.67† 1461/172 18.67‡ 1023/172 18.67 1023/172 H 26.67 1461/172 26.67 1461/172 26.67 1461/172 L 26.67 1461/172 18.67 1023/172 18.67 1023/172 H 26.67 1461/172 18.67 1023/172 18.67 1023/172 † IFS = 1461/172 × 1.35/430 ‡ IFS = 1023/172 × 1.35/430 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage: AVDD to AVSS, DVDD to DVSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V AVDD to DVDD, AVSS to DVSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 0.5 V Digital input voltage range to DVSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to DVDD + 0.5 V Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. recommended operating conditions over operating free-air temperature range, TA power supply Supply voltage AVDD DVDD • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • MIN NOM MAX 4.75 5 5.25 3 3.3/5 5.25 UNIT V 9 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 recommended operating conditions over operating free-air temperature range, TA (continued) digital and reference inputs MIN High-level input voltage, VIH DVDD = 3.3 V DVDD = 5 V Low−level input voltage, VIL NOM MAX 2 DVDD 2.4 DVDD UNIT V DVSS 0.8 V Clock frequency, fclk 0 80 MHz Pulse duration, clock high, tw(CLKH) 5 Pulse duration, clock low, tw(CLKL) Reference input voltage,† Vref(I) (see Note 3) 5 ns ns 1.35 1.62 V FSADJ resistor, R(FS) (see Note 3) 360 430 Ω † Voltage reference input applies to the externally applied voltage (overdrive condition). Internally a 2 kΩ resistor isolates the internal reference from the externally applied voltage, if any. NOTE 3: The combination of Vref and RFS can be chosen at will as long as the maximum full-scale DAC output current I(FS) does not exceed 120% of its nominal value. Therefore, at fixed R(FS) = R(FSnom), Vref should not be higher than the maximum value mentioned and at fixed Vref = Vref(nom), R(FS) should not be less than the minimum value mentioned. electrical characteristics over recommended operating conditions with fCLK = 80 MSPS and use of internal reference voltage Vref, with R(FS) = R(FSnom) (unless otherwise noted) power supply (1 MHz, −1 dBFS digital sine simultaneously applied to all 3 channels) PARAMETER TEST CONDITIONS IDD Operating supply current AVDD = DVDD = 5 V AVDD = 5 V, DVDD = 3.3 PD Power dissipation AVDD = DVDD = 5 V AVDD = 5 V, DVDD = 3.3 MIN TYP MAX 134 142 114 121 670 710 525 565 TYP MAX UNIT mA mW digital inputs − dc characteristics PARAMETER TEST CONDITIONS MIN UNIT 1 µA −1 µA 1 µA A IIH IIL High-level input current IIL(CLK) IIH(CLK) Low-level input current, CLK CI Input capacitance ts tH Data and control inputs setup time 3 ns Data and control inputs hold time 0 ns td(D) AVDD = DVDD = 5 V Digital inputs and CLK at 0 V for IIL; Digital inputs and CLK at 5 V for IIH Low-level input current High-level input current, CLK −1 TA = 25_C Digital process delay from first registered color component of pixel‡ (see Figures 3−5) 7 RGB and YPbPr 4:4:4 7 YPbPr 4:2:2 2×10 bit 8 pF CLK periods YPbPr 4:2:2 1×10 bit 9 ‡ This parameter is assured by design and not production tested. The digital process delay is defined as the number of CLK cycles required for the first registered color component of a pixel, starting from the time of registering it on the input bus, to propagate through all processing and appear at the DAC output drivers. The remaining delay through the IC is the analog delay td(A) of the analog output drivers. 10 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 electrical characteristics over recommended operating conditions with fCLK = 80 MSPS and use of internal reference voltage Vref , with R(FS) = R(FSnom) (unless otherwise noted) (continued) analog (DAC) outputs PARAMETER TEST CONDITIONS DAC resolution MIN TYP 10 10 INL Integral nonlinearity Static, best fit DNL Differential nonlinearity Static 37 PSRR Power supply ripple rejection ratio of DAC output (full scale) f = 100 kHz (see Note 4) f = 1 MHz (see Note 4) 43 XTALK Crosstalk between channels f up to 30 MHz, (see Note 5) VO(ref) Voltage reference output ro(VREF) VREF output resistance G(DAC) DAC gain factor VO(DAC) MAX UNIT bits ±0.6 ±1.2 LSB −0.25/0.5 ±1 LSB dB −55 dB 1.30 1.35 1.40 V 7K 11K 15K W See Table 4 Imbalance between DACs, (KIMBAL) See Note 6 ±5% Imbalance between positive and negative sync, (KIMBAL(SYNC)) See Note 6 ±2% DAC output compliance voltage (sync+video) RL = 37.5 Ω, See Note 7 1 1.2 RL = 75 Ω, See Note 7 2 2.4 AGY Internal reference GBR sync-on-green and YPbPr sync-on-Y/syncon-all External reference I(FS) Internal reference GBR sync-on-all External reference ro DAC output resistance CO DAC output capacitance (pin capacitance) tr(DAC) DAC output current rise time tf(DAC) 24 26.67 28 ABPb and ARPr 17.3 18.67 19.7 AGY 24.9 26.67 27.2 ABPb and ARPr 17.5 18.67 19.3 AGY 24 26.67 28 ABPb and ARPr 24 26.67 28 AGY 24.9 26.67 27.2 ABPb and ARPr 24.9 26.67 27.2 See Note 10 57 92 V mA mA kΩ 8 pF 10% to 90% of full scale 2 ns DAC output current fall time 10% to 90% of full scale 2 ns td(A) Analog output delay Measured from CLK=VIH(min) to 50% of full-scale transition, See Note 8 tS Analog output settling time Measured from 50% of full scale transition on output to output settling, within 2%, See Note 9 SNR Signal -to-noise ratio 1 MHz, −1 dBFS digital sine input, measured from 0 MHz to 8.8 MHz 57.5 dB SFDR Spurious-free dynamic range 1MHz, −1 dBFS digital sine input, measured from 0 MHz to 8.8 MHz 64 dB Bandwidth See Note 11 40 MHz BW(1 dB) NOTES: 5 9 ns 9 ns 4. PSRR is measured with a 0.1 µF capacitor between the COMP and AVDD terminal; with a 0.1 µF capacitor connected between the VREF terminal and AVSS. The ripple amplitude is within the range 100 mVp-p to 500 mVp-p with the DAC output set to full scale and a double-terminated 75 Ω (=37.5 Ω) load. PSRR is defined as 20 × log(ripple voltage at DAC output/ripple voltage at AVDD input). Limits from characterization only. 5. Crosstalk spec applies to each possible pair of the 3 DAC outputs. Limits from characterization only. 6. The imbalance between DACs applies to all possible pairs of the three DACs. KIMBAL is assured over full temperature range. In parts labeled THS8133CPHP, KIMBAL(SYNC) is assured at 25°C. In parts labeled THS8133ACPHP, KIMBAL(SYNC) and THS8133BCPHP, KIMBAL(SYNC) are assured over the full temperature range. 7. Nominal values at R(FS) = R(FSnom) : Maximum values at R(FS) = R(FSnom) ÷ 1.2. Maximum limits from characterization only. 8. This value excludes the digital process delay, td(D). Limit from characterization only. 9. Maximum limit from characterization only 10. Limit from characterization only 11. This bandwidth relates to the output amplitude variation in excess of the droop from the sinx/x sampled system. Since the output is a sample-and-hold signal, a sin(π × Fin ÷ Fclk) ÷ (π × Fin ÷ Fclk) roll-off is observed, which accounts e.g. at Fin = 40 MHz and Fclk = 80 MSPS for −3.92 dB signal drop (sync droop). The total DAC output variation (device droop) consists of this and an additional amount (excess droop) caused by the output impedance of the device, as shown in Table 5. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 11 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 performance plots of AGY output channel at 80 MSPS and use of internal reference Static DNL (LSB) STATIC DNL (LSB) vs DAC CODE 1.2 1.0 0.8 0.6 0.4 0.2 0 −0.2 −0.4 −0.6 −0.8 −1.0 −1.2 0 100 200 300 400 500 600 700 800 900 1023 700 800 900 1023 DAC Code Figure 7. Static DNL Static INL (LSB) STATIC INL (LSB) vs DAC CODE 1.2 1.0 0.8 0.6 0.4 0.2 0 −0.2 −0.4 −0.6 −0.8 −1.0 −1.2 0 100 200 300 400 500 600 DAC Code Figure 8. Static INL 12 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 performance plots of AGY output channel at 80 MSPS and use of internal reference (continued) SPECTRUM OF DAC OUTPUTS AMPLITUDE (dBFS) vs FREQUENCY (MHz) 0 Amplitude (dBFS) −20 −40 −60 −80 −100 −120 0.6 1.2 1.7 2.3 2.9 3.4 4.0 4.5 5.1 5.7 6.2 6.8 7.3 7.9 8.5 9.0 9.6 10.1 Frequency (MHz) Figure 9. Spectral Plot for 1.02 MHz Digital Sine Input at 80 MSPS Blank to Full-Scale Video Output (mV) DAC OUTPUT WAVEFORM BLANK TO FULL-SCALE VIDEO OUTPUT (mV) vs TIME (ns) 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 −25.0−22.2−19.4−16.6−13.8−11.0 −8.2 −5.4 −2.6 0.2 3.0 5.8 8.6 11.4 14.2 17.0 19.8 22.6 Time (ns) Figure 10. DAC Output Waveform (rise/fall and settling times) Table 5. DAC Output Amplitude Variation Over Varying Fin at Fclk = 80 MSPS Fin (kHz) 500 Fclk (MSPS) 80 SYNC DROOP (dB) 0 0 5000 80 −0.056 −0.02 10000 80 −0.22 −0.08 20000 80 −0.91 −0.29 30000 80 −2.11 −0.39 40000 80 −3.92 −0.40 • EXCESS DROOP (dB) POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 13 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 APPLICATION INFORMATION configuring THS8133 for generating SMPTE compliant signals Table 6 lists the standards that relate to the definition of analog interfaces for component video signals. Table 6. Relevant Video Standards STANDARD TITLE SCOPE SMPTE 253M 3-Channel RGB Analog Video Interface Component analog video for studio applications using 525 lines, 59.94 fields, 2:1 interlace and 4:3 or 16:9 aspect ratio. SMPTE 274M 1920x1080 Scanning and Analog and Parallel Digital Interfaces for Multiple-Picture Rates Definition of image format of 1920x1080 pixels inside a total raster of 1125 lines, with an aspect ratio of 16:9. Interlaced format used for 1080I display definition of the ATSC HDTV standard. SMPTE 296M 1280x720 Scanning, Analog and Digital Representation and Analog Interface Definition of image format of 1280x720 pixels inside a total raster of 750 lines, with an aspect ratio of 16:9. Progressive format used for 720P display definition of the ATSC HDTV standard. THS8133 can be used to generate output signals compliant to each of these standards. The configuration for each is detailed below. In each of the cases the current output of each DAC can be converted into standard-compliant voltage levels by connecting a double terminated 75-Ω load, as shown in the top part of Figure 11. 37.5 Ω DACs 75Ω 75Ω (source) 75Ω (monitor) 50 Ω DACs 75Ω 150Ω (source) 75Ω (monitor) Figure 11. Typical Video Loads The use of THS8133 for each of these standards is discussed next. SMPTE 253M This standard defines a component analog video interface using GBR color signals carried on parallel channels for the interconnection of television equipment. The scanning structure is typically 525 lines, 59.94 fields, 2:1 interlace and 4:3 or 16:9 aspect ratio. The analog signals of this standard are suitable for the generation of, or they can be generated from, digital video signals compliant to SMPTE 125M and SMPTE 267M by A/D or D/A conversion respectively. Furthermore, SMPTE 253M signals can be the input to NTSC composite encoders compliant with SMPTE 170M. Table 7 lists the scope of the standards mentioned. 14 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 APPLICATION INFORMATION SMPTE 253M (continued) Table 7. Video Standards Compatible with SMPTE 253M STANDARD TITLE SMPTE 125M Component Video Signal 4:2:2 − Bit−Parallel Digital Interface SMPTE 267M Bit−Parallel Digital Interface − Component Video Signal 4:2:2 16x9 Aspect Ratio SMPTE 170M Composite Analog Video Signal − NTSC for Studio Applications The SMPTE 253M standard defines a GBR component set with positive going signals and a maximum peak level of 700 mV from blanking level. The green signal has a negative-going sync pulse of amplitude 300 mV from blanking level. The dc offset, as defined by the blanking level of the signal, is 0.0 V ±1.0 V. Figure 12 shows the waveform of the green channel, onto which the horizontal sync is inserted. H Blanking rise time 90% 50% 50% 10% Sync rise time 90% Horizontal reference point 50% 50% Blanking Start to H reference 10% Sync H reference to Blanking End Figure 12. SMPTE 253M Line Waveform (green channel) For this mode, the INS3_INT control should be kept low to enable sync-on-green only and the device is put in GBR 4:4:4 mode. This corresponds to the GBR with sync-on-green operation mode of Table 1. Table 8 lists the THS8133 output currents that will produce compliant signals to this standard after proper termination, together with the required input signals. Table 8. THS8133 Signals for SMPTE 253M Compliant Operation AGY LEVEL (mA) ARPr,ABPb (V) (mA) (V) SYNC SYNC_T BLANK DAC INPUT 3FFh data White 26.67 1.000 18.67 0.7000 1 X 1 Video video+8.00 video+0.3 video video 1 X 1 Black 8.00 0.3000 0 0 1 X 1 Blank 8.00 0.3000 0 0 1 X 0 000h xxxh Sync 0 0 0 0 0 0 x xxxh • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 15 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 APPLICATION INFORMATION SMPTE 253M (continued) BLANK can be tied high in this mode if the data input is kept to 000h during the blanking time, since black and blanking level are at identical levels. Furthermore the SYNC_T terminal remains low, since only a bi-level sync is generated. SMPTE 274M This standard defines a raster scanning format of 1920×1080 pixels inside a total raster of 1125 lines and an aspect ratio of 16:9, GBR and YPbPr color encoding formats and both analog and digital interfaces for GBR and YPbPr formats. With respect to the analog interface, SMPTE 274M defines the position of the start of each line at the positive zero-crossing of a tri-level sync pulse. The sync pulse has a negative-going transition on a fixed number of clock cycles preceding this instant and another negative transition on a fixed number of clock cycles following this instant, as shown in Figure 13. The positive peak of sync is 300 mV; the negative peak of sync –300 mV. The interface can carry both GBR or YPbPr signals. The tri-level horizontal sync is inserted on all analog outputs and has identical absolute amplitude levels in all cases. For Y, black corresponds to a level of 0 V and peak white is 700 mV. Pb and Pr on the other hand have amplitudes between –350 mV and 350 mV. The relative amplitudes of the current sources are identical to the case of SMPTE 253M. However, in this case a tri-level sync needs to be generated instead of a bi-level negative sync, and it needs to be present on all three component outputs. THS8133 supports the tri-level sync via an additional internal current source, activated by asserting SYNC_T. The sync insertion on all outputs is under the control of the INS3_INT pin. When asserted (high), the sync is inserted on all three output channels. 0H 44T 44T Analog Waveform (Y’R’G’B’) Duration in Reference Clock Period 1920T Figure 13. SMPTE 274M Line Waveform† † This figure is for illustration purposes only. Consult the latest SMPTE 274M standard when designing a compliant system. Figure 14 shows the relative amplitudes of video and horizontal/vertical sync. The level of vertical sync (broad pulse) is identical to the negative excursion of horizontal sync and therefore can be generated by the same current source on THS8133 by appropriately asserting the sync control inputs. 16 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 APPLICATION INFORMATION SMPTE 274M (continued) +300 Vertical Sync Blanking 0 −300 Broad Pulse OH +350 +300 P’B, P’r 0 −300 −350 +700 +300 Y’,R’,G’,B’ 0 −300 OH Figure 14. SMPTE 274M Analog Interface Horizontal Timing Details† † This figure is for illustration purposes only. Consult the latest SMPTE 274M standard when designing a compliant system. For GBR operation, Table 9 lists the THS8133 full-scale output currents that produce compliant signals to the standard after proper termination. These amplitudes are valid also in YPbPr mode for the Y channel. For GBR operation, the device needs to be configured with INS3_INT high, corresponding to the GBR with sync-on-all operation mode of Table 1. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 17 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 APPLICATION INFORMATION SMPTE 274M (continued) Table 9. THS8133 Signals for SMPTE 274M Compliant Operation on GBR and Y Channels GBRY LEVEL (mA) (V) SYNC SYNC_T BLANK DAC INPUT 3FFh data White 26.67 1.000 1 X 1 Video video+8.00 video+0.3 1 X 1 Sync Pos 16.00 0.600 0 1 X Black 8.00 0.3000 1 X 1 Blank 8.00 0.3000 1 X 0 xxxh 000h xxxh Sync Neg 0 0 0 0 X xxxh In the YPbPr mode of this standard, the sync is centered around the center span of the video amplitude levels, as shown in Figure 14. So the current for Pb and Pr is down-shifted with respect to Y to accommodate the minimum data level at 0 mA. Thus, an input code of 00h corresponds now to an output drive of 0 mA while the negative sync level is at 1.33 mA, corresponding to 50 mV. The Pb and Pr data input format is offset binary. Table 10 lists the THS8133 full-scale output currents for Pb and Pr channels in the YPbPr operation mode of the device. The operation mode corresponds to YPbPr with sync-on-all of Table 1. Table 10. THS8133 Signals for SMPTE 274M Compliant Operation on Pb and Pr Channels Pb, Pr LEVEL (mA) (V) SYNC SYNC_T BLANK DAC INPUT Max 18.67 0.7000 1 X 1 Video video video 1 X 1 3FFh data Sync Pos 17.33 0.650 0 1 X xxxh Blank 9.33 0.350 1 X 0 xxxh Sync Neg 1.33 0.050 0 0 x xxxh Min 0 0 1 X 1 000h SMPTE 296M This standard defines a raster scanning format of 1280x720 and an aspect ratio of 16:9, the analog and digital representation, and the definition of an analog interface. Both GBR and YPbPr component color encoding can be used. With respect to the sync and video level definition, this standard is analogous to SMPTE 274M with the use of a tri-level sync pulse. Therefore, for the generation of output signals compliant to this standard, refer to the configuration of THS8133 for SMPTE 274M. 18 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 APPLICATION INFORMATION comparison to EIA RS-343/RS-170 levels Traditionally, video amplitude levels are specified according to the EIA RS-343 or RS-170 standards. RS-343 uses a bi-level negative going sync. Also, there is a difference between the reference blanking and black video level. Figure 15 shows the relative amplitudes and the current drives that would be needed to generate compliant relative amplitudes with a double-terminated 75-Ω load, as is specified for RS-343. RS-170 compliant levels can be reached using the same current sources but a different 150-Ω source termination resistor, which brings the load to 150 || 75 Ω = 50 Ω. In this case a blank-to-white level of approximately 1 V is reached (0.714 V × 50 ÷ 37.5) as required by RS-170. With Sync Insertion Without Sync Insertion mA V mA V 26.67 1.000 19.05 0.714 92.5 IRE 9.05 0.340 1.44 0.340 7.62 0.286 0 0 BLACK Level 7.5 IRE BLANK Level 40 IRE 0 0 SYNC Level Figure 15. RS-343 Video Definition The video signal contains 140 IRE, equal to 1 Vpp. This is split into 40 IRE for the composite sync, 7.5 IRE for blanking-to-black and 92.5 IRE for the active video portion. designing with PowerPAD The THS8133 is housed in a high-performance, thermally enhanced, 48-pin PowerPAD package (TI package designator: 48PHP). Use of the PowerPAD package does not require any special considerations except to note that the PowerPAD which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. Therefore, if not implementing the PowerPAD PCB features, solder masks (or other assembly techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection etches or vias under the package. The recommended option, however, is not to run any etches or signal vias under the device, but to have only a grounded thermal land as explained below. Although the actual size of the exposed die pad may vary, the minimum size required for the keepout area for the 48-pin PHP PowerPAD package is 7 mm × 7 mm. It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the PowerPAD package. The thermal land will vary in size, depending on the PowerPAD package being used, the PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may not contain numerous thermal vias, depending on PCB construction. More information on this package and other requirements for using thermal lands and thermal vias are detailed in the TI application note PowerPAD Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI Web pages beginning at URL: http://www.ti.com. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • 19 SLVS204C − APRIL 1999 − REVISED SEPTEMBER 2000 designing with PowerPAD (continued) For the THS8133 this thermal land should be grounded to the low impedance ground plane of the device. This improves not only thermal performance but also the electrical grounding of the device. It is also recommended that the device ground terminal landing pads be connected directly to the grounded thermal land. The land size should be as large as possible without shorting device signal terminals. The thermal land may be soldered to the exposed PowerPAD using standard reflow soldering techniques. While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is recommended that the thermal land be connected to the low impedance ground plane for the device. Table 11 lists a comparison for thermal resistances between the PowerPAD package (48PHP) used for this device and a regular 48-pin TQFP package (48PFB). Table 11. Junction-Ambient and Junction-Case Thermal Resistances 48PHP PowerPAD vs 48PFB REGULAR TQFP 20 AIRFLOW IN lfm 0 150 250 500 θJA (°C/W) 48PHP θJC (°C/W) 48PHP 29.1 23.1 21.6 19.9 θJA (°C/W) 48PFB θJC (°C/W) 48PFB 97.5 71.6 63.5 1.14 78.3 19.6 • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 • PACKAGE OPTION ADDENDUM www.ti.com 5-Feb-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty THS8133ACPHP OBSOLETE HTQFP PHP 48 THS8133BCPHP ACTIVE HTQFP PHP 48 THS8133BCPHPG4 ACTIVE HTQFP PHP THS8133CPHP OBSOLETE HTQFP PHP Lead/Ball Finish MSL Peak Temp (3) TBD Call TI Green (RoHS & no Sb/Br) CU NIPDAU 48 TBD Call TI Call TI 48 TBD Call TI Call TI 250 Call TI Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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