TPD4S009 TPD4S010 www.ti.com ....................................................................................................................................................... SLVS817A – MAY 2008 – REVISED OCTOBER 2008 4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE FEATURES 1 • Supports High-Speed Differential Data Rates (3-dB Bandwidth > 4 GHz) • 0.05-pF Matching Capacitance Between Differential Signal Pairs • Low 0.8-pF Line Capacitance for Each Data Line to GND • Flow-Through Single-in-Line Pin Mapping for High-Speed Lines Ensures No Additional Board Layout Burden While Placing ESD Protection Chip Near Connector • 2 1 6 D1– D1+ D1– GND D2+ 2 3 5 4 VCC D2– • TPD4S009...DGS PACKAGE (TOP VIEW) TPD4S009...DBV OR DCK PACKAGE (TOP VIEW) D1+ • • • IEC 61000-4-2 (Level 4) System-Level ESD Compliance 2.5-A Peak Pulse Current (8/20-µs Pulse) Ioff Feature Industrial Temperature Range: –40°C to 85°C Space-Saving Package Options GND 1 10 2 3 9 8 TPD4S010...DQA PACKAGE (TOP VIEW) N.C. N.C. D1+ D1– 1 2 10 9 N.C. D1+ 1 6 N.C. GND 2 5 VCC D2+ 3 4 D2– VCC GND 3 8 GND 4 7 N.C. 5 6 N.C. D2+ 4 7 N.C. D2+ D2– 5 6 N.C. D2– TPD4S009...DRY PACKAGE (TOP VIEW) D1– DESCRIPTION/ORDERING INFORMATION TPD4S009/TPD4S010 provide an electrostatic discharge (ESD) solution for high-speed differential lines. This device offers four ESD clamp circuits for dual differential lines. The monolithic silicon technology allows matching between the differential signal pairs. The excellent matching between the differential pair signal lines (0.05-pF line-line) enables this device to operate at high-speed differential data rates (3-dB bandwidth > 4 GHz). TPD4S009/TPD4S010 are suitable for high-speed differential applications, such as high-definition multimedia interface (HDMI), low-voltage differential signaling (LVDS), serial advanced technology attachment (SATA), Ethernet, 1394 (FireWire®), etc. TPD4S009/TPD4S010 comply with IEC 61000-4-2 (Level 4) ESD. TPD4S009 is offered in space-saving DBV, DCK, DGS, and DRY packages. TPDS4010 is offered in a DQA package. TPD4S009/TPD4S010 are characterized for operation over the ambient air temperature range of –40°C to 85°C. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. FireWire is a registered trademark of Apple Inc. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TPD4S009 TPD4S010 SLVS817A – MAY 2008 – REVISED OCTOBER 2008 ....................................................................................................................................................... www.ti.com ORDERING INFORMATION PACKAGE (1) (2) TA –40°C to 85°C (1) (2) (3) NOMINAL DIMENSIONS (mm) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) MSOP – DGS Reel of 3000 W = 4.9, L = 3, H < 1.1, Pitch = 0.5 TPD4S009DGSR PREVIEW SON – DQA Reel of 3000 W = 1, L = 2.5, H < 1.1, Pitch = 0.5 TPD4S010DQAR PREVIEW SON – DRY Reel of 5000 W = 1, L = 1.45, H = 0.55, Pitch = 0.5 TPD4S009DRYR 3H SOT (SC-70) – DCK Reel of 3000 W = 2.1, L = 2, H = 0.95, Pitch = 0.65 TPD4S009DCKR 3H_ SOT (SOT-23) – DBV Reel of 3000 W = 2.9, L = 2.8, H < 1.45, Pitch = 0.95 TPD4S009DBVR NFJK Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DCK: The actual top-side marking has one additional character that designates assembly/test site. CIRCUIT DIAGRAM VCC D2+ D1+ D1– D2– GND TERMINAL FUNCTIONS 2 DBV, DCK, OR DRY PIN NO. DGS PIN NO. DQA PIN NO. NAME I/O 1, 3, 4, 6 1, 2, 4, 5 1, 2, 4, 5 D1+, D1–, D2+, D2– ESD port 2 3 3, 8 GND GND – 6, 7, 9, 10 6, 7, 9, 10 N.C. – 5 8 – VCC Pwr DESCRIPTION High-speed ESD clamp provides ESD protection to the high-speed differential data lines. Ground Not internally connected Supply Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 TPD4S009 TPD4S010 www.ti.com ....................................................................................................................................................... SLVS817A – MAY 2008 – REVISED OCTOBER 2008 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) MIN MAX –0.3 6 V 0 VCC V Storage temperature range –65 125 °C Characterized free-air operating temperature range –40 85 °C 260 °C IEC 61000-4-2 Contact Discharge ±8 kV IEC 61000-4-2 Air-Gap Discharge ±9 kV Peak pulse power (tp = 8/20 µs) 25 W Peak pulse current (tp = 8/20 µs) 2.5 A VCC Supply voltage range VIO IO signal voltage range Tstg TA Lead temperature, 1.6 mm (1/16 in) from case for 10 s) UNIT ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP VRWM Reverse standoff voltage Any IO pin to ground VBR Breakdown voltage IIO = 1 mA Any IO pin to ground IIO IO port current VIO = 3.3 V, VCC = 5 V Any IO pin Ioff Current from IO port to supply pins VIO = 3.3 V, VCC = 5 V Any IO pin VD Diode forward voltage IIO = 8 mA Lower clamp diode RDYN Dynamic resistance I=1A Any IO pin 1.1 CIO IO capacitance VCC = 5 V, VIO = 2.5 V Any IO pin 0.8 ICC Operating supply current VIO = Open, VCC = 5 V VCC pin 0.1 MAX UNIT 5.5 V 0.1 µA 0.01 0.1 µA 0.8 0.95 9 V 0.01 0.6 pF 1 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 V Ω µA 3 TPD4S009 TPD4S010 SLVS817A – MAY 2008 – REVISED OCTOBER 2008 ....................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS 2 70 D1+ Leakage Current (pA) Insertion Loss (dB) 0 D2+ -2 -4 -6 -8 60 50 40 30 20 10 -10 100k 1.E+05 1M 1.E+06 10M 1.E+07 100M 1.E+08 1G 1.E+09 0 10G 1.E+10 55 25 Temperature, TA (°C) –40 Frequency (Hz) Figure 1. Insertion Loss S21 – I/O to GND 85 Figure 2. Leakage Current vs Temperature (VIO = 2.5 V) 220 5.0 200 180 160 140 3.0 Amplitude (V) IO Capacitance (pF) 4.0 2.0 1.0 120 100 80 60 40 20 0 0.0 1 3 2 –20 5 4 0 25 50 IO Voltage (V) 3.0 30 2.5 25 2.0 20 Current (A) 1.5 15 1.0 10 100 125 150 175 200 225 250 Time (nS) Figure 4. IEC Clamping Waveforms (8-kV Contact, Average of Ten Waveforms) PPP (W) IPP (A) Figure 3. IO Capacitance vs Input Voltage (VCC = 5 V) 75 Power (W) 5 0.5 0.0 0 0 5 10 15 20 25 30 35 Time (µs) 40 45 50 Figure 5. Pulse Waveform (8/20 µs Pulse) 4 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 TPD4S009 TPD4S010 www.ti.com ....................................................................................................................................................... SLVS817A – MAY 2008 – REVISED OCTOBER 2008 TYPICAL CHARACTERISTICS (continued) Figure 6. Eye Diagram Without TPD4S009 Figure 7. Eye Diagram With TPD4S009 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 5 PACKAGE OPTION ADDENDUM www.ti.com 14-Oct-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPD4S009DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD4S009DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD4S009DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD4S009DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD4S009DRYR ACTIVE SON DRY 6 5000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD4S010DQAR PREVIEW SON DQA 10 3000 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Sep-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) TPD4S009DBVR SOT-23 DBV 6 3000 180.0 TPD4S009DCKR SC70 DCK 6 3000 TPD4S009DRYR SON DRY 6 5000 9.2 3.23 3.17 1.37 4.0 8.0 Q3 180.0 9.2 2.55 2.34 1.22 4.0 8.0 Q3 179.0 8.4 1.2 1.65 0.7 4.0 8.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 20-Sep-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD4S009DBVR SOT-23 DBV 6 3000 205.0 200.0 33.0 TPD4S009DCKR SC70 DCK 6 3000 202.0 201.0 28.0 TPD4S009DRYR SON DRY 6 5000 220.0 205.0 50.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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