TPD3F303 www.ti.com SLVSAM5 – JANUARY 2011 EMI FILTER WITH INTEGRATED VCC CLAMP FOR SIM CARD INTERFACE Check for Samples: TPD3F303 FEATURES 1 • • • • • Bidirectional EMI/RFI Filtering and Line Termination with Integrated ESD Protection Robust ESD Protection Exceeds IEC 61000-4-2 (Level 4) – ±15-kV Human-Body Model (HBM) – ±15-kV IEC 61000-4-2 (Contact Discharge) – ±15-kV IEC 61000-4-2 (Air-Gap Discharge) Breakdown voltage 6-V Low Noise C-R-C Filter Topology Integrated VCC Clamp Eliminates the Need for External ESD Protection Space Saving DPV (0.5-mm Pitch), DQD Packages (0.4-mm Pitch) TPD6F303 PACKAGE (TOP VIEW) DATA1_Out 1 8 DATA1_In CLK_Out 2 7 CLK_In DATA2_Out 3 6 DATA2_In NC 4 5 VCC TPD3F303 2.1-mm x 1.6-mm DPV (0.5-mm Pitch) 1.7-mm x 1.35-mm DQD (0.4-mm Pitch) APPLICATIONS Mobile handsets PDAs Video Consoles Portable Computers SIM Controller 4 5 VCC GND 3 6 Reset VPP 7 CLK I/O NC NC 2 1 GND • • • • GND • 8 Figure 1. Board Layout with TPD3F303 at the SIM Card Interface DESCRIPTION/ORDERING INFORMATION The TPD3F303 is a 3-ch integrated EMI filter for SIM interface. This device integrates a VCC clamp to provide system level ESD protection at the VCC line. Termination resistor value of 47 Ω is included on the CLK line, while a 100 Ω termination is employed at the DATA and RST line. The low-pass filter arrays reduce EMI emissions and provide system level ESD protection. Because of its small package and easy-to-use pin assignments, the TPD3F303 filter is suitable for a wide array of applications such as mobile handsets, PDAs, video consoles, notebook computers, etc. The TPD3F303 is designed to suppress EMI/RFI noise in systems subjected to electromagnetic interferences. These filter series include an ESD protection circuitry which prevents damage to the application when subjected to ESD stress far exceeding IEC 61000-4-2 (Level 4). The TPD3F303 is specified for –40°C to 85°C operation. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) (2) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING 8 – DPV Tape and reel TPD3F303DPVR 6SS 8 – DQD Tape and reel TPD3F303DQDR 6SS Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TPD3F303 SLVSAM5 – JANUARY 2011 www.ti.com CIRCUIT DIAGRAMS 45 Ω Pin 7 Pin 5 Pin 2 100 Ω Pin 6,8 GND GND GND Schematic for VCC Schematic for CLK Line Pin 1,3 Schematic for DATA1, DATA2 Lines TERMINAL FUNCTIONS TERMINAL NAME DPV/DQD PIN NO. DATAx_IN, DATAx_OUT 1, 3, 6, 8 CLK_OUT, CLK_IN V 2, 7 VCC 5 TYPE DESCRIPTION Data and Rest signals Input, Output pins. The DATA1 and DATA2 are symmetric circuits. Input, Output They can be used interchangeably for either DATA or RESET pins based off board layout Pins scheme. Input, Output Clock Input and Output signals. Pins Power Clamp ESD Clamp circuit for the VCC pin. NC 4 No Connect GND Central ground Pad Ground Not connected to any internal circuit. Leave this pin floating. Ground connection for the EMI filter. It is very important to connect the device GND to the printed circuit board ground plane through Vias directly under the package. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN IO voltage tolerance IO pins TA Operating free-air temperature range Tstg Storage temperature range (1) MAX UNIT 5.5 V –40 85 °C –55 155 °C IEC 61000-4-2 Contact Discharge IO pins ±15 KV IEC 61000-4-2 Air-gap Discharge IO pins ±15 KV Human Body Model ESD IO pins ±15 KV Stresses beyond those listed under "ABSOLUTE MAXIMUM RATINGS" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Vclamp Clamp voltage IIO = ±2 A IO pin to ground ±10 V II Leakage current RPU = Open IO pin to ground 0.1 µA RCLK CLK series resistors Ω RDAT_RST Data/RST series resistors CTotal IO Capacitance VIO = 0 V VBR Break-down Voltage IIO = 1 mA F–3dB –3 dB BW for DATA/RESET line ZSOURCE = 50 Ω ZLOAD = 50 Ω 2 IO Pins to GND Submit Documentation Feedback 40 47 55 85 100 115 Ω 16 20 24 pF 6 V 294 MHz Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPD3F303 TPD3F303 www.ti.com SLVSAM5 – JANUARY 2011 ELECTRICAL CHARACTERISTICS (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER F–3dB –3 dB BW for CLK line TEST CONDITIONS ZSOURCE = 50 Ω ZLOAD = 50 Ω MIN TYP MAX 308 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPD3F303 UNIT MHz 3 TPD3F303 SLVSAM5 – JANUARY 2011 www.ti.com TYPICAL OPERATING CHARACTERISTICS 100 1.0 90 0.8 80 0.6 IIO - Input Offset Current - mA IIO - Input Offset Current - pA VIO = 2.5 V 70 60 50 40 0.2 0.0 -0.2 30 -0.4 20 -0.6 10 0 -40 0.4 tA = 25°C -0.8 -15 10 35 60 TA - Free-Air Temperature - °C -1.0 -2 85 -1 0 Figure 2. IIO vs Temperature, VIO = 2.5V 1 2 3 4 5 6 VIO - Input Offset Voltage - V 7 8 Figure 3. IIO vs VIO -0 0 0 V Bias -10 -5 -20 -10 DATA CLK -30 CLK_IN to DATA2_OUT -40 -15 Loss - dB Loss - dB -50 -20 -25 -30 -60 -70 -80 -90 -35 -100 -40 -110 DATA1_IN to DATA2_OUT -120 DATA1_IN to CLK_OUT -45 -130 -50 1.0E+05 1.0E+06 1.0E+07 1.0E+08 f - Frequency - Hz 1.0E+09 1.0E+10 -140 1.0E+05 1.0E+06 Figure 4. Frequency Response Data (0 V Bias) 4 Submit Documentation Feedback 1.0E+07 1.0E+08 f - Frequency - Hz 1.0E+09 1.0E+10 Figure 5. Channel-to-Channel Crosstalk Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPD3F303 TPD3F303 www.ti.com SLVSAM5 – JANUARY 2011 TYPICAL OPERATING CHARACTERISTICS (continued) 35 80 TA = 25°C 60 DATA_In 40 30 DATA_Out 20 0 20 Amplitude - V Capacitance - pF 25 Data CLK 15 -20 -40 -60 -80 -100 -120 10 -140 -160 VCC 5 -180 -200 0 0 0.5 1 1.5 2 2.5 3 3.5 VBIAS - V 4 4.5 5 -220 0 5.5 25 220 80 200 60 180 40 160 20 140 0 120 DATA_In 100 80 60 DATA_Out 40 -160 -40 -180 -60 -200 175 200 DATA_Out -80 -140 150 DATA_In -100 0 75 100 125 t - Time - nS 200 -60 -20 50 175 -40 -120 25 150 -20 20 -80 0 75 100 125 t - Time - nS Figure 7. IEC Clamping Waveforms –15 kV Contact, DATA1_In Stressed Amplitude - V Amplitude - V Figure 6. Capacitance vs VBIAS, tA = 25°C 50 -220 0 25 Figure 8. IEC Clamping Waveforms +15 kV Contact, DATA1_In Stressed 50 75 100 125 t - Time - nS 150 175 Figure 9. IEC Clamping Waveforms –15 kV Contact, CLK_In Stressed Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPD3F303 200 5 TPD3F303 SLVSAM5 – JANUARY 2011 www.ti.com TYPICAL OPERATING CHARACTERISTICS (continued) 220 200 180 160 Amplitude - V 140 120 DATA_In 100 80 60 DATA_Out 40 20 0 -20 -40 -60 -80 0 6 25 50 75 100 125 150 175 t - Time - nS Figure 10. IEC Clamping Waveforms +15 kV Contact, CLK_In Stressed Submit Documentation Feedback 200 Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPD3F303 PACKAGE OPTION ADDENDUM www.ti.com 3-Mar-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TPD3F303DPVR ACTIVE USON DPV 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD3F303DQDR ACTIVE WSON DQD 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jan-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPD3F303DPVR USON DPV 8 3000 180.0 8.4 1.84 2.32 0.78 4.0 8.0 Q1 TPD3F303DQDR WSON DQD 8 3000 180.0 8.4 1.65 2.0 0.95 4.0 8.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 21-Jan-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD3F303DPVR USON DPV 8 3000 202.0 201.0 28.0 TPD3F303DQDR WSON DQD 8 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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