IXYS MCC170

MCC 170
ITRMS = 2x 350 A
ITAVM = 2x 203 A
VRRM = 1200-1800 V
Thyristor Modules
Thyristor/Diode Modules
VRSM
VDSM
VRRM
VDRM
V
V
1300
1500
1700
1900
1200
1400
1600
1800
3
Type
6 7 1
5 4 2
3
2
MCC
MCC
MCC
MCC
170-12io1
170-14io1
170-16io1
170-18io1
Symbol
Test Conditions
ITRMS
ITAVM
TVJ = TVJM
TC = 85°C; 180° sine
ITSM, IFSM
TVJ = 45°C;
VR = 0
76
5
4
1
Maximum Ratings
Features
International standard package
Direct copper bonded Al2O3-ceramic
with copper base plate
Planar passivated chips
Isolation voltage 3600 V~
UL registered E 72873
Keyed gate/cathode twin pins
●
òi2dt
(di/dt)cr
(dv/dt)cr
350
203
A
A
t = 10 ms (50 Hz)
t = 8.3 ms (60 Hz)
5400
5800
A
A
TVJ = TVJM
VR = 0
t = 10 ms (50 Hz)
t = 8.3 ms (60 Hz)
5000
5500
A
A
TVJ = 45°C
VR = 0
t = 10 ms (50 Hz)
t = 8.3 ms (60 Hz)
146 000
140 000
A2s
A2s
125 000
126 000
2
As
A2s
100
A/ms
TVJ = TVJM
VR = 0
t = 10 ms (50 Hz)
t = 8.3 ms (60 Hz)
TVJ = TVJM
f =50 Hz, tP =200 ms
VD = 2/3 VDRM
IG = 1 A,
diG/dt = 1 A/ms
repetitive, IT = 660 A
●
Applications
Motor control, softstarter
Power converter
Heat and temperature control for
industrial furnaces and chemical
processes
Lighting control
Solid state switches
●
●
●
●
non repetitive, IT = ITAVM
500
A/ms
1000
V/ms
tP = 30 ms
tP = 500 ms
PGAV
VRGM
TVJ
TVJM
Tstg
-40...+130
130
-40...+125
°C
°C
°C
3000
3600
V~
V~
VISOL
50/60 Hz, RMS
IISOL £ 1 mA
Md
Mounting torque (M6)
Terminal connection torque (M8)
Typical including screws
Advantages
Simple mounting
Improved temperature and power
cycling
Reduced protection circuits
●
●
W
W
W
V
Weight
●
●
TVJ = TVJM; VDR = 2/3 VDRM
RGK = ¥; method 1 (linear voltage rise)
TVJ = TVJM
IT = ITAVM
●
●
120
60
20
10
PGM
●
t = 1 min
t=1s
●
4.5-7/40-62 Nm/lb.in.
11-13/97-115 Nm/lb.in.
750
g
Data according to IEC 60747 and refer to a single thyristor/diode unless otherwise stated.
IXYS reserves the right to change limits, test conditions and dimensions
© 2000 IXYS All rights reserved
1-4
MCC 170
Symbol
Test Conditions
Characteristic Values
IRRM, IDRM
TVJ = TVJM; VR = VRRM; VD = VDRM
VT, VF
IT, IF = 600 A; TVJ = 25°C
VT0
rT
10
1: IGT, TVJ = 130
140°C
40
mA
1.65
V
For power-loss calculations only (TVJ = 130°C)
0.8
1
V
mW
VGT
VD = 6 V;
IGT
VD = 6 V;
TVJ = 25°C
TVJ = -40°C
TVJ = 25°C
TVJ = -40°C
2
3
150
220
V
V
mA
mA
VGD
IGD
TVJ = TVJM;
TVJ = TVJM;
VD = 2/3 VDRM
VD = 2/3 VDRM
0.25
10
V
mA
IL
TVJ = 25°C; tP = 30 ms; VD = 6 V
IG = 0.45 A; diG/dt = 0.45 A/ms
200
mA
IH
TVJ = 25°C; VD = 6 V; RGK = ¥
150
mA
tgd
TVJ = 25°C; VD = 1/2 VDRM
IG = 1 A; diG/dt = 1 A/ms
2
ms
tq
TVJ = TVJM; IT = 300 A, tP = 200 ms; -di/dt = 10 A/ms
VR = 100 V; dv/dt = 50 V/ms; VD = 2/3 VDRM
200
ms
QS
IRM
TVJ = 125°C; IT, IF = 300 A; -di/dt = 50 A/ms
550
235
mC
A
RthJC
RthJK
dS
dA
a
per thyristor (diode); DC current
per module
per thyristor (diode); DC current
per module
Creeping distance on surface
Creepage distance in air
Maximum allowable acceleration
V
2: IGT, TVJ = 25°C
3: IGT, TVJ = -40°C
VG
3
6
2
5
1
1
4
4: PGM = 20 W
5: PGM = 60 W
IGD, TVJ = 130
140°C
0.1
10-3
10-2
6: PGM = 120 W
10-1
100
101 A
IG
102
Fig. 1 Gate trigger characteristics
other values
see Fig. 8/9
typ.
0.164
0.082
0.204
0.102
K/W
K/W
K/W
K/W
12.7 mm
9.6 mm
50 m/s2
100
TVJ = 25°C
µs
tgd
typ.
Limit
10
Optional accessories for modules
Keyed Gate/Cathode twin plugs with wire length = 350 mm, gate = yellow, cathode = red
Type ZY 180 L (L = Left for pin pair 4/5)
UL 758, style 1385,
Type ZY 180 R (R = Right for pin pair 6/7)
CSA class 5851, guide 460-1-1
1
0.01
Dimensions in mm (1 mm = 0.0394")
0.1
A
1
10
IG
Fig. 2 Gate trigger delay time
M8x20
© 2000 IXYS All rights reserved
2-4
MCC 170
106
6000
ITSM
A
50 Hz
80 % VRRM
TVJ = 45°C
TVJ = 130°C
5000
400
I2dt
ITAVM
A
IFAVM
DC
180° sin
120°
60°
30°
A2 s
300
4000
TVJ = 45°C
105
3000
200
TVJ = 130°C
2000
100
1000
0
0.001
104
0.01
s
0.1
1
0
ms
1
t
t
Fig. 4 òi2dt versus time (1-10 ms)
Fig. 3 Surge overload current
ITSM, IFSM: Crest value, t: duration
Ptot
400
RthKA K/W
W
0.1
0.2
0.3
0.4
0.6
0.8
1.0
300
10
0
25
50
75
100
125 °C 150
TC
Fig. 4a Maximum forward current
at case temperature
Fig. 5 Power dissipation versus onstate current and ambient
temperature (per thyristor or
diode)
200
DC
180° sin
120°
60°
30°
100
0
0
100
200
300
A
0
25
50
75
100
125 °C 150
TA
ITAVM/IFAVM
2000
Ptot
RthKA K/W
W
0.04
0.06
0.08
0.1
0.15
0.2
0.3
1500
Fig. 6 Three phase rectifier bridge:
Power dissipation versus direct
output current and ambient
temperature
1000
Circuit
B6
3xMCC170
500
0
0
200
400
600
A
IdAVM
© 2000 IXYS All rights reserved
0
25
50
75
100
125 °C 150
TA
3-4
MCC 170
2000
Fig. 7 Three phase AC-controller:
Power dissipation versus RMS
output current and ambient
temperature
Ptot
W
RthKA K/W
0.04
0.06
0.08
0.1
0.15
0.2
0.3
1500
1000
Circuit
W3
3xMCC170
500
0
0
100
200
300
400
A
0
25
50
75
125 °C 150
100
TA
IRMS
0.25
Fig. 8 Transient thermal impedance
junction to case (per thyristor or
diode)
K/W
ZthJC
0.20
RthJC for various conduction angles d:
d
0.15
DC
180°
120°
60°
30°
30°
60°
120°
180°
DC
0.10
0.05
0.160
0.171
0.180
0.203
0.247
Constants for ZthJC calculation:
i
0.00
10-3
RthJC (K/W)
10-2
10-1
100
101
s
102
t
0.30
1
2
3
4
Rthi (K/W)
ti (s)
0.0077
0.0413
0.096
0.0149
0.00054
0.098
0.54
12
Fig. 9 Transient thermal impedance
junction to heatsink (per thyristor
or diode)
K/W
0.25
ZthJK
RthJK for various conduction angles d:
0.20
d
DC
180°
120°
60°
30°
0.15
30°
60°
120°
180°
DC
0.10
0.05
0.200
0.211
0.220
0.243
0.287
Constants for ZthJK calculation:
i
0.00
10-3
RthJK (K/W)
10-2
10-1
100
101
s
t
© 2000 IXYS All rights reserved
102
1
2
3
4
5
Rthi (K/W)
ti (s)
0.0077
0.0413
0.096
0.0149
0.04
0.00054
0.098
0.54
12
12
4-4