DATA SHEET MOS INTEGRATED CIRCUIT µPD4722 RS-232 LINE DRIVER/RECEIVER AT 3.3 V/5 V The µPD4722 is a high-breakdown voltage silicon gate CMOS line driver/receiver based on the EIA/TIA-232-E standard. The internal DC/DC converter can switch between multiple voltages, allowing it to operate with a single +3.3 V or +5 V power supply. It also provides standby function. This IC incorporates 4 driver circuits and 4 receiver circuits. An RS-232 interface circuit can be easily configured by connecting 5 capacitors externally. FEATURES • Conforms to EIA/TIA-232-E (former name, RS-232C) standards • Selectable +3.3 V/+5 V single power supply (selected by VCHA pin) • By setting the standby pin to a low level (standby mode), circuit current can be reduced. At such times, the driver output is in a high-impedance state. • Even in the standby mode, 2 receiver circuits can operate as inverters without hysteresis width. The other 2 circuits are fixed at a high level. ORDERING INFORMATION Part number µPD4722GS-GJG Package 30-pin plastic SSOP (300 mil) Document No. S12199EJ3V0DS00 (3rd edition) (Previous No. IC-3280) Date Published January 1997 N Printed in Japan © 1993 µ PD4722 BLOCK DIAGRAM/PIN CONFIGURATION (TOP VIEW) +10 V C3 1 + C4 2 +3.3 V or +5 V C1 C4+ 30 VDD + C1+ GND 29 + C2 + 3 VCC C4– 28 4 C1– VSS 27 5 C5+ 26 STBY 6 GND 25 VCHA 7 C5– –10 V C5 + 24 EN Note 4 300 Ω DIN1 8 DIN2 9 23 DOUT1 300 Ω 22 DOUT2 300 Ω DIN3 10 21 DOUT3 300 Ω DIN4 11 20 DOUT4 ROUT1 12 19 RIN1 5.5 kΩ ROUT2 13 18 RIN2 5.5 kΩ ROUT3 14 17 RIN3 5.5 kΩ ROUT4 15 16 RIN4 5.5 kΩ Note 1. VDD and VSS are output pins stepped up internally. These pins should not be loaded directly. 2. Capacitors C1 to C5 with a breakdown voltage of 20 V or higher are recommended. And it is recommended to insert the capacitor that is 0.1 µF to 1 µF between VCC and GND. 3. If VCHA is kept low level (in 5 V mode), capacitor C5 is not necessary. 4. The pull-up resistors at driver input are active resistors. 2 µ PD4722 Truth Table Driver STBY D IN DOUT Remarks L × Z Standby mode (DC/DC converter is stopped) H L H Space level output H H L Mark level output Receiver R IN STBY R OUT EN Remarks R 3 to R 4 R 1 to R 2 R 3 to R 4 R 1 to R 2 L L × × H H Standby mode 1 (DC/DC converter is stopped) L H L × H H Standby mode 2 (DC/DC converter is stopped, R3 and R4 are operated) L H H × L H Standby mode 2 (DC/DC converter is stopped, R3 and R4 are operated) H × L H Mark level input H × H L Space level input 3 V ↔ 5 V switchingNote 5 VCHA Operating mode L 5 V mode (double step-up) H 3 V mode (3 times step-up) H: high-level, L: low-level, Z: high-impedance, ×: H or L Note 5. When switching VCHA, standby mode must be selected (STBY = L). 3 µ PD4722 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) Parameter Symbol Ratings Unit Supply Voltage (V CHA = L) V CC –0.5 to +7.0 V Supply Voltage (V CHA = H) V CC –0.5 to +4.5 V Driver Input Voltage D IN –0.5 to V CC +0.5 V Receiver Input Voltage R IN –30.0 to +30.0 V Control Input Voltage (STBY, V CHA, EN) V IN –0.5 to V CC +0.5 V Driver Output Voltage D OUT –25.0 to +25.0 Note 6 V Receiver Output Voltage R OUT –0.5 to V CC +0.5 V Input Current (D IN , STBY, V CHA, EN) I IN ±20.0 mA Operating Ambient Temperature TA –40 to +85 °C Storage Temperature T stg –55 to + 150 °C Total Power Dissipation PT 0.5 W Note 6. Pulse width = 1 ms, duty = 10 % MAX. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage (V CHA = L, 5 V mode) V CC 4.5 5.0 5.5 V Supply Voltage (V CHA = H, 3 V mode) V CC 3.0 3.3 3.6 V High-Level Input Voltage (D IN ) V IH 2.0 V CC V Low-Level Input Voltage (D IN) V IL 0 0.8 V High-Level Input Voltage (STBY, V CHA , EN) V IH 2.4 V CC V Low-Level Input Voltage (STBY, V CHA , EN) V IL 0 0.6 V Receiver Input Voltage R IN –30 +30 V Operating Ambient Temperature TA –40 +85 °C Note 7 0.47 4.7 µF Capacitance of External Capacitor Note 7. In low temperature (below 0 ˚C), the capacitance of electrolytic capacitor becomes lower. Therefore, set higher values when using in low temperature. Concerning the wiring length between the capacitor and the IC, the shorter the better. Capacitors with good frequency characteristics such as tantalum capacitors, laminated ceramic capacitors, and aluminum electrolytic capacitors for switching power supply are recommended for the external capacitors. 4 µ PD4722 ELECTRICAL SPECIFICATIONS (TOTAL) (UNLESS OTHERWISE SPECIFIED, T A = –40 to +85 °C, C 1 to C 5 = 1 µ F) Parameter Circuit Current Circuit Current Circuit Current at Standby (Standby Mode 1) Circuit Current at Standby (Standby Mode 2) Symbol I CC1 I CC2 I CC3 I CC4 MAX. Unit V CC = +3.3 V, No load, R IN pin OPEN, STBY = H Conditions MIN. 16 mA V CC = +5.0 V, No load, R IN pin OPEN, STBY = H 12 mA V CC = +3.3 V, R L = 3 kΩ (D OUT), D IN = GND, R IN , R OUT pin OPEN, STBY = H 47 mA V CC = +5.0 V,R L = 3 kΩ (D OUT), D IN = GND, R IN , R OUT pin OPEN, STBY = H 38 mA 3 µA V CC = +3.3 V, No load, D IN and R IN pins are OPEN, STBY = L, EN = L, T A = 25 °C 1 V CC = +3.3 V, No load, D IN and R IN pins are OPEN, STBY = L, EN = L 5 V CC = +5.0 V, No load, D IN and R IN pins are OPEN, STBY = L, EN = L, T A = 25 °C 2 V CC = +5.0 V, No load, D IN and R IN pins are OPEN, STBY = L, EN = L 10 V CC = +3.3 V, No load, D IN and R IN pins are OPEN, STBY = L, EN = H, T A = 25 °C 1 V CC = +3.3 V, No load, D IN and R IN pins are OPEN, STBY = L, EN = H 5 V CC = +5.0 V, No load, D IN and R IN pins are OPEN, STBY = L, EN = H, T A = 25 °C 2 V CC = +5.0 V, No load, D IN and R IN pins are OPEN, STBY = L, EN = H 10 High-Level Input Voltage V IH V CC = +3.0 to +5.5 V, STBY, V CHA, EN pin Low-Level Input Voltage V IL V CC = +3.0 to +5.5 V, STBY, V CHA, EN pin High-Level Input Current I IH V CC = +5.5 V, V I = 5.5 V, STBY, V CHA, EN pin Low-Level Input Current I IL Input Capacitance STBY — V CHA Time V CHA — STBY Time STBY — V CC Time V CC — STBY Time TYP. µA 5 µA µA 3 µA µA 5 µA µA 2.4 V 0.6 V 1 µA V CC = +5.5 V, V I = 0 V, STBY, V CHA, EN pin –1 µA Driver input and receiver input V CC = +3.3 V, for GND, f = 1 MHz 10 pF Driver input and receiver input V CC = +5.0 V, for GND, f = 1 MHz 10 pF C IN t SCH V CC = +3.0 to 5.5 V, STBY ↓ → V CHA , Note 8 1 µs t CHS V CC = +3.0 to 5.5 V, V CHA → STBY ↑, t SC t CS 1 µs V CC = +3.0 to 5.5 V, STBY ↓ → V CC, Note 8 1 µs V CC = +3.0 to 5.5 V, V CC → STBY ↑, Note 8 1 µs Note 8 * The TYP. values are for reference at T A = 25 °C. 5 µ PD4722 Note 8. Measuring point 5V 3.3 V STBY 0.6 V 0.6 V 0.6 V 0.6 V 0V tSCH tCHS tSCH tCHS 3.3 V 2.4 V VCHA 2.4 V 0.6 V 0V tSC 0.6 V tCS tSC tCS 5V 4.5 V VCC 4.5 V 3.6 V 3.6 V 3.3 V ELECTRICAL SPECIFICATIONS (DRIVER) (UNLESS OTHERWISE SPECIFIED, T A = –40 to +85 °C, C 1 to C 5 = 1 µ F) 3 V mode (unless otherwise specified, V CHA = H, V CC = 3.0 to 3.6 V) Parameter Symbol Conditions MIN. MAX. Unit 0.8 V Low-Level Input Voltage V IL High-Level Input Voltage V IH Low-Level Input Current I IL V CC = +3.6 V, V I = 0 V –25 µA High-Level Input Current I IH V CC = +3.6 V, V I = 3.6 V 1.0 µA 2.0 V CC = +3.3 V, R L = ∞, T A = 25 °C Output Voltage V DO Output Short-Circuit Current I SC Slew-Rate Note 9 SR V CC = +3.3 V, R L = 3 kΩ, T A = T opt ±5.0 V CC = +3.0 V, R L = 3 kΩ, T A = +25 °C ±5.0 V ±9.5 V ±6.0 V V V CC = +3.3 V, for GND ±40 mA C L = 10 pF, R L = 3 to 7 kΩ 3.0 30 V/ µ s C L = 2 500 pF, RL = 3 to 7 kΩ 3.0 30 V/ µ s Propagation Delay Time Note 9 t PHL t PLH R L = 3 kΩ, C L = 2 500 pF Output Resistor RO V CC = V DD = V SS = 0 V V OUT = ±2 V Standby Output Transfer Time t DAZ R L = 3 kΩ, C L = 2 500 pF, Note 10 4 10 µs Standby Output Transfer Time t DZA R L = 3 kΩ, C L = 2 500 pF, Note 10 1 3 ms Power-On Output Transfer Time t PRA R L = 3 kΩ, C L = 2 500 pF, Note 11 1 3 ms * The TYP. values are for reference at T A = 25 °C. 6 TYP. µs 2.5 Ω 300 µ PD4722 5 V mode (unless otherwise specified, VCHA = L, V CC = +5.0 V ± 10 %) Parameter Symbol Conditions MIN. TYP. MAX. Unit 0.8 V Low-Level Input Voltage V IL High-Level Input Voltage V IH Low-Level Input Current I IL V CC = +5.5 V, V I = 0 V –40 µA High-Level Input Current I IH V CC = +5.5 V, V I = 5.5 V 1.0 µA 2.0 V CC = +5.0 V, RL = ∞, T A = 25 °C Output Voltage V DO Output Short-Circuit Current I SC Slew-Rate Note 9 SR V ±9.7 V V CC = +5.0 V, RL = 3 kΩ, T A = T opt ±6.0 V V CC = +4.5 V, RL = 3 kΩ, T A = T opt ±5.0 V V CC = +5.0 V, for GND ±40 mA C L = 10 pF, R L = 3 to 7 kΩ 4.0 30 V/ µ s C L = 2 500 pF, RL = 3 to 7 kΩ 4.0 30 V/ µ s Propagation Delay Time Note 9 t PHL t PLH R L = 3 kΩ, C L = 2 500 pF Output Resistor RO V CC = V DD = V SS = 0 V V OUT = ±2 V Standby Output Transfer Time t DAZ R L = 3 kΩ, CL = 2 500 pF, Note 10 4 10 µs Standby Output Transfer Time t DZA R L = 3 kΩ, CL = 2 500 pF, Note 10 0.5 1 ms Power-On Output Transfer Time t PRA R L = 3 kΩ, CL = 2 500 pF, Note 12 0.5 1 ms µs 2 Ω 300 * The TYP. values are for reference at T A = 25 °C. Note 9. Measuring point VCC 2.0 V DIN 0.8 V 0V tPLH VDO+ DOUT tPHL +5 V +3 V –3 V +3 V –3 V –5 V VDO– SR+ SR– 7 µ PD4722 Note 10. Measuring point VCC 2.4 V STBY 0.6 V 0V tDZA tDAZ VDO+ +5 V DOUT High-impedance –5 V VDO– Driver outputs are indefinite during transition time (t DZA). Note 11. Measuring point 3.3 V 3.0 V VCC 0V tPRA VDO+ High-impedance DOUT +5 V –5 V VDO– Driver outputs are indefinite during transition time (t PRA). Note 12. Measuring point 5V 4.5 V VCC 0V tPRA VDO+ High-impedance DOUT +5 V –5 V VDO– Driver outputs are indefinite during transition time (t PRA). 8 +5 V –5 V µ PD4722 ELECTRICAL SPECIFICATIONS (RECEIVER) (UNLESS OTHERWISE SPECIFIED, V CC = 3.0 to 5.5 V, T A = –40 to +85 °C, C 1 to C 5 = 1 µ F) Parameter Symbol Conditions MIN. TYP. MAX. Unit 0.4 V Low-Level Output Voltage V OL1 I OUT = 4 mA, STBY = H High-Level Output Voltage V OH1 I OUT = –4 mA, STBY = H Low-Level Output Voltage V OL2 I OUT = 4 mA, STBY = L High-Level Output Voltage V OH2 I OUT = –4 mA, STBY = L Propagation Delay Time (STBY = H) t PHL t PLH R IN → ROUT , C L = 150 pF V CC = +3.0 V, Note 13 0.2 µs Propagation Delay Time (STBY = L) t PHL t PLH R IN → ROUT , C L = 150 pF V CC = +3.0 V, Note 14 0.1 µs Propagation Delay Time (STBY = L) t PHA t PAH EN → R OUT, C L = 150 pF V CC = +3.0 V, Note 15 100 300 ns 5.5 7 kΩ 0.5 V Input Resistor RI Input Pin Open Voltage V IO VCC – 0.4 V 0.5 VCC – 0.5 3 V V V IH V CC = +3.0 to +5.5 V 1.7 2.3 2.7 V V IL V CC = +3.0 to +5.5 V 0.7 1.1 1.7 V VH V CC = +3.0 to +5.5 V (Hysteresis width) 0.5 1.2 1.8 V Input Threshold (STBY = L, EN = H) V IH V CC = +3.0 to +5.5 V, R IN3, R IN4 2.7 1.5 V IL V CC = +3.0 to +5.5 V, R IN3, R IN4 1.5 0.7 V Standby Output Transfer Time t DAH Note 16 0.2 3 µs V CHA = H (3 V mode) Note 16 0.6 3 ms Standby Output Transfer Time t DHA V CHA = L (5 V mode)Note 16 0.3 1 ms V CHA = H (3 V mode) Note 17 1 3 ms V CHA = L (5 V mode)Note 18 0.5 1 ms Input Threshold (STBY = H) Power-On Reset Release Time V t PRA * The TYP. values are for reference at T A = 25 °C. 9 µ PD4722 Note 13. Measuring point +3 V 2.7 V RIN 0.7 V 0V –3 V tPHL tPLH VOH ROUT 2.0 V 0.8 V VOL Note 14. Measuring point +3 V 2.7 V RIN 0.7 V 0V –3 V tPLH tPHL VOH ROUT 2.0 V 0.8 V VOL Note 15. Measuring point VCC 2.4 V EN 0.6 V 0V tPAH tPHA VOH ROUT 2.0 V 0.8 V VOL STBY = L 10 µ PD4722 Note 16. Measuring point VCC STBY 2.4 V 0.6 V 0V tDAH tDHA VOH ROUT 2.0 V 0.8 V VOL Receiver outputs are indefinite during transition time (tDHA). Note 17. Measuring point 3.3 V 3.0 V VCC 0V tPRA VOH ROUT 0.8 V VOL Receiver outputs are indefinite during reset release time (t PRA). Note 18. Measuring point 5V 4.5 V VCC 0V tPRA VOH ROUT 0.8 V VOL Receiver outputs are indefinite during reset release time (t PRA). REFERENCE MATERIAL • IC PACKAGE MANUAL (C10943X) • NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY (IEI-1212) 11 µ PD4722 RECOMMENDED SOLDERING CONDITIONS The following conditions (See table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SMT MANUAL” (C10535E). µ PD4722 GS-GJG Soldering process Soldering conditions Symbol Infrared ray reflow Peak package’s surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 2, Exposure limit*: None IR30-00-2 VPS Peak package’s surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 2, Exposure limit*: None VP15-00-2 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below, Number of flow process: 1, Exposure limit*: None WS60-00-1 Partial heating method Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None * Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for “Partial heating method” 12 µ PD4722 PACKAGE DRAWINGS 30 PIN PLASTIC SHRINK SOP (300 mil) 30 16 3° +7° –3° detail of lead end 1 15 A H J E K F G I C D N L B M M NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. P30GS-65-300B-1 ITEM MILLIMETERS INCHES A 10.11 MAX. 0.398 MAX. B 0.51 MAX. 0.020 MAX. C 0.65 (T.P.) 0.026 (T.P.) D 0.30+0.10 –0.05 0.012+0.004 –0.003 E 0.125 ± 0.075 0.005 ± 0.003 F 2.0 MAX. 0.079 MAX. G 1.7 ± 0.1 0.067 ± 0.004 H 8.1 ± 0.2 0.319 ± 0.008 I 6.1 ± 0.2 0.240 ± 0.008 J 1.0 ± 0.2 0.039+0.009 –0.008 K 0.15+0.10 –0.05 0.006+0.004 –0.002 L 0.5 ± 0.2 0.020+0.008 –0.009 M 0.10 0.004 N 0.10 0.004 13 µ PD4722 [MEMO] 14 µ PD4722 [MEMO] 15 µ PD4722 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 16