DATA SHEET MOS INTEGRATED CIRCUIT µPD4723 RS-232 LINE DRIVER/RECEIVER AT 3.3 V/5 V The µPD4723 is a high-breakdown voltage silicon gate CMOS line driver/receiver based on the EIA/TIA-232-E standard. The internal DC/DC converter can switch between multiple voltages, allowing it to operate with a single +3.3 V or +5 V power supply. It also provides standby function. This IC incorporates 3 driver circuits and 3 receiver circuits. An RS-232 interface circuit can be easily configured by connecting 5 capacitors externally. Features • Conforms to EIA/TIA-232-E (former name, RS-232C) standards • Selectable +3.3 V/+5 V single power supply (selected by VCHA pin) • By setting the standby pin to a low level (standby mode), circuit current can be reduced. At such times, the driver output is in a high-impedance state. • Even in the standby mode, 2 receiver circuits can operate as inverters without hysteresis width. The other circuit is fixed at a high level. Ordering Information Part number µPD4723GS-GJG Document No. S12200EJ2V0DS00 (2nd edition) (Previous No. IC-3284) Date Published January 1997 N Printed in Japan Package 30-pin plastic SSOP (300 mil) © 1993 µPD4723 BLOCK DIAGRAM/PIN CONFIGURATION (Top View) +10 V C3 1 + C4 2 +3.3 V or +5 V C1 C4+ 30 VDD + C1+ GND 29 + C2 + 3 VCC C4– 28 4 C1– VSS 27 5 C5+ 26 STBY 6 GND 25 VCHA 7 C5– –10 V C5 + 24 EN Note 4 300 Ω DIN1 8 DIN2 9 23 DOUT1 300 Ω 22 DOUT2 300 Ω DIN3 10 21 DOUT3 ROUT1 11 20 RIN1 5.5 kΩ ROUT2 12 19 RIN2 5.5 kΩ ROUT3 13 18 RIN3 5.5 kΩ NC 14 17 NC NC 15 16 NC Note 1. VDD and VSS are output pins stepped up internally. These pins should not be loaded directly. 2. Capacitors C1 to C5 with a breakdown voltage of 20 V or higher are recommended. And it is recommended to insert the capacitor that is 0.1 µF to 1 µF between VCC and GND. 3. If VCHA is kept low level (in 5 V mode), capacitor C5 is not necessary. 4. The pull-up resistors at driver input are active resistors. 2 µPD4723 Truth Table Driver STBY DIN DOUT Remarks L × Z Standby mode (DC/DC converter is stopped) H L H Space level output H H L Mark level output Receiver RIN STBY EN L ROUT Remarks R2 to R3 R1 R2 to R3 R1 L × × H H Standby mode 1 (DC/DC converter is stopped) L H L × H H Standby mode 2 (DC/DC converter is stopped, R2 and R3 are operated) L H H × L H Standby mode 2 (DC/DC converter is stopped, R2 and R3 are operated) H × L H Mark level input H × H L Space level input 3 V ↔ 5 V switchingNote 5 VCHA Operating mode L 5 V mode (double step-up) H 3 V mode (3 times step-up) H: high-level, L: low-level, Z: high-impedance, ×: H or L Note 5. When switching VCHA, standby mode must be selected (STBY = L). 3 µPD4723 ABSOLUTE MAXIMUM RATINGS (TA = 25 °C) Parameter Symbol Ratings Unit Supply Voltage (VCHA = L) VCC –0.5 to +7.0 V Supply Voltage (VCHA = H) VCC –0.5 to +4.5 V Driver Input Voltage DIN –0.5 to VCC +0.5 V Receiver Input Voltage RIN –30.0 to +30.0 V Control Input Voltage (STBY, VCHA, EN) VIN –0.5 to VCC +0.5 V –25.0 to +25.0Note 6 Driver Output Voltage DOUT V Receiver Output Voltage ROUT –0.5 to VCC +0.5 V Input Current (DIN, STBY, VCHA, EN) IIN ±20.0 mA Operating Ambient Temperature TA –40 to +85 °C Storage Temperature Tstg –55 to + 150 °C Total Power Dissipation PT 0.5 W Note 6. Pulse width = 1 ms, duty = 10 % MAX. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage (VCHA = L, 5 V mode) VCC 4.5 5.0 5.5 V Supply Voltage (VCHA = H, 3 V mode) VCC 3.0 3.3 3.6 V High-Level Input Voltage (DIN) VIH 2.0 VCC V Low-Level Input Voltage (DIN) VIL 0 0.8 V High Level Input Voltage (STBY, VCHA, EN) VIH 2.4 VCC V Low Level Input Voltage (STBY, VCHA, EN) VIL 0 0.6 V Receiver Input Voltage RIN –30 +30 V TA –40 +85 °C Note 7 0.33 4.7 µF Operating Ambient Temperature Capacitance of External Capacitor Note 7. In low temperature (below 0 °C), the capacitance of electrolytic capacitor becomes lower. Therefore, set higher values when using in low temperature. Concerning the wiring length between the capacitor and the IC, the shorter the better. Capacitors with good frequency characteristics such as tantalum capacitors, laminated ceramic capacitors, and aluminum electrolytic capacitors for switching power supply are recommended for the external capacitors. 4 µPD4723 ELECTRICAL SPECIFICATIONS (TOTAL) (UNLESS OTHERWISE SPECIFIED, TA = –40 to +85 °C, C1 to C5 = 1 µF) Parameter Circuit Current Circuit Current Circuit Current at Standby (Standby Mode 1) Circuit Current at Standby (Standby Mode 2) Symbol Conditions MAX. Unit VCC = +3.3 V, No load, RIN pin OPEN, STBY = H TYP. 14 mA VCC = +5.0 V, No load, RIN pin OPEN, STBY = H 10 mA VCC = +3.3 V, RL = 3 kΩ (DOUT), DIN = GND, RIN, ROUT pin OPEN, STBY = H 35 mA VCC = +5.0 V,RL = 3 kΩ (DOUT), DIN = GND, RIN, ROUT pin OPEN, STBY = H 28 mA 3 µA ICC1 ICC2 ICC3 ICC4 VCC = +3.3 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = L, TA = 25 °C 1 VCC = +3.3 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = L 5 VCC = +5.0 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = L, TA = 25 °C 2 VCC = +5.0 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = L 10 VCC = +3.3 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = H, TA = 25 °C 1 VCC = +3.3 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = H 5 VCC = +5.0 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = H, TA = 25 °C 2 VCC = +5.0 V, No load, DIN and RIN pins are OPEN, STBY = L, EN = H 10 High-Level Input Voltage VIH VCC = +3.0 to +5.5 V, STBY, VCHA, EN pin Low-Level Input Voltage VIL VCC = +3.0 to +5.5 V, STBY, VCHA, EN pin High-Level Input Current IIH Low-Level Input Current IIL Input Capacitance MIN. µA 5 µA µA 3 µA µA 5 µA µA 2.4 V 0.6 V VCC = +5.5 V, VI = 5.5 V, STBY, VCHA, EN pin 1 µA VCC = +5.5 V, VI = 0 V, STBY, VCHA, EN pin –1 µA Driver input and receiver input VCC = +3.3 V, for GND, f = 1 MHz 10 pF Driver input and receiver input 10 pF CIN VCC = +5.0 V, for GND, f = 1 MHz STBY — VCHA Time tSCH VCC = +3.0 to 5.5 V, STBY ↓ → VCHA,Note 8 1 µs VCHA — STBY Time tCHS VCC = +3.0 to 5.5 V, VCHA → STBY ↑,Note 8 1 µs STBY — VCC Time tSC VCC = +3.0 to 5.5 V, STBY ↓ → VCC,Note 8 1 µs VCC — STBY Time tCS VCC = +3.0 to 5.5 V, VCC → STBY ↑,Note 8 1 µs * The TYP. values are for reference at TA = 25 °C. 5 µPD4723 Note 8. Measuring point 5V 3.3 V STBY 0.6 V 0.6 V 0.6 V 0.6 V 0V tSCH tCHS tSCH tCHS 3.3 V 2.4 V VCHA 2.4 V 0.6 V 0V tSC 0.6 V tCS tSC tCS 5V 4.5 V VCC 3.6 V 3.3 V 6 4.5 V 3.6 V µPD4723 ELECTRICAL SPECIFICATIONS (DRIVER) (UNLESS OTHERWISE SPECIFIED, TA = –40 to +85 °C, C1 to C5 = 1 µF) 3 V mode (unless otherwise specified, VCHA = H, VCC = 3.0 to 3.6 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit 0.8 V Low-Level Input Voltage VIL High-Level Input Voltage VIH Low-Level Input Current IIL VCC = +3.6 V, VI = 0 V –25 µA High-Level Input Current IIH VCC = +3.6 V, VI = 3.6 V 1.0 µA 2.0 VCC = +3.3 V, RL = ∞, TA = 25 °C Output Voltage VDO VCC = +3.3 V, RL = 3 kΩ, TA = Topt ±5.0 VCC = +3.0 V, RL = 3 kΩ, TA = +25 °C ±5.0 V ±9.5 V ±6.0 V V VCC = +3.3 V, for GND ±40 mA Output Short-Circuit Current ISC Slew-RateNote 9 SR Propagation Delay TimeNote 9 tPHL tPLH RL = 3 kW, CL = 2 500 pF Output Resistor RO VCC = VDD = VSS = 0 V VOUT = ±2 V Standby Output Transfer Time tDAZ RL = 3 kΩ, CL = 2 500 pF,Note 10 4 10 µs Standby Output Transfer Time tDZA RL = 3 kΩ, CL = 2 500 pF,Note 10 1 3 ms Power-On Output Transfer Time tPRA RL = 3 kΩ, CL = 2 500 pF,Note 11 1 3 ms CL = 10 pF, RL = 3 to 7 kΩ 3.0 30 V/µs CL = 2 500 pF, RL = 3 to 7 kΩ 3.0 30 V/µs µs 2.5 Ω 300 * The TYP. values are for reference at TA = 25 °C. 7 µPD4723 5 V mode (unless otherwise specified, VCHA = L, VCC = +5.0 V ± 10 %) Parameter Symbol Conditions MIN. TYP. Unit 0.8 V Low-Level Input Voltage VIL High-Level Input Voltage VIH Low-Level Input Current IIL VCC = +5.5 V, VI = 0 V –40 µA High-Level Input Current IIH VCC = +5.5 V, VI = 5.5 V 1.0 µA 2.0 V VCC = +5.0 V, RL = ∞, TA = 25 °C Output Voltage VDO ±9.7 V VCC = +5.0 V, RL = 3 kΩ, TA = Topt ±6.0 V VCC = +4.5 V, RL = 3 kΩ, TA = Topt ±5.0 V mA ISC Slew-RateNote 9 SR Propagation Delay TimeNote 9 tPHL tPLH RL = 3 kΩ, CL = 2 500 pF Output Resistor RO VCC = VDD = VSS = 0 V VOUT = ±2 V Standby Output Transfer Time tDAZ RL = 3 kΩ, CL = 2 500 pF,Note 10 4 10 µs tDZA RL = 3 kΩ, CL = 2 500 pF,Note 10 0.5 1 ms RL = 3 kΩ, CL = 2 500 pF,Note 12 0.5 1 ms Power-On Output Transfer Time tPRA VCC = +5.0 V, for GND ±40 Output Short-Circuit Current Standby Output Transfer Time CL = 10 pF, RL = 3 to 7 kΩ 4.0 30 V/µs CL = 2 500 pF, RL = 3 to 7 kΩ 4.0 30 V/µs Ω 300 Note 9. Measuring point VCC 2.0 V DIN 0.8 V 0V tPLH VDO+ DOUT tPHL +5 V +3 V –3 V +3 V –3 V –5 V VDO– SR+ µs 2 * The TYP. values are for reference at TA = 25 °C. 8 MAX. SR– µPD4723 Note 10. Measuring point VCC 2.4 V STBY 0.6 V 0V tDAZ tDZA VDO+ +5 V DOUT High-impedance –5 V +5 V –5 V VDO– Driver outputs are indefinite during transition time (tDZA). Note 11. Measuring point 3.3 V 3.0 V VCC 0V tPRA VDO+ High-impedance DOUT +5 V –5 V VDO– Driver outputs are indefinite during transition time (tPRA). Note 12. Measuring point 5V 4.5 V VCC 0V tPRA VDO+ High-impedance DOUT +5 V –5 V VDO– Driver outputs are indefinite during transition time (tPRA). 9 µPD4723 ELECTRICAL SPECIFICATIONS (RECEIVER) (UNLESS OTHERWISE SPECIFIED, VCC = 3.0 to 5.5 V, TA = –40 to +85 °C, C1 to C5 = 1 µF) Parameter Symbol Conditions MIN. TYP. MAX. Unit 0.4 V Low-Level Output Voltage VOL IOUT = 4 mA, STBY = H High-Level Output Voltage VOH IOUT = –4 mA , STBY = H Low-Level Output Voltage VOL2 IOUT = 4 mA, STBY = L High-Level Output Voltage VOH2 IOUT = 4 mA, STBY = L Propagation Delay Time (STBY = H) tPHL tPLH RIN → ROUT, CL = 150 pF VCC = +3.0 V,Note 13 0.2 µs Propagation Delay Time (STBY = L) tPHL tPLH RIN → ROUT, CL = 150 pF VCC = +3.0 V,Note 14 0.1 µs Propagation Delay Time (STBY = L) tPHA tPAH EN → ROUT, CL = 150 pF VCC = +3.0 V,Note 15 100 300 ns 5.5 7 kΩ 0.5 V Input Resistor RI Input Pin Open Voltage VIO VCC – 0.4 V 0.5 VCC – 0.5 3 V V VIH VCC = +3.0 to +5.5 V 1.7 2.3 2.7 V VIL VCC = +3.0 to +5.5 V 0.7 1.1 1.7 V VH VCC = +3.0 to +5.5 V (Hysteresis width) 0.5 1.2 1.8 V Input Threshold VIH VCC = +3.0 to +5.5 V, RIN1, RIN2 2.7 1.5 (STBY = L, EN = H) VIL VCC = +3.0 to +5.5 V, RIN1, RIN2 1.5 0.7 V tDAH Note 16 Input Threshold (STBY = H) Standby Output Transfer Time Standby Output Transfer Time Power-On Reset Release Time tDHA tPRA 0.2 1 µs VCHA = H (3 V mode)Note 16 0.6 3 ms VCHA = L (5 V mode)Note 16 0.3 1 ms VCHA = H (3 V mode)Note 17 1 3 ms VCHA = L (5 V mode)Note 18 0.5 1 ms * The TYP. values are for reference at TA = 25 °C. 10 V µPD4723 Note 13. Measuring point +3 V 2.7 V RIN 0.7 V 0V –3 V tPHL tPLH VOH ROUT 2.0 V 0.8 V VOL Note 14. Measuring point +3 V 2.7 V RIN 0.7 V 0V –3 V tPHL tPLH VOH ROUT 2.0 V 0.8 V VOL Note 15. Measuring point VCC 2.4 V EN 0.6 V 0V tPAH tPHA VOH ROUT 2.0 V 0.8 V VOL STBY = L 11 µPD4723 Note 16. Measuring point VCC STBY 2.4 V 0.6 V 0V tDHA tDAH VOH ROUT 2.0 V 0.8 V VOL Receiver outputs are indefinite during transition time (tDHA). Note 17. Measuring point 3.3 V 3.0 V VCC 0V tPRA VOH ROUT 0.8 V VOL Receiver outputs are indefinite during reset release time (tPRA). Note 18. Measuring point 5V 4.5 V VCC 0V tPRA VOH ROUT 0.8 V VOL Receiver outputs are indefinite during reset release time (tPRA). REFERENCE MATERIAL • IC PACKAGE MANUAL (C10943X) • NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY (IEI-1212) 12 µPD4723 RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “SMT MANUAL” (C10535E). µPD4723GS-GJG Soldering process Soldring conditions Symbol Infrared ray reflow Peak package’s surface temperature: 230 °C or below, Reflow time: 30 seconds or below (210 °C or higher), Number of reflow process: 2, Exposure limit*: None IR30-00-2 VPS Peak package’s surface temperature: 215 °C or below, Reflow time: 40 seconds or below (200 °C or higher), Number of reflow process: 2, Exposure limit*: None VP15-00-2 Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or below, Number of flow process: 1, WS60-00-1 Exposure limit*: None Partial heating method Terminal temperature: 300 °C or below, Flow time: 10 seconds or below, Exposure limit*: None * Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25 °C and relative humidity at 65 % or less. Note Do not apply more than a single process at once, except for “Partial heating method”. 13 µPD4723 PACKAGE DRAWINGS 30 PIN PLASTIC SHRINK SOP (300 mil) 30 16 3° +7° –3° detail of lead end 1 15 A H J E K F G I C D N M M NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. 14 L B P30GS-65-300B-1 ITEM MILLIMETERS INCHES A 10.11 MAX. 0.398 MAX. B 0.51 MAX. 0.020 MAX. C 0.65 (T.P.) 0.026 (T.P.) D 0.30+0.10 –0.05 0.012+0.004 –0.003 E 0.125 ± 0.075 0.005 ± 0.003 F 2.0 MAX. 0.079 MAX. G 1.7 ± 0.1 0.067 ± 0.004 H 8.1 ± 0.2 0.319 ± 0.008 I 6.1 ± 0.2 0.240 ± 0.008 J 1.0 ± 0.2 0.039+0.009 –0.008 K 0.15+0.10 –0.05 0.006+0.004 –0.002 L 0.5 ± 0.2 0.020+0.008 –0.009 M 0.10 0.004 N 0.10 0.004 µPD4723 [MEMO] 15 µPD4723 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5