DATA SHEET MOS INTEGRATED CIRCUIT µPD4726 RS-232 LINE DRIVER/RECEIVER The µPD4726 is a high-voltage silicon gate CMOS line driver/receiver conforming to EIA/TIA-232-E Standards. It contains a DC/DC converter and can operate with a +5 V single power supply. In addition, it is also provided with ancillary functions such as a standby function. This IC is equipped with four driver circuits and seven receiver circuits and can configure a simple RS-232 interface circuit with only four external capacitors. FEATURES • Conforms to EIA/TIA-32-E (old RS-232C) Standards • +5 V single power supply • A standby mode can be set by making the standby pin low to reduce the power dissipation. At this time, the driver outputs go into a high-impedance state. • Two receiver circuits can operate as inverters without a hysteresis width even in the standby mode. The remaining five receiver circuits are fixed to the high level. ORDERING INFORMATION Part Number Package Quality Grade µPD4726GS-BAF 36-pin plastic SSOP (300 mil) Standard Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by NEC Corporation to know the specification of quality grade on the devices and its recommended applications. Document No. IC-3413 (1st edition) (O.D.No. IC-8923) Date Published March 1997 P Printed in Japan © 1994 µPD4726 BLOCK DIAGRAM/PIN CONFIGURATION (Top View) +10 V C3 + 1 VDD C4+ 36 2 C1 + GND 35 3 VCC C4 4 C1- VSS 33 5 N.C. 6 GND + C4 + + C2 C1 +5 V 7 N.C. - To internal circuit To internal circuit 34 −10 V 32 STBY 31 GND 30 EN DIN1 8 29 DOUT1 DIN2 9 28 DOUT2 DIN3 10 27 DOUT3 DIN4 11 26 DOUT4 ROUT1 12 25 RIN1 ROUT2 13 24 RIN2 ROUT3 14 23 RIN3 ROUT4 15 22 RIN4 ROUT5 16 21 RIN5 ROUT6 17 20 RIN6 ROUT7 18 19 RIN7 Notes 1. VDD and VSS output internally boosted voltages. Do not connect a load directly to these pins. 2. It is recommended that capacitors having a breakdown voltage of 20 V or higher be used as C1 through C5. Inserting a bypass capacitor of 0.1 to 1 µF in between VCC and GND is also recommended. 3. Be sure to connect all the GND pins. Especially, make sure that pin 31 is connected; otherwise, the µPD4726 will not operate normally. Be sure to leave the NC pins (pins 5 and 7) open. 4. The pull-up resistors for DIN1 through DIN4 and STBY and the pull-down resistor for EN are active resistors. 2 µPD4726 TRUTH TABLE Drivers STBY DIN DOUT Remarks L × Z Standby mode (DC/DC converter stops.) H L H Space level output H H L Mark level output Receivers ROUT RIN STBY EN Remarks R6 - R7 R1 - R5 R6 - R7 R1 - R5 L L × × H H Standby mode 1 (DC/DC converter stops.) L H L × H H Standby mode 2 (DC/DC converter stops. R 6 and R7 operate.) L H H × L H H × L H Mark level input H × H L Space level input H : high level L : low level Z : high impedance × : H or L 3 µPD4726 ABSOLUTE MAXIMUM RATING (Ta = 25 °C) Parameter Symbol Ratings Unit Supply voltage VCC −0.5 to +7.0 V Driver input voltage DIN −0.5 to V CC + 0.5 V Receiver input voltage RIN −30.0 to +30.0 V Control input voltage (STBY, EN) VIN −0.5 to V CC + 0.5 V Driver output voltage DOUT Receiver output voltage ROUT −0.5 to V CC + 0.5 V Input current (DIN, STBY, EN) IINI ±20.0 mA Operating ambient temperature Topt. −40 to +85 °C Storage temperature Tstg. −55 to +150 °C PT 0.5 W Permissible package power dissipation −25.0 to +25.0 Note 5 V Note 5. Pulse width: 1 ms, duty cycle: 10 % MAX. RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. TYP. MAX. Unit Supply voltage (VCHA = L) VCC 4.5 5.0 5.5 V Input voltage, high (DIN) VIH 2.0 VCC V Input voltage, low (DIN) VIL 0 0.8 V Input voltage, high (STBY, EN) VIH 2.4 VCC V Input voltage, low (STBY, EN) VIL 0 0.8 V Receiver input voltage RIN −30 +30 V Operating ambient temperature Topt. −40 +85 °C Note 6 1 4.7 µF External capacitance (nominal value) Note 6. Use capacitors whose capacitance fluctuation is within ±50 % including fluctuations due to temperature and tolerance (effective value: 0.5 to 7.05 µF). Use of capacitors with excellent high-frequency characteristics (such as multilayer ceramic capacitors, tantalum capacitors, and aluminum electrolytic capacitors for switching power supply) is recommended. Keep the wiring length between a capacitor and an IC pin as short as possible. 4 µPD4726 ELECTRICAL SPECIFICATIONS (CHIP) (Unless otherwise specified, Ta = −40 to +85 °C, C1 through C5 = 1 µF) Parameter Symbol Conditions MIN. TYP. MAX. Unit Circuit current ICC1 VCC = +5.0 V, no load, RIN pin open, STBY = H 12 mA Circuit current ICC2 VCC = +5.0 V, RL = 3 kΩ (DOUT), DIN = GND, RIN, ROUT pins open, STBY = H 38 mA Circuit current in standby mode (standby mode 1) ICC3 VCC = +5.0 V, no load, DIN, RIN pins open, STBY = L, EN = L, Ta = 25 °C 9 20 µA VCC = +5.0 V, no load, DIN, RIN pins open, STBY = L, EN = L, 15 VCC = +5.0 V, no load, DIN, RIN pins open, STBY = L, EN = H, Ta = 25 °C 9 VCC = +5.0 V, no load, DIN, RIN pins open, STBY = L, EN = H, Ta = 25 °C 15 Circuit current in standby mode (standby mode 2) ICC4 Input voltage, high VIH STBY, EN pins, VCC = +4.5 to +5.5 V Input voltage, low VIL STBY, EN pins, VCC = +4.5 to +5.5 V Input current, high IIH STBY pin, VCC = +5.5 V, VI = +5.5 V Input current, low IIL Input current, high µA 20 µA µA 2.4 V 0.8 V 1 µA STBY pin, VCC = +5.5 V, VI = 0 V −40 µA IIH EN pin, VCC = +5.5 V, VI = +5.5 V 40 µA Input current, low IIL EN pin, VCC = +5.5 V, VI = 0 V −1 µA Input capacitance CIN Driver inputs and receiver inputs, VCC = +5.0 V, vs. GND, f = 1 MHz 10 pF Remark TYP. value is a reference value at Ta = 25 °C. 5 µPD4726 ELECTRICAL SPECIFICATIONS (DRIVERS) (Unless otherwise specified, Ta = −40 to +85 °C, VCC = +5.0 V ±10 %, C1 through C5 = 1 µF) Parameter Symbol Conditions MIN. MAX. Unit 0.8 V Input voltage, low VIL Input voltage, high VIH Input current, low IIL −40 µA Input current, high IIH 1.0 µA Output voltage VDO 2.0 VCC = +5.0 V, RL = ∞, Ta = 25 °C ±9.7 V ±5.5 V VCC = +4.5 V, RL = 3 kΩ, Ta = Topt. ±5.0 V ISC VCC = +5.0 V, vs. GND Slew rate SR C L = 10 pF, RL = 3 to 7 kΩ CL = 2 500 pF, RL = 3 to 7 kΩ Note 8 V VCC = +5.0 V, RL = 3 kΩ, Ta = Topt. Output short current Propagation delay time ±40 mA 4.0 30 V/µs 4.0 30 V/µs µs tPHL tPLH RL = 3 kΩ, C L = 2 500 pF Output resistance R0 VCC = VDD = VSS = 0 V VOUT = ±2 V Standby output transition time tDAZ RL = 3 kΩ, C L = 2500 pF, Note 9 4 10 µs tDZA RL = 3 kΩ, C L = 2500 pF, Note 9 0.5 1 ms RL = 3 kΩ, C L = 2500 pF, Note 10 0.5 1 ms Standby output transition time Power-ON output transition time tPRA 2 Note 8. Test point VCC DIN 2.0 V 0.8 V 0V tPHL tPLH VDO+ DOUT +5 V +3 V −3 V +3 V −3 V VDO− SR+ Ω 300 Remark TYP. value is a reference value at Ta = 25 °C. 6 TYP. SR− −5 V µPD4726 Note 9. Test point VCC STBY 2.4 V 0.6 V 0V tDZA tDAZ VDO+ DOUT +5 V High impedance +5 V −5 V −5 V VDO− The driver output is undefined during the standby output transition time tDZA. Do not perform communication within the standby output transition time tDZA after the standby mode has been released. Note 10. Test point 5V 4.5 V VCC 0V tPRA VDO+ High impedance DOUT +5 V −5 V VDO− The driver output is undefined during the power-ON output transition time tPRA. Do not perform communication within the power-ON output transition time tPRA on power application. 7 µPD4726 ELECTRICAL SPECIFICATIONS (RECEIVERS) (Unless otherwise specified, VCC = 4.5 to 5.5 V, Ta = −40 to +85 °C, C1 through C5 = 1 µF) Parameter Symbol Conditions MIN. MAX. Unit 0.4 V Output voltage, low (STBY = H) VOL1 IOUT = 4 mA Output voltage, high (STBY = H) VOH1 IOUT = −4 mA Output voltage, low (STBY = L) VOL2 IOUT = 4 mA Output voltage, high (STBY = L) VOH2 IOUT = −4 mA Propagation delay time (STBY = H) tPHL tPLH RIN → ROUT, C L =150 pF VCC = +4.5 V, Note 11 0.2 µs Propagation delay time (STBY = L, EN = H) tPHL tPLH RIN → ROUT (R6, R 7), CL =150 pF VCC = +4.5 V, Note 11 0.1 µs Propagation delay time (STBY = L) tPHA tPAH EN → ROUT (R 6, R 7), CL =150 pF VCC = +4.5 V, Note 12 100 300 ns 5.5 7 kΩ 0.5 V VCC − 0.4 V 0.5 VCC − 0.5 3 V V Input resistance RI Open voltage across input pins VIO Input threshold voltage VIH VCC = +4.5 to +5.5 V 1.7 2.3 2.7 V (STBY = H) VIL VCC = +4.5 to +5.5 V 0.7 1.1 1.7 V VH VCC = +4.5 to +5.5 V (hysteresis width) 0.5 1.2 1.8 V Input threshold voltage VIH VCC = +4.5 to +5.5 V, RIN6 , RIN7 2.7 1.5 (STBY = L, EN = H) VIL VCC = +4.5 to +5.5 V, RIN6 , RIN7 1.5 0.7 V Standby output transition time tDAH Note 13 0.2 3 µs Standby output transition time tDHA Note 13 0.3 1 ms Power-ON output transition time tPRA Note 14 0.5 1 ms Remark TYP. value is a reference value at Ta = 25 °C. Note 11. Test point +3 V 2.7 V RIN 0V 0.7 V −3 V tPHL tPLH VOH ROUT 2.0 V 0.8 V VOL 8 TYP. V µPD4726 Note 12. Test point VCC 2.4 V EN 0.6 V 0V tPHA tPAH VOH ROUT 2.0 V 0.8 V VOL STBY = L Note 13. Test point VCC STBY 2.4 V 0.6 V 0V tDHA tDAH VOH ROUT 2.0 V 0.8 V VOL The receiver output is undefined during the standby output transition time tDHA. Do not perform communication within the standby output transition time tDHA after the standby mode has been released. Note 14. Test point 5V 4.5 V VCC 0V tPRA VOH ROUT 0.8 V VOL The receiver output is undefined during the power-ON output transition time tPRA. Do not perform communication within the power-ON output transition time tPRA on power application. 9 µPD4726 36 PIN PLASTIC SHRINK SOP (300 mil) 19 1 detail of lead end 5°±5° 36 18 A H J E K F G I C N D L B M M P36GM-80-300B-3 NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. 10 ITEM MILLIMETERS INCHES A 15.54 MAX. 0.612 MAX. B 0.97 MAX. 0.039 MAX. C 0.8 (T.P.) 0.031 (T.P.) D +0.10 0.35 –0.05 0.014+0.004 –0.003 E 0.125 ± 0.075 0.005 ± 0.003 F 1.8 MAX. 0.071 MAX. G 1.55 0.061 H 7.7 ± 0.3 0.303 ± 0.012 I 5.6 0.220 J 1.1 0.043 K 0.20 +0.10 –0.05 0.008+0.004 –0.002 L 0.6 ± 0.2 0.024 –0.009 M 0.10 0.004 N 0.10 0.004 +0.008 µPD4726 RECOMMENDED SOLDERING CONDITIONS Solder and mount the µPD4726 under the following recommended conditions. Consult NEC for conditions other than those recommended. µPD4726GS-BAF Soldering method Infrared ray reflow Soldering conditions Peak temperature of package surface: 235 °C, Reflow time: Within 30 sec (210 °C or higher), Number of reflow process: 2, Exposure limit: None Peak temperature of package surface: 215 °C, Reflow time: Within 40 sec (200 °C or higher), Number of reflow process: 2, Exposure limit: None VPS IR35-00-2 Note VP15-00-2 Note Wave soldering Solder temperature: 260 °C or lower, Reflow time: Within 10 sec, Number of reflow process: 1, Exposure limit: None Note Partial heating Pin temperature: 300 °C or lower, Time: Within 10 sec, Exposure limit: None Note Note Symbol WS60-00-1 Exposure limit before soldering after dry-package is opened. Storage condition: 25 °C and relative humidity at 65 % or less. Caution Do not use two or more soldering methods in combination (except the partial heating method). REFERENCE Document name Document No. Semiconductor Device Mounting Technology Manual IEI-1207 Quality grade on NEC Semiconductor Devices IEI-1209 NEC Semiconductor Device Reliability/Quality Control system IEI-1212 11 µPD4726 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5