SEME-LAB 2N6782

2N6782
MECHANICAL DATA
Dimensions in mm (inches)
N–CHANNEL
POWER MOSFET
8.89 (0.35)
9.40 (0.37)
7.75 (0.305)
8.51 (0.335)
4.19 (0.165)
4.95 (0.195)
0.89 max.
(0.035)
12.70
(0.500)
min.
APPLICATIONS
7.75 (0.305)
8.51 (0.335)
dia.
• FAST SWITCHING
• MOTOR CONTROLS
5.08 (0.200)
typ.
• POWER SUPPLIES
2.54
(0.100)
2
1
3
0.66 (0.026)
1.14 (0.045)
0.71 (0.028)
0.86 (0.034)
45˚
TO39
Pin 1 - Source
Pin 2 - Gate
Pin 3 Drain and Case
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
Drain Source Voltage
100V
Drain Gate Voltage (RGS = 1MW)
100V
ID @Tcase = 25°C
Continuous Drain Current
±3.5V
ID @Tcase = 100°C
±2.25A
IDM
Continuous Drain Current
Pulsed Drain Current 1
VGS
Gate Source Voltage
±40V
PD@ Tcase = 25°C
Maximum Power Dissipation
15W
PD@ Tcase = 100°C
Maximum Power Dissipation
6W
Junction to Case
Linear Derating Factor
0.12W/°C
Junction to ambient
Linear Derating Factor
0.005W/°C
TJ,Tstg
Operating and Storage Temperature Range
Lead Temperature
(1/16” from case for 10 secs)
VDS
GR
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: [email protected]
Website: http://www.semelab.co.uk
±8V
-55 to +150°C
300°C
6/00
2N6782
ELECTRICAL CHARACTERISTICS (Tcase = 25°C unless otherwise stated)
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
STATIC ELECTRICAL RATINGS
BVDSS Drain – Source Breakdown Voltage
VGS(th) Gate Threshold Voltage
IGSSF
Gate Body Leakage Forward
IGSSR
Gate Body Leakage Reverse
IDSS
Zero Gate Voltage Drain Current
VGS = 0
ID = 0.25mA
VDS = VGS
ID = 0.5A
2*
4.0*
TA = 125°C
1*
4.0*
VGS = 20V
100*
V
ID = 0.5A
100*
TA = 125°C
200*
VGS = -20V
VDS(on)
RDS(on)
On State Drain Current1
Static Drain Source On-State
Voltage1
Static Drain Source On-State
nA
-100*
VDS = 0.8 Max.
Ratings VGS =0
VDS = Max.
Ratings VGS =0
0.25*
1*
TC = 125°C
ID(on)
V
mA
VDS ³ 2VDS(ON) VGS = 10V
3.5
A
VGS = 10V
ID = 3.5A
2.1*
V
VGS = 10V
ID = 2.25A
0.6*
TC = 125°C
1.08*
Resistance1
DYNAMIC CHARACTERISTICS
W
V
VDS ³ 2VDS(ON) IDS = 2.25A
gfs
Forward Transductance 1
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(on)
Turn–On Delay Time
VDD = 34V
ID = 2.25A
15*
tr
Rise Time
RG = 25W
RL = 15W
25*
td(off)
Turn–Off Delay Time
(MOSFET switching times are essentially
25*
tf
Fall Time
independent of operating temperature.)
20*
VGS = 0
VDS = 25V
f = 1MHz
1.0*
3.0*
60*
200*
40*
100*
10*
25*
S (É)
pF
ns
BODY– DRAIN DIODE RATINGS & CHARACTERISTICS
Continuous Source Current Body
MOdified MOS POWER
Diode
symbol showing the intergal
ISM
Source Current1 (Body Diode)
P-N junction rectifier.
VSD
Diode Forward Voltage 1
trr
Reverse Recovery Time
IS
IS = -3.5A
,
5
VGS = 0
TC = 25°C
IF =IS
-3.5*
A
-8
A
-1.5*
V
/
TJ = 150°C
di / dt = 100A/ms
-0.75*
V
200
THERMAL CHARACTERISTICS
RqJC Thermal Resistance Junction – Case
RqJPC Thermal Resistance Junction – PC Board
Free Air Operation
8.33*
170
°C\W
Notes
1) Pulse Test: Pulse Width £ 300ms, d £ 2%
* JEDEC registered Values
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: [email protected]
Website: http://www.semelab.co.uk
6/00