PREPARED BY: Jian Cleda APPROVED BY: DATE: SPEC.No. DG!wo43 /16/‘jj ISSUE Jun/16/99 DATE: PAGE REPRESENTATIVE ELECTRONK GROUP DIVISION: SHARP CORPORATION Lt /l&/45 3 XlkU~ COMPONENTS 10 pages Opto-Electronic Devices Division ‘1 SPECIFICATION DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. GL52R44 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharp’s consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment * Computers 1 L * Tooling machines If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Rescue and security equipment * Traffic signals * Gas leakage sensor breakers * Other safety equipment [_ (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Telecommunication equipment (for trunk lines) * Space equipment * Medical equipment i * Nuclear power control equipment 1 1 (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMER’S DATE: BY: APPROVAL DATE: PRESENTED BY: M.Katoh, Department General Manager of Engineering Dept.,III Optc-Electronic Devices Division Electronic Components Group SHARP COlZPORATlON / DG996043 Jun/16/9!I PAGE MODEL No. GL5ZR44 GL5ZR44 Stxxitication 1. Application This specificationappliesto the light emitting diode &vice Model No. GL5ZR44. [AlGalnP (dicing or scribe/braketype> Red LED device] 2. Outline dimensionsandpin connections. . . . . . . . . . . . . . . . . . . . . . . . . ..o Refer to the attachedsheetPage2. 3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4. 3-1. Absolutemaximumratings 3-2. Electra-opticalcharacteristics 3-3. DeratingCwe 3-4. CharacteristicsDiagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4-l. Test itemsand test conditions 4-2. MeasurementitemsandFailure judgementcriteria 5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..a Refer to the attachedsheetPage6. 5- 1. Applied standard 5-2. Samplingmethodand level 5-3. Test items,judgementcriteria andclassificaof defect 5-4. Test itemsthe surfaceis be applied for flat type, judgementcriteria and classifka of defect 6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage7-8. 6-l. Packing 6-2. Luminousintensity rank 6-3. Dominantwavelengthrank 6-4. Environment 7 precau~omforuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9- 10. 7- 1. Lead forming method 7-2. Notice of installation 7-3. Solderingconditions 7-4. For cleaning l/10 DG9!%043 Juni16i99 MODEL No. PAGE i;L5zR44 2/10 i -2Outlhe dimensionsand pin eons l+lorless transp8rencY pin COMtXtiOIls (ore) Unspecifiedtol. to be +0.2mm Joti> Cold rolled steelleadsare plated with but the tie-bar cut portions have no plating do not sol&r this part of the product. unit mm Material Lead : (Fe) Cold rolled steel Package: Epoxy reek Finish Lead : Sn plated or wave soldering Drawing No. 51106024 Jun/16/99~ DG996043 PAGE MODEL No. I 3. Ratings and characteristics 3- 1. Absolute maximum ratings Parameter Symbol Power dissipation P GL5ZR44 I (Ta=25”C) unit mW Value 130 (Note I) Duty ratio=l/lO&he width=O.lms (Note 2) At the position of 1.6mm from the bottom resin package (Note 3) Refer to the suplement item 6. regarding the standard of rank classification. 3-3. Derating Curve Peak Forward Current Derating Curve Forward $ ,” 2 100 80 60 2 5 L ; c 2 L. d 50 Curve 40 30 7 z 4o ‘: L 20 5 20 B 10 : 0. Derating 60 120 3 h Current 0 0 -25 0 Ambient 25 50 Temperature 75 *%nl Ta (“cl 125 -25 0 Ambient 25 50 Temperature 7585 100 Ta (“C) 125 3110 DG996043 MODEL No. Jun/16/99 PAGE 4110 GL5ZR44 Peak Forward Current vs. Duty Ratio (Ta=25”C) 10 l/100 1 l/10 Duty Raito 10 DR 3-4. Characteristics Diagramttyp) (Note 1) Forward Current vs.Forward Relative Luminous Intensity vs. Ambient Temperature Voltage (Ta=25"C) 1 1.2 1.4 1.6 Forward Relativs Lumitmus 1.8 2 Voltage Intsmity vs. (IF=2Om4) -60 2.22.42.6 VF(v) Frowmrd -40 -20 Ambient Voltrga (Ta=25’=C) 1000 $ .it 100 0 1 1 .B 0.01 0. 1 10 1 Forward Current 100 IFhN (Note 1) Above characteristic data are typical data and not a guarantteed data. 0 20 40 Temprature 60 80 TarC)- 100 120 I Jun/16/!39 DG996043 1PAGE MODEL No. GL5ZR44 5110 4. Reliability The reliability of productsshallbe satisfiedwith itemslisted below. Confidencelevel: 904b 4- 1. Test itemsand testconditions n=22,c=O 10 n=22,c=o 10 High temperaturestorageTa=l 00°C, t= lOOOh n=22, C=O 10 Low temperaturestorageTa=-4O’C. t=lOOOh n=22, C=O 10 n=22, C=O 10 Temperaturecycling -4O”c(3Omin)~+lOO”c(3Omin),3Ocycles High temp*andhigh Ta=+6O”c, 9O%RH,t=lOOOh humidity storage Operationlife Ta=25”C, IrMAX. t=lOOOh*3 4-2. MeasurementitemsandFailure judgementcriteria * 1 Measurement SylIlbOl Failure judgementcriteria *2 Forward voltage VF VF > U.S.L. x 1.2 Reversecurrent IR IR >u.s.L.x Luminousintensity Iv 2.0 Iv > The first stagevalue X 2.0 or The first stagevalue X 0.5 > Iv Z Solderability : Sol&r shahbe adhereat the areaof 95% or more of dippedportion. z Terminal strength: Packageis not destroyed,andterminal is not slack *l: Measuring conditionis in accordancewith specification. *2: U.S.L. is shownby UpperSpecification Limit. *3: IF MAX.is shownby forward current of absolutemaximumratings. L Juni16l99 DG996043 IMODEL No. PAGE GL5ZR44 6110 5. Incoming inspection 5- 1. Applied standard: IS0 2859-1 5-2. Samplingmethodand level : A single samplingplannormalinqection level II : AQL Major defect : 0.065% Minor defect : 0.4% 5-3. Test items,judgementcriteria and classificaof defect No. 1 Test items I judgementcriteria :lassifica ofdefec Not emit light DiscoMection 2 Positionof Cutting off rim Different from dimension 3 Reverseterminal Different from dimension 4 Outline dimensions Not satisfy outlinespecification Major defect 5 I characteristics I Over the limit value of specificationat V,, I,, andIv 6 I Cut off the rim I Exceed -0.2mm 7 Foreign substance White point : Exceed 4 0.3mm (on top view) Black point : Exceed 4 0.3mm (on top view) Sing form : Exceed 3.Omm(on top view) 8 Scratch Exceed 4 0.3mmor O.lmm x l.Omm(on top view) 9 Void Exceed $0.3mm (ontop view) Unevendensityof for scattering 10 12 Extremely unevendensity material 11 Exceed fo25mm from packagecenter Unbalancedcenter I 13 Burr Minor defect I Insertionpositionof terminal Exceed +0.2mrn againstprovided dimension Insertion positionof terminal 5-4. Test itemsthe surfaceis be applied for flat type, judgementcriteria andclassificaof defect No. Test items 14 Chappedthe surface 15 1 I Hollow the surface 1 judgementcriteria The surfacechappedis striking for seethe lamp top The surfacehollow is strikingfor seethe lamp top Minor defect DC996043 MODEL No. GL5ZR44 I Junll6/99 PAGE 1 7110 6. Supplement 61. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One Product,Typ.) (kiication label sample) SHIPBENT TABLE PART No. GL5ZR44 + Model number *&l cl tlclclclcl QUANTITY 250 + Quantity of products LOT No. KA99B19 + Lot number * 00 0 a 0 @-0 cLuminous intensity rank dominant wavelength rank SHARP’ MADE IN JAPAN + Production country @ @ @) @ @ Production plant code(to be indicated alphabetically) Support code Year of production(the last two figures of the year) Month of production (to be indicated alphabetically with January corresponding to A) Date of production(Ol-31) 6-l-2. Outer package Put 8 packs (the same luminous intensity rank) into outer package. (approximately 670g per one outer package) 6-l-3. Outer package out line dimension Width: 14Omm, Depth: 225mrn, Hight: 9Omm (Note 1) Tolerance:flS% In regard to luminous intensity , the following ranking shall be carried out. However the quantity of each rank shall not be pre scribed. In case of the distribution of the luminous intensity shift to high, at that point new upper rank is prescribed and lower rank is delete. 6-3Dominant wavelength rank (Note 2) (Ta=25”c ) Dominant wavelength Rank 1 Unit 1 Condition I I Y 1 628.5 632.5 1 I z 631.5 635.5 1 634.5 638.5 run IF2OmA 2 637.5 641.5 3 640.5 644.5 (Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp. This rank value is the setting value of when that classifies it the rank and be not a guarantee value. Also I shall not ask the delivery ratio of each rank. DG996043 GL5ZR44 6-4. Environment 641. Ozonosphere destructive chemicals. (1) The &vice doesn’t contain following substance. (2) The &vice doesn’t have a production line whose process requires following substance. Restricted part: CFCs~ones,CCb,T~c~o~~~e~ych) 642. Bromic non-bun&g materials The device doesn’t contain bromic non-burning materiak@BBOs,PBBs) Jun/16/99 PAGE MODEL No. 8/10 DG996043 MODEL No. Jun/16/!8 PAGE GL5ZR44 9110 7. prtcautions for use 7 - 1. Lead forming method Avoid forming a lead pin with the lead pin b&se as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be forwed before soldering. 7 - 2. Notice of installation 7-Z-l installation on a P WB Whenmounting an LED lamp on a PIB, do not apply physical stress to the lead pins. *The lead pin pitch should match the PBBpin-hole pitch:absolutely avoid widening or narrowing the lead pins. when positioning an LED lamp,basicaIly employ an LEDwith tie-bar cut or use a spacer. 7-Z-Z when an LED 1 is mounted directly on a P W B If the bottom face of an LED lamp is mounted directly on single-sided PWB,the base of the lead pins may be subjected to physical stress due to PWBwarp, cutting or clinching of lead pins.Prior to use,be sure to check that no disconnection inside of the resin or damageto resin etc.,is found.When an LED lamp is mounted on a double-sided PWB,the heat during soldering affects the resin;therefore,keep the LED lamp more that 1.6mmafloat above the PW. 7-Z-3 Installation using a holder During an LED lamp positioning,when a holder is used, a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-Z-4 Installation to the case Do not fix part C with- adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the inside of resin to any undue stress. l Goal DG996043 GL5ZR44 7 - 3. S oldering Conditions Solder the lead pins under the following conditions Type of S oldering Conditions 1. Manual soldering 295°C-+S”c. within 3 seconds 2. Wave soldering 260°C+ 5°C. vi thin 5 seconds 3. Auto soldering Preheating 70°C to 8O”c, within 30 seconds Soldering 245”c+5”c, within 5 seconds (Note) Avoid d’ipping resin into soldering bath Avoid applying stress to lead pins while they are heated.For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair,disconnection mayoccur. i ran 7 - 4. For cleaning (1) Jun/16/99 PAGE MODEL No. Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less (2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,PWBsize or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent : Ethyl alcohol. Methyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed in actual using condition. lo/lo