ELECTRONIC
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COMPONENTS GROUP
SHARPCORPORATION
Opto-Electronic
SPECIFICATION
DEVICE SPECIFICATION
Devices Division
FOR
Emitting Diode
MODEL No.
GL5ZS44
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharp’s consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas:
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (‘Terminal) * Measuring equipment
L * Tooling machines * Computers
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3). please be sure to observe the precautions given in those respective paragraphs.
I
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals
* Gas leakage sensor breakers
* Rescue and security equipment
[ * Other safety equipment
I
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
*
* Medical equipment
C Nuclear power control equipment
(4) PIease contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
CUSTOMER’S
‘DATE:
BY:
APPROVAL
DATE:
PRESENTED BY:
M.Katoh,
Department General Manager of
Engineering DeptJII
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
Juni16/9!I
DG996041
PAGE
MODEL No.
GL5ZS44
GL5ZS44 Snecification
1. Application
This specificationappliesto the light emitting diodedevice Model No. GL5ZS44.
[AlGaInP (dicing or m-ii/brake type) Sunset-orange LED device]
2. Outline dimensionsandpin COMedOnS
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attachedsheetPage2.
3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4.
3- 1. Absolute maximumratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. CharacteristicsDiagram
4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5.
4- 1. Test itemsandtestconditions
4-2. MeasurementitemsandFailurejudgement criteria
5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage6.
5- 1. Applied standard
5-2. Samplingmethodand level
5-3. Test items,judgementcriteria and classifrcaof defect
5-4. Test itemsthe surfaceis be appliedfor flat type, judgementcriteria andclakfica of defect
6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage7-8.
6-l. Packing
6-2. Luminousintensity rank
6-3. Dominant
wavelengthrank
6-4. Environment
7. Precautionsfor use. . . . . . . ..*.....................................
7-l. Lead forming method
7-2. Notice of installation
7-3. SolderingConditions
,7-k For cleaning
Refer to the attachedsheetPageg-10.
l/10
DG996041
Jun/16/99
PAGE
MODEL No.
GL5ZS44
2ilO
Colotless ttrnsp8reney
“I
k
Vote) Unspecified tol. to be CO.2mm
Vote) Coldxolled steelleadsareplatedwith but the tie-bar cut portionsha\, no plating do not sol&r this part of the product
unit
mm
Material
Lead : (Fe) Cold rolled steel
Package: Epoxy resin
Finish
Lead : So platedor wave soldering
Drawing No.
51106022
Jun116/99
DG99604 I
MODEL
PAGE
No.
I
GL5ZS44
I
3. Ratings and characteristics
(Note 1) Duty ratio=l/lO,Pulse width=O. lms
(Note 2) At the position of 1.6mm from the bottom resin package
3-2. Electra-optical characteristics
MIN.
Parameter
Symbol
Conditions
Forward voltage
vF
r
Iv
Luminous intensity (Note 3)
IF=2OmA
Peak emission wavelength
J.P
Dominant wavelength
1.d
1
!
Spectrum radiation bandwidth
A ;1
VR4V
Reverse current
IR
Terminal capacitance
ct
V=OV,f=lMHz
Viewing Angle
281/2
rF=2OmA
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
I
TYP.
2.1
(Ta=25”C)
h&4x.
unit
V
2.6
mcd
run
3-3. Derating Curve
Peak
Forward
Current
Derating
Forward
Curve
120
60
a
9
e
100
50
s
80
40
2
60
30
7
g
40
20
20
10
Current
Derating
Curve
z
2
:
2
a
0
0
-25
0
Ambient
25
50
Temperature
75 a51OO
Ta("C)
125
-25
0
Ambient
25
50
Temperature
7585100
Ta("C)
125
3110
DC5996041
MODEL No.
GL5ZS44
Peak
Forward
Current
vs.
Junl16/!w
PAGE
4110
Duty Ratio
(Ta=2573
1000
f
2
10
l/10
l/100
Duty
3-4. Characteristics
Raito
Diagram&p)
Forward
10
1
Current
DR
(Note 1)
vs.Forward
Relative
Luminous
intensity
vs. Ambient
Temperature
Voltage
( I F=2OmA)
(Ta=25"C)
ii’
(I! I,, , , ,
Ii ii ii i IAI I I I I I I I
2Oh
-J--Ji
I
100
i
i//i’
1 ! i !!
.r E
3
1
1.21.41.61.8
2
Forward
Relative
Luminour
Voltage
Intensity
vs.
‘-60 -40 -20 0 20 40 60 80
2.22.42.6
Ambient
VF(V)
Frorard
Voltage
(TaKZ@C)
1000
5.
Yz
2
2
.-Ea v
5
-I
:
.:
2
100
10
1
0. 1
0. 01
1
0. 1
Forward
10
Current
100
IFhA)
(Note 1) Above characteristic data are typical data and not
a
smttced
data.
Temprature
TarC)
100 120
Jud16/99
DG99604 1
PAGE
MODEL No.
GL5ZS44
5110
4. Reliability
The reliability of products shall be satisfied with items listed below.
4-l. Test items and test conditions
Confidence level: 909
Samples (n)
LTPD
Defective (C)
(%I
Test conditions
Test items
Solderability
23025°C. 5s
Prior disposition : Dip in rosin flux
n=l l? C=O
20
Soldering
temperature
26025°C.
n=ll.
C=O
20
5s
Mechanical shock
15 OOOm/s2,0.5ms.
3times / kX,*Y,kZ
direction
n=ll,
C=O
20
Variable frequency
vibration
2oom/s2, 100 to 2 Ooo to lOOHz/sweep for 4mi.n.
,4times/fX,ltY,fZ
direction
n=ll,
C=O
20
Terminal strength
(Tension)
Weight:lON,
n=ll,
C=O
20
Terminal strength
(Bending)
Weight:SN, 0” :
/each terminal
n=ll,
C=O
20
n=22. C=O
10
n=22, C=O
10
High temperature storage Ta=lOO”C, t=lOOOh
n=22. C=O
10
Low temperature storage Ta=-QO”C , t=lOOOh
n=22, C=O
10
n=22, C=O
10
S/each
terminal
90” + 0% -90”
Temperature cycling
-4O”c(3Omin)~+lOO”c(3Omirt).3O
High temp. and high
humidity storage
Ta=+6O”C, 9O%RH. t=lOOOh
Operation life
Ta=25”C, IrMAX,
-0”
cycles
t=lOOOh *3
4-2. Measurement items and Failure judgement criteria * 1
Measurement
Symbol
Failure judgement criteria *2
Forward voltage
VF
VF > u.sL.
Reverse current
IR
IR > U.S.L. x 2.0
Luminous intensity
Iv
x 1.2
Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
% Solderability : Solder shall be adhere at the area of 95% or more of dipped portion.
% Terminal strength : Package is not destroyed, and terminal is not slack.
*l: Measuring condition is in accordance with specification.
*2: U.S .L. is shown by Upper Specification Limit.
*3: IF w.is
shown by forward current of absolute maxirnum ratings.
5. Incoming inspection
5-1. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling plan,normal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items, judgement criteria and classifica of defect
judgement criteria
No.
Test items
1
Disconnection
Not emit light
2
Position of Cutting off
rim
Different from dimension
3
Reverse terminal
Different from dimension
4
Outline dimensions
Not satisfy outline specification
5
Characteristics
Over the limit value of specification at Vr. IR, and Iv
6
Cut off the rim
Exceed -0.2rnm
7
Foreign substance
.White point : Exceed Q 0.3mm (on top view)
Black point : Exceed 4 0.3rnm (on top view)
Shim form : Exceed 3.Omm (on too view)
8
Scratch
Exceed $I 0.3mm or O.lmm x l.Omm (on top view)
9
Void
Exceed @0.3mm (on top view)
10
Uneven density of
material for scattering
Extremely uneven density
11
Unbalanced center
Exceed M.25nun from package center
12
Burr
Exceed +0.2mm againstprovided dimension
I 13 I Insertion.--:--lposition of
I
I
:lassifica of defec
Major defect
Minor defect
Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No.
Test items
judgement criteria
classifica of defec
14
Chapped the surface
The surface chapped is striking for see the lamp top
Minor defect
15
Hollow the surface
The surface hollow is striking for see the lamp top
Junh6/99
PAGE
1 7110
DG996041
MODEL No.
GL5ZS44
6. Supplement
6-1. Packing
6-l-l. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put
Product weight : 0.28g (One Product,Typ.)
(Indication label sample)
SHIPMENT TABLE
- Model numher
PART No.
GLSZS44
*clQUANTITY
250
- Quantity of products
LOT No.
KA99B19
+ Lot number *
0’
@-Cl tLuminous intensity rank
dominant wavelength rank
SHARP’
MADE IN JAPAN
+ Production country
0
@
@
@
@
following label by pack.
---cl
0
00000
QOQ
Production plant code(to he indicated alphabetically)
Support code
Year of production(the last two figures of the year)
Month of production
(to he indicated alphabetically with January corresponding to A)
Date of production(Ol-31)
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6- 1-3. Outer package out line dimension
Width: 14Omm. Depth : 225mm, Hight : 9Omm
6-2luminous
intensity rank (Note 1)
(Ta=25”c )
ci
(Note 1) Tolerance:~lS%
In regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not he pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
6-3.Dominant wavelength rank (Note 2)
Rank
Dominant wavelength
0
598.5
y602.0
P
601.0
604.5
Q
603.5
607.0
R
606.0
609.5
S
608.5
612.0
Unit
:Ta=25”c )
Condition
run
IF2cTnA
I
(Note 2) The condition of measurement : The measurement oft slightemission from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
DG996041
MODEL No.
I
GL5ZS44
6-4. Environment
6-4-l. Ozonosphere destmctive chemicals.
(1) The device doesn’t contain following substance.
(2) The device doesn’t have a production line whose process requires following substance.
Restricted part: CFCs,halones,CCl,,,Trichloroethane(Methychloroform)
642. Bromic non-burning mate&s
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
Jun/16/!39
PAGE
g/10
IX996041
Jun/16/99
PAGE
MODEL No.
GL5ZS44
9/10
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering
7 - 2. Notice of installation
7-Z-l installation on a P WB
!Jhen mounting an LED lamp on a PYB,do not apply
physical stress to the lead pins.
. The lead pin pitch should match the PWBpin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
. lhen positioning an LED lamp,basically employ
an LED with tie-bar cut or use a spacer.
7-2-2 when an LED 1 is mounted directly on a PWB
If the bottom face of an LED lamp is mounted
directly on single-sided P’R the base of the
lead pins may be subjected to physical stress
due to PWBwarp,cutting or clinching of lead
pins.Prior to use.be sure to check that no
disconnection inside of the resin or damageto
resin etc., is found. Whenan LED lamp is mounted
on a double-sided PW.the heat during soldering
affects the resin;therefore,keep
the LED lamp
more that 1.6mmafloat above the P’JB.
7-2-3 Installation using a holder
During an LED lamp posiIioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation
to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure..\ hole of the case should
be designed not to subject the inside of resin
to any undue stress.
Good
DG996041
MODELNo.
I
GL5ZS44
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Conditions
Type of Soldering
295°C+5”c, within 3 seconds
1. Manual soldering
260”ct5”C. within 5 seconds
2. Wave soldering
Preheating 70°C to 8O”c, within 30 seconds
3. Auto soldering
Soldering 245”ck5”c, within 5 seconds
(Note) Avoid dipping resin into soldering bath.
Avoid applying stress to lead pins while they are heated.For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
Soldering
iron
7 - 4. For cleaning
(1)
Solvent cleaning : Solvent telsperature 45°C or less
Immersion for 3 min or less
( 2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size.ultrasonic power
output,cleaning time,PYB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning
( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
In case when the other solvent is us&there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
Judl6/!39
PAGE
1 lO/lO