SONY CXG1014N

CXG1014N
1.5 GHz Low Noise Amplifier/Down Conversion Mixer
Description
The CXG1014N is a low noise amplifier/down
conversion mixer MMIC, designed using the Sony’s
GaAs J-FET process.
Features
• Low noise
NF=1.85 dB (Typ.)
at 1.49 GHz
(low noise amplifier)
• Low distortion
Input IP3=+2 dBm (Typ.)
at 1.49 GHz
(mixer)
• Low LO input power operation
–15 dBm
• Single 3.0 V power supply operation
• 16-pin SSOP package
Applications
1.5 GHz Japan digital cellular telephones
Structure
GaAs J-FET MMIC
16 pin SSOP (Plastic)
Absolute Maximum Ratings (Ta=25 °C)
• Supply voltage
VDD
6
V
• Operating temperature Topr
–35 to +85
°C
• Storage temperature
Tstg –65 to +150 °C
• Power dissipation
PD
150
mW
• Current consumption
IDD (low noise amplifier)
20
mA
IDD (LO amplifier)
10
mA
IDD (mixer, IF amplifier)
20
mA
• Input power
PIN
+5
dBm
Operating Condition
Supply voltage
3.0
V
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
—1—
E97408-TE
CXG1014N
Electrical Characteristics
VDD=3.0 V, fRF=1.49 GHz, fLO=1.62 GHz, PLO=–15 dBm, when 50 Ω I/O matching; unless otherwise specified
(Ta=25 °C)
Low noise
amplifier
Mixer
Item
Current consumption
Power gain
Noise figure
Input IP3
Isolation
Current consumption
Conversion gain
Noise figure
Input IP3
LO to RF leak level
Symbol
IDD
GP
NF
IIP3
ISO
IDD
GC
NF
IIP3
PLK
Min.
—
14
—
–7.5
30
—
6
—
–2
—
Typ.
2.2
16
1.85
–3.5
35
3.8
8
8.5
2
–17
Max.
3.0
18
2.6
—
—
5.5
10
10.5
—
–12
Unit
mA
dB
dB
dBm
dB
mA
dB
dB
dBm
dBm
Measurement condition
When no signal
Block Diagram
LNA
LNA RFOUT
LNA RFIN
MIX
LOIN
MIX RFIN
LO AMP
IF AMP
IFOUT
Pin Configuration
1
16
LNA RFIN
LNA RFOUT/VDD (LNA)
NC
NC
CAP
NC
GND
GND
GND
GND
LOIN
MIX RFIN
CAP
CAP
VDD (LO AMP)
IF OUT/VDD (MIX, IF AMP)
16pin SSOP (PLASTIC)
—2—
When no signal
CXG1014N
Recommended Circuit
L1
C1
L3
16
1
LNA RFIN
C2
LNA RFOUT
L2
R1
L4
VDD (LNA)
C14
C13
L7
C6
C12
C7
L5
C4
C3
LOIN
MIX RFIN
L8
L6
C15
C16
IFOUT
L9
C5
VDD (LO AMP)
C9
L10
C8
C10
L1
L2
L3
L4
L5
L6
L7
L8
L9
6.8 nH
4.7 nH
4.7 nH
3.3 nH
10 nH
4.7 nH
5.6 nH
3.3 nH
10 nH
L10
C1
C2
C3
C4
C5
C6
C7
C8
150 nH
100 pF
100 pF
2 pF
100 pF
10 pF
1000 pF
1 µF
1000 pF
—3—
C11
C9
C10
C11
C12
C13
C14
C15
C16
R1
VDD (MIX, IF AMP)
10 nF
1000 pF
1 µF
100 pF
1000 pF
1 µF
1000 pF
1 µF
1 kΩ
CXG1014N
Recommended Evaluation Board
Front
50mm
SONY
CXG1014N
LNA RFOUT
C2
LNA RFIN
L2
C7
L4
C6
L1
C1
R1 L3
L8
L5 C3
L6
L10
L7 C4
L9
C8 C10
C9
C11
MIX RFIN
C5
LOIN
IFOUT
GND
VDD (LNA)
VDD (LO AMP)
VDD (MIX, IF AMP)
Back
C14
C13
C12
C16 C15
GND
VDD (MIX, IF AMP)
VDD (LO AMP)
VDD (LNA)
Glass fabric-base epoxy 4-layer board (2 × 0.3 mm thickness)
GND for the 2nd and 3rd layers.
—4—
CXG1014N
Example of Representative Characteristics (Ta=25 °C)
LNA block POUT, IM3 vs. PIN
MIX block POUT, IM3 vs. PIN
20
20
POUT
0
0
POUT-IF output Power (dBm)
–20
IM3
–40
VDD=3.0V
fRF1=1.49GHz
fRF2=1.4901GHz
–60
–20
IM3
–40
VDD=3.0V
fRF1=1.49GHz
fRF2=1.4901GHz
fLO=1.62GHz
PLO=–15dBm
–60
–80
–40
–30
–20
–10
PIN-RF input power (dBm)
–80
–35
0
MIX block GC, NF vs. PLO
4
15
–5
IIP3
GC
8
2
4
9
IIP3-Input IP3 (dBm)
11
VDD=3.0V
fRF=1.49GHz
fLO=1.62GHz
NF-Noise figure (dB)
13
6
–10
0
–15
PLK
–2
–20
VDD=3.0V
fRF=1.49GHz
fLO=1.62GHz
NF
2
0
–25
–20
–15
–10
–5
PLO-LO input power (dBm)
5
MIX block IIP3, PLK vs. PLO
10
GC-Conversion gain (dB)
–25
–15
–5
PIN-RF input power (dBm)
0
7
–4
5
–6
–25
5
—5—
–25
–30
–20
–15
–10
–5
PLO-LO input power (dBm)
0
5
PLK-LO to RF leak level (dBm)
POUT-RF output Power (dBm)
POUT
CXG1014N
Unit : mm
16PIN SSOP (PLASTIC)
+ 0.2
1.25 – 0.1
∗5.0 ± 0.1
0.1
16
9
A
1
+ 0.1
0.22 – 0.05
6.4 ± 0.2
∗4.4 ± 0.1
8
+ 0.05
0.15 – 0.02
0.65 ± 0.12
0.1 ± 0.1
0.5 ± 0.2
Package Outline
0° to 10°
DETAIL A
NOTE: Dimension “∗” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SSOP-16P-L01
LEAD TREATMENT
SOLDER / PALLADIUM
PLATING
EIAJ CODE
SSOP016-P-0044
LEAD MATERIAL
COPPER / 42 ALLOY
PACKAGE WEIGHT
0.1g
JEDEC CODE
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
—6—