CXG1014N 1.5 GHz Low Noise Amplifier/Down Conversion Mixer Description The CXG1014N is a low noise amplifier/down conversion mixer MMIC, designed using the Sony’s GaAs J-FET process. Features • Low noise NF=1.85 dB (Typ.) at 1.49 GHz (low noise amplifier) • Low distortion Input IP3=+2 dBm (Typ.) at 1.49 GHz (mixer) • Low LO input power operation –15 dBm • Single 3.0 V power supply operation • 16-pin SSOP package Applications 1.5 GHz Japan digital cellular telephones Structure GaAs J-FET MMIC 16 pin SSOP (Plastic) Absolute Maximum Ratings (Ta=25 °C) • Supply voltage VDD 6 V • Operating temperature Topr –35 to +85 °C • Storage temperature Tstg –65 to +150 °C • Power dissipation PD 150 mW • Current consumption IDD (low noise amplifier) 20 mA IDD (LO amplifier) 10 mA IDD (mixer, IF amplifier) 20 mA • Input power PIN +5 dBm Operating Condition Supply voltage 3.0 V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E97408-TE CXG1014N Electrical Characteristics VDD=3.0 V, fRF=1.49 GHz, fLO=1.62 GHz, PLO=–15 dBm, when 50 Ω I/O matching; unless otherwise specified (Ta=25 °C) Low noise amplifier Mixer Item Current consumption Power gain Noise figure Input IP3 Isolation Current consumption Conversion gain Noise figure Input IP3 LO to RF leak level Symbol IDD GP NF IIP3 ISO IDD GC NF IIP3 PLK Min. — 14 — –7.5 30 — 6 — –2 — Typ. 2.2 16 1.85 –3.5 35 3.8 8 8.5 2 –17 Max. 3.0 18 2.6 — — 5.5 10 10.5 — –12 Unit mA dB dB dBm dB mA dB dB dBm dBm Measurement condition When no signal Block Diagram LNA LNA RFOUT LNA RFIN MIX LOIN MIX RFIN LO AMP IF AMP IFOUT Pin Configuration 1 16 LNA RFIN LNA RFOUT/VDD (LNA) NC NC CAP NC GND GND GND GND LOIN MIX RFIN CAP CAP VDD (LO AMP) IF OUT/VDD (MIX, IF AMP) 16pin SSOP (PLASTIC) —2— When no signal CXG1014N Recommended Circuit L1 C1 L3 16 1 LNA RFIN C2 LNA RFOUT L2 R1 L4 VDD (LNA) C14 C13 L7 C6 C12 C7 L5 C4 C3 LOIN MIX RFIN L8 L6 C15 C16 IFOUT L9 C5 VDD (LO AMP) C9 L10 C8 C10 L1 L2 L3 L4 L5 L6 L7 L8 L9 6.8 nH 4.7 nH 4.7 nH 3.3 nH 10 nH 4.7 nH 5.6 nH 3.3 nH 10 nH L10 C1 C2 C3 C4 C5 C6 C7 C8 150 nH 100 pF 100 pF 2 pF 100 pF 10 pF 1000 pF 1 µF 1000 pF —3— C11 C9 C10 C11 C12 C13 C14 C15 C16 R1 VDD (MIX, IF AMP) 10 nF 1000 pF 1 µF 100 pF 1000 pF 1 µF 1000 pF 1 µF 1 kΩ CXG1014N Recommended Evaluation Board Front 50mm SONY CXG1014N LNA RFOUT C2 LNA RFIN L2 C7 L4 C6 L1 C1 R1 L3 L8 L5 C3 L6 L10 L7 C4 L9 C8 C10 C9 C11 MIX RFIN C5 LOIN IFOUT GND VDD (LNA) VDD (LO AMP) VDD (MIX, IF AMP) Back C14 C13 C12 C16 C15 GND VDD (MIX, IF AMP) VDD (LO AMP) VDD (LNA) Glass fabric-base epoxy 4-layer board (2 × 0.3 mm thickness) GND for the 2nd and 3rd layers. —4— CXG1014N Example of Representative Characteristics (Ta=25 °C) LNA block POUT, IM3 vs. PIN MIX block POUT, IM3 vs. PIN 20 20 POUT 0 0 POUT-IF output Power (dBm) –20 IM3 –40 VDD=3.0V fRF1=1.49GHz fRF2=1.4901GHz –60 –20 IM3 –40 VDD=3.0V fRF1=1.49GHz fRF2=1.4901GHz fLO=1.62GHz PLO=–15dBm –60 –80 –40 –30 –20 –10 PIN-RF input power (dBm) –80 –35 0 MIX block GC, NF vs. PLO 4 15 –5 IIP3 GC 8 2 4 9 IIP3-Input IP3 (dBm) 11 VDD=3.0V fRF=1.49GHz fLO=1.62GHz NF-Noise figure (dB) 13 6 –10 0 –15 PLK –2 –20 VDD=3.0V fRF=1.49GHz fLO=1.62GHz NF 2 0 –25 –20 –15 –10 –5 PLO-LO input power (dBm) 5 MIX block IIP3, PLK vs. PLO 10 GC-Conversion gain (dB) –25 –15 –5 PIN-RF input power (dBm) 0 7 –4 5 –6 –25 5 —5— –25 –30 –20 –15 –10 –5 PLO-LO input power (dBm) 0 5 PLK-LO to RF leak level (dBm) POUT-RF output Power (dBm) POUT CXG1014N Unit : mm 16PIN SSOP (PLASTIC) + 0.2 1.25 – 0.1 ∗5.0 ± 0.1 0.1 16 9 A 1 + 0.1 0.22 – 0.05 6.4 ± 0.2 ∗4.4 ± 0.1 8 + 0.05 0.15 – 0.02 0.65 ± 0.12 0.1 ± 0.1 0.5 ± 0.2 Package Outline 0° to 10° DETAIL A NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE SSOP-16P-L01 LEAD TREATMENT SOLDER / PALLADIUM PLATING EIAJ CODE SSOP016-P-0044 LEAD MATERIAL COPPER / 42 ALLOY PACKAGE WEIGHT 0.1g JEDEC CODE NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). —6—