ILX547K 2700 × 3 pixel CCD Linear Sensor (Color) For the availability of this product, please contact the sales office. Description The ILX547K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of 300DPI. The distance between lines is only 4 line (32µm). The power supply of this device is single 5V. 22 pin DIP (Plastic) NC 5 18 NC NC 6 17 NC NC 7 NC 8 15 NC NC 9 14 NC NC 10 13 φ1 φROG 11 Amplifier (G) Amplifier (B) VOUT (G) 2 VOUT (R) 22 12 φ2 Sensor (B) Reset out gate (B) Sensor (G) Reset out gate (G) Amplifier (R) φCLP 12 φ2 VOUT (B) 21 , 1 1 G B 2700 2700 1 R 2700 16 NC 3 19 φRS GND 4 19 NC φRS 20 VDD 20 3 VDD GND 21 VOUT (B) 1 2 VREF VOUT (G) 22 VOUT (R) CCD analog shift register (B) 1 CCD analog shift register (G) VREF Timing generator Pin Configuration (Top View) CCD analog shift register (R) Sensor (R) φ1 V °C °C Reset out gate (R) Absolute Maximum Ratings • Supply voltage VDD 6 • Operating temperature –10 to +60 • Storage temperature –30 to +80 13 ROG driver 11 φROG Features • Number of effective pixels: 8100 pixels (2700 pixels × 3) • Pixel size: 8µm × 8µm (8µm pitch) • Distance between line: 32µm (4 lines) Block Diagram • Maximum data rate: 6MHz (2MHz × 3) • Built-in clamp circuit • Low lag/High sensitivity • Single 5V power supply • Input clock pulse: CMOS 5V drive • Number of output: 3 (R, G, B) • Package: 22 pin Plastic DIP (400mil) Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E99908-PS ILX547K Pin Description Pin No. Symbol Pin No. Description Symbol Description 1 VREF Reference voltage 12 φ2 Clock pulse input 2 VOUT (G) Signal output (G) 13 φ1 Clock pulse input 3 GND GND 14 NC NC 4 NC NC 15 NC NC 5 NC NC 16 NC NC 6 NC NC 17 NC NC 7 NC NC 18 NC NC 8 NC NC 19 φRS Clock pulse input 9 NC NC 20 VDD Power supply 10 NC NC 21 VOUT (B) Signal output (B) 11 φROG Clock pulse input 22 VOUT (R) Signal output (R) Recommended Supply Voltage Item VDD Min. Typ. Max. Unit 4.75 5 5.25 V Input Pin Capacity Item Symbol Min. Typ. Max. Unit Input capacity of φ1, φ2 Cφ1, Cφ2 — 900 — pF Input capacity of φRS CφRS — 60 — pF Input capacity of φROG CφROG — 10 — pF Min. Typ. Max. Unit — 1 2 MHz Min. Typ. Max. Unit High level 4.75 5.0 5.25 V Low level — 0 0.1 V Clock Frequency Item Frequency of φ1, φ2, φRS Symbol fφ1, fφ2, fφRS Input Clock Pulse Voltage Item φ1, φ2, φRS, φROG pulse voltage –2– ILX547K Electrooptical Characteristics (Note 1) (Ta = 25°C, VDD = 5V, fφRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Symbol Min. Typ. Max. Unit Remarks Red RR 3.6 5.6 7.6 Green RG 4.4 6.8 9.2 V/(lx · s) Note 2 Blue RB 3.1 4.8 6.5 Sensitivity nonuniformity PRNU — 4 20 % Note 3 Saturation output voltage VSAT 1.2 1.5 — V Note 4 Red SER 0.16 0.27 — Green SEG 0.13 0.22 — lx · s Note 5 Blue SEB 0.19 0.31 — Dark voltage average VDRK — 0.5 3 mV Note 6 Dark signal nonuniformity DSNU — 3 10 mV Note 6 Image lag IL — 1 — % Note 7 Supply current IVDD — 9.5 15 mA — Total transfer efficiency TTE 92 98 — % — Output impedance Zo — 430 — Ω — Offset level VOS — 3.6 — V Note 8 Sensitivity Saturation exposure Notes) 1. In accordance with the given electrooptical characteristics, the black level is defined as the average value of the signal level of the optical black pixels. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT (G) = 500mV (Typ.) PRNU = (VMAX – VMIN)/2 VAVE × 100 [%] Where the 2700 pixels are divided to blocks of 150, R, G and B pixels, respectively. The maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = VSAT R , Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6. Optical signal accumulated time τ int stands at 10ms. 7. VOUT (G) = 500mV (Typ.) VOUT 8. Vos is defined as indicated bellow. VOUT indicates VOUT (R), VOUT (G) and VOUT (B). VOS GND –3– –4– VOUT φRS φ2 φ1 D61 D14 D13 D12 D3 D63 D2700 S2699 S2698 S1 Effective picture elements signal (2700 pixels) S2 D62 1-line output period (2764 pixels) Dummy signal (62 pixels) Optical black (48 pixels) , D60 1 Note) The transfer pulses (φ1, φ2) must have more than 2764 cycles. 0 5 0 5 0 5 0 2 D1 5 3 D2 φROG Clock Timing Chart 1 ILX547K D64 2764 ILX547K Clock Timing Chart 2 t4 t5 φROG t2 t6 t7 φ1 t1 t3 φ2 Clock Timing Chart 3 t7 t6 φ1 φ2 t10 t11 t9 φRS t8 , , VOUT t12 t13 –5– ILX547K Clock Pulse Recommended Timing Item Symbol Min. Typ. Max. Unit φROG, φ1 pulse timing t1 50 100 — ns φROG pulse high level period t2 800 1000 — ns φROG, φ1 pulse timing t3 800 1000 — ns φROG pulse rise time t4 0 5 10 ns φROG pulse fall time t5 0 5 10 ns φ1 pulse rise time/φ2 pulse fall time t6 0 10 60 ns φ1 pulse fall time/φ2 pulse rise time t7 0 60 ns φRS pulse high level period t8 50 10 250∗1 — ns φRS, φ1 pulse timing t9 80 250∗1 — ns φRS pulse rise time t10 0 10 30 ns φRS pulse fall time t11 0 10 30 ns t12 — 130 — ns t13 — 40 — ns Signal output delay time ∗1 These timing is the recommended condition under fφRS = 1MHz. –6– 0.1µF –7– 47µF/16V 10µF/16V Buffer1 VOUT (B) 4 6 OUT IN 1.5kΩ 100Ω Buffer1: 5 2SK523 5V 7 8 9 10 IC1 IC1: 74AC04 φROG 100Ω 11 IC1 Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same. VOUT (G) Buffer1 3 2 1 12 13 14 15 16 17 18 19 2Ω φ2 20 2Ω φ1 21 2Ω φRS 22 Buffer1 VOUT (R) VREF VOUT (R) VOUT (G) VOUT (B) GND VDD NC φRS NC NC NC NC NC NC NC NC NC NC NC φ1 φROG φ2 ∗ Data rate fφRS = 1MHz 5V Application Circuit∗ ILX547K ILX547K Example of Representative Characteristics (VDD = 5V, Ta = 25°C) Spectral sensitivity characteristics (Standard characteristics) 1.0 Relative sensitivity 0.8 0.6 0.4 0.2 0 400 500 450 550 600 650 700 Wavelength [nm] Dark voltage rate vs. Ambient temperature (Standard characteristics) Output voltage rate vs. Integration time (Standard characteristics) 10 Output voltage rate Dark voltage rate 100 10 1 0.1 –10 0 10 20 30 40 50 1 0.1 60 1 5 Offset level vs. Ambient temperature (Standard characteristics) 5 5 4 4 Vos – Offset level [V] Vos – Offset level [V] Offset level vs. Supply voltage (Standard characteristics) 3 ∆Vos ∆VDD 0.8 2 1 0 4.75 10 τ int – Integration time [ms] Ta – Ambient temperature [°C] 3 2 ∆Vos ∆Ta –1mV/°C 1 5 0 –10 5.25 0 10 20 30 40 Ta – Ambient temperature [°C] VDD – Supply voltage [V] –8– 50 60 ILX547K Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm , , Cover glass 0.9Nm ,, ,, ,, ,, Plastic portion 39N 29N 29N Adhesive Ceramic portion (1) (2) (3) (4) b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. –9– ILX547K 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. – 10 – 5.0 ± 0.3 – 11 – 1 V H 22 6.8 ± 0.3 21.6 (8µm X 2700Pixels) 32.0 ± 0.3 2.54 Plastic , Ceramic GOLD PLATING 42 ALLOY 2.21g LS-D8-01(E) PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER 30.6 No.1 Pixel (Green) PACKAGE STRUCTURE 4.0 ± 0.5 0.51 11 12 22pin DIP(400mil) 9.0 0.3 2.10 Unit: mm 10.0 ± 0.3 M 2.80 ± 0.5 Package Outline 0º to 9º 0.25 10.16 2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5. 1. The height from the bottom to the sensor surface is 1.61 ± 0.3mm. ILX547K