TRIQUINT TGL6425

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TGL6425-SCC
D
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Digital Attenuator
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0.5 to 18-GHz Frequency Range
T O
R ,
I
N
C .
6425
5- Bit Step Attenuator
15.5-dB Attenuation Range
4-dB Typical Inser tion Loss
1.6:1 Input/Output SWR
2,1844 x 1,8288 x 0,1016 mm (0.086 x 0.072 x 0.004 in.)
PHOTO ENLARGEMENT
DESCRIPTION
The TriQuint TGL6425-SCC is a GaAs MMIC 5- bit FET attenuator which operates fr om
0.5 to 18-GHz. The attenuation step is 0.5- dB and is controlled by 10 input lines. Control bias voltages
are 0 V and -5 V. The input and output return loss is typically 13 - dB.
This unique absorptive design combines both “T”and “PI”configurations to produce an extremely
small size and low inser tion loss attenuator. The small size and reliability advantage of a monolithic
attenuator over a hybrid design make this device attractive for use in electronic war fare, radar,
telecommunication, and navigation systems for level set, modulation and switching functions.
Bond pad and backside metallization is gold plated for compatibility with eutectic alloy attachment
method as well as the thermocompression and thermosonic wire bonding processes. Ground is
provided to the circuitry through vias to the backside metallization.
TriQuint Semiconductor, Inc.
•
Texas Facilities
• (972) 995-8465
• www.triquint.com
TGL6425-SCC
0
TYPICAL ATTENUATION
TA = 25°C
Attenuation (dB)
-5
-10
Attenuation
State:
-15
0 dB
2 dB
4 dB
-20
8 dB
15.5 dB
-25
0
2
4
6
8
10
12
14
16
18
Frequency (GHz )
35
TYPICAL
INPUT POWER
TA = 25°C
30
Input Power (dBm)
P1dB
25
20
Attenuation
State:
15
0 dB
2 dB
10
4 dB
5
8 dB
15.5 dB
0
0
3
6
9
12
15
18
Frequency (GHz )
7
TYPICAL
INPUT RETURN LOSS
T = 25°C
Input Return Loss (dB)
13
19
25
Attenuation
State:
31
0 dB
2 dB
4 dB
8 dB
15.5 dB
37
43
0
3
6
9
12
15
18
Frequency (GHz )
TriQuint Semiconductor, Inc.
•
Texas Facilities
• (972) 995-8465
• www.triquint.com
2
TGL6425-SCC
0
Output Return Loss (dB)
TYPICAL
OUTPUT RETURN LOSS
TA = 25°C
6
12
18
Attenuation
State:
24
0dB
2dB
4dB
8dB
15.5dB
30
36
0
3
6
9
12
15
18
Frequency (GHz )
ABSOLUTE
MAXIMUM RATINGS
Input continuous wave power , PIN .......................................................................................................... 1 W
Contr ol voltage range, V1, V2, V3, V4, V5, V6, V7, V8, V9, V10 ................................................ -10 V to 0 V
Operating channel temperature, TCH* ................................................................................................ 150 ° C
Mounting temperature (30 sec), TM .................................................................................................... 320 ° C
Storage temperature range, TSTG ............................................................................................ -65 to 150 ° C
Ratings over operating channel temperature range, TCH (unless otherwise noted)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are str ess ratings only and functional operation of the device at these or any other conditions beyond
those indicated under “RF Characteristics” is not implied. Exposure to absolute maximum rated conditions for
extended periods may af fect device reliability.
*Operating channel temperature, TCH, will directly affect the device MTTF . For maximum life, it is recommended
that channel temperature be maintained at the lowest possible level.
RF CHARACTERISTICS
PARAMETER
SWR(in)
TEST CONDITIONS
Attenuation
Input standing wave ratio
SWR(out) Output standing wave ratio
P1dB(in)
TYPICAL
UNIT
see next table
dB
f = 2 - 18 GHz (all states)
1.6:1
-
f = 2 - 18GHz (all states)
1.4:1
-
see next table
dBm
Input power at 1- dB gain compression
T A = 25°C
TriQuint Semiconductor, Inc.
•
Texas Facilities
• (972) 995-8465
• www.triquint.com
3
TGL6425-SCC
RF CHARACTERISTICS
ATTENUATION
STATE
(dB)
TYPICAL
ATTENUATION
at 9 GHz (dB)
TYPICAL
VARIANCE
at 9 GHz (dB)
3.6
4.1
4.4
5.7
7.6
12.1
19.7
± 0.25
± 0.25
± 0.25
± 0.25
± 0.25
± 0.45
± 0.7
0
0.5
1
2
4
8
15.5
BIAS TRUTH TABLE
TriQuint Semiconductor, Inc.
TYPICAL INPUT POWER
1–dB Gain Compression
at 2-18 GHz (dBm)
28
28
29
29
29
20
20
ATTEN
STATE
(dB)
V1
V2
V3
V4
V5
V6
V7
V8
V9
V10
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-5
-5
-5
-5
-5
-5
-5
-5
0
0
0
0
0
0
0
0
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
0
0
0
0
-5
-5
0
0
-5
-5
0
0
0
0
0
0
-5
-5
-5
-5
0
0
-5
-5
0
0
0
0
0
0
-5
-5
0
0
-5
-5
0
0
0
0
-5
-5
-5
-5
-5
0
-5
0
-5
0
-5
0
4.0
4.5
-5
-5
0
0
0
0
-5
-5
-5
-5
-5
-5
-5
-5
0
0
0
0
-5
0
5.0
5.5
-5
-5
0
0
0
0
-5
-5
0
0
-5
-5
-5
-5
0
0
-5
-5
-5
0
6.0
6.5
-5
-5
0
0
0
0
0
0
-5
-5
-5
-5
-5
-5
-5
-5
0
0
-5
0
7.0
7.5
-5
-5
0
0
0
0
0
0
0
0
-5
-5
-5
-5
-5
-5
-5
-5
-5
0
8.0
8.5
9.0
9.5
10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
14.5
15.0
15.5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
0
0
0
0
0
0
0
0
-5
-5
-5
-5
0
0
0
0
-5
-5
-5
-5
0
0
0
0
-5
-5
0
0
-5
-5
0
0
-5
-5
0
0
-5
-5
0
0
0
0
0
0
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
-5
0
0
-5
-5
0
0
0
0
-5
-5
-5
-5
-5
-5
-5
-5
0
0
-5
-5
0
0
-5
-5
0
0
0
0
-5
-5
-5
-5
0
0
0
0
-5
-5
-5
-5
0
0
-5
-5
0
0
-5
-5
-5
0
-5
0
-5
0
-5
0
-5
0
-5
0
-5
0
-5
0
•
Texas Facilities
• (972) 995-8465
• www.triquint.com
4
TGL6425-SCC
EQUIVALENT
SCHEMATIC
2 - 186mm
2 - 70mm
2 - 290mm
2 - 32mm
2 - 62mm 2 - 16mm
RF
INPUT
2 - 32mm
2 - 16mm
2 - 62mm
2 - 30mm
RF
OUTPUT
2 - 50mm
100mm
V1
2 - 55mm
V2
V3
V4
V5 V6 V7
V8 V9
V1 V3
BIAS NETWORK
2
V2
3
V5
V 10
5
6
4
V10
7
1
RF Input
TGL6425
12
V9
11 10
V8
V6
9
V7
RF Output
8
V4
All bias r esistors have a nominal value of 25 - Ohms.
RF connections: Bond using two 1-mil diameter , 20 to 25-mil- length gold bond wires at both RF Input and
RF Output for optimum RF per formance.
DC blocks are not provided at RF ports.
Close placement of external components is essential to resonant-free performance.
5
TriQuint Semiconductor, Inc.
•
Texas Facilities
• (972) 995-8465
• www.triquint.com
1,3970 (0.055)
MECHANICAL DRAWING
2,0396 (0.0803)
TGL6425-SCC
1,8288 (0.0720)
1,6358 (0.0644)
2
1,0592 (0.0417)
3
4
5
6
10
9
1,3691 (0.0539)
11
1,1049 (0.0435)
12
0,8077 (0.0318)
0,1880 (0.0074)
1,0592 (0.0417)
7
0,5029 (0.0198)
1
8
2,1844 (0.0860)
1,7145 (0.0675)
0.0
0.0
Units: Millimeters (inches)
Thickness: 0,102 (0.004) (reference only)
Chip edge to bond pad dimensions are shown to center of bond pad.
Chip size ±0,0508 (0.002)
Bond pad #1 (RF In): 0,127 x 0,207 (0.0050 x 0.0082)
Bond pad #7 (RF Out): 0,246 x 0,119 (0.0097 x 0.0047)
Bond pad #2 (V1):
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #8 (V4):
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #3 (V3):
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #9 (V7):
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #4 (V2):
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad 1#0 (V6): 0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #5 (V5):
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #11 (V8): 0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #6 (V10):
0,120 x 0,120 (0.0047 x 0.0047)
Bond pad #12 (V9): 0,120 x 0,120 (0.0047 x 0.0047)
6
TriQuint Semiconductor, Inc.
•
Texas Facilities
• (972) 995-8465
• www.triquint.com
TGL6425-SCC
Application Notes:
Suggested Driver Cir cuit
OVERVIEW
The following is a suggested driver circuit for the TriQuint TGL6425-SSC 0.5 to 18 - Ghz
step attenuator. The circuit allows the user to use a digital binary input to achieve the desir ed level
of attenuation; with a digital wor d of “00000” equaling0 -dB relative attenuation and “11111”
equaling 15.5- dB relative attenuation. The JFET s (2N5116 or equivalent) provide the r equired level
shift from TTL voltages to attenuation control levels. The 2 - input NOR gates should be CMOS
(74C02 or equivalent) with 0 V applied to the positive supply terminal and -5 V on the negative
supply terminal.
DRIVER CIRCUIT
SCHEMATIC
TriQuint Semiconductor, Inc.
~ 5kOhms
•
Texas Facilities
• (972) 995-8465
• www.triquint.com
7