1.0x0.5mm SMD CHIP LED LAMP APHS1005SYCK SUPER BRIGHT YELLOW Features Description !1.0mmx0.5mm SMT LED, 0.5mm THICKNESS. The Super Bright Yellow source color devices are !LOW POWER CONSUMPTION. made with DH InGaAlP on GaAs substrate Light Emitting !WIDE VIEWING ANGLE. Diode. !IDEAL FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3. Lead spacing is measured where the lead emerge package. 4. Specifications are subject to change without notice. SPEC NO: CDA0313 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/24/2001 DRAWN: Y.F.XU PAGE: 1 OF 4 Selection Guide Par t No . Dic e APHS1005SYCK Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT YELLOW ( InGaAlP ) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 30 60 120° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er D ev i c e λpeak Peak Wavelength Super Bright Yellow λD Dominate Wavelength ∆λ1/2 Ty p . Max . Un it s Tes t Co n d it io n s 590 nm IF=20mA Super Bright Yellow 590 nm IF=20mA Spectral Line Halfwidth Super Bright Yellow 20 nm IF=20mA C Capacitance Super Bright Yellow 20 pF VF=0V;f=1MHz VF Forward Voltage Super Bright Yellow 2.0 2.5 V IF=20mA IR Reverse Current Super Bright Yellow 10 uA V R = 5V Absolute Maximum Ratings at T)=25°°C P ar am e t e r Su p er B r ig h t Yello w Un it s Power dissipation 125 mW DC Forward Current 30 mA Peak Forward Current [1] 175 mA Reverse Voltage 5 V Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: CDA0313 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/24/2001 DRAWN: Y.F.XU PAGE: 2 OF 4 Super Bright Yellow APHS1005SYCK SPEC NO: CDA0313 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/24/2001 DRAWN: Y.F.XU PAGE: 3 OF 4 APHS1005SYCK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: CDA0313 APPROVED : J. Lu REV NO: V.1 CHECKED : DATE: OCT/24/2001 DRAWN: Y.F.XU PAGE: 4 OF 4