KINGBRIGHT KP

1.6x0.8mm SMD CHIP LED LAMP
KP-1608SEC
SUPER BRIGHT ORANGE
Features
Description
!1.6mmx0.8mm SMT LED, 1.1mm THICKNESS.
The Super Bright Orange source color devices
!LOW
are made with DH InGaAlP on GaAs substrate
POWER CONSUMPTION.
!WIDE VIEWING ANGLE.
Light Emitting Diode.
!IDEAL FOR BACKLIGHT AND INDICATOR.
! VARIOUS
!PACKAGE
COLORS AND LENS TYPES AVAILABLE.
: 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.1(0.004") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
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SPEC NO: KDA0021
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 1 OF 4
Selection Guide
Par t No .
Di c e
KP-1608SEC
Iv (mc d )
@ 20 mA
L en s Ty p e
SUPER BRIGHT ORANGE( InGaAlP )
View in g
An g l e
Min .
Ty p .
2θ1/2
80
200
120°
WATER CLEAR
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Electrical / Optical Characteristics at T)=25°°C
Sy m b o l
Par ameter
Dev ic e
Ty p .
λpeak
Peak Wavelength
Super Bright Orange
λD
Dominate Wavelength
∆λ1/2
Max .
Un i t s
Tes t Co n d itio n s
610
nm
IF=20mA
Super Bright Orange
601
nm
IF=20mA
Spectral Line Halfwidth
Super Bright Orange
29
nm
IF=20mA
C
Capacitance
Super Bright Orange
30
pF
VF=0V;f=1MHz
VF
Forward Voltage
Super Bright Orange
2.0
2.5
V
IF=20mA
IR
Reverse Current
Super Bright Orange
10
uA
VR = 5V
Absolute Maximum Ratings at T)=25°°C
Par ameter
Su p er B r ig h t Or an g e
Un i t s
Power dissipation
75
mW
DC Forward Current
30
mA
Peak Forward Current [1]
195
mA
Reverse Voltage
5
V
Operating Temperature
-40°C To +85°C
Storage Temperature
-40°C To +85°C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: KDA0021
APPROVED: J. LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 2 OF 4
Super Bright Orange KP-1608SEC
SPEC NO: KDA0021
APPROVED: J.LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 3 OF 4
KP-1608SEC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
SPEC NO: KDA0021
APPROVED: J. LU
REV NO: V.1
CHECKED:
DATE: FEB/23/2002
DRAWN: J.X.FU
PAGE: 4 OF 4