HTSEMI SI2300

SI2300
20V N-Channel Enhancement Mode MOSFET
VDS= 20V
RDS(ON), Vgs@ 4.5V, Ids@ 3.0A
RDS(ON), Vgs@ 2.5V, Ids@ 2.0A
70m Ω
80m Ω
Features
Advanced trench process technology
High Density Cell Design For Ultra Low On-Resistance
High Power and Current handing capability
Ideal for Li ion battery pack applications
Package Dimensions
D
G
S
SOT-23(PACKAGE)
A
B
C
D
E
Millimeter
Min.
Max.
2.70
3.10
2.40
2.80
1.40
1.60
0.35
0.50
0
0.10
F
0.45
REF.
G
H
K
J
L
Millimeter
Min.
Max.
1.90 REF.
1.00
1.30
0.10
0.20
0.40
0.85
1.15
M
0°
REF.
0.55
10°
Maximum Ratings and Thermal Characteristics (TA = 25oC unless otherwise noted)
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
± 12
ID
2.3
IDM
8
Continuous Drain Current
Pulsed Drain Current
1)
o
TA = 25 C
Maximum Power Dissipation
o
TA = 75 C
PD
TJ, Tstg
Operating Junction and Storage Temperature Range
Junction-to-Ambient Thermal Resistance (PCB mounted)
2)
RθJA
Unit
V
A
1.25
W
0.8
o
-55 to 150
78
o
C
C/W
Notes
1) Pulse width limited by maximum junction temperature.
2) Surface Mounted on FR4 Board, t v 5 sec.
1
JinYu
semiconductor
www.htsemi.com
Date:2011/05
SI2300
20V N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TA = 25oC unless otherwise noted)
Parameter
Static
Test Condition
Symbol
Min.
Typ.
Miax.
Unit
3)
Drain-Source Breakdown Voltage
BVDSS VGS = 0V, ID = 250uA
Drain-Source On-State Resistance
RDS(on) VGS = 2.5V, ID = 2.0A
70.0
80.0
Drain-Source On-State Resistance
RDS(on) VGS = 4.5V, ID = 3.0A
60.0
70.0
Gate Threshold Voltage
VGS(th) VDS =VGS, ID = 250uA
Zero Gate Voltage Drain Current 0
IDSS
VDS = 20V, VGS = 0V
Gate Body Leakage
IGSS
VGS = ± 12V, VDS = 0V
gfs
VDS = 5V, ID = 4..2A
Forward Transconductance
20
0.6
V
mΩ
0.76
V
1
uA
±100
nA
S
5
4)
Dynamic
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-On Delay Time
td(on)
Turn-On Rise Time
tr
Turn-Off Delay Time
td(off)
Turn-Off Fall Time
tf
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
VDS = 10V, ID = 3.6A
VGS = 4.5V
5.4
10
nC
0.65
.
1.5
12
25
VDD = 10V, RG = 6Ω
36
60
ID = 1A,
34
60
10
25
VGS = 4.5V
RL = 5.5 Ω
VDS = 10V, VGS = 0V
f = 1.0 MHz
ns
340
pF
115
33
Source-Drain Diode
Max. Diode Forward Current
Diode Forward Voltage
IS
VSD
IS = 1.6A, VGS = 0V
1.6
A
1.2
V
Notes
3) Short duration test pulse used to minimize self-heating effect.
4) Pulse test pulse width <=300us,duty cycle <= 2%.
2
JinYu
semiconductor
www.htsemi.com
Date:2011/05
SI2300
20V N-Channel Enhancement Mode MOSFET
Output Characteristics
10
Transfer Characteristics
10
VGS = 5 thru 2.5 V
8
2V
I D – Drain Current (A)
I D – Drain Current (A)
8
6
4
2
TC = 125C
4
2
1.5 V
0, 0.5, 1 V
6
25C
–55C
0
0
0
1
2
3
4
5
0
0.5
VDS – Drain-to-Source Voltage (V)
1.0
2.0
2.5
VGS – Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
0.15
1000
0.12
800
C – Capacitance (pF)
r DS(on)– On-Resistance ( )
1.5
VGS = 2.5 V
0.09
VGS = 4.5 V
0.06
0.03
600
Ciss
400
Coss
200
Crss
0
0
0
2
4
6
8
10
0
ID – Drain Current (A)
1.8
1.6
4
r DS(on)– On-Resistance ( )
(Normalized)
V GS – Gate-to-Source Voltage (V)
VDS = 10 V
ID = 3.6 A
3
2
1
0
0
1
2
3
4
5
8
12
16
6
7
Qg – Total Gate Charge (nC)
On-Resistance vs. Junction Temperature
VGS = 4.5 V
ID = 3.6 A
1.4
1.2
1.0
0.8
0.6
–50
0
50
100
TJ – Junction Temperature (C)
-3-
3
JinYu
semiconductor
20
VDS – Drain-to-Source Voltage (V)
Gate Charge
5
4
www.htsemi.com
Date:2011/05
150
SI2300
20V N-Channel Enhancement Mode MOSFET
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.20
r DS(on)– On-Resistance ( W )
I S – Source Current (A)
10
TJ = 150C
TJ = 25C
0.16
0.12
ID = 3.6 A
0.08
0.04
1
0
0.2
0.4
0.6
0.8
1.0
0
1.2
2
VSD – Source-to-Drain Voltage (V)
Threshold Voltage
0.1
12
10
ID = 250 mA
–0.1
8
TC = 25C
Single Pulse
6
–0.2
4
–0.3
2
–0.4
–50
0
0
50
100
150
0.01
0.10
TJ – Temperature (C)
1.00
10.00
Time (sec)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
1
Duty Cycle = 0.5
Normalized Effective Transient
Thermal Impedance
8
Single Pulse Power
14
Power (W)
V GS(th) Variance (V)
6
VGS – Gate-to-Source Voltage (V)
0.2
–0.0
4
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10–4
10–3
10–2
10–1
1
10
30
Square Wave Pulse Duration (sec)
-44
JinYu
semiconductor
www.htsemi.com
Date:2011/05