TI TPA2025D1

User's Guide
SLOU310 – September 2011
TPA2025D1 Audio Power Amplifier Evaluation Module
This document describes the operation of the TPA2025D1 evaluation module that users may use to
evaluate the TPA2025D1 Audio Power Amplifier. Included are the TPA2025D1EVM schematic, board art,
and bill of materials.
1
2
3
Contents
Introduction ..................................................................................................................
1.1
Description ..........................................................................................................
1.2
TPA2025D1 Specifications .......................................................................................
Operation .....................................................................................................................
2.1
Quick-Start List for Stand-Alone Operation .....................................................................
2.2
Boost Settings ......................................................................................................
2.3
Power Up ............................................................................................................
Reference ....................................................................................................................
3.1
TPA2025D1EVM Schematic ......................................................................................
3.2
TPA2025D1EVM PCB Layers ....................................................................................
3.3
TPA2025D1EVM Bill of Materials ................................................................................
1
1
2
2
2
3
4
5
5
6
9
List of Figures
1
TPA2025D1EVM Schematic............................................................................................... 5
2
EVM Assembly Layer....................................................................................................... 6
3
EVM Top Layer .............................................................................................................. 6
4
EVM Layer 2 ................................................................................................................. 7
5
EVM Layer 3 ................................................................................................................. 7
6
EVM Bottom Layer .......................................................................................................... 8
List of Tables
1
1
TPA2025D1EVM Bill of Materials ......................................................................................... 9
Introduction
This section provides an overview of the Texas Instruments (TI) TPA2025D1 audio power amplifier
evaluation module (EVM). It includes a brief description of the module and a list of specifications.
1.1
Description
The TPA2025D1 is a high-efficiency, class-D, audio power amplifier and an integrated boost converter. It
drives up to 2 W into a 4-Ω speaker from low supply voltages.
The TPA2025D1 audio power amplifier EVM is a complete, stand-alone audio amplifier. It contains the
TPA2025D1 WCSP (YZG) Class-D audio power amplifier with an integrated boost converter. All
components and the EVM are Pb-Free.
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Operation
1.2
2
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TPA2025D1 Specifications
VBAT
Supply voltage range
2.5 V to 5.2 V
IDD
Supply current
3 A Maximum
PO
Continuous output power per channel, 4 Ω, VBAT = 3.6 V
2W
VI
Audio input voltage
0 V to VBAT
RL
Minimum load impedance
4Ω
Operation
This section describes how to operate the TPA2025D1EVM.
2.1
Quick-Start List for Stand-Alone Operation
Use the following steps when operating the TPA2025D1EVM as a stand-alone or when connecting the
EVM into existing circuits or equipment.
2.1.1
Power and Ground
1. Ensure the external power sources are set to OFF.
2. Set the power supply voltage between 2.3 V and 5.2 V. When connecting the power supply to the
EVM, attach the power supply ground connection to the GND connector first, and then connect the
positive supply to the VDD connector. Verify that correct connections are made to the banana jacks.
2.1.2
Audio
1. Ensure that the audio source is set to the minimum level.
2. Connect the audio source to the input RCA jack IN. In case of differential audio input, ensure that the
jumper, JP SE, is not inserted. In case of a single-ended audio input, ensure that the jumper, JP SE, is
inserted, thereby grounding IN+ through the input capacitor C2.
3. Connect a speaker (4 Ω to 32 Ω) to the output banana jacks, OUT+ and OUT–.
4. FLT Out+ and FLT OUT- test points allow the user to connect the outputs of the amplfier through an
RC filter for audio measurements. (Many audio analyzers will not give the correct readings on a
Class-D amplifier without additional filtering.) Note that the user must provide the necessary resistors,
R7 and R8 to complete the filters. The typical value for R7 and R8 is 1.0 kΩ.
5. The filtered output of the TPA2025D1 can be measured between test points FILT OUT– and FILT
OUT+
2.1.3
AGC Control
The TPA2025D1 has three selectable inflection point settings: 3.25 V, 3.55 V, and 3.75 V.
1. Remove the jumper, AGC, to select the 3.25-V inflection point (AGC1).
2. Install the jumper, AGC, between pins 2 and 3 to select the 3.55-V inflection point (AGC2).
3. Install the jumper, AGC, between pins 1 and 2 to select the 3.75-V inflection point (AGC3).
2.1.4
Amplifier Gain
The TPA2025D1 has a fixed setting of 20 dB.
2.1.5
Shutdown Controls
1. The TPA2025D1 provides shutdown control for the Class-D amplifier and the boost converter. The EN
pin enables the boost converter and Class-D amplifier. It is active high.
2. Press and hold pushbutton S1 to place the boost converter and the Class-D amplifier in shutdown.
Release pushbutton S1 to activate the Class-D amplifier and boost converter. The boost converter only
turns on if an audio signal (> 2 VPEAK) is present at one of the outputs (OUT+ or OUT-).
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NOTE: The TPA2025D1 has an auto pass-through mode. Under normal operation (EN = HIGH), the
boost converter automatically turns off if no audio signal is present at one of the inputs (IN+
or IN-).
2.2
Boost Settings
The default voltage for the boost converter is 5.9 V (unloaded) and cannot be changed. If no audio signal
is present, the boost converter is automatically disabled. Once the audio signal is present at IN+ and IN-,
the boost converter enables automatically, when the output signal exceeds 2 VPEAK.
2.2.1
Boost Terms
The following is a list of terms and definitions:
CMIN
L
fboost
IPVDD
IPVDD
IL
PVDD (PVOUT)
VBAT (VDD)
ΔIL
ΔV
2.2.2
Minimum boost capacitance required for a given ripple voltage on PVOUT (PVDD)
Boost inductor
Switching frequency of the boost converter
Current pulled by the class-D amplifier from the boost converter
Current pulled by the class-D amplifier from the boost converter
Current through the boost inductor.
Supply voltage for the class-D amplifier (Voltage generated by the boost converter
output)
Supply voltage to the TPA2025D1 (Supply voltage to the EVM).
Ripple current through the inductor.
Ripple voltage on PVOUT (PVDD) due to capacitance
Changing the Boost Inductor
Working inductance decreases as inductor current increases. If the drop in working inductance is severe
enough, it may cause the boost converter to become unstable, or cause the TPA2025D1 to reach its
current limit at a lower output power than expected. Inductor vendors specify currents at which inductor
values decrease by a specific percentage. This can vary by 10% to 35%. Inductance is also affected by dc
current and temperature.
Inductor current rating is determined by the requirements of the load. The inductance is determined by two
factors: the minimum value required for stability and the maximum ripple current permitted in the
application.
Use Equation 1 to determine the required current rating. Equation 1 shows the approximate relationship
between the average inductor current, IL, to the load current, load voltage, and input voltage (IPVDD,
PVOUT, and VBAT, respectively.) Insert IPVDD, PVDD, and VBAT into Equation 1 to solve for IL. The
inductor must maintain at least 90% of its initial inductance value at this current.
PVDD
æ
ö
IL = IPVDD ´ ç
÷
è VBAT ´ 0.8 ø
(1)
The minimum working inductance is 1.3 μH. A lower value may cause instability.
Ripple current, ΔIL, is peak-to-peak variation in inductor current. Smaller ripple current reduces core losses
in the inductor as well as the potential for EMI. Use Equation 2 to determine the value of the inductor, L.
Equation 2 shows the relationships among inductance L, VBAT, PVDD, the switching frequency, fboost, and
ΔIL. Insert the maximum acceptable ripple current into Equation 2 to solve for L.
VBAT ´ (PVDD - VBAT)
L=
ΔIL ´ fBOOST ´ PVDD
(2)
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ΔIL is inversely proportional to L. Minimize ΔIL as much as is necessary for a specific application. Increase
the inductance to reduce the ripple current. Note that making the inductance too large prevents the boost
converter from responding to fast load changes properly. Typical inductor values for the TPA2025D1 are
2.2 μH to 4.7 μH.
Select an inductor with a small dc resistance, DCR. DCR reduces the output power due to the voltage
drop across the inductor.
2.2.3
Changing the Boost Capacitor
The value of the boost capacitor is determined by the minimum value of working capacitance required for
stability and the maximum voltage ripple allowed on PVOUT in the application. The minimum value of
working capacitance is 4.7 μF. Do not use any component with a working capacitance less than 4.7 μF.
Working capacitance is defined as the rated capacitance reduced by the DC Bias factor, temperature, and
aging parameters of the capacitor being used. It may be necessary to request these parameters from the
capacitor manufacturer. For best performance, only consider ceramic capacitors with X5R or X7R
dielectric.
For X5R or X7R ceramic capacitors, Equation 3 shows the relationships among the boost capacitance, C,
to load current, load voltage, ripple voltage, input voltage, and switching frequency (IPVOUT, PVOUT, ΔV,
VDD, fboost respectively). Insert the maximum allowed ripple voltage into Equation 3 to solve for C. A factor
of about 1.5 is included to account for capacitance loss due to dc voltage and temperature.
I
´ (PVDD - VBAT)
C = 1.5 ´ PVDD
D V ´ fBOOST ´ PVDD
(3)
For aluminum or tantalum capacitors, Equation 4 shows the relationships among the boost capacitance,
C, to load current, load voltage, ripple voltage, input voltage, and switching frequency (IPVOUT, PVOUT, ΔV,
VDD, fboost respectively). Insert the maximum allowed ripple voltage into Equation 4 to solve for C. Solve
this equation assuming ESR is zero.
I
´ (PVDD - VBAT)
C = PVDD
D V ´ fBOOST ´ PVDD
(4)
Capacitance of aluminum and tantalum capacitors is normally insensitive to applied voltage, so no factor
of 1.5 is included in Equation 4. However, the ESR in aluminum and tantalum capacitors can be
significant. Choose an aluminum or tantalum capacitor with an ESR around 30 mΩ. For best performance
with tantalum capacitors, use at least a 10-V rating. Note that tantalum capacitors must generally be used
at voltages of half their ratings or less.
2.3
Power Up
1. Verify that the correct connections are as described in Section 2.1.
2. Verify that the voltage setting of the power supply is between 2.5 V and 5.2 V, and turn on the power
supply. Proper operation of the EVM begins.
3. Adjust the audio signal source as needed.
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3
Reference
This section includes the EVM schematic, board layout reference, and parts list.
3.1
TPA2025D1EVM Schematic
Vdd
GND
1
Vdd
1
L1
2
1
C11
10ufd/10V
2
C3
2
GND
1
1
2.2uH
C4
1
0.1ufd/16V
2
DNP
C5
C1
GND
2
1
GND
1.0ufd/10V
C9
4700pfd/50V
2
D1
DNP
C2
22
OUT+
U1
TPA2025D1YZG
C6
GND
AGND
D2
EN
A3
C2
2
B2
B2 AGC
33
1
MPZ2012S101A
100ohms/4A
B1
OUT-
C8
2
1000pfd/50V
R101
1
MPZ2012S101A
2 1
TVS1
TVS2
DNP
DNP
FLT OUT1
GND
Vdd
R8
2
GND
C10
GND
2
2
100K
1
GND
1
DNP
R5
OUT-
0.0
100ohms/4A
GND
1
OUT+
0.0
C7
1000pfd/50V
GND
FB2
TP2 GND
GND
R100 2 1
DNP
C1
1
2
11
AGC
IN+
1
2
1
2
C3
FB1
GND
1
JP SE
2
PVDD A1
D3
D3
SW A2
VBAT B3
6.8V
2
1.0ufd/10V
1
GND
2
GND
GND
1
R7
DNP
1.00K
1
1
GND
2
1
0.1ufd/16V
2
BGND
IN
R4
PGND
3
1
D1
2
FLT OUT+
TP1 GND
2
22ufd/10V
C12
1
1
1
VDD
2
4700pfd/50V
GND
S1
STANDOFF HARDWARE
0.5in
0.5in
0.5in
0.5in
GND GND GND GND
0.5in
0.5in 0.5in 0.5in
Figure 1. TPA2025D1EVM Schematic
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Reference
3.2
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TPA2025D1EVM PCB Layers
Figure 2. EVM Assembly Layer
Spacer
B
D
Figure 3. EVM Top Layer
6
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Figure 4. EVM Layer 2
Spacer
Figure 5. EVM Layer 3
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B
D
Figure 6. EVM Bottom Layer
8
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3.3
TPA2025D1EVM Bill of Materials
Table 1. TPA2025D1EVM Bill of Materials
ITEM
MANU PARTNUM
QTY
REF
DESIGNATORS
VENDOR PARTNUM DESCRIPTION
VENDOR
MANUFACTURER
1
TPA2025D1YZG
1
U1
TPA2025D1YZG
TEXAS
INSTRUMENTS
TEXAS
INSTRUMENTS
MOUSER
ST
MICROELECTRONI
CS
Audio Power Amplifier
SEMICONDUCTORS
2
ESDALC6V1-1BT2
(0) DNP
TVS1,TVS2
ESDALC6V1-1BT2
TRANSIENT VOLTAGE SUPPRESSION
BIDIR 6.1V 9A SOD-882 ROHS
CAPACITORS
3
C1608C0G1H102J
2
C7,C8
445-1293-1
CAP SMD0603 CERM 1000PFD 50V 5%
COG ROHS
DIGI-KEY
TDK CORP.
4
ECJ-1VB1H472K
2
C9,C10
PCC1780CT
CAP SMD0603 CERM 4700PFD 50V 10%
X7R ROHS
DIGI-KEY
PANASONIC
5
GRM21BR71A106KE51L
1
C3
490-3905-1
CAP SMD0805 CERM 10UFD 10V10% X7R
ROHS
DIGI-KEY
MURATA
6
LMK212BJ226MG-T
1
C5
587-1958-1
CAP SMD0805 CERM 22UFD 10V 20% X5R
ROHS
DIGI-KEY
TAIYO YUDEN
7
ECJ-1VB1C104K
2
C11,C12
PCC1762CT
CAP SMD0603 CERM 0.1UFD 16V 10% X7R
ROHS
DIGI-KEY
PANASONIC
8
GRM185R61A105KE36D
2
C1,C2
490-3893-1
CAP SMD0603 CERM 1.0UFD 10V 10% X5R
ROHS
DIGI-KEY
MURATA
RESISTOR SMD0603 100K OHM 5% THICK
FILM 1/10W ROHS
DIGI-KEY
PANASONIC
RESISTORS
R5
P100KGCT
1
R4
311-1.00KHRCT
RESISTOR SMD0603 THICK FILM 1.00K
OHM 1% 1/10W ROHS
DIGI-KEY
YAGEO
2
R100,R101
P0.0GCT
RESISTOR SMD0603 0.0 OHM 5% THICK
FILM 1/10W ROHS
DIGI-KEY
PANASONIC
TOKO JAPAN
TOKO JAPAN
DIGI-KEY
TDK
9
ERJ-3GEYJ104V
1
10
RC0603FR-071KL
11
ERJ-3GEY0R00V
INDUCTORS
12
1239AS-H-2R2N=P2
1
L1
13
MMSZ5235BT1
(0) DNP
D1
14
MPZ2012S101A
2
FB1,FB2
1239AS-H-2R2N=P2
INDUCTOR POWER SMD1008 2.2uH
RDC=80mOHMS 2.3A DFE252012C ROHS
ZENER DIODE,6.8V,SMT SOD-123
445-1567-1
FERRITE BEAD, 100 Ohms 4A 100MHz
SM0805 ROHS
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Table 1. TPA2025D1EVM Bill of Materials (continued)
ITEM
MANU PARTNUM
QTY
REF
DESIGNATORS
VENDOR PARTNUM DESCRIPTION
15
26630301RP2
1
AGC
2663S-03
16
26630201RP2
1
JP SE
2663S-02
17
PJRAN1X1U01X
1
IN
VENDOR
MANUFACTURER
HEADER 3 PIN, PCB 2.0MM ROHS
DIGI-KEY
NORCOMP
HEADER 2 PIN, PCB 2.0MM ROHS
DIGI-KEY
NORCOMP
65K7770
JACK, RCA 3-PIN PCB-RA BLACK ROHS
NEWARK
SWITCHCRAFT
SP2-001E
SHUNT, BLACK AU FLASH 2 MM ROHS
DIGI-KEY
NORCOMP
HEADERS, JACKS, AND SHUNTS
18
810-002-SP2L001
2
JP SE, AGC
(1)
TESTPOINTS AND SWITCHES
19
5002
1
FLT OUT-
5002K
PC TESTPOINT, WHITE, ROHS
DIGI-KEY
KEYSTONE
ELECTRONICS
20
5001
2
TP1 GND,TP2 GND
5001K
PC TESTPOINT, BLACK, ROHS
DIGI-KEY
KEYSTONE
ELECTRONICS
21
5000
1
FLT OUT+
5000K
PC TESTPOINT, RED, ROHS
DIGI-KEY
KEYSTONE
ELECTRONICS
22
TL1015AF160QG
1
S1
EG4344CT
SWITCH, MOM, 160G SMT 4X3MM ROHS
DIGI-KEY
E-SWITCH
23
2027
4
SO1,SO2,SO3,SO4
2027K
STANDOFF,4-40,0.5INx3/16IN,ALUM RND
F-F
DIGI-KEY
KEYSTONE
ELECTRONICS
24
111-2223-001
4
GND, VDD, OUT+,
OUT-
J587
BINDING-POST,NONINS,THRU,ROHS
DIGI-KEY
EMERSON NPCS
25
R0603_DNP
2
R7, R8
26
C0603_DNP
2
C4, C6
STANDOFFS AND HARDWARE
COMPONENTS NOT ASSEMBLED
(1)
10
Place Shunts Only On Pin2 of JP SE and on Pin3 of AGC
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Evaluation Board/Kit Important Notice
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION
PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the
product(s) must have electronics training and observe good engineering practice standards. As such, the goods being provided are
not intended to be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations,
including product safety and environmental measures typically found in end products that incorporate such semiconductor
components or circuit boards. This evaluation board/kit does not fall within the scope of the European Union directives regarding
electromagnetic compatibility, restricted substances (RoHS), recycling (WEEE), FCC, CE or UL, and therefore may not meet the
technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30
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TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
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Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the
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FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION
PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and
can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15
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will be required to take whatever measures may be required to correct this interference.
EVM Warnings and Restrictions
It is important to operate this EVM within the input voltage range of –0.3 V to 6 V and the output voltage range of –0.3 V to VDD
+0.3 V .
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are
questions concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the
EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load
specification, please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than 85°C. The EVM is designed to
operate properly with certain components above 85°C as long as the input and output ranges are maintained. These components
include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of
devices can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near
these devices during operation, please be aware that these devices may be very warm to the touch.
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