TPA2100P1 YZH www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008 19-VPP Mono Class-D Audio Amplifier for Piezo/Ceramic Speakers FEATURES 1 • 19 VPP Output Load Voltage From a 2.5 V Supply • Integrated DC-DC Converter Generates 10 V Supply • No External Schottky Diode Required • Integrated Audio Input Low-Pass Filter • Small Boost Converter Inductor • Supply Voltage Range From 2.5 V to 5.5 V • Selectable Gain of 12 dB, 16 dB, and 24 dB • Independent Shutdown Control for the Boost Converter and the Audio Amplifier • Fast Startup Time: 8 ms • Low Supply Current: 5.5 mA • Low Shutdown Current: < 1 µA • Short-Circuit and Thermal Protection • Space Saving Package – 2,1 mm × 2,1 mm NanoFree™ WCSP (YZH) DESCRIPTION APPLICATIONS The TPA2100P1 (TPA2100) has three gain modes of 12 dB, 16 dB, and 24 dB. The TPA2100P1 (TPA2100) provides thermal and short circuit protection on the boost converter and the Class-D audio amplifier. The TPA2100P1 (TPA2100) is available in a 16-ball 2,1 mm × 2,1 mm WCSP package. The TPA2100P1 (TPA2100) requires only one small external inductor for operation. 2 • • • • • The TPA2100P1 (sometimes referred to as TPA2100) is a mono, Class-D audio power amplifier with integrated DC-DC converter designed for piezo and ceramic speakers. The TPA2100P1 (TPA2100) is capable of driving a ceramic / piezo speaker with 19 VPP (6.7 VRMS) from a 2.5 V power supply at less than 1% THD+N. The DC-DC converter operates at a fixed frequency of 1.2 MHz. The TPA2100P1 (TPA2100) DC-DC converter provides a 10 V supply with a minimum number of external components. The DC-DC converter can be used to drive other components that require a 10 V supply voltage (note: audio signal must be present for proper functionality of boost converter). The TPA2100P1 (TPA2100) features an integrated audio low pass filter that rejects high frequency noise (CODEC out-of-band and RF noise) thus improving audio fidelity. Wireless or Cellular Handsets Portable DVD Player Personal Digital Assistants (PDAs) Electronic Dictionaries Digital Still Cameras 4.7 mH 10 nF VIN 2.5 V to 5.5 V 10 mF Vdd SW BST VccOUT VccIN 10 mF Analog Baseband or CODEC C IN OUT+ IN1 mF 5 ~ 10 W IN+ Piezo Speaker 0.1 ~ 2 mF OUT- C IN Digital BaseBand 5 ~ 10 W Vref GAIN 1 mF SD SDa GND GND 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008, Texas Instruments Incorporated TPA2100P1 SLOS595 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DEVICE PINOUT YZH wcsp) package (TOP VIEW) VccIN VccOUT SW GND A1 A2 A3 A4 OUT+ GAIN BST Vdd B1 B2 B3 B4 OUT– Vref SDa GND C1 C2 C3 C4 GND IN– IN+ SD D1 D2 D3 D4 PIN FUNCTIONS PIN Name WCSP I/O/P DESCRIPTION IN+ D3 I Positive Differential Audio Input IN– D2 I Negative Differential Audio Input SDa C3 I Audio Amplifier Shutdown GAIN B2 I Gain Selection (tri-state input) SD D4 I Device Shutdown Vref C2 O Internal Analog Supply (Do not connect to external supply/circuit) OUT+ B1 O Positive Differential Audio Output OUT– C1 O Negative Differential Audio Output BST B3 O Reference Voltage for Boost Converter VDD B4 P Power Supply VCCOUT A2 P DC-DC Converter Output Voltage VCCIN A1 P Audio Amplifier Power Supply SW A3 P Boost and Rectifying Switch Input A4, C4,D1 P Ground GND 2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 TPA2100P1 www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008 ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted) VI VALUE UNIT Supply voltage, VDD –0.3 to 6.0 V Amplifier supply voltage, VccOUT, VccIN –0.3 to 12.0 V –0.3 to VDD + 0.3 V Input voltage, IN-, IN+, SDa, SD, GAIN Output continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range –40 to 150 °C Tstg Storage temperature range –65 to 150 °C 2 kV ESD Protection — HBM (All Pins) (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS (1) (1) PACKAGE TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C 16-ball WCSP (YZH) 1.66 W 13.3 mW/°C 1.06 W 0.86 W Dissipation ratings are for a 2-side, 2-plane board JEDEC high K board. AVAILABLE OPTIONS TA –40°C to 85°C (1) (2) PACKAGED DEVICES (1) 16-ball WCSP, 2,1mm × 2,1 mm (+ 0,01 / –0,09 mm) PART NUMBER (2) TPA2100P1YZHR TPA2100P1YZHT SYMBOL CEH For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. The YZH package is only available taped and reeled. The suffix "R" indicates a reel of 3000; the suffix "T" indicates a reel of 250. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 3 TPA2100P1 SLOS595 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com RECOMMENDED OPERATING CONDITIONS MIN MAX UNIT Supply voltage VDD 2.5 5.5 V Output voltage range VccIN, VccOUT 9.5 10.5 V VIH High-level input voltage SD, SDa 1.3 VIL Low-level input voltage SD, SDa 0.6 V IIH High-level input current SD, SDa, VDD = 2.5 V to 5.5 V 1 µA IIL Low-level input current SD, SDa, VDD = 2.5 V to 5.5 V 1 µA fOSC Oscillator frequency 1.1 1.3 MHz TA Operating free-air temperature –40 85 °C UNIT V ELECTRICAL CHARACTERISTICS TA = 25°C, SD ≥ 1.3 V, GAIN = 12 dB, LOAD = 10 Ω +1 µF + 33 µH (unless otherwise noted) PARAMETER VDD Supply voltage range ISD Shutdown quiescent current IDD Supply current TEST CONDITIONS MIN TYP MAX 2.5 3.6 5.5 V 0.5 1 µA VDD = 3.0 V 6 9 VDD = 3.6 V 5.5 8 VDD = 5.5 V 4 5 SD ≤ 0.35 V, VDD = 2.5 V to 5.5 V mA fSW Class-D switching frequency 250 300 350 kHz fBOOST Boost converter switching frequency 1.1 1.2 1.3 MHz POR Power on reset on threshold 2.2 V POR Power on reset hysteresis 0.2 V CMR Input common mode range VIN = ±100 mV, VDD = 2.5 V 0.5 2.0 VIN = ±100 mV, VDD = 3.6 V 0.5 2.7 VIN = ±100 mV, VDD = 5.5 V 0.5 2.7 VOOS Output offset voltage VDD = 3.6 V, Av = 12 dB, inputs ac grounded ZOUT Output Impedance in shutdown mode SD ≤ 0.35 V AV Gain 4 1.4 5 2 mV kΩ GAIN ≤ 0.35 V 11.3 11.8 12.3 0.7 V ≤ GAIN ≤ 1 V 15.5 16 16.5 GAIN ≥ 1.35 V 23.5 24 24.5 Submit Documentation Feedback V dB Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 TPA2100P1 www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008 OPERATING CHARACTERISTICS TA = 25°C, VDD = 3.6 V, SD = SDa = 1.3 V, Gain = 12 dB, Load = 10 Ω + 1 µF + 22 µH (unless otherwise noted) PARAMETER TEST CONDITIONS MIN VOUTMAX Maximum output voltage swing THD+N = 1%, Vdd = 3.0 V, L = 4.7 µH, fAUD_IN ≤ 10 kHz THD+N Total harmonic distortion plus noise fAUD_IN = 1 kHz; VOUT = 10 to 18 VP-P kSVR Supply ripple rejection ratio 200 mVPP supply ripple at 217 Hz CMRR Input common mode rejection ZIN Input impedance SNR Signal to noise ratio tON Start up time (Class-D and Boost converter) TYP MAX 19 UNIT VPP 0.07% –100 dB RL = 8 Ω, Vicm = 0.5V and Vicm = Vdd – 0.8 V, differential inputs shorted –60 dB Av = 12 dB 23.2 Av = 16 dB 18.5 Av = 24 dB 10 f = 20 to 20 kHz, VOUT = 6 VRMS, Av = 12 dB, A-weighted 94 2.5 V ≤ VDD ≤ 5.5 V, no turn-on pop, CIN ≤ 1 µF kΩ dB 8 ms TYPICAL CHARACTERISTICS TA = 25°C, VDD = 3.6 V, Gain = 12 dB, CIN = 1 µF, LBOOST = 4.7 µH, CBOOST = 10 µF, SD = SDa = 3.6 V, Load = 10 Ω + 1 µF + 22 µH (unless otherwise noted) QUIESCENT SUPPLY CURRENT vs SUPPLY VOLTAGE AVERAGE POWER CONSUMPTION vs AUDIO DRIVER TYPE 0.40 10 Gain = 12 dB SD = SDa = 2 V Average Power Consumption − W IDD − Quiescent Supply Current − mA 9 8 7 6 5 4 3 2 Pop Ringtone Disco 0.30 Classical News − Intro 0.25 News − Interview 0.20 0.15 0.10 0.05 1 0 2.5 0.35 VDD = 3.6 V Load = Piezo Speaker VO = 14 Vpp Max. 0.00 3.0 3.5 4.0 4.5 5.0 VDD − Supply Voltage − V 5.5 Class-ABw. Dynamic Figure 1. Class-AB w. Piezo A Class-D w. Dynamic TPA2100P1 w. Piezo A Figure 2. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 5 TPA2100P1 SLOS595 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) TA = 25°C, VDD = 3.6 V, Gain = 12 dB, CIN = 1 µF, LBOOST = 4.7 µH, CBOOST = 10 µF, SD = SDa = 3.6 V, Load = 10 Ω + 1 µF + 22 µH (unless otherwise noted) TOTAL SUPPLY INPUT POWER vs OUTPUT VOLTAGE TOTAL SUPPLY CURRENT vs OUTPUT VOLTAGE 100 0.25 Frequency = 1 kHz 90 0.20 0.15 IDD − Total Supply Current − mA PSUP - Total Supply Power − W Frequency = 1 kHz VDD = 5.5 V 0.10 VDD = 3.6 V 0.05 80 70 60 VDD = 2.5 V 50 40 30 20 VDD = 3.6 V VDD = 2.5 V 10 VDD = 5.5 V 0.00 0 0 1 2 3 4 5 6 7 0 1 2 VO − Output Voltage − Vrms 5 6 7 VO − Output Voltage − Vrms Figure 4. OUTPUT VOLTAGE DRIVE vs FREQUENCY OUTPUT VOLTAGE DRIVE vs FREQUENCY 10 THD = 10% @ 1 kHz THD = 1% @ 1 kHz 8 7 6 VDD = 5.5 V VDD = 5.5 V 9 VDD = 3.6 V 5 VDD = 2.5 V 4 3 2 VO − Output Voltage Drive − Vrms 9 VO − Output Voltage Drive − Vrms 4 Figure 3. 10 8 7 VDD = 3.6 V 6 5 VDD = 2.5 V 4 3 2 1 1 0 20 100 1k 10k 20k 0 20 100 1k 10k 20k f − Frequency − Hz f − Frequency − Hz Figure 5. 6 3 Figure 6. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 TPA2100P1 www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008 TYPICAL CHARACTERISTICS (continued) TA = 25°C, VDD = 3.6 V, Gain = 12 dB, CIN = 1 µF, LBOOST = 4.7 µH, CBOOST = 10 µF, SD = SDa = 3.6 V, Load = 10 Ω + 1 µF + 22 µH (unless otherwise noted) TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 10 THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % 100 Frequency = 1 kHz 10 VDD = 2.5 V 1 VDD = 5.5 V 0.1 VDD = 3.6 V 0.01 0 1 2 3 4 5 6 7 VDD = 2.5 V VO = 6 Vrms 1 VO = 2 Vrms 0.1 VO = 4 Vrms 0.01 20 8 100 1k VO − Output Voltage − Vrms Figure 7. Figure 8. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 10 VDD = 3.6 V 1 VO = 2 Vrms VO = 4 Vrms 0.1 VO = 6 Vrms 100 1k 10k 20k THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % 10 0.01 20 10k 20k f − Frequency − Hz VDD = 5.5 V 1 VO = 2 Vrms VO = 4 Vrms 0.1 VO = 6 Vrms 0.01 20 100 1k f − Frequency − Hz f − Frequency − Hz Figure 9. Figure 10. 10k 20k Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 7 TPA2100P1 SLOS595 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) TA = 25°C, VDD = 3.6 V, Gain = 12 dB, CIN = 1 µF, LBOOST = 4.7 µH, CBOOST = 10 µF, SD = SDa = 3.6 V, Load = 10 Ω + 1 µF + 22 µH (unless otherwise noted) SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY GAIN AND PHASE vs FREQUENCY 30 50 VRIPPLE = 200 mVpp 40 25 −40 −50 −60 −70 −80 VDD = 3.6 V −90 0 −20 10 Gain = 12 dB Phase @ Gain = 16 dB f − Frequency − Hz Figure 12. STARTUP WAVEFORMS vs TIME TOTAL SUPPLY INPUT POWER AND OUTPUT VOLTAGE vs INPUT VOLTAGE 0.10 12 VDD = 3.6 V 0.09 13 VDD = 3.6 V PSUP - Total Supply Power − W 11 9 V − Voltage − V VCC 7 SD and SDa VO 3 1 −1 10 0.08 Supply Input Power 0.07 8 0.06 0.05 6 Output Voltage 0.04 4 0.03 0.02 2 0.01 −3 0.000 0.005 0.010 0.015 0.020 0.00 0.0 t − Time − ms 0.5 1.0 1.5 2.0 0 2.5 VI − Input Voltage − mVrms Figure 13. 8 −60 10k 20k 1k Figure 11. 5 −40 −50 100 f − Frequency − Hz −30 Phase @ Gain = 12 dB CI = 1 mF VI = 100 mVrms 0 20 10k 20k 10 −10 VDD = 5.5 V 1k Gain = 16 dB 15 −100 100 20 Phase @ Gain = 24 dB 20 5 −110 20 30 Phase −° −30 VO − Output Voltage − mVrms −20 Gain = 24 dB Closed-Loop Response − dB Ksvr − Supply Ripple Rejection Ratio − dB −10 Figure 14. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 TPA2100P1 www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008 APPLICATION INFORMATION The TPA2100P1 consists of a boost converter and a Class-D amplifier. The boost converter takes a low supply voltage, VDD, and increases it to a higher output voltage, VCCOUT. VCCIN is the power supply for the Class-D amplifier. Connect VCCOUT to VCCIN. FULLY DIFFERENTIAL CLASS-D AUDIO POWER AMPLIFIER The TPA2100P1 is a fully differential amplifier. The fully differential amplifier includes a differential amplifier with common-mode feedback. The differential output is equal to the differential input times the gain. The common-mode feedback ensures that the common-mode voltage at the output is biased around VCC/2 (Class-D supply voltage, VCCOUT, divided by 2) regardless of the common-mode voltage at the input. The fully differential TPA2100P1 can still be used with a single-ended input; however, the TPA2100P1 should be used with differential inputs when in a noisy environment, like a wireless handset, to ensure maximum noise rejection. • Input-coupling capacitors are not required: – The TPA2100P1 inputs can be biased anywhere within the common mode input voltage range listed in the Recommended Operating Conditions table. If the inputs are biased outside of that range, then input-coupling capacitors are required. • Mid-supply bypass capacitor, CBYPASS, is not required: – The fully differential amplifier does not require a bypass capacitor. Any shift in the midsupply affects both positive and negative channels equally and cancels at the differential output. • Excellent RF-immunity and supply noise rejection: – GSM handsets save power by turning on and off the RF transmitter at 217 Hz. The transmitted signal is picked-up on input, output, and power supply traces. The fully differential amplifier cancels the signal better than a typical audio amplifier. DRIVING A CERAMIC/PIEZO SPEAKER Applications that require thin cases, such as mobile phones, demand that external components have a small form factor. Dynamic loudspeakers that use a cone and voice coil typically cannot conform to the height requirements. The option for these applications is to use a ceramic/piezoelectric loudspeaker. Ceramic speakers have a capacitive behavior unlike a conventional loudspeaker, which has an inductive behavior. Typical capacitance values for ceramic/piezo speakers are as high as 2 µF. High peak-to-peak voltage drive is required to achieve acceptable sound pressure levels. Ceramic/piezo speakers have low current consumption at frequencies up to 8 kHz. The impedance of the ceramic/piezo speaker decreases with increasing audio frequency, thus requiring higher current as the frequency increases. However, audio signals in this range are higher harmonics of lower fundamentals, so the current demand is still small when compared to dynamic speaker current consumption. Due to these characteristics, ceramic/piezo speakers are efficient in converting electrical audio signals into sound pressure in the mid and high audio bands (starting at 900 Hz). The TPA2100P1 overcomes the challenges of driving a ceramic/piezo speaker. The TPA2100P1 drives the ceramic/piezo speaker with a constant output voltage over the battery life and across the audio frequency range. LOAD CONFIGURATION The TPA2100P1 can be configured in several different ways to drive a ceramic/piezo speaker. The most obvious configuration is to place a resistor on each output of the Class-D amplifier. A more efficient configuration is to replace one resistor with an inductor at one of the outputs. A third way to configure is to place just one resistor between the output and the speaker and connect the other output directly to the speaker. For proper configuration of the load, it is important to observe the following variables: • Speaker capacitance – CSPK • Maximum available current from the Boost converter – IBOOSTMAX • Highest desired audio frequency – fAUDMAX • Maximum voltage allowed across the speaker – VOUTPEAK • Peak Output Current from the Class-D Amplifier – ICLASSDPEAK Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 9 TPA2100P1 SLOS595 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com RESISTOR – SPEAKER – RESISTOR LOAD CONFIGURATION This is the simplest configuration. However, this type of load configuration does not achieve the best efficiency possible. Thus, it is recommended to use the resistor – speaker – inductor load configuration. The following figure shows an example of the resistor – speaker – resistor configuration. 4.7 mH VIN 10 mF 2 .5 V to 5.5 V Vdd SW 10 nF BST VccOUT VccIN 10 mF C IN Analog Baseband or CODEC R IN- OUT + 1 mF 0.1 ~ 2 mF IN+ OUT - C IN Vref GAIN Digital BaseBand 5 ~ 10 W 5 ~ 10 W R 1 mF SD SDa GND GND Figure 15. Application Schematic with Resistor – Speaker – Resistor Load Configuration For the RC load configuration, only two calculations are required. Note that R in Equation 1 is the sum of the two output resistors in Figure 15. The highest desired audio frequency will be limited by the RC low-pass filter configuration of the load: 1 f AUDMAX = 2 ´ p ´ R ´ CSPK (1) Peak Output Current from the Class-D Amplifier should therefore be limited to the maximum audio frequency: V ICLASSDPEAK = OUTPEAK R2 + XC2 (2) Where XC is: XC = 1 2 ´ p ´ fAUDMAX ´ CSPK (3) To calculate the proper boost converter inductor required for this application, see the Inductor Selection section. Note that an input low-pass filter should be added before the audio amplifier in order to limit the audio frequency, fAUDMAX. RESISTOR – SPEAKER – INDUCTOR LOAD CONFIGURATION The second configuration with a resistor – speaker – inductor load is the most efficient configuration and is the preferred solution. Figure 16 shows an example of this configuration. 10 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 TPA2100P1 www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008 4.7 mH VIN 2.5V to 5.5 V 10 mF Vdd SW 10 nF BST VccOUT VccIN 10 mF C IN Analog Baseband or CODEC R IN- OUT+ 1 mF IN+ OUT- C IN Vref GAIN Digital 10 ~ 20 W 0.1 ~ 2 mF 10 ~ 22 mH L 1 mF SD BaseBand SDa GND GND Figure 16. Application Schematic with Resistor – Speaker – Inductor Load Configuration For the resistor – speaker – inductor load configuration, it is desired to make the output load configuration overdamped (Zeta (ζ) > 0.707). Use Equation 4 to calculate ζ: ζ= R ´ CSPK 2 ´ L (4) If ζ is greater than one, then the maximum audio frequency will be limited by the resistor – speaker capacitance low pass filter as shown in Equation 5. f AUDMAX = 1 2 ´ p ´ R ´ CSPK (5) Calculate equivalent load impedance with Equation 6, through Equation 9. 1 XC = 2 × p × f AUDMAX × CSPK (6) XL = 2 ´ p ´ f AUDMAX ´ L Z= 2 (7) 2 R + (XL - XC ) ICLASSDPEAK (8) V = OUTPEAK Z (9) To calculate the proper boost converter inductor required for this application, see the Inductor Selection section. Note that an input low pass filter should be added before the audio amplifier in order to limit the audio frequency, fAUDMAX. RESISTOR – SPEAKER LOAD CONFIGURATION This load configuration is similar to the resistor – speaker – resistor load configuration. Apply the same equations here to calculate the maximum audio frequency and maximum required current from the class-D audio amplifier. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 11 TPA2100P1 SLOS595 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com 4.7 mH VIN 2.5V to 5.5 V 10 mF Vdd SW 10 nF BST VccOUT VccIN 10 mF Analog Baseband or CODEC C IN 10 ~ 20 W IN- OUT+ R 1 mF IN+ OUT- C IN Vref GAIN Digital BaseBand 0.1 ~ 2 mF 1 mF SD SDa GND GND Figure 17. Application Schematic with Resistor – Speaker Load Configuration BOOST CONVERTER There are two main passive components necessary for the functioning of a boost converter. The boost inductor stores current, and the boost capacitor stores charge. When the Class-D amplifier depletes the charge in the boost capacitor, the boost inductor charges it back up with the stored current. The cycle of charge/discharge occurs at a frequency of fboost. The following is a list of terms and definitions used in the boost equations found in this document. C Minimum boost capacitance required for a given ripple voltage on VCC L Boost inductor fBOOST Switching frequency of the boost converter. ICC Current pulled by the Class-D amplifier from the boost converter. IL Average current through the boost inductor. VCC Boost voltage. Generated by the boost converter (VCCOUT). Voltage supply for the Class-D amplifier (VCCIN). VDD Supply voltage to the IC. ΔIL Ripple current through the inductor. ΔV Ripple voltage of VCC due to capacitance. VCC is the voltage on the VccOUT and VccIN pins. INDUCTOR SELECTION SURFACE MOUNT INDUCTORS Working inductance decreases as inductor current increases. If the drop in working inductance is severe enough, it may cause the boost converter to become unstable, or cause the TPA2100P1 to reach its current limit at a lower output voltage than expected. Inductor vendors specify currents at which inductor values decrease by a specific percentage. This can vary by 10% to 35%. Inductance is also affected by dc current and temperature. TPA2100P1 INDUCTOR EQUATIONS Inductor current rating is determined by the requirements of the load. The inductance is determined by two factors: the minimum value required for stability and the maximum ripple current permitted in the application. 12 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 TPA2100P1 www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008 Use Equation 10 to determine the required current rating. Equation 10 shows the approximate relationship between the average inductor current, IL, to the load current, load voltage, and input voltage (ICC, VCC, and VDD, respectively). Insert ICC, VCC, and VDD into Equation 10 to solve for IL. The inductor must maintain at least 90% of its initial inductance value at this current. æ VCC ö IL = ICC ´ ç ÷ 0.8 V ´ è DD ø (10) The minimum working inductance is 3.3µH. A lower value may cause instability. Ripple current, ΔIL, is peak-to-peak variation in inductor current. Smaller ripple current reduces core losses in the inductor as well as the potential for EMI. Use Equation 11 to determine the value of the inductor, L. Equation 11 shows the relationship between inductance L, VDD, VCC, the switching frequency, fBOOST, and ΔIL. Insert the maximum acceptable ripple current into Equation 11 to solve for L. VDD ´ (VCC - VDD ) L= DIL ´ fboost ´ VCC (11) ΔIL is inversely proportional to L. Minimize ΔIL as much as is necessary for a specific application. Increase the inductance to reduce the ripple current. Note that making the inductance value of L greater than 10 µH will prevent the boost converter from responding to fast load changes properly. A typical inductor value for the TPA2100P1 is 4.7 µH. Select an inductor with a dc resistance, DCR, no greater than 0.5 Ω. DCR reduces the amount of power the device receives from the supply due to the voltage drop across the inductor. CAPACITOR SELECTION SURFACE MOUNT CAPACITORS Temperature and applied dc voltage influence the actual capacitance of high-K materials. Table 1 shows the relationship between the different types of high-K materials and their associated tolerances, temperature coefficients, and temperature ranges. Notice that a capacitor made with X5R material can lose up to 15% of its capacitance within its working temperature range. Table 1. Typical Tolerance and Temperature Coefficient of Capacitance by Material MATERIAL COG/NPO X7R X5R Typical tolerance ±5% ±10% ±20% Temperature Coefficient ±30 ppm ±15% ±15% Temperature range, °C –55/125°C –55/125°C –55/85°C High-K material is very sensitive to applied dc voltage. X5R capacitors have can have losses ranging from 15% to 45% of their initial capacitance with only half of their dc rated voltage applied. For example, if 5 Vdc is applied to a 10 V, 1 µF X5R capacitor, the measured capacitance at that point may show between 0.55 µF and 0.85 µF. Y5V capacitors have losses that can reach or exceed 50% to 75% of their rated value. The working capacitance of components made with high-K materials is generally much lower than nominal capacitance. A worst case result with a typical X5R material might be –10% tolerance, –15% temperature effect, and –45% dc voltage effect at 50% of the rated voltage. This particular case would result in a working capacitance of 42% (0.9 × 0.85 × 0.55) of the nominal value. Select high-K ceramic capacitors according to the following rules: 1. Use capacitors made of materials with temperature coefficients of X5R, X7R, or better. 2. Use capacitors with dc voltage ratings of at least twice the application voltage, because high-K capacitor values generally are reduced by DC voltage. 25V capacitors are recommended when boost converter output is 10V. The minimum rating that should be used in this case is 16V, but correct operation should be verified carefully. 3. Choose a capacitance value at least twice the nominal value calculated for the application. Multiply the nominal value by a factor of 2 for safety. If a 10 µF capacitor is required, use 22 µF. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 13 TPA2100P1 SLOS595 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com The preceding rules and recommendations apply to capacitors used in connection with the TPA2100P1. The TPA2100P1 cannot meet its performance specifications if the rules and recommendations are not followed. TPA2100P1 CAPACITOR EQUATIONS The value of the boost capacitor is determined by the minimum value of working capacitance required for stability and the maximum voltage ripple allowed on VCC in the application. The minimum value of working capacitance is 10 µF. Do not use any component with a working capacitance less than 10 µF. For X5R or X7R ceramic capacitors, Equation 12 shows the relationship between the boost capacitance, C, to load current, load voltage, ripple voltage, input voltage, and switching frequency (ICC, VCC, ΔV, VDD, fBOOST respectively). Insert the maximum allowed ripple voltage into Equation 12 to solve for C. A factor of 2 is included to implement the rules and specifications listed earlier. ICC ´ (VCC - VDD ) C=2 ´ DV ´ fboost ´ VCC (12) For aluminum or tantalum capacitors, Equation 13 shows the relationship between he boost capacitance, C, to load current, load voltage, ripple voltage, input voltage, and switching frequency (ICC, VCC, ΔV, VDD, fBOOST respectively). Insert the maximum allowed ripple voltage into Equation 12 to solve for C. Solve this equation assuming ESR is zero. ICC ´ (VCC - VDD ) C= DV ´ fboost ´ VCC (13) Capacitance of aluminum and tantalum capacitors is normally not sensitive to applied voltage so there is no factor of 2 included in Equation 4. However, the ESR in aluminum and tantalum capacitors can be significant. Choosing an aluminum or tantalum capacitor with ESR around 30 mΩ is acceptable. Decoupling Capacitors The TPA2100P1 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling to ensure the efficiency is high and total harmonic distortion (THD) is low. In addition to the 10 µF capacitor at VDD, place a 1 µF low ESR capactior within 1 mm of the VDD pin to reduce higher frequency transients, spikes, or digital hash on the line. For the same reasons place a 1 µF low ESR capactior within 1 mm of the VCCOUT pin in addition to the boost output capacitor. Input Capacitors, CI The TPA2100P1 does not require input coupling capacitors if the design uses a low offset differential source that is biased within the common mode input voltage range. Note that source offset is amplified if no DC blocking capacitors are used. If the input signal is not biased within the recommended common-mode input range, if high pass filtering is needed, or if using a single-ended source, input coupling capacitors are required. The input capacitors and input resistors form a high-pass filter with the corner frequency, ƒC, determined in Equation 14. 1 fC = (2p ´ RI ´ CI ) (14) The value of the input capacitor directly affects the bass (low frequency) performance of the circuit. Piezo speakers cannot usually respond well to low frequencies, so the corner frequency can be set to block low frequencies and reduce speaker distortion in this application. Not using input capacitors can increase output offset. Use Equation 15 to solve for the input coupling capacitance. If the corner frequency is within the audio band, the input capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below. 14 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 TPA2100P1 www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008 CI = 1 (2p ´ RI ´ fC ) (15) BOARD LAYOUT In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 18 and Table 2 shows the appropriate diameters for a WCSP layout. Copper Trace Width Solder Pad Width Solder Mask Opening Solder Mask Thickness Copper Trace Thickness Figure 18. Land Pattern Dimensions Table 2. Land Pattern Dimensions (1) SOLDER PAD DEFINITIONS Nonsolder mask defined (NSMD) (1) (2) (3) (4) (5) (6) (7) COPPER PAD SOLDER MASK (5) OPENING 275 µm (+0.0, –25 µm) 375 µm (+0.0, –25 µm) (2) (3) (4) COPPER THICKNESS STENCIL (6) (7) OPENING STENCIL THICKNESS 1 oz max (32 µm) 275 µm × 275 µm Sq. (rounded corners) 125 µm thick Circuit traces from NSMD defined PWB lands should be 75 µm to 100 µm wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and impact reliability. Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application Recommend solder paste is Type 3 or Type 4. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0,5 mm to avoid a reduction in thermal fatigue performance. Solder mask thickness should be less than 20 µm on top of the copper circuit pattern Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in inferior solder paste volume control. Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to solder wetting forces. Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 15 TPA2100P1 SLOS595 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com Component Location Place all the external components as close as possible to the TPA2100P1. Placing the decoupling capacitor as close as possible to the TPA2100P1 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency. Trace Width Recommended trace width at the solder balls is 75 µm to 100 µm to prevent solder wicking onto wider PCB traces. For high current pins (SW, VccOUT, VccIN, GND, and audio output pins) of the TPA2100P1, use 100 µm trace widths at the solder balls and at least 500 µm PCB traces to ensure proper performance and output power for the device. For the remaining signals of the TPA2100P1, use 75 µm to 100 µm trace widths at the solder balls. The audio input pins (IN- and IN+) must run side-by-side to maximize common-mode noise cancellation. EFFICIENCY AND THERMAL INFORMATION The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor for the packages are shown in the dissipation rating table. Converting this to θJA for the WCSP package: θJA = 1 1 = = 75o C/W Derating Factor 0.0133 (16) Given θJA of 75°C/W, the maximum allowable junction temperature of 150°C, and the maximum estimated internal dissipation of 1 W (driving 1 µF speaker with 6 Vrms 15 kHz sine wave, the maximum ambient temperature is calculated with Equation 17. TA Max = TJMax - θJA PDmax = 150 - 75(1) = 75o C (17) Equation 17 shows that the calculated maximum ambient temperature is 75°C at maximum power dissipation. The TPA2100P1 is designed with thermal protection that turns the device off when the junction temperature surpasses 150°C to prevent damage to the IC. Using the resistor- speaker - resistor or the resistor - speaker load configurations dramatically increases the temperature of the TPA2100P1 since those configurations require a much higher output current. OPERATION WITH DACs AND CODECs When using Class-D amplifiers with CODECs and DACs, sometimes there is an increase in the output noise floor from the audio amplifier. This occurs when the output frequencies of the CODEC/DAC mix with the switching frequencies of the audio amplifier input stage. The TPA2100P1 has a built-in low-pass filter to reduce CODEC/DAC out-of-band noise that could mix with the switching frequency of the Class-D amplifier. FILTER FREE OPERATION A ferrite bead filter is not required for operation with the resistor – speaker – resistor load configuration or with the resistor – speaker – inductor load configuration. In order to achieve low radiated emissions, the resistor and/or inductor should be placed within 1 cm of the output of the amplifier and followed with a 100 pF to 1000 pF capacitor to GND. Figure 19 and Figure 20 show typical load configurations to reduce radiated emissions. 16 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 TPA2100P1 www.ti.com ........................................................................................................................................................................................... SLOS595 – DECEMBER 2008 OUT+ 5 ~ 10 W 330 pF Piezo Speaker 0.1 ~ 2 mF 22 mH OUT330 pF Figure 19. Typical Radiated Emissions Suppression Circuit (Resistor-Speaker-Inductor Load) OUT+ 5 ~ 10 W 330 pF Piezo Speaker 0.1 ~ 2 mF 5 ~ 10 W OUT330 pF Figure 20. Typical Radiated Emissions Suppression Circuit (Resistor-Speaker-Resistor Load) Figure 21 shows the EMC performance of Figure 19 using a 1 µF load to simulate the speaker. Table 3 list the measurement conditions. The worst-case quasi-peak margin is 14.4 dB at 55.9 MHz. 70 Limit Level - dBuV/m 60 50 40 30 20 10 0 30M 230M 430M 630M f - Fr equency - Hz 830M Figure 21. Measured Radiated Emissions – Vertical Front Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 17 TPA2100P1 SLOS595 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com Table 3. Measurement Conditions for Radiated Emissions of Figure 21 PARAMETER VALUE UNIT VDD Supply Voltage 3.6 V AV Gain 12 dB fAUD Input signal frequency 1 kHz VI Input signal amplitude 1.3 VRMS VO Output signal amplitude 5.3 VRMS CL Load capacitance Cable length Antenna position 1 µF 25.4 mm Vertical Front – For a full Radiated Emissions report, please contact your local TI representative. For operation with a resistor – speaker load configuration the ferrite bead filter can often be used if the design is failing radiated emissions without an LC filter and the frequency sensitive circuit is greater than 1 MHz. This filter functions well for circuits that just have to pass FCC and CE because FCC and CE only test radiated emissions greater than 30 MHz. When choosing a ferrite bead, choose one with high impedance at high frequencies, and very low impedance at low frequencies. In addition, select a ferrite bead with adequate current rating to prevent distortion of the output signal. Figure 22 shows a typical ferrite bead output filter. Ferrite Chip Bead OUT+ 10 ~ 20 W 1 nF Ferrite Chip Bead Piezo Speaker 0.1 ~ 2 mF OUT1 nF Figure 22. Typical Ferrite Bead Filter (Chip bead example: TDK: MPZ1608Y101B) 18 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): TPA2100P1 PACKAGE OPTION ADDENDUM www.ti.com 19-Dec-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPA2100P1YZHR ACTIVE DSBGA YZH 16 3000 Green (RoHS & no Sb/Br) SnAgCu Level-1-260C-UNLIM TPA2100P1YZHT ACTIVE DSBGA YZH 16 250 SnAgCu Level-1-260C-UNLIM Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 17-Dec-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) TPA2100P1YZHR DSBGA YZH 16 3000 180.0 TPA2100P1YZHT DSBGA YZH 16 250 180.0 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 8.4 2.32 2.37 0.81 4.0 8.0 Q1 8.4 2.32 2.37 0.81 4.0 8.0 Q1 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 17-Dec-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA2100P1YZHR DSBGA YZH 16 3000 220.0 220.0 34.0 TPA2100P1YZHT DSBGA YZH 16 250 220.0 220.0 34.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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