SEMIKRON SEMIX404GB12E4S_10

SEMiX404GB12E4s
Absolute Maximum Ratings
Symbol
Conditions
Values
Unit
IGBT
VCES
IC
Tj = 175 °C
1200
V
Tc = 25 °C
618
A
Tc = 80 °C
475
A
400
A
ICnom
ICRM
SEMiX® 4s
Trench IGBT Modules
ICRM = 3xICnom
1200
A
-20 ... 20
V
10
µs
-40 ... 175
°C
Tc = 25 °C
440
A
Tc = 80 °C
329
A
400
A
VGES
tpsc
VCC = 800 V
VGE ≤ 20 V
VCES ≤ 1200 V
Tj = 150 °C
Tj
Inverse diode
IF
SEMiX404GB12E4s
Tj = 175 °C
IFnom
Features
• Homogeneous Si
• Trench = Trenchgate technology
• VCE(sat) with positive temperature
coefficient
• High short circuit capability
• UL recognized, file no. E63532
IFRM
IFRM = 3xIFnom
1200
A
IFSM
tp = 10 ms, sin 180°, Tj = 25 °C
1980
A
-40 ... 175
°C
Tj
Module
It(RMS)
Tstg
Visol
AC sinus 50Hz, t = 1 min
600
A
-40 ... 125
°C
4000
V
Typical Applications*
• AC inverter drives
• UPS
• Electronic Welding
Characteristics
Symbol
Conditions
min.
typ.
max.
Unit
Tj = 25 °C
1.8
2.05
V
Tj = 150 °C
2.2
2.4
V
VCE0
Tj = 25 °C
0.8
0.9
V
Tj = 150 °C
0.7
0.8
V
rCE
Tj = 25 °C
2.5
2.9
mΩ
3.8
4.0
mΩ
5.8
6.5
V
0.12
0.36
mA
IGBT
Remarks
• Case temperature limited to TC=125°C
max.
• Product reliability results are valid for
Tj=150°C
• For short circuit: Soft RGoff
recommended RGoff > 25
• Dynamic values apply to the
following combination of resistors:
RGon,main = 1,0 Ω
RGoff,main = 1,0 Ω
RG,X = 2,2 Ω
RE,X = 0,5 Ω
VCE(sat)
IC = 400 A
VGE = 15 V
chiplevel
VGE = 15 V
Tj = 150 °C
VGE(th)
VGE=VCE, IC = 15.2 mA
ICES
VGE = 0 V
VCE = 1200 V
Cies
Coes
Cres
VCE = 25 V
VGE = 0 V
QG
VGE = - 8 V...+ 15 V
RGint
Tj = 25 °C
VCC = 600 V
IC = 400 A
td(on)
tr
Eon
Tj = 25 °C
Tj = 150 °C
24.6
nF
f = 1 MHz
1.62
nF
f = 1 MHz
1.38
nF
2260
nC
1.88
Ω
Tj = 150 °C
296
ns
Tj = 150 °C
67
ns
Tj = 150 °C
27
mJ
634
ns
137
ns
59.7
mJ
Eoff
Rth(j-c)
per IGBT
tf
mA
f = 1 MHz
RG on = 1.7 Ω
Tj = 150 °C
RG off = 1.7 Ω
di/dton = 5800 A/µs Tj = 150 °C
di/dtoff = 3700 A/µs
Tj = 150 °C
td(off)
5
0.072
K/W
GB
© by SEMIKRON
Rev. 0 – 05.05.2010
1
SEMiX404GB12E4s
Characteristics
Symbol
Conditions
Inverse diode
VF = VEC IF = 400 A
VGE = 0 V
chip
VF0
rF
SEMiX® 4s
IRRM
Qrr
Trench IGBT Modules
Err
Rth(j-c)
SEMiX404GB12E4s
• Homogeneous Si
• Trench = Trenchgate technology
• VCE(sat) with positive temperature
coefficient
• High short circuit capability
• UL recognized, file no. E63532
Typical Applications*
• AC inverter drives
• UPS
• Electronic Welding
Tj = 25 °C
Tj = 150 °C
typ.
max.
Unit
2.2
2.52
V
2.1
2.5
V
Tj = 25 °C
1.1
1.3
1.5
V
Tj = 150 °C
0.7
0.9
1.1
V
Tj = 25 °C
2.0
2.3
2.5
mΩ
3.1
3.4
mΩ
Tj = 150 °C
IF = 400 A
Tj = 150 °C
di/dtoff = 4900 A/µs T = 150 °C
j
VGE = -15 V
T
j = 150 °C
VCC = 600 V
per diode
2.6
315
A
63
µC
26.4
mJ
0.14
K/W
Module
LCE
RCC'+EE'
Features
min.
res., terminal-chip
Rth(c-s)
per module
Ms
to heat sink (M5)
22
nH
TC = 25 °C
0.7
mΩ
TC = 125 °C
1
mΩ
0.03
to terminals (M6)
Mt
K/W
3
5
Nm
2.5
5
Nm
Nm
w
400
g
Temperatur Sensor
R100
Tc=100°C (R25=5 kΩ)
B100/125
R(T)=R100exp[B100/125(1/T-1/T100)];
T[K];
493 ± 5%
Ω
3550
±2%
K
Remarks
• Case temperature limited to TC=125°C
max.
• Product reliability results are valid for
Tj=150°C
• For short circuit: Soft RGoff
recommended RGoff > 25
• Dynamic values apply to the
following combination of resistors:
RGon,main = 1,0 Ω
RGoff,main = 1,0 Ω
RG,X = 2,2 Ω
RE,X = 0,5 Ω
GB
2
Rev. 0 – 05.05.2010
© by SEMIKRON
SEMiX404GB12E4s
Fig. 1: Typ. output characteristic, inclusive RCC'+ EE'
Fig. 2: Rated current vs. temperature IC = f (TC)
Fig. 3: Typ. turn-on /-off energy = f (IC)
Fig. 4: Typ. turn-on /-off energy = f (RG)
Fig. 5: Typ. transfer characteristic
Fig. 6: Typ. gate charge characteristic
© by SEMIKRON
Rev. 0 – 05.05.2010
3
SEMiX404GB12E4s
Fig. 7: Typ. switching times vs. IC
Fig. 8: Typ. switching times vs. gate resistor RG
Fig. 9: Typ. transient thermal impedance
Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE'
Fig. 11: Typ. CAL diode peak reverse recovery current
Fig. 12: Typ. CAL diode recovery charge
4
Rev. 0 – 05.05.2010
© by SEMIKRON
SEMiX404GB12E4s
SEMiX 4s
spring configuration
This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX
* The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested
for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is
subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal.
© by SEMIKRON
Rev. 0 – 05.05.2010
5