TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com 2.95-V to 6-V Input, 6-A Synchronous Buck, Integrated Power Solution Check for Samples: TPS84610 FEATURES 1 • 2 • • • • • • • • • • • • • • Complete Integrated Power Solution Allows Small Footprint, Low-Profile Design Efficiencies Up To 96% Wide-Output Voltage Adjust 0.8 V to 3.6 V, with ±1% Reference Accuracy Adjustable Switching Frequency (500 kHz to 2 MHz) Synchronizes to an External Clock Adjustable Slow-Start Output Voltage Sequencing / Tracking Power Good Output Programmable Undervoltage Lockout (UVLO) Output Overcurrent Protection Over Temperature Protection Operating Temperature Range: –40°C to 85°C Enhanced Thermal Performance: 12°C/W Meets EN55022 Class B Emissions For Design Help Including SwitcherPro™ visit http://www.ti.com/TPS84610 DESCRIPTION The TPS84610RKG is an easy-to-use integrated power solution that combines a 6-A DC/DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process. The 9×11×2.8 mm BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow. The TPS84610 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques. SIMPLIFIED APPLICATION APPLICATIONS • • • • • TPS84610 Broadband and Communications Infrastructure Automated Test and Medical Equipment Compact PCI / PCI Express / PXI Express DSP and FPGA Point of Load Applications High Density Distributed Power Systems VIN VIN PWRGD VOUT CIN VOUT COUT SENSE+ RT/CLK Efficiency (%) 100 95 INH/UVLO 90 SS/TR VADJ 85 STSEL 80 75 PGND AGND RSET 70 65 60 VIN = 5.0 V, VOUT = 3.3 V, fSW = 1 MHz VIN = 3.3 V, VOUT = 1.8 V, fSW = 1 MHz 55 50 0 1 2 3 4 Output Current (A) 5 6 G000 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. SwitcherPro is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) TA PACKAGE -40°C to 85°C Plastic Quad Flat Pack (BQFN) (1) PINS TRANSPORT MEDIA MINIMUM QUANTITY ORDERABLE NUMBER ECO PLAN Large tape and reel 500 TPS84610RKGR Green (RoHS and no Sb/Br) Small tape and reel 250 TPS84610RKGT Green (RoHS and no Sb/Br) 39 For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) over operating temperature range (unless otherwise noted) VALUE Input Voltage MAX VIN, PWRGD –0.3 7 V INH/UVLO, RT/CLK –0.3 3.3 V SS/TR, STSEL, VADJ –0.3 3 V SENSE+ -0.3 VOUT V –0.6 7 V VADJ rating must also be met PH Output Voltage PH 10 ns, transient VOUT VDIFF (GND to exposed thermal pad) –2 7 V -0.6 VIN V –0.2 0.2 V ±100 µA PH Current Limit A PH Current Limit A RT/CLK, INH/UVLO Source Current Sink Current UNIT MIN SS/TR PWRGD ±100 µA 10 mA Operating Junction Temperature –40 125 (2) °C Storage Temperature, Tstg –65 150 °C Mechanical Shock Mil-STD-883D, Method 2002.3, 1 msec, 1/2 sine, mounted Mechanical Vibration Mil-STD-883D, Method 2007.2, 20-2000Hz (1) (2) 2 1500 20 G Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. See the temperature derating curves in the Typical Characteristics section for thermal information. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com THERMAL INFORMATION TPS84610 THERMAL METRIC (1) RKG39 UNIT 39 PINS θJA Junction-to-ambient thermal resistance (2) 12 (3) ψJT Junction-to-top characterization parameter ψJB Junction-to-board characterization parameter (4) (1) (2) (3) (4) °C/W 2.2 9.7 For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. The junction-to-ambient thermal resistance, θJA, applies to devices soldered directly to a 100 mm x 100 mm double-sided PCB with 1 oz. copper and natural convection cooling. Additional airflow reduces θJA. The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT * Pdis + TT; where Pdis is the power dissipated in the device and TT is the temperature of the top of the device. The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB * Pdis + TB; where Pdis is the power dissipated in the device and TB is the temperature of the board 1mm from the device. PACKAGE SPECIFICATIONS TPS84610 Weight Flammability MTBF Calculated reliability UNIT 0.85 grams Meets UL 94 V-O Per Bellcore TR-332, 50% stress, TA = 40°C, ground benign 32.8 MHrs Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 3 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS Over -40°C to 85°C free-air temperature, VIN = 3.3 V, VOUT = 1.8 V, IOUT = 6A, CIN1 = 47 µF ceramic, CIN2 = 220 µF poly-tantalum, COUT1 = 47 µF ceramic, COUT2 = 100 µF poly-tantalum (unless otherwise noted) PARAMETER TEST CONDITIONS IOUT Output current TA = 85°C, natural convection VIN Input voltage range Over IOUT range UVLO VIN Undervoltage lockout VOUT(adj) VOUT Over IOUT range 0.8 Set-point voltage tolerance TA = 25°C, IOUT = 0A Temperature variation -40°C ≤ TA ≤ +85°C, IOUT = 0A ±0.3% Line regulation Over VIN range, TA = 25°C, IOUT = 0A ±0.1% Load regulation Over IOUT range, TA = 25°C ±0.1% Total output voltage variation Includes set-point, line, load, and temperature variation VINH-L II(stby) Inhibit Control Input standby current 96% 94% VOUT = 1.8V, fSW = 1 MHz 92% VOUT = 1.5V, fSW = 1 MHz 90% VOUT = 1.2V, fSW =750 kHz 89% VOUT = 1.0V, fSW = 650 kHz 87% VOUT = 0.8V, fSW = 650 kHz 85% VOUT = 1.8V, fSW = 1 MHz 92% VOUT = 1.5V, fSW = 1 MHz 90% VOUT = 1.2V, fSW = 750 kHz 89% VOUT = 1.0V, fSW = 650 kHz 87% VOUT = 0.8V, fSW = 650 kHz 85% 1.0 A/µs load step from 1.5A to 4.5A A VOUT over/undershoot 120 VOUT falling Over VIN and IOUT ranges, RT/CLK pin OPEN fCLK Synchronization frequency VCLK-H CLK High-Level Threshold VCLK-L CLK Low-Level Threshold CLK Control (4) 4 1.25 –0.3 Thermal shutdown Thermal shutdown hysteresis mV Open (3) 1.0 70 Good 93% Fault 109% Fault 91% Good 107% 100 V µA 0.3 V 600 kHz 500 2000 kHz 2.2 3.3 -0.3 0.4 400 500 75 (4) CLK_PW CLK Pulse Width Thermal Shutdown mVPP µs PWRGD Thresholds I(PWRGD) = 0.33 mA (2) 80 INH pin to AGND Switching frequency ±1.5% V Recovery time Inhibit Low Voltage PWRGD Low Voltage (2) V 9 Inhibit High Voltage fSW ±1.0% 10 VOUT rising Power Good 3.6 VOUT = 2.5V, fSW = 1 MHz 20 MHz bandwith 3.135 2.75 VOUT = 3.3V, fSW = 1 MHz Overcurrent threshold VINH-H (3) V Output voltage adjust range Transient response (1) (2) A 6 2.5 Output voltage ripple UNIT 6 VIN = decreasing VIN = 3.3V IO = 3 A MAX 0 3.05 Efficiency ILIM TYP 2.95 (1) VIN = increasing VIN = 5 V IO = 3 A η MIN V V ns 170 °C 20 °C The minimum VIN depends on VOUT and the switching frequency. Please refer to Table 7 for operating limits. The stated limit of the set-point voltage tolerance includes the tolerance of both the internal voltage reference and the internal adjustment resistor. The overall output voltage tolerance will be affected by the tolerance of the external RSET resistor. This control pin has an internal pullup. Do not place an external pull-up resistor on this pin. If this pin is left open circuit, the device operates when input power is applied. A small low-leakage MOSFET is recommended for control. See the application section for further guidance. The maximum synchronization clock pulse width is dependant on VIN, VOUT, and the synchronization frequency. See the Synchronization (CLK) section for more information. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Over -40°C to 85°C free-air temperature, VIN = 3.3 V, VOUT = 1.8 V, IOUT = 6A, CIN1 = 47 µF ceramic, CIN2 = 220 µF poly-tantalum, COUT1 = 47 µF ceramic, COUT2 = 100 µF poly-tantalum (unless otherwise noted) PARAMETER CIN TEST CONDITIONS MIN Ceramic External input capacitance External output capacitance 47 Non-ceramic (6) (6) (7) UNIT µF 150 650 (7) (6) 2000 (7) 100 Equivalent series resistance (ESR) (5) MAX 220 (5) Non-ceramic Ceramic COUT 47 TYP (5) 25 µF mΩ A minimum of 47µF of ceramic capacitance is required across the input for proper operation. Locate the capacitor close to the device. An additional 220µF of bulk capacitance is recommended. See Table 4 for more details. The amount of required output capacitance varies depending on the output voltage (see Table 3 ). The amount of required capacitance must include at least 47µF of ceramic capacitance. Locate the capacitance close to the device. Adding additional capacitance close to the load improves the response of the regulator to load transients. See Table 3 and Table 4 for more details. When using both ceramic and non-ceramic output capacitance, the combined maximum must not exceed 2200µF. DEVICE INFORMATION FUNCTIONAL BLOCK DIAGRAM Thermal Shutdown PWRGD PWRGD Logic INH/UVLO Shutdown Logic VIN UVLO VSENSE+ VIN VADJ PH + + SS/TR VREF Power Stage and Control Logic Comp STSEL VOUT RT/CLK PGND OSC w/PLL OCP AGND TPS84610 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 5 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com PIN DESCRIPTIONS TERMINAL NAME DESCRIPTION NO. 1 5 AGND 29 33 Zero VDC reference for the analog control circuitry. These pins should be connected directly to the PCB analog ground plane. Not all pins are connected together internally. All pins must be connected together externally with a copper plane or pour directly under the module. Connect the AGND copper area to the PGND copper area at a single point; directly at the pin 37 PowerPAD using multiple vias. See the recommended layout in Figure 34. 34 PowerPAD (PGND) 37 This pad provides both an electrical and thermal connection to the PCB. This pad should be connected directly to the PCB power ground plane using multiple vias for good electrical and thermal performance. The same vias should also be used to connect to the PCB analog ground plane. See the recommended layout in Figure 34. 2 3 DNC 15 Do Not Connect. Do not connect these pins to AGND, to another DNC pin, or to any other voltage. These pins are connected to internal circuitry. Each pin must be soldered to an isolated pad. 16 26 INH/UVLO 28 Inhibit and UVLO adjust pin. Use an open drain or open collector output logic to control the INH function. A resistor between this pin and AGND adjusts the UVLO voltage. 17 18 19 20 21 PH 22 Phase switch node. These pins should be connected by a small copper island under the device for thermal relief. Do not connect any external component to this pin or tie it to a pin of another function. 23 24 25 39 PWRGD 27 Power good fault pin. Asserts low if the output voltage is out of tolerance. A pull-up resistor is required. RT/CLK 4 This pin automatically selects between RT mode and CLK mode. An external timing resistor adjusts the switching frequency of the device. In CLK mode, the device synchronizes to an external clock. SENSE+ 36 Remote sense connection. Connect this pin to VOUT at the load for improved regulation. This pin must be connected to VOUT at the load, or at the module pins. SS/TR 6 Slow-start and tracking pin. Connecting an external capacitor to this pin adjusts the output voltage rise time. A voltage applied to this pin allows for tracking and sequencing control. STSEL 7 Slow-start or track feature select. Connect this pin to AGND to enable the internal SS capacitor with a SS interval of approximately 1.1 ms. Leave this pin open to enable the TR feature. VADJ 35 Connecting a resistor between this pin and AGND sets the output voltage above the 0.8V default voltage. 30 VIN 31 The positive input voltage power pins, which are referenced to PGND. Connect external input capacitance between these pins and the PGND plane, close to the device. 32 8 9 10 VOUT 11 12 Output voltage. Connect output capacitors between these pins and the PGND plane, close to the device. 13 14 38 6 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com 1 DNC 2 DNC 3 RT/CLK 4 AGND VIN VIN VIN 35 34 33 32 AGND 36 AGND VADJ AGND SENSE+ RKG PACAKGE 39 PINS (TOP VIEW) 31 30 29 AGND 28 INH/UVLO 27 PWRGD 26 DNC 5 25 PH SS/TR 6 24 PH STSEL 7 23 PH VOUT 8 22 PH VOUT 9 21 PH VOUT 10 20 PH VOUT 11 37 PGND PH 39 17 18 19 PH PH DNC DNC VOUT VOUT VOUT 12 13 14 15 16 PH VOUT 38 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 7 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com TYPICAL CHARACTERISTICS (VIN = 5 V) (1) 15 100 VOUT = 3.3 V, fSW = 1 MHz VOUT = 2.5 V, fSW = 1 MHz VOUT = 1.8 V, fSW = 1 MHz VOUT = 1.2 V, fSW = 750 kHz VOUT = 0.8 V, fSW = 650 kHz Output Voltage Ripple (mV) 95 Efficiency (%) 90 85 80 75 70 VOUT = 3.3 V, fSW = 1 MHz VOUT = 2.5 V, fSW = 1 MHz VOUT = 1.8 V, fSW = 1 MHz VOUT = 1.2 V, fSW = 750 kHz VOUT = 0.8 V, fSW = 650 kHz 65 60 55 50 0 1 2 3 4 Output Current (A) 5 14 13 12 11 10 9 6 0 1 2 G000 Figure 1. Efficiency vs. Output Current 3 4 Output Current (A) 6 G000 90 VOUT = 3.3 V, fSW = 1 MHz VOUT = 2.5 V, fSW = 1 MHz VOUT = 1.8 V, fSW = 1 MHz VOUT = 1.2 V, fSW = 750 kHz VOUT = 0.8 V, fSW = 650 kHz 1.2 80 Ambient Temperature (°C) 1.5 0.9 0.6 0.3 70 60 50 40 30 All Output Voltages 0 1 2 3 4 Output Current (A) 5 6 20 0 2 G000 Figure 3. Power Dissipation vs. Output Current Gain (dB) 1 120 30 90 20 60 10 30 0 0 −30 −10 6 G000 −60 −20 −40 1000 5 Figure 4. Safe Operating Area 40 −30 Natural Convection 3 4 Output Current (A) Phase (°) 0 5 Figure 2. Voltage Ripple vs. Output Current 1.8 Power Dissipation (W) (2) Gain Phase −90 10000 Frequency (Hz) 100000 −120 500000 G000 Figure 5. VOUT= 1.8 V, IOUT= 6 A, COUT1= 47 µF ceramic, COUT2= 100 µF POSCAP, fSW= 1 MHz (1) (2) 8 The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the converter. Applies to Figure 1, Figure 2, and Figure 3. The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to devices soldered directly to a 100 mm × 100 mm double-sided PCB with 1 oz. copper. Applies to Figure 4. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com TYPICAL CHARACTERISTICS (VIN = 3.3 V) (1) 12 100 VOUT = 1.8 V, fSW = 1 MHz VOUT = 1.2 V, fSW = 750 kHz VOUT = 0.8 V, fSW = 650 kHz Output Voltage Ripple (mV) 95 Efficiency (%) 90 85 80 75 70 65 VOUT = 1.8 V, fSW = 1 MHz VOUT = 1.2 V, fSW = 750 kHz VOUT = 0.8 V, fSW = 650 kHz 60 55 50 0 1 2 3 4 Output Current (A) 5 11 10 9 8 7 6 0 1 2 G000 Figure 6. Efficiency vs. Output Current 3 4 Output Current (A) 6 G000 90 VOUT = 1.8 V, fSW = 1 MHz VOUT = 1.2 V, fSW = 750 kHz VOUT = 0.8 V, fSW = 650 kHz 80 Ambient Temperature (°C) 1.5 1.2 0.9 0.6 0.3 70 60 50 40 30 All Output Voltages 0 1 2 3 4 Output Current (A) 5 6 20 0 2 G000 Figure 8. Power Dissipation vs. Output Current Gain (dB) 1 120 30 90 20 60 10 30 0 0 −30 −10 6 G000 −60 −20 −40 1000 5 Figure 9. Safe Operating Area 40 −30 Natural Convection 3 4 Output Current (A) Phase (°) 0 5 Figure 7. Voltage Ripple vs. Output Current 1.8 Power Dissipation (W) (2) Gain Phase −90 10000 Frequency (Hz) 100000 −120 500000 G000 Figure 10. VOUT= 1.8 V, IOUT= 6 A, COUT1= 47 µF ceramic, COUT2= 100 µF POSCAP, fSW= 1 MHz (1) (2) The electrical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the converter. Applies to Figure 6, Figure 7, and Figure 8. The temperature derating curves represent the conditions at which internal components are at or below the manufacturer's maximum operating temperatures. Derating limits apply to devices soldered directly to a 100 mm × 100 mm double-sided PCB with 1 oz. copper. Applies to Figure 9. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 9 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com APPLICATION INFORMATION ADJUSTING THE OUTPUT VOLTAGE The VADJ control sets the output voltage of the TPS84610. The output voltage adjustment range is from 0.8V to 3.6V. The adjustment method requires the addition of RSET, which sets the output voltage, the connection of SENSE+ to VOUT, and in some cases RRT which sets the switching frequency. The RSET resistor must be connected directly between the VADJ (pin 35) and AGND (pin 33 & 34). The SENSE+ pin (pin 36) must be connected to VOUT either at the load for improved regulation or at VOUT of the module. The RRT resistor must be connected directly between the RT/CLK (pin 4) and AGND (pins 33 & 34). Table 1 gives the standard external RSET resistor for a number of common bus voltages, along with the recommended RRT resistor for that output voltage. Table 1. Standard RSET Resistor Values for Common Output Voltages RESISTORS OUTPUT VOLTAGE VOUT (V) 0.8 1.2 1.5 1.8 2.5 3.3 RSET (kΩ) open 2.87 1.65 1.15 0.673 0.459 RRT (kΩ) 1200 715 348 348 348 348 For other output voltages, the value of the required resistor can either be calculated using the following formula, or simply selected from the range of values given in Table 2. (1) Table 2. Standard RSET Resistor Values 10 VOUT (V) RSET (kΩ) RRT (kΩ) fSW (kHz) VOUT (V) RSET (kΩ) RRT (kΩ) fSW (kHz) 0.8 open 1200 650 2.3 0.768 348 1000 0.9 11.8 1200 650 2.4 0.715 348 1000 1.0 5.83 1200 650 2.5 0.673 348 1000 1.1 3.83 1200 650 2.6 0.634 348 1000 1.2 2.87 715 750 2.7 0.604 348 1000 1.3 2.32 715 750 2.8 0.576 348 1000 1.4 1.91 715 750 2.9 0.549 348 1000 1.5 1.65 348 1000 3.0 0.523 348 1000 1.6 1.43 348 1000 3.1 0.499 348 1000 1.7 1.27 348 1000 3.2 0.475 348 1000 1.8 1.15 348 1000 3.3 0.459 348 1000 1.9 1.05 348 1000 3.4 0.442 348 1000 2.0 0.953 348 1000 3.5 0.422 348 1000 2.1 0.845 348 1000 3.6 0.412 348 1000 2.2 0.825 348 1000 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com CAPACITOR RECOMMENDATIONS FOR THE TPS84610 POWER SUPPLY Capacitor Technologies Electrolytic, Polymer-Electrolytic Capacitors When using electrolytic capacitors, high-quality, computer-grade electrolytic capacitors are recommended. Polymer-electrolytic type capacitors are recommended for applications where the ambient operating temperature is less than 0°C. The Sanyo OS-CON capacitor series is suggested due to the lower ESR, higher rated surge, power dissipation, ripple current capability, and small package size. Aluminum electrolytic capacitors provide adequate decoupling over the frequency range of 2 kHz to 150 kHz, and are suitable when ambient temperatures are above 0°C. Ceramic Capacitors The performance of aluminum electrolytic capacitors is less effective than ceramic capacitors above 150 kHz. Multilayer ceramic capacitors have a low ESR and a resonant frequency higher than the bandwidth of the regulator. They can be used to reduce the reflected ripple current at the input as well as improve the transient response of the output. Tantalum, Polymer-Tantalum Capacitors Polymer-tantalum type capacitors are recommended for applications where the ambient operating temperature is less than 0°C. The Sanyo POSCAP series and Kemet T530 capacitor series are recommended rather than many other tantalum types due to their lower ESR, higher rated surge, power dissipation, ripple current capability, and small package size. Tantalum capacitors that have no stated ESR or surge current rating are not recommended for power applications. Input Capacitor The TPS84610 requires a minimum input capacitance of 47 μF of ceramic capacitance. An additional 220 μF polymer-tantalum capacitor is recommended for applications with transient load requirements. The combined ripple current rating of the input capacitors must be at least 3000 mArms. Table 4 includes a preferred list of capacitors by vendor. For applications where the ambient operating temperature is less than 0°C, an additional 1 μF, X5R or X7R ceramic capacitor placed between VIN and AGND is recommended. Output Capacitor The required output capacitance is determined by the output voltage of the TPS84610. See Table 3 for the amount of required capacitance. The required output capacitance must include at least one 47 µF ceramic capacitor. For applications where the ambient operating temperature is less than 0°C, an additional 100 µF polymer-tantalum capacitor is recommended. When adding additional non-ceramic bulk capacitors, low-ESR devices like the ones recommended in Table 4 are required. The required capacitance above the minimum is determined by actual transient deviation requirements. See Table 5 for typical transient response values for several output voltage, input voltage and capacitance combinations. Table 4 includes a preferred list of capacitors by vendor. Table 3. Required Output Capacitance VOUT RANGE (V) (1) (2) MINIMUM REQUIRED COUT (µF) MIN MAX 0.8 < 1.8 147 (1) 1.8 < 3.3 100 (2) 3.3 3.6 47 (2) Minimum required must include at least 1 x 47 µF ceramic capacitor plus 1 x 100 µF polymer-tantalum capacitor. Minimum required must include at least 47 µF of ceramic capacitance. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 11 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Table 4. Recommended Input/Output Capacitors (1) CAPACITOR CHARACTERISTICS VENDOR SERIES PART NUMBER WORKING VOLTAGE (V) CAPACITANCE (µF) ESR (2) (mΩ) Murata X5R GRM32ER61C476K 16 47 2 TDK X5R C3225X5R0J107M 6.3 100 2 Murata X5R GRM32ER60J107M 6.3 100 2 TDK X5R C3225X5R0J476K 6.3 47 2 Murata X5R GRM32ER60J476M 6.3 47 2 Sanyo POSCAP 10TPE220ML 10 220 25 Kemet T520 T520V107M010ASE025 10 100 25 Sanyo POSCAP 6TPE100MPB 6.3 100 25 Sanyo POSCAP 2R5TPE220M7 2.5 220 7 Kemet T530 T530D227M006ATE006 6.3 220 6 Kemet T530 T530D337M006ATE010 6.3 330 10 Sanyo POSCAP 2TPF330M6 2.0 330 6 Sanyo POSCAP 6TPE330MFL 6.3 330 15 (1) (2) Capacitor Supplier Verification Please verify availability of capacitors identified in this table. RoHS, Lead-free and Material Details Please consult capacitor suppliers regarding material composition, RoHS status, lead-free status, and manufacturing process requirements. Maximum ESR @ 100kHz, 25°C. Transient Response Table 5. Output Voltage Transient Response CIN1 = 1 x 47 µF CERAMIC, CIN2 = 220 µF POLYMER-TANTALUM VOLTAGE DEVIATION (mV) VOUT (V) VIN (V) 3.3 0.8 5 3.3 1.2 5 3.3 1.8 5 12 2.5 5 3.3 5 RECOVERY TIME (µs) COUT1 Ceramic COUT2 BULK 2 A LOAD STEP, (1 A/µs) 3 A LOAD STEP, (1 A/µs) 47 µF 330 µF 35 45 60 47 µF 470 µF 30 40 60 47 µF 330 µF 30 40 60 47 µF 470 µF 25 35 60 47 µF 330 µF 45 65 60 47 µF 470 µF 40 60 60 47 µF 330 µF 40 65 60 47 µF 470 µF 35 60 60 47 µF 220 µF 65 90 70 47 µF 330 µF 60 85 70 47 µF 220 µF 60 85 70 47 µF 330 µF 50 75 70 3x 47 µF - 95 150 70 3x 47 µF 100 µF 85 125 70 3x 47 µF - 120 180 70 3x 47 µF 100 µF 100 150 70 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Transient Waveforms Figure 11. VIN = 5V, VOUT = 0.8V, 2A Load Step Figure 12. VIN = 3.3V, VOUT = 0.8V, 2A Load Step Figure 13. VIN = 5V, VOUT = 1.2V, 2A Load Step Figure 14. VIN = 3.3V, VOUT = 1.2V, 2A Load Step Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 13 TPS84610 SLVSAZ4 – OCTOBER 2011 14 www.ti.com Figure 15. VIN = 5V, VOUT = 1.8V, 2A Load Step Figure 16. VIN = 3.3V, VOUT = 1.8V, 2A Load Step Figure 17. VIN = 5V, VOUT = 2.5V, 2A Load Step Figure 18. VIN = 5V, VOUT = 3.3V, 2A Load Step Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Application Schematics VIN 2.95 V to 6 V VIN + CIN2 220 F TPS84610 PWRGD CIN1 47 F VOUT 1.2 V SENSE+ VOUT INH/UVLO COUT1 + 47 F COUT2 100 F RT/CLK RRT 715 k SS/TR VADJ STSEL PGND AGND RSET 2.87 k Figure 19. Typical Schematic VIN = 2.95 V to 6.0 V, VOUT = 1.2 V VIN 4.4 V to 6 V VIN + CIN2 220 F TPS84610 PWRGD CIN1 47 F VOUT 3.3 V SENSE+ VOUT INH/UVLO COUT1 47 F COUT2 47 F RT/CLK RRT 348 k SS/TR VADJ STSEL PGND AGND RSET 459 Figure 20. Typical Schematic VIN = 4.4 V to 6.0 V, VOUT = 3.3 V Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 15 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Power Good (PWRGD) The PWRGD pin is an open drain output. Once the voltage on the SENSE+ pin is between 93% and 107% of the set voltage, the PWRGD pin pull-down is released and the pin floats. The recommended pull-up resistor value is between 10 kΩ and 100 kΩ to a voltage source that is 6 V or less. The PWRGD pin is in a defined state once VIN is greater than 1.2 V, but with reduced current sinking capability. The PWRGD pin achieves full current sinking capability once the VIN pin is above 2.95V. Figure 21 shows the PWRGD waveform during power-up. The PWRGD pin is pulled low when the voltage on SENSE+ is lower than 91% or greater than 109% of the nominal set voltage. Also, the PWRGD pin is pulled low if the input UVLO or thermal shutdown is asserted, or if the INH pin is pulled low. Power-Up Characteristics When configured as shown in the front page schematic, the TPS84610 produces a regulated output voltage following the application of a valid input voltage. During the power-up, internal soft-start circuitry slows the rate that the output voltage rises, thereby limiting the amount of in-rush current that can be drawn from the input source. The soft-start circuitry introduces a short time delay from the point that a valid input voltage is recognized. Figure 21 shows the start-up waveforms for a TPS84610, operating from a 5-V input and with the output voltage adjusted to 1.8 V. The waveform is measured with a 3-A constant current load. Figure 21. Start-Up Waveforms Remote Sense The SENSE+ pin must be connected to VOUT at the load, or at the device pins. Connecting the SENSE+ pin to VOUT at the load improves the load regulation performance of the device by allowing it to compensate for any I-R voltage drop between its output pins and the load. An I-R drop is caused by the high output current flowing through the small amount of pin and trace resistance. This should be limited to a maximum of 300 mV. NOTE The remote sense feature is not designed to compensate for the forward drop of nonlinear or frequency dependent components that may be placed in series with the converter output. Examples include OR-ing diodes, filter inductors, ferrite beads, and fuses. When these components are enclosed by the SENSE+ connection, they are effectively placed inside the regulation control loop, which can adversely affect the stability of the regulator. 16 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Output On/Off Inhibit (INH) The INH pin provides electrical on/off control of the device. Once the INH pin voltage exceeds the threshold voltage, the device starts operation. If the INH pin voltage is pulled below the threshold voltage, the regulator stops switching and enters low quiescent current state. The INH pin has an internal pull-up current source, allowing the user to float the INH pin for enabling the device. If an application requires controlling the INH pin, use an open drain/collector device, or a suitable logic gate to interface with the pin. Do not place an external pull-up resistor on this pin. Figure 22 shows the typical application of the inhibit function. Turning Q1 on applies a low voltage to the inhibit control (INH) pin and disables the output of the supply, as shown in Figure 23. If Q1 is turned off, the supply executes a soft-start power-up sequence, as shown in Figure 24. The waveforms were measured with a 3-A constant current load. INH/UVLO Q1 INH Control AGND Figure 22. Typical Inhibit Control Figure 23. Inhibit Turn-Off Figure 24. Inhibit Turn-On Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 17 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Slow Start (SS/TR) Connecting the STSEL pin to AGND and leaving SS/TR pin open enables the internal SS capacitor with a slow start interval of approximately 1.1 ms. Adding additional capacitance between the SS pin and AGND increases the slow start time. Table 6 shows an additional SS capacitor connected to the SS/TR pin and the STSEL pin connected to AGND. See Table 6 below for SS capacitor values and timing interval. SS/TR CSS (Optional) AGND STSEL UDG-11119 Figure 25. Slow-Start Capacitor (CSS) and STSEL Connection Table 6. Slow-Start Capacitor Values and Slow-Start Time CSS (pF) open 2200 4700 10000 15000 22000 25000 SS Time (msec) 1.1 1.9 2.8 4.6 6.4 8.8 9.8 Overcurrent Protection For protection against load faults, the TPS84610 uses current limiting. The device is protected from overcurrent conditions by cycle-by-cycle current limiting and frequency foldback. During an overcurrent condition the output current is limited and the output voltage is reduced, as shown in Figure 26. When the overcurrent condition is removed, the output voltage returns to the established voltage, as shown in Figure 27. Figure 26. Overcurrent Limiting Figure 27. Removal of Overcurrent Condition Thermal Shutdown The internal thermal shutdown circuitry forces the device to stop switching if the junction temperature exceeds 170°C typically. The device reinitiates the power up sequence when the junction temperature drops below 150°C typically. 18 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Synchronization (CLK) An internal phase locked loop (PLL) has been implemented to allow synchronization between 500 kHz and 2 MHz, and to easily switch from RT mode to CLK mode. To implement the synchronization feature, connect a square wave clock signal to the RT/CLK pin with a minimum pulse width of 75 ns. The maximum clock pulse width must be calculated using Equation 2. The clock signal amplitude must transition lower than 0.4 V and higher than 2.2 V. The start of the switching cycle is synchronized to the falling edge of RT/CLK pin. Applications requiring both RT mode and CLK mode, configure the device as shown in Figure 28. Before the external clock is present, the device works in RT mode and the switching frequency is set by the RT resistor (RRT). When the external clock is present, the CLK mode overrides the RT mode. The device switches from RT mode to CLK mode and the RT/CLK pin becomes high impedance as the PLL starts to lock onto the frequency of the external clock. The device will lock to the external clock frequency approximately 15 µs after a valid clock signal is present. It is not recommended to switch from CLK mode back to RT mode because the internal switching frequency drops to a lower frequency before returning to the switching frequency set by the RT resistor. 470 pF 1 kΩ RT/CLK 500 kHz to 2 MHz External Clock æ ö V 0.75 ´ ç 1 - OUT ÷ ç VIN(min ) ÷ è ø CLK _ PWMAX = fSW RRT AGND (2) Figure 28. CLK/RT Configuration Select the synchronization frequency based on the output voltages of the devices being synchronized. Table 7 shows the allowable VOUT range for a given switching frequency when operating from a typical 5 V bus and a typical 3.3 V bus. For the most optimal solution, synchronize to a frequency in the center of the allowable frequency range. For example, an application requires synchronizing three TPS84610 devices with output voltages of 1.2V, 1.8V, and 3.3V, all powered from VIN = 5V. Table 7 shows that all three output voltages can be synchronized to any frequency between 600 kHz to 1 MHz. For the most optimal solution, choose 800 kHz as the sychronization frequency. (Values included in the table are based on a resistive load.) Table 7. Synchronization Frequency vs Output Voltage VIN = 5V (+/- 10%) SYNCHRONIZATION FREQUENCY (kHz) RRT (kΩ) VOUT RANGE (V) VIN = 3.3V (+/- 5%) VOUT RANGE (V) MIN MAX MIN MAX 500 open 0.8 1.8 0.8 2.5 550 3400 0.8 2.2 0.8 2.5 600 1800 0.8 3.3 0.8 2.5 650 1200 0.8 3.6 0.8 2.5 700 887 0.8 3.6 0.8 2.5 750 715 0.9 3.6 0.8 2.5 800 590 0.9 3.6 0.8 2.5 850 511 1.0 3.6 0.8 2.5 900 442 1.0 3.6 0.8 2.5 950 392 1.1 3.6 0.8 2.5 1000 348 1.1 3.6 0.8 2.5 1250 232 1.4 3.6 0.9 2.4 1500 174 1.7 3.5 1.1 2.3 1750 137 2.0 3.4 1.3 2.3 2000 113 2.2 3.3 1.4 2.2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 19 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Programmable Undervoltage Lockout (UVLO) The TPS84610 implements internal UVLO circuitry on the VIN pin. The device is disabled when the VIN pin voltage falls below the internal VIN UVLO threshold. The internal VIN UVLO rising threshold is 3.135 V(max) with a typical hysteresis of 300 mV. If an application requires a higher UVLO threshold on the VIN pin, the UVLO pin can be configured as shown in Figure 29. Table 8 lists standard values for RUVLO to adjust the VIN UVLO voltage up. VIN VIN INH/UVLO RUVLO AGND Figure 29. Adjustable VIN UVLO Table 8. Standard Resistor values for Adjusting VIN UVLO VIN UVLO (V) (typ) 20 3.25 3.5 3.75 4.0 4.25 4.5 4.75 RUVLO (kΩ) 294 133 86.6 63.4 49.9 42.2 35.7 Hysteresis (mV) 325 335 345 355 365 375 385 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Sequencing (SS/TR) Many of the common power supply sequencing methods can be implemented using the SS/TR, INH and PWRGD pins. The sequential method is illustrated in Figure 30 using two TPS84610 devices. The PWRGD pin of the first device is coupled to the INH pin of the second device which enables the second power supply once the primary supply reaches regulation. Figure 31 shows sequential turn-on waveforms of two TPS84610 devices. INH/UVLO VOUT1 VOUT STSEL PWRGD INH/UVLO VOUT2 VOUT STSEL PWRGD Figure 30. Sequencing Schematic Figure 31. Sequencing Waveforms Simultaneous power supply sequencing can be implemented by connecting the resistor network of R1 and R2 shown in Figure 32 to the output of the power supply that needs to be tracked or to another voltage reference source. Figure 33 shows simultaneous turn-on waveforms of two TPS84610 devices. Use Equation 3 and Equation 4 to calculate the values of R1 and R2. (3) (4) VOUT1 VOUT INH/UVLO STSEL SS/TR VOUT2 VOUT INH/UVLO R1 STSEL SS/TR R2 Figure 32. Simultaneous Tracking Schematic Figure 33. Simultaneous Tracking Waveforms Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 21 TPS84610 SLVSAZ4 – OCTOBER 2011 www.ti.com Layout Considerations To achieve optimal electrical and thermal performance, an optimized PCB layout is required. Figure 34, shows a typical PCB layout. Some considerations for an optimized layout are: • Use large copper areas for power planes (VIN, VOUT, and PGND) to minimize conduction loss and thermal stress. • Place ceramic input and output capacitors close to the module pins to minimize high frequency noise. • Locate additional output capacitors between the ceramic capacitor and the load. • Place a dedicated AGND copper area beneath the TPS84610. • Connect the AGND and PGND copper area at one point; directly at the pin 37 PowerPad using multiple vias. • Place RSET, RRT, and CSS as close as possible to their respective pins. • Use multiple vias to connect the power planes to internal layers. SENSE+ Via PGND Vias to PGND Layer CIN1 VIN SENSE+ Via Vias to Topside PGND Copper COUT1 PH Vias to Topside AGND Copper PGND Plane Vias to PGND Layer VOUT SENSE+ Via AGND RSET SENSE+ Via RRT Figure 34. Typical Top-Layer Recommended Layout Figure 35. Typical PGND-Layer Recommended Layout EMI The TPS84610 is compliant with EN55022 Class B radiated emissions. Figure 36 and Figure 37 show typical examples of radiated emissions plots for the TPS84610 operating from 5V and 3.3V respectively. Both graphs include the plots of the antenna in the horizontal and vertical positions. Figure 36. Radiated Emissions 5-V Input, 1.8-V Output, 6-A Load (EN55022 Class B) 22 Figure 37. Radiated Emissions 3.3-V Input, 1.8-V Output, 6-A Load (EN55022 Class B) Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPS84610 PACKAGE OPTION ADDENDUM www.ti.com 7-Dec-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPS84610RKGR ACTIVE B1QFN RKG 39 500 TBD Call TI Call TI TPS84610RKGT ACTIVE B1QFN RKG 39 250 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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