TI DRV11873

DRV11873
www.ti.com
SLWS237 – NOVEMBER 2012
12-V, 3-PHASE, SENSORLESS BLDC MOTOR DRIVER
Check for Samples: DRV11873
FEATURES
1
•
•
•
•
•
•
•
•
•
•
Input Voltage Range 5 V to 16 V
Six Integrated MOSFETs With 1.5-A
Continuous Output Current
Total Driver H+L RDSON 450 mΩ
Sensorless Proprietary BMEF Control Scheme
150° Commutation
Synchronous Rectification PWM Operation
FG and RD Open Drain Output
5-V LDO for External Use
PWMIN Input From 15 kHz to 100 kHz
Over Current Protection With Adjustable Limit
Through External Resistor
•
•
•
•
Lock Detection
Voltage Surge Protection
UVLO
Thermal Shutdown
APPLICATIONS
•
•
•
Appliance Cooling Fan
Desktop Cooling Fan
Server Cooling Fan
DESCRIPTION
DRV11873 is a three phase, sensorless motor driver with integrated power MOSFETs with drive current
capability up to 1.5-A continuous and 2-A peak. DRV11873 is specifically designed for low noise and low external
component count fan motor drive applications. DRV11873 has built in over current protection with no external
current sense resistor needed. The synchronous rectification mode of operation achieves increased efficiency for
motor driver applications. DRV11873 outputs FG and RD to indicate motor status with open drain output. A 150°
sensorless BEMF control scheme is implemented for a three phase motor. DRV11873 is available in the
thermally efficient 16-pin TSSOP package. The operation temperature is specified from -40°C to 125°C.
TYPICAL APPLICATION
1
16
FG
2
15
FR
RD
3
14
CS
VCP
4
13
COM
CPP
5
12
V5
CPN
6
11
VCC
7
10
8
9
2.2uF
0.1uF
0.1uF
PWMIN
FS
W
U
10uF
GND
V
M
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
DRV11873
SLWS237 – NOVEMBER 2012
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–40°C to 125°C
(1)
(2)
TSSOP-16 (PWP)
Tape and reel, 3000
PART NUMBER
TOP-SIDE MARKING
DRV11873PWP
11873
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/package.
FUNCTIONAL BLOCK DIAGRAM
FG
GND
PWM&Standby
Lock
detection
Phase Current
Sense
COM
U
V
W
PCOM
&
FILT
Ilimit
COMP
FS
CS
VREF
VCC
UVLO
Bandgap
&
UVLO
VCC
PWM
VREF
V
Predriver
VCP
GND
U
VCC
Predriver
Core Logic
GND
GND
Thermal
detection
W
Predriver
GND
FR
VCC
U
V
W
RD
AVS
OSC
VCC
VCP
VCP
GND
Charge Pump
VCC
GND
V5
2
CPP
CPN
5V LDO
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DRV11873
www.ti.com
SLWS237 – NOVEMBER 2012
PIN DESIGNATION
PWP PACKAGE
(TOP VIEW)
FS
PWMIN
FG
FR
RD
CS
VCP
COM
CPP
V5
CPN
VCC
W
U
GND
V
Table 1. PIN DESCRIPTIONS
TERMINAL
NAME
NO.
I/O (1)
DESCRIPTION
FS
1
I
Motor parameter adjustment pin. Pull low for lower speed motor and pull high for high speed motor.
FG
2
O
Frequency generator output. The output have period equal to 6 electrical states (FG).
RD
3
O
In the lock condition, RD output high through a pull up resistor to VCC or 5 V.
VCP
4
O
Charge pump output
CPP
5
O
Charge pump conversion terminal
CPN
6
O
Charge pump conversion terminal
W
7
O
Phase W output
GND
8
-
Ground pin
V
9
O
Phase V output
U
10
O
Phase U output
VCC
11
I
Input voltage for motor and chip supply voltage
V5
12
O
5-V regulator output
COM
13
I
Motor common terminal input
CS
14
I
Over current threshold set up pin. A resistor set up current limit is connected between this pin and ground.
The voltage across the resistor will compare with the voltage converted from the bottom MOSFETs current.
If MOSFETs current is high, the part will get into the over-current protection mode by turning off top PWM
MOSFET and keeping the bottom MOSFET on.
Ilimit(A) = 6600/RCS(Ω), Equation valid range: 500 mA < Ilimit < 2000 mA
FR
15
I
Set high for reverse rotation. Set low or floating for forward rotation.
PWMIN
16
I
PWM input pin. The PWM input signal will be converted to a fixed switching frequency on MOSFET driver.
The PWM input signal resolution is less than 1%.
(1)
I = input, O = output, N/A = not available
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DRV11873
SLWS237 – NOVEMBER 2012
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ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
MIN
Input voltage range
Output voltage range
Electrostatic discharge (ESD)
VCC
-0.3
20
CS
-0.3
3.6
PWMIN, FS, FR
-0.3
6
GND
-0.3
0.3
COM
-1
20
U, V, W
-1
20
FG, RD
-0.3
20
VCP
-0.3
25
CPN
-0.3
20
CPP
-0.3
25
V5
-0.3
6
Human body model, HBM
4
Charge device model, CBM
1
Machine model, MM
TJ
UNIT
MAX
Operating junction temperature
Tstg Storage temperature
V
V
kV
200
V
-40
125
°C
-55
150
°C
THERMAL INFORMATION
DRV11873
THERMAL METRIC
(1)
PWP
UNITS
16 PINS
θJA
Junction-to-ambient thermal resistance (2)
39.4
θJCtop
Junction-to-case (top) thermal resistance (3)
30.3
(4)
θJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter (5)
ψJB
Junction-to-board characterization parameter (6)
θJCbot
(1)
(2)
(3)
(4)
(5)
(6)
(7)
4
Junction-to-case (bottom) thermal resistance
25.6
0.5
(7)
°C/W
10.2
3.6
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
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DRV11873
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SLWS237 – NOVEMBER 2012
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
Supply voltage
MIN
MAX
VCC
Voltage range
5
16
U, V, W
-0.7
17
COM
-0.1
17
FG, RD
-0.1
16
PGND, GND
-0.1
0.1
VCP
-0.1
22
CPP
-0.1
22
CPN
-0.1
16
V5
-0.1
5.5
PWMIN, FR, FS
-0.1
5.5
-40
125
Operating junction temperature, TJ
UNIT
V
V
V
ELECTRICAL CHARACTERISTICS
Supply Current
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
IVCC
Supply current
TEST CONDITIONS
MIN
TA = 25°C; PWM = VCC; VCC = 12 V
TYP
MAX
2.7
5
TYP
MAX
4.3
4.6
UNIT
mA
UVLO
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
UNIT
VVUVLO-th_r
UVLO threshold voltage
Rise threshold, TA = 25°C
VUVLO-th_f
UVLO threshold voltage
Fall threshold, TA = 25°C
3.9
4.1
V
VUVLO-thhys
UVLO threshold voltage
hysteresis
TA = 25°C
100
200
300
mV
MIN
TYP
MAX
UNIT
0.45
0.6
V
Integrated MOSFET
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
RDSON
Series resistance(H+L)
TEST CONDITIONS
TA = 25°C; VCC = 12 V; VCP = 19 V;
IOUT = 1.5 A
Ω
PWM
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VPWM-IH
High-level input voltage
VCC ≥ 4.5 V
VPWM-IL
Low-level input voltage
VCC ≥ 4.5 V
fPWM
PWM input frequency
15
IPWM-SOURCE
PWM source current
35
MIN
TYP
MAX
2.7
UNIT
V
0.8
V
100
kHz
50
65
µA
TYP
MAX
UNIT
FG
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IFG-SINK
FG pin sink current
VFG = 0.3 V
IFG-short
FG pin short current limit
VFG = 12 V
Copyright © 2012, Texas Instruments Incorporated
5
mA
20
25
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mA
5
DRV11873
SLWS237 – NOVEMBER 2012
www.ti.com
RD
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IRD-SINK
RD pin sink current
VRD = 0.3 V
IRD-short
RD pin short current limit
VRD = 12 V
MIN
TYP
MAX
20
25
TYP
MAX
5
UNIT
mA
mA
FR and FS
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VFR-IH
High-level input voltage
VCC ≥ 4.5 V
VFR-IL
Low-level input voltage
VCC ≥ 4.5 V
VFS-th
FS set threshold voltage
VCC ≥ 4.5 V
MIN
2.3
UNIT
V
2.3
0.8
V
0.8
V
V5
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V5
5V LDO voltage
VCC = 12 V
IV5
5V LDO load current
VCC = 12 V
MIN
TYP
MAX
UNIT
4.75
5
5.25
V
20
mA
Lock Protection
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
TLOCK-ON
Lock detect time
TLOCK-OFF
Lock release time
MIN
TYP
MAX
FS = 0
TEST CONDITIONS
0.875
1.25
1.625
FS = 1
0.437
0.625
0.812
FS = 0
4.375
6.25
8.125
FS = 1
2.187
3.125
4.06
UNIT
s
s
Current Limit
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
Current limit
TEST CONDITIONS
MIN
TYP
MAX
CS pin to GND resistor = 3.3 kΩ
1.7
2
2.3
UNIT
A
Thermal Shutdown
over recommended operating free-air temperature (unless otherwise noted)
PARAMETER
TSDN
6
Shut down temperature threshold
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TEST CONDITIONS
Shut down temperature
Hysteresis
MIN
TYP
160
10
MAX UNIT
°C
Copyright © 2012, Texas Instruments Incorporated
DRV11873
www.ti.com
SLWS237 – NOVEMBER 2012
DETAILED DEVICE DESCRIPTION
DRV11873 is a three phase, sensorless motor driver with integrated power MOSFETs with drive current
capability up to 1.5-A continuous and 2-A peak. It is specifically designed for low noise and low external
component count fan motor drive applications. DRV11873 has built in over current protection with no external
current sense resistor needed. The synchronous rectification mode of operation achieves increased efficiency for
motor driver applications. DRV11873 outputs FG and RD to indicate motor status with open drain output. A 150°
sensorless BEMF control scheme was implemented for a three phase motor. DRV11873 can fit a wide range of
fan motors with the FS pin selection function. Voltage surge protection scheme prevents the input VCC capacitor
from over charge during motor braking mode. DRV11873 has multiple built in protection blocks including UVLO,
over current protection, lock protection and thermal shut down protection.
SPEED CONTROL
DRV11873 can control motor speed through either the PWMIN or VCC pin. Motor speed will increase with higher
PWMIN duty cycle or VCC input voltage. The curve of motor speed (RPM) vs PWMIN duty cycle or VCC input
voltage is close to linear in most cases. However, motor characteristics will affect the linearity of this speed
curve. DRV11873 can operate at low VCC input voltage down to 4.1 V. The PWMIN pin is pulled up to V5
internally and the frequency range can vary from 15 kHz to 100 kHz. The motor driver MOSFETs will operate at
constant switching frequency 125 kHz when the FS pin is pulled high and 62.5 kHz when the FS pin is pulled
low. With this high switching frequency, DRV11873 can eliminate audible noise and reduce the ripple of VCC
input voltage and current.
FREQUENCY GENERATOR
FG output is a 50% duty square wave output in the normal operation condition. Its frequency represents the
motor speed and phase information. FG pin is an open drian output. An external pull up resistor is needed to
connect external system. During the start up FG output will stay at high impedance until the motor speed reaches
certain level and BEMF is detected. If FG is not used, this pin can be left for floating. FG pin can be tie to either
5 V or VCC through a pull up resistor. Normally the pull up resistor value can be 100 kΩ or higher. During lock
protection condition, FG output will keep high until the lockout protection is dismissed and restart completed. A
current limit function has been built in for FG pin. It will prevent FG open drain MOSFET get damaged in case
VCC or 5 V directly connected to FG pin by accident. To calculate RPM based on FG frequency, please refer to
below equation.
(FG ? 60)
RPM =
pole pairs
(1)
Where FG is in hertz (Hz).
FS SETTING
DRV11873 can fit a wide range of fan motors by setting the FS pin. For high speed fan motors with low motor
winding resistance and low inductance, the FS pin should be pulled high. For low speed fan motors with high
motor winding resistance and high inductance, the FS pin should be pulled low. Through FS pin selection,
DRV11873 can be used for wide applications from low speed refrigerator cooling fans to high speed server
cooling fans. FS status can only be set during device power up.
LOCK PROTECTION AND RD OUTPUT
If the motor is blocked or stopped by the external force, the lock protection will be triggered after detection time.
During lock detection time, the circuit monitors FG signal. If the FG output is high during lock detection time, the
lock protection will stop driving the motor. After lock release time, DRV11873 will resume driving the motor. If the
lock condition is still there, DRV11873 will proceed with next lock protection cycle until the lock condition is
removed. With this lock protection, the motor and device will not get over heated or be damaged. A different FS
setting will determine a different lock detection and lock release time.
The RD pin is an open drain output which can be tied to either V5 or VCC through a pull-up resistor. Normally the
pull-up resistor value can be 100 kΩ or higher. During the lock protection condition, RD output will keep high until
the lock protection is dismissed and restart completed. A current limit function has been built in for the RD pin
which prevents the open drain MOSFET from damage in case VCC or V5 directly connects to the RD pin.
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REVERSE SPIN CONTROL FR
DRV11873 has an FR pin to set the motor for a forward spin or reverse spin. During DRV11873 power up, FR
status will be set. During normal operation, the spin direction of the motor will not be changed when the FR
status is changed. The FR status can be reset after the next PWM rising edge if PWMIN was pulled low for 300
µs (when the FS status is high) or 600 µs (when the FS status is low).
5-V LDO
DRV11873 has a built-in 5-V LDO which can output a 20-mA load current. It can provide 5-V bias voltage for
external use. A 2.2-µF ceramic capacitor is recommend to connect closely on the PCB layout between V-5 pin
and ground.
OVER CURRENT PROTECTION
DRV11873 can adjust over current point through the external resistor connected to CS pin and ground. Without
using external current sense resistor, DRV11873 senses the current through power MOSFET. Therefore there is
no power loss during the current sensing. This current sense architecture improves the system efficiency. Short
CS pin to ground will disable over current protection. During over current protection, DRV11873 will only limit the
current to the motor and it will not shut down the operation. The over current threshold can be set by the value of
current sensing resistor through Equation 2.
6600
I (A) =
RCS (W)
(2)
UVLO
DRV11873 has a built-in UVLO function block. The hysteresis of UVLO threshold is 200 mV. The device will be
locked out when VCC reaches 4.1 V and woke up at 4.3 V.
THERMAL SHUTDOWN
DRV11873 has a built in thermal shunt down function, which will shut down the device when the junction
temperature is over 160°C and will resume operating when the junction temperature drops back to 150°C.
8
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DRV11873
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SLWS237 – NOVEMBER 2012
APPLICATION INFORMATION
DRV11873 only requires 5 external components. A 10-µF or higher ceramic capacitor connected to VCC and
ground is needed for decoupling purpose. During layout, the strategy of ground copper pour is very important to
enhance the thermal performance. For two or more layers, eight thermal vias are needed. Refer to Figure 1 for
an example of PCB layout. For high speed motors (FS = 1), which need higher start up current, three Schottkey
diodes are needed between phases U, V, W and ground. Each diode anode terminal needs to be connected to
ground and cathode terminal needs to be connected to either U or V or W.
Figure 1. PCB Layout
Copyright © 2012, Texas Instruments Incorporated
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Feb-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
DRV11873PWPR
ACTIVE
Package Type Package Pins Package Qty
Drawing
HTSSOP
PWP
16
2000
Eco Plan
Lead/Ball Finish
(2)
Green (RoHS
& no Sb/Br)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
CU NIPDAU
Level-2-260C-1 YEAR
(4)
-40 to 85
11873
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DRV11873PWPR
Package Package Pins
Type Drawing
SPQ
HTSSOP
2000
PWP
16
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
330.0
12.4
Pack Materials-Page 1
6.9
B0
(mm)
K0
(mm)
P1
(mm)
5.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV11873PWPR
HTSSOP
PWP
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
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