Connector for CompactFlash™ SCFB Series Unique eject mechanism achieves high operability and 5mm ejection stroke. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Features Applications ● Metal-plated structure enhances noise reduction and mechanical strength. ● ● Screw clamping structure strengthens mounting. Minimized depth design contributes to smaller body structure. ● ● ● For digital still cameras, digital camcorders, various personal digital assistants and printers For flat panel TVs For notebook PCs Combine Type For Compact Flash™ Typical Specifications Specifications Items TypeⅡ compatible For PC cards supporting CardBus Pin pitch For Express Card™ For CMOS Camera Module 1.27mm Numbers of pins 50pins Applicable media TypeⅠ, TypeⅡ Media ejection 5mm Mounting type Surface mounting type Mounting style Standard mount/Reverse mount Structure Eject mechanism Stand-off Performance 0/1.2mm Operating temperature range −20℃ to ＋60℃ Voltage proof 500V AC 1minute Insulation resistance （Initial） Contact resistance （Initial） Insertion and removal cycle 46 2 step 1,000MΩ min. 40mΩ max. 10,000cycles Connector for CompactFlash™ SCFB Series Product Line Media ejection structure Stand-off （mm） Mounting system Position of knob Right Left Right Left Right Left 0 Standard mount 2 step lever ejection type 1.2 0 Reverse mount Product No. Applicable card Ejector Drawing No. SCFB3A0300 SCFB3A0900 SCFB3A0200 SCFB3A1000 SCFB3A0400 SCFB3A0500 1 2 3 4 5 6 Pin header SCFB1A0500 TypeⅠ/TypeⅡ SCFB1A0900 SCFB1A0600 Note Pin headers and ejectors are supplied as separate parts. To apply these parts, solder the pin header to the printed circuit board, assemble the ejector to the pin header and screw cramp. Dimensions Unit:mm No. PC board mounting hole dimensions （Viewed from the mounting face side） Style 27.1 max. 2 step Standard type Stand–off 0mm Position of knob: Left Combine Type For Compact Flash™ PC board mounting side For PC cards supporting CardBus For Express Card™ For CMOS Camera Module ! ! 2-¿2.54 max. 2-M2×P0.4 × Card eject travel 27.65 29.05 25.95 (55) Card center #25 & " !' 2-ø2.54 max. 2-ø1 #26 #50 Pitch 0.635 43 43.5 0.7 5 1.27 #1 ! " 3.5 24.25 (51.6) 2.7 PC board mounting side 27.35 1.27 PC board mounting side 6 （Knob travel） Knob lock pos. 4.45 Card center 2.15 Knob eject pos. 2-M2×P0.4 5 Knob over tra. 4.1 # $ " % 22.15 32.4 22.15 6.3 max. 4.1 8 1.5 2 (40.9) 36.4 (48.35) 22.25 39.9 17 max. 3 min. Knob lock pos. Knob eject pos. 0.5 7.1 max. 5.3 max. 4.5 PC board mounting side Card end pos. " ! # Card end pos. Range of movement of the lever 27.1 26.1 0.7 #50 2-¿1 Knob over tra. #25 5 1.27 2.7 27.65 29.05 (55) '& 0.5 1.5 8 (51.6) 6（Knob stroke） 4.45 27.35 #26 Pitch 0.635 43 43.5 （Full height） 6.3 0.3max. For W-SIM （Full height） 0.3 max. 4.1 6.3 max. 22.15 36.4 (40.9) 32.4 22.15 4.1 Card center 2.15 3.5 Card eject stroke 5 1.27 2-M2×P0.4 × $%& 6.3 4.5 5.3 max. 7.1 max. 26.1 1 Card center #1 For SIM Card 8pins For Memory Stick™ Range of movement of the lever (48.35) 22.25 39.9 17 max. 2-M2×P0.4 3 min. 25.95 For microSD™ Card For Memory Stick Micro™ 2 step Standard type Stand–off 0mm Position of knob: Right 24.25 For SD Memory Card & "$ $ 47 Connector for CompactFlash™ SCFB Series Dimensions Unit:mm No. Style 2 step Standard type Stand–off 1.2mm Position of knob: Right 3 Knob over tra. 1.5 8 2-M2×P0.4 3.9 6 （Knob stroke） (53.6) 1.27 #25 PC board mounting side 2-M2×P0.4 3 min. 2-4.1 2-22.15 32.4 Card end pos. (40.9) 36.4 6.3 max. Card end pos. " " " " 17 max. × $% # (48.35) 22.25 39.9 26.1 Range of movement of the lever 27.1 max. 0.5 (Full height) 7.5 0.3 max. 2-ø2.54 max. '!! For CMOS Camera Module 7.1 max. 5.3 max. 4.5 2 step Standard type Stand–off 1.2mm Position of knob: Left 2-ø1 For PC cards supporting CardBus #50 Pitch 0.635 43 43.5 48.5 0.7 1.1 #26 PC board mounting side 5 #1 3.5 1.27 For Compact Flash™ Card eject stroke Card center 3.35 Combine Type 4.45 27.65 25.95 ' Knob lock pos. Knob eject pos. 5 For Memory Stick™ For Express Card™ ! " 6.3 max. 36.4 (40.9) 32.4 2-22.15 2-4.1 For W-SIM Card end pos. 3 0.5 0.2 max. ## $×#% & (Full height) 7.5 4.5 5.3 max. 7.1 max. 26.1 2-M2×P0.4 For SIM Card 8pins 27.1 max. (48.35) 22.25 39.9 17 max. 3 min. Range of movement of the lever For microSD™ Card ! For SD Memory Card For Memory Stick Micro™ PC board mounting hole dimensions （Viewed from the mounting face side） '( 8 1.5 Knob over tra. Knob lock pos. Knob eject pos. 2-M2×P0.4 Card center #25 2-ø1 #26 #50 Pitch 0.635 43 43.5 48.5 1.1 #1 1.27 3.9 1.27 2-ø2.54 max. 48 25.95 5.36 5 PC board mounting side & 5 4.45 27.65 （Knob stroke） PC board mounting side Card eject travel 3.5 Card center 3.35 6 4 & Connector for CompactFlash™ SCFB Series Dimensions Unit:mm No. PC board mounting hole dimensions （Viewed from the mounting face side） Style 2 step Reverse type Stand–off 0mm Position of knob: Right For SD Memory Card 2-3.6 min. " - -# & 22.65 13.5 min. 9.49 min. No pattern area , $ ) $ "&% + $ *& + & & & & !" 36.４ + , &# 0.635 '!$ , !"" ## For CMOS Camera Module 27.65 29.05 （$ %） , 27.35 × 2-M2×P0.4 *& % & For Compact Flash™ Land area For PC cards supporting CardBus 24.6 min. 26.65 2-M2×P0.4 25.95 For Memory Stick™ No part mounting 6 24.25 For Memory Stick Micro™ Combine Type 29.45 min. 29.75 ' ( ) ( # ") 5.4 2.4 2.6 For Express Card™ 2 step Reverse type Stand–off 0mm Position of knob: Left - 2-ø - &! # For W-SIM 2.25 min. 8.9 22 27.35 ,& % # （$ %） # 2.4 2-Ground pad $ &% + $ ,& + 5.3 $ * 5 #26 #1 #50 #25 23.1 min. 20.85 max. 26 min. 27.7 min. 3.1 min. '× Card end pos. # " # + # 0.5 For SIM Card 8pins ø1 .2 1.35 4.3 For microSD™ Card 21.75 39.9 (0.635×49=) 31.115 15.7 min. 2.5 max. Pitch 0.635 Width 0.35 2- 2.2 ø .1 ø1 " 2-3.6 min. '× !!" 43.5 7.1 min. 5 min. 2.5 min. ( ) * ) ! * #! !$% #! 49 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition（Reference） For SD Memory Card 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA（K）or CC（T）. 3. Temperature profile（Surface of products）. For microSD™ Card For W-SIM For Memory Stick Micro™ For Memory Stick™ Temperature (˚C ) For SIM Card 8pins 240℃(max.) 230℃(min.) 200 180℃ 150℃ 100 Room temperature Time (s) Pre-heating 90±30 sec. 10 sec.(max.) Combine Type Heating time sec. For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 50 Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.