DRV777 www.ti.com SLRS062 – DECEMBER 2012 7- bit Integrated Motor and Relay Driver Check for Samples: DRV777 FEATURES 1 • • • • • • • • • • • • (1) Supports up to 20V Output Pull-up Voltage –40°C to 125°C Operating Temperature Range Supports Wide Range of Stepper Motors, DC Motors, Relays, and Inductive Coils Low Output VOL of 0.4V (Typical) With – 140mA Current Sink per Channel at 5.0V Logic Input(1) – 1A Current Output when all 7 Channels Tied in Parallel(1) Compatible to 1.8V, 3.3V and 5.0V Microcontrollers and Logic Interface Internal Free-wheeling Diodes for Inductive Kick-back Protection Input Pull-down Resistors Allows Tri-stating the Input Driver Input RC-Snubber to Eliminate Spurious Operation in Noisy Environment Low Input and Output Leakage Currents Easy to use Parallel Interface ESD Protection Exceeds JESD 22 – 2kV HBM, 500V CDM Available in 16-pin SOIC and TSSOP Packages Total current sink may be limited by the internal junction temperature, absolute maximum current levels etc - refer to the Electrical Specifications section for details. APPLICATIONS • • • • • • Unipolar Stepper Motor Drivers Relay and Inductive Load Drivers Solenoid Drivers Lamp and LED Displays Logic Level Shifter General Low-Side Switch Applications Functional Diagram IN1 1 16 OUT1 IN2 2 15 OUT2 IN3 3 14 OUT3 IN4 4 13 OUT4 OUT5 IN5 5 12 IN6 6 11 OUT6 IN7 7 10 OUT7 GND 8 9 COM DRV777 TSSOP/SOIC DESCRIPTION DRV777 motor driver features 7 low output impedance drivers that minimize on-chip power dissipation. DRV777 supports 1.8V to 5V CMOS logic input interface thus making it compatible to a wide range of micro-controllers and other logic interfaces. DRV777 features an improved input interface that minimizes the input DC current drawn from the external drivers. Device also features an input RC snubber that greatly improves its performance in noisy operating conditions. All channel inputs feature an internal input pull-down resistor thus allowing input logic to be tri-stated. DRV777 also supports other logic input levels, e.g. TTL and 1.8V; see typical characteristics section for details. As shown in the Functional Diagram, each output of the DRV777 features an internal free-wheeling diode connected in a common-cathode configuration at the COM pin. Device provides flexibility of increasing current sink capability through combining several adjacent channels in parallel. Under typical conditions DRV777 can support up to 1.0A of load current when all 7channels are connected in parallel. DRV777 is available in 16-pin SOIC and 16-pin TSSOP packages. Table 1. DRV777 Function Table(1) INPUT (IN1 – IN7) OUTPUT (OUT1–OUT7) L H+(2) H L Z +(2) H (1) L = Low-level (GND); H= High-level; Z= High-impedance; (2) H+ = Pull-up-level 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated DRV777 SLRS062 – DECEMBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) TJ PART NUMBER –40°C to 125°C (1) PACKAGE TOP-SIDE MARKING DRV777DR 16-Pin SOIC Reel of 2500 DRV777 DRV777PWR 16-Pin TSSOP Reel of 2000 DRV777 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DEVICE INFORMATION IN1 1 16 OUT1 IN2 2 15 OUT2 IN3 3 14 OUT3 IN4 4 13 OUT4 16-Pin SOIC/TSSOP COM OUTX RC Filter/Snubber RIN=3kQ INX IN5 5 IN6 6 11 OUT6 IN7 7 10 OUT7 GND 8 9 COM 12 OUT5 NFET Pull-down 300kQ ESD Figure 1. DRV777 PINOUT CIN= 9pF ESD Figure 2. Channel Block Diagram DRV777 PIN DESCRIPTION NAME PIN NUMBER IN1 – IN7 GND COM OUT7 – OUT1 2 DESCRIPTION 16-SOIC 16-TSSOP 1–7 1–7 8 8 Ground Reference Pin 9 9 Internal Free-Wheeling Diode Common Cathode Pin 10–16 10–16 Logic Input Pins IN1 through IN7 Channel Output Pins OUT7 through OUT1 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV777 DRV777 www.ti.com SLRS062 – DECEMBER 2012 ABSOLUTE MAXIMUM RATINGS (1) Specified at TJ = –40°C to 125°C unless otherwise noted. VALUE MIN MAX –0.3 UNIT VIN Pins IN1- IN7 to GND voltage 5.5 V VOUT Pins OUT1 – OUT7 to GND voltage 20 V VCOM Pin COM to GND voltage 20 V Max GND-pin continuous current (100ºC < TJ < +125°C) 700 mA Max GND-pin continuous current (TJ < +100°C) 1.0 A 16 Pin - SOIC 0.86 W 16 Pin - TSSOP IGND PD Total device power dissipation at TA = 85°C ESD 0.68 W ESD Rating – HBM 2 kV ESD Rating – CDM 500 V TJ Operating virtual junction temperature –55 150 °C Tstg Storage temperature range –55 150 °C (1) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS (1) (2) PACKAGE θJC θJA (3) DERATING FACTOR ABOVE TA = 25ºC TA < 25°C TA = 70°C TA = 85°C High-K 16-Pin SOIC 46°C/W 75°C/W 13.33 mW/ºC 1.66 W 1.06 W 0.86 W 0.59 W High-K 16-Pin TSSOP 49°C/W 95°C/W 10.44 mW/ºC 1.31 W 0.84 W 0.68 W 0.47 W BOARD (1) (2) (3) TA = 105°C Maximum dissipation values for retaining device junction temperature of 150°C Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance Operating at the absolute TJ-max of 150°C can affect reliability– for higher reliability it is recommended to ensure TJ < 125°C RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) PARAMETER MIN TYP MAX UNIT VOUT Channel off-state output pull-up voltage 16 V VCOM COM pin voltage 16 V IOUT(ON) Per channel continuous sink current TJ Operating junction temperature (1) VINx = 3.3V 100 (1) VINx = 5.0V 140 (1) –40 125 mA ºC 1) Refer to ABSOLUTE MAXIMUM RATINGS for TJ dependent absolute maximum GND-pin current Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV777 3 DRV777 SLRS062 – DECEMBER 2012 www.ti.com ELECTRICAL CHARACTERISTICS Specified over the recommended junction temperature range TJ = –40°C to 125°C and over recommended operating conditions unless otherwise noted. Typical values are at TJ = 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT INPUTS IN1 THROUGH IN7 PARAMETERS VI(ON) IN1–IN7 logic high input voltage Vpull-up = 3.3 V, Rpull-up = 1 kΩ, IOUTX = 3.2 mA VI(OFF) IN1–IN7 logic low input voltage Vpull-up = 3.3 V, Rpull-up = 1 kΩ, (IOUTX < 20 µA) 1.65 V 0.4 II(ON) IN1–IN7 ON state input current Vpull-up = 3.3 V, VINx = 3.3 V 12 II(OFF) IN1–IN7 OFF state input leakage Vpull-up = 3.3 V, VINx = 0 V 0.6 V 25 uA 250 nA OUTPUTS OUT1 THROUGH OUT7 PARAMETERS VINX = 3.3 V, IOUTX = 100 mA 0.36 VINX = 5.0 V, IOUTX = 140 mA 0.40 VOL OUT1–OUT7 low-level output voltage IOUT(ON) OUT1–OUT7 ON-state continuous current (1) (2) at VOUTX = 0.4V VINX = 3.3 V, VOUTX = 0.4 V 80 100 VINX = 5.0 V, VOUTX = 0.4 V 95 140 IOUT(OFF)(ICEX) OUT1–OUT7 OFF-state leakage current VINX = 0 V, VOUTX = VCOM = 16 V 0.49 V mA 0.5 µA SWITCHING PARAMETERS (3) (4) tPHL OUT1–OUT7 logic high propagation delay VINX = 3.3V, Vpull-up = 12 V, Rpull-up = 1 kΩ 50 70 ns tPLH OUT1–OUT7 logic low propagation delay VINX = 3.3V, Vpull-up = 12 V, Rpull-up = 1 kΩ 121 140 ns t CHANNEL Channel to Channel delay Over recommended operating conditions and with same test conditions on channels. 15 50 ns RPD IN1–IN7 input pull-down Resistance 300k 390k ζ IN1–IN7 Input filter time constant COUT OUT1–OUT7 output capacitance 210k VINX = 3.3 V, VOUTX = 0.4 V Ω 9 ns 15 pF FREE-WHEELING DIODE PARAMETERS (5) (4) VF Forward voltage drop IF-peak Diode peak forward current (1) (2) (3) (4) (5) 4 IF-peak = 140 mA, VF = VOUTx – VCOM 1.2 V 140 mA The typical continuous current rating is limited by VOL= 0.4V. Whereas, absolute maximum operating continuous current may be limited by the Thermal Performance parameters listed in the Dissipation Rating Table and other Reliability parameters listed in the Recommended Operating Conditions Table. Refer to the Absolute Maximum Ratings Table for TJ dependent absolute maximum GND-pin current. Rise and Fall propagation delays, tPHL and tPLH, are measured between 50% values of the input and the corresponding output signal amplitude transition. Guaranteed by design only. Validated during qualification. Not measured in production testing. Not rated for continuous current operation – for higher reliability use an external freewheeling diode for inductive loads resulting in more than specified maximum free-wheeling. diode peak current across various temperature conditions Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV777 DRV777 www.ti.com SLRS062 – DECEMBER 2012 APPLICATION INFORMATION TTL and other Logic Inputs DRV777 input interface is specified for standard 1.8V, 3V and 5V CMOS logic interface. Refer to Figure 8 and Figure 9 to establish VOL and the corresponding typical load current levels for various input voltage ranges. Application Information section shows an implementation to drive 1.8V relays using DRV777. Input RC Snubber DRV777 features an input RC snubber that helps prevent spurious switching in noisy environment. Connect an external 1kΩ to 5kΩ resistor in series with the input to further enhance DRV777’s noise tolerance. High-impedance Input Drivers DRV777 features a 300kΩ input pull-down resistor. The presence of this resistor allows the input drivers to be tristated. When a high-impedance driver is connected to a channel input the DRV777 detects the channel input as a low level input and remains in the OFF position. The input RC snubber helps improve noise tolerance when input drivers are in the high-impedance state. On-chip Power Dissipation Use the below equation to calculate DRV777 on-chip power dissipation PD: N PD = å VOLi ´ ILi i=1 Where: N is the number of channels active together. VOLi is the OUTi pin voltage for the load current ILi. (1) Thermal Reliability It is recommended to limit DRV777 IC’s die junction temperature to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation. Use the following equation to calculate the maximum allowable on-chip power dissipation for a target IC junction temperature: PD(MAX) = (T J(MAX) - TA ) qJA Where: TJ(MAX) is the target maximum junction temperature. TA is the operating ambient temperature. θJA is the package junction to ambient thermal resistance. (2) Improving Package Thermal Performance The package θJA value under standard conditions on a High-K board is listed in the DISSIPATION RATINGS. θJA value depends on the PC board layout. An external heat sink and/or a cooling mechanism, like a cold air fan, can help reduce θJA and thus improve device thermal capabilities. Refer to TI’s design support web page at www.ti.com/thermal for a general guidance on improving device thermal performance. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV777 5 DRV777 SLRS062 – DECEMBER 2012 www.ti.com Application Examples One Amp Unipolar DC Motor Driver An implementation of DRV777 for driving a uniploar DC motor is shown in Figure 3. With all of the channels tied together and the input being driven at 5V, the driver can sink 1A of current. With a VOL of 0.4V this creates a driver with 400mΩ. The input snubber circuitry is great for PWM applications that need high noise immunity. These two features make DRV777 an ideal choice for power efficient high duty cycle motor driving applications. Logic Input (5V) DRV777 IN1 VSUP OUT1 + IN2 OUT2 IN3 OUT3 IN4 OUT4 IN5 OUT5 IN6 OUT6 IN7 OUT7 M _ GND VSUP COM Figure 3. DRV777 as a DC Motor Driver 6 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV777 DRV777 www.ti.com SLRS062 – DECEMBER 2012 Unipolar Stepper Motor Driver Figure 4 shows an implementation of DRV777 for driving a uniploar stepper motor. The unconnected input channels can be used for other functions. When an input pin is left open the internal 300kΩ pull down resistor pulls the respective input pin to GND potential. For higher noise immunity use an external short across an unconnected input and GND pins. Motor Motor Supply (Up to 8V) VSUP Motor Control Pulses (3V to 5V) DRV777 IN1 OUT1 Phase_A IN2 OUT2 Phase_C IN3 OUT3 Phase_B IN4 OUT4 Phase_D IN5 OUT5 IN6 OUT6 IN7 OUT7 GND VSUP COM Figure 4. DRV777 as a Stepper Motor Driver Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV777 7 DRV777 SLRS062 – DECEMBER 2012 www.ti.com Multi-Purpose Sink Driver When configured as per Figure 5 DRV777 can be used as a multi-purpose driver. The output channels can be tied together to sink more current. DRV777 can easily drive motors, relays & LEDs with little power dissipation. The COM pin must be tied to the supply of whichever inductive load is to be protected by the free-wheeling diode. VSUP Logic Inputs (1.8V to 5V) + DRV777 VSUP IN1 OUT1 IN2 OUT2 IN3 OUT3 IN4 OUT4 IN5 OUT5 IN6 OUT6 IN7 OUT7 M _ IN1 NOR IN2 NOR IN3 GND VSUP COM Figure 5. DRV777 Multi-Purpose Sink Driver Application 8 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV777 DRV777 www.ti.com SLRS062 – DECEMBER 2012 1.8V Relay Driver To drive lower voltage relays, like 1.8V, connect two or more adjacent channels in parallel as shown in Figure 6. Connecting several channels in parallel lowers the channel output resistance and thus minimizes VOL for a fixed current. DRV777 can be used for driving 3V, 5V and 12V relays with similar implementation. VSUP 1.8V Relays DRV777 1.8V Logic 1.8V Logic 1.8V Logic IN1 OUT1 IN2 OUT2 IN3 OUT3 IN4 OUT4 IN5 OUT5 IN6 OUT6 IN7 OUT7 GND VSUP COM Figure 6. DRV777 Driving 1.8V Relays Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV777 9 DRV777 SLRS062 – DECEMBER 2012 www.ti.com TYPICAL CHARACTERISTICS TA = +25ºC Figure 7. Load Current 1-Channel; VOL=0.4V Figure 8. Load Current 7-Channels in parallel; VOL=0.4V Figure 9. Freewheeling Diode VF versus IF 10 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: DRV777 PACKAGE OPTION ADDENDUM www.ti.com 24-Jan-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) DRV777DR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 DRV777PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DRV777PWR Package Package Pins Type Drawing TSSOP PW 16 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 12.4 Pack Materials-Page 1 7.0 B0 (mm) K0 (mm) P1 (mm) 5.6 1.6 8.0 W Pin1 (mm) Quadrant 12.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DRV777PWR TSSOP PW 16 2000 364.0 364.0 27.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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