TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 SP3T SWITCH WITH IMPEDANCE DETECTION MICRO-USB SWITCH TO SUPPORT USB, UART, AUDIO, AND CHARGER Check for Samples: TSU5511 FEATURES • 1 • • • • • • • Compatible Accessories – USB Data Cable – UART Cable – Charger (Dedicated Charger or Host/Hub Charger) – Stereo Headset With Mic Integrated LDOs for VREF and Mic Bias USB Path Supports USB 2.0 High Speed Audio Path Provides Negative Rail Support and Click/Pop Reduction Supports Factory Test Mode 1.8-V Compatible I2C Interface ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) ESD Performance DP/DM/ID/VBUS to GND – ±8-kV Contact Discharge (IEC 61000-4-2) – ±15-kV Air Gap Discharge (IEC 61000-4-2) APPLICATIONS • Cellular Telephones YZP PACKAGE (LASER SCRIBE VIEW) A B C D E 4 3 2 1 PIN ASSIGNMENTS A B C D E 4 MIC 3 R2.2K ISET UART_TX USB_DM USB_DP INT UART_RX ID 2 DP SDA SCL DSS GND DM 1 CLDO VSUPPLY AUDIO_R AUDIO_L VBUS DESCRIPTION The TSU5511 is designed to interface the cell phone UART, USB, and audio chips with external peripherals via a micro-USB connector. The switch features impedance detection for identification of various accessories that are attached through DP and DM of the micro-USB port. When an accessory is plugged into the micro-USB port, the switch uses a detection mechanism to identify the accessory (see State Machine for details). It will then switch to the appropriate channel—data, audio, or UART. The TSU5511 has an I2C interface for communication with the cellphone baseband or applications processor. An interrupt is generated when anything plugged into the micro-USB is detected. Another interrupt is generated when the device is unplugged. Table 1. ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE WSCP – YZP (0.5-mm pitch) (1) (2) Tape and reel ORDERABLE PART NUMBER TSU5511YZPR TOP-SIDE MARKING 5F2 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com Table 2. SUMMARY OF CHARACTERISTICS TA = 25°C USB PATH UART PATH AUDIO PATH 2 2 2 1 5Ω 37 Ω 3Ω 8.8 Ω 1Ω 3Ω 1.1 Ω N/A 0.24 Ω 14 Ω 0.1 Ω 0.5 Ω Number of switches ON-state resistance (rON) ON-state resistance match (ΔrON) ON-state resistance flatness (rON(flat)) Turn-on/turn-off time (tON/tOFF) MIC PATH 1 ms 1 ms 1 ms 1 ms >720 MHz >300 MHz >900 MHz >67 MHz OFF isolation (OISO) –22 dB -40 dB –75 dB –100 dB Crosstalk (XTALK) –40 dB -40 dB –50 dB –50 dB N/A N/A 0.05% 0.0017% 100 nA 100 nA 100 nA 100 nA Bandwidth (BW) Total harmonic distortion (THD) Leakage current (INO(OFF)/INC(OFF)) Package options YZP package, 0.5-mm pitch BLOCK DIAGRAM VSUPPLY UART_TX UART Supply Detect UART_ RX Switch Matrix USB VBUS 0.6V 3.5 V USB_DM _ DM USB_DP DP Micro USB ID AUDIO_L AUDIO AUDIO_R MIC 75 mA Negative Rail and Click/Pop Free 200 kW INT Logic & I2C SDA 2.3, 2.6V DP/ DM Comparators 10nF ADC SCL GND 2 2.21kW LDO ... Processor 680 W ISET DSS Noise Filter Cap = pin on MUIC1 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 SWITCH MATRIX BLOCK DIAGRAM UART _RX VBUS UART _TX DUSB_DM D+ USB _DP ID AUDIO _L AUDIO _R MIC Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 3 TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com TERMINAL FUNCTIONS TERMINAL 4 NAME NO. TYPE DESCRIPTION AUDIO_L D1 I/O Stereo audio left channel AUDIO_R C1 I/O Stereo audio right channel CLDO A1 O Capacitor connection for LDO noise filtering DM E2 I/O Common I/O port for USB, UART, Audio. Connected to USB receptacle. DP E3 I/O Common I/O port for USB, UART, Audio. Connected to USB receptacle. DSS C2 I GND D2 GND ID D3 I/O Common I/O port for microphone, ID detection INT B3 O Open-drain interrupt output. Connect an external pullup resistor. ISET B4 O Output to charger for high-current charging mode. Open-drain output. MIC A4 I/O Microphone signal R2.2K A3 I 2.21 kΩ connection for microphone bias SCL B2 I I2C clock input. Connect an external pullup resistor. SDA A2 I/O I2C data. Connect an external pullup resistor. UART_RX C3 I/O UART receive data UART_TX C4 I/O UART transmit data USB_DM D4 I/O USB D– connected to host USB_DP E4 I/O USB D+ connected to host VBUS E1 I VBUS power supply from USB receptacle VSUPPLY B1 I 2.8-V to 4.4-V battery supply voltage Pulldown or pullup resistor connection to determine default switch Ground Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) VBUS Supply voltage from USB connector VSUPPLY Supply voltage from battery MIN MAX –0.5 28 UNIT V –0.5 6 V VUSBIO USB switch –0.5 VSUPPLY+0.5 V VUARTIO UART switch –0.5 VSUPPLY+0.5 V Audio switch –1.5 VSUPPLY+0.5 Mic switch –0.5 VSUPPLY+0.5 DSS, SCL, SDA –0.5 VSUPPLY+0.5 VAUDIO Switch I/O voltage range VMICIO V VLOGICIO Logic input, output and I/O voltage ranges IBUS Input current on VBUS pin 100 mA ISUPPLY Input current on VSUPPLY pin 100 mA IGND Continuous current through GND 100 mA IK Analog port diode current 50 mA ISW-DC ON-state continuous switch current –60 60 mA ISW-PEAK ON-state peak switch current –150 150 mA IIK Digital logic input clamp current –50 mA ILOGIC_O Continuous current through logic output 50 mA Tstg Storage temperature range 150 °C (1) (2) –50 VL < 0 –65 V Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. THERMAL IMPEDANCE RATINGS UNIT qJA Package thermal impedance YZP package 75.5 °C/W UNIT RECOMMENDED OPERATING CONDITIONS VBUS Supply voltage from USB connector VSUPPLY Supply voltage from battery VUSBIO VUARTIO VAUDIO MIN MAX 4.35 6.7 V 2.8 4.4 V 0 3.6 UART switch 0 VSUPPLY Audio switch –1.3 1.3 Mic switch 0 2.3 DSS, SCL, SDA 0 VSUPPLY USB switch Switch I/O voltage range VMICIO V VLOGICIO Logic input, output and I/O voltage ranges ISW-DC ON-state continuous switch current mA ISWPEAK ON-state peak switch current mA TA Ambient temperature –40 85 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 V °C 5 TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS TA = –40°C to 85°C, typical values are at VSUPPLY = 3.6 V, VBUS = 5 V, TA = 25°C (unless otherwise noted) PARAMETER VSUPPLY supply current SYMBOL VSUPPLY = 4.2 V, VBUS = 0 V, ADC_EN = 0, IVSUPPLY VBUS supply current VBUS detect threshold TEST CONDITIONS VSUPPLY = 3.6 V, VBUS = 5 V, ADC_EN = 0, IVBUS VBUSDET TYP MAX CP_EN = 0, SEMREN =0 MIN 6 10 CP_EN = 0, SEMREN =1 6 10 CP_EN = 1, SEMREN =1 60 70 CP_EN = 0, SEMREN =0 45 60 CP_EN = 0, SEMREN =1 45 60 CP_EN = 1, SEMREN =1 80 98 3.5 4 VBUS = 0 to 5 V, read the INT 3 LDO voltage = 2.6 V 2.2 LDO voltage = 2.3 V 1.95 Microphone removal threshold VMRCOMP Ramp ID down, read the INT SEND/END threshold VSECOMP LDO voltage = 2.3 or 2.6 V, ramp ID up from 0 V, read the INT UNIT mA mA V V 0.15 V ID resistance 1 RID1 ID_200 = 1, VSUPPLY = 3.6 V 160 200 240 kΩ ID resistance 2 RID2 ID_620 = 1, VSUPPLY = 3.6 V 496 620 744 Ω LDO ELECTRICAL CHARACTERISTICS TA = –40°C to 85°C, typical values are at VSUPPLY = 3.6 V, VBUS = 5 V, TA = 25°C (unless otherwise noted) PARAMETER Input voltage Output voltage Max output current Power supply rejection Integrated output noise SYMBOL MIN TYP MAX VBUS 4.35 5 6.7 VSUPPLY 2.8 VOUT-26 VOUT-23 IO-26 IO-23 PSR217 TEST CONDITIONS IO = 0 mA 4.4 2.54 2.6 2.65 2.2 2.3 2.35 10 Measured at R2.2K pin 500 UNIT V V mA VOUT = 2.3 V, VSUPPLY = 3.2 V, IO = 150 to 450 mA, f = 217 Hz –50 dB PSR1k f = 1 kHz –42 dB en-OUT VOUT = 2.3 V, VSUPPLY = 3.2 V, IO = 150 to 450 mA, f = 20 Hz to 20 kHz (A-weighted) 1 50 mV Rise time 1 tr1 IO = 20 mA, R2.2K = 0 to 2.6 V 178 ms Rise time 2 tr2 IO = 20 mA, R2.2K = 2.3 to 2.6 V 260 ms Fall time tf IO = 0 mA, R2.2K = 2.6 to 2.3 V 2.5 ms 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 USB SWITCH ELECTRICAL CHARACTERISTICS FOR 2.8 V to 4.4 V SUPPLY TA = –40°C to 85°C, typical values are at VSUPPLY = 3.6 V, VBUS = 5 V, TA = 25°C (unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Analog Switch Analog signal range VUSBIO 0 VI = 0 V to 3.6 V, IO = –2 mA, VSUPPLY = 3.0 V, CP_EN = 1, Switch ON VI = 0.4 V, IO = –2 mA, VSUPPLY = 3.0 V, CP_EN = 1, Switch ON ON-state resistance rON ON-state resistance match between channels ΔrON ON-state resistance flatness rON(flat) VI = 0 V to 3.6 V, IO = –2 mA, VSUPPLY = 3.0 V CP_EN = 1, Switch ON VI or VO OFF leakage current (1) IIO(OFF) VI = 0.3 V, VO = 2.5 V or VI = 2.5 V, VO = 0.3 V, VSUPPLY = 4.4 V, Switch OFF IIO(ON) VI = OPEN, VO = 0.3 V or 2.5 V, VSUPPLY = 4.4 V, CP_EN = 1, Switch ON VO ON leakage current (1) 3.6 V 4.5 10 Ω 1 1.5 Ω 0.5 1 Ω 25 360 nA 10 360 nA Dynamic tON VI or VO = VSUPPLY, RL = 50 Ω, CL = 35 pF CP_EN = 1 Turn-ON time tOFF VI or VO = VSUPPLY, RL = 50 Ω, CL = 35 pF, CP_EN = 0 Turn-OFF time (1) CI(OFF) DC bias = 0 V or 3.6 V f = 10 MHz, CP_EN = 0, Switch OFF VO OFF capacitance (1) CO(OFF) DC bias = 0 V or 3.6 V f = 10 MHz, CP_EN = 0, Switch OFF VI, VO ON capacitance CI(ON), CO(ON) DC bias = 0 V or 3.6 V f = 10 MHz, CP_EN = 1, Switch ON BW RL = 50 Ω, CP_EN = 1, Switch ON OFF Isolation OISO f = 240 MHz, RL = 50 Ω, CL = 20 pF, CP_EN = 0, Switch OFF Crosstalk XTALK f = 240 MHz, RL = 50 Ω, CL = 20 pF, CP_EN = 1, Switch ON VI OFF capacitance (1) Bandwidth (1) From receipt of I2C ACK bit From receipt of I2C ACK bit 1 ms 1 ms 6.5 pF 3 pF 9 pF 830 MHz –20 dB –42 dB VI = voltage asserted on DP and DM pins. VO = voltage asserted on USB_DP and USB_DM pins. IO = current on the USB_DP or USB_DM pins. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 7 TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com UART SWITCH ELECTRICAL CHARACTERISTICS FOR 2.8 V to 4.4 V SUPPLY TA = –40°C to 85°C, typical values are at VSUPPLY = 3.6 V, VBUS = 5 V, TA = 25°C (unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Analog Switch Analog signal range VUARTIO 0 VI = 0 V to 2.8 V, IO = –2 mA, VSUPPLY = 2.8 V, CP_EN = 1, Switch ON VI = 0.4 V, IO = –2 mA, VSUPPLY = 2.8 V, Switch ON ON-state resistance rON ON-state resistance match between channels ΔrON ON-state resistance flatness rON(flat) VI = 0 V to 2.8 V, IO = –2 mA, VSUPPLY = 2.8 V Switch ON VI or VO OFF leakage current (1) IIO(OFF) VI = 0.3 V, VO = 3.3 V or VI = 3.3 V, VO = 0.3 V, VSUPPLY = 3.6 V, Switch OFF IIO(ON) VI = OPEN, VO = 0.3 V or 3.3 V, VSUPPLY = 3.6 V, CP_EN = 1, Switch ON VO ON leakage current (1) VSUPPLY V 37 61 Ω 2 3.5 Ω 20 27 Ω 100 360 nA 100 360 nA Dynamic Turn-ON time tON VI or VO = VSUPPLY, RL = 50 Ω, CL = 35 pF From receipt of I2C ACK bit 1 ms Turn-OFF time tOFF VI or VO = VSUPPLY, RL = 50 Ω, CL = 35 pF From receipt of I2C ACK bit 1 ms 6.5 pF 8 pF 22 pF 295 MHz –100 dB –98 dB (1) CI(OFF) DC bias = 0 V or VSUPPLY, f = 10 MHz, Switch OFF VO OFF capacitance (1) CO(OFF) DC bias = 0 V or VSUPPLY, f = 10 MHz, Switch OFF VI, VO ON capacitance CI(ON), CO(ON) DC bias = 0 V or VSUPPLY, f = 10 MHz, Switch ON BW RL = 50 Ω, Switch ON OFF Isolation OISO f = 250 kHz, RL = 50 Ω, CL = 20 pF, Switch OFF Crosstalk XTALK f = 250 kMHz, RL = 50 Ω, CL = 20 pF, Switch ON VI OFF capacitance (1) Bandwidth (1) 8 VI = voltage asserted on DP and DM pins. VO = voltage asserted on UART_RX and UART_TX pins. IO = current on the UART_RX and UART_TX pins. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 AUDIO SWITCH ELECTRICAL CHARACTERISTICS FOR 2.8 V to 4.4 V SUPPLY TA = –40°C to 85°C, typical values are at VSUPPLY = 3.6 V, VBUS = 5 V, TA = 25°C (unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Analog Switch Analog signal range VAUDIOIO –1.3 V 3.8 6 Ω ON-state resistance rON ON-state resistance match between channels ΔrON VI = 1.3 V, IO = –20 mA, VSUPPLY = 2.8 V, AUDIO_L or AUDIO R, DM or DP 1 1.3 Ω ON-state resistance flatness rON(flat) VI = ±1.3 V, IO = –20 mA, VSUPPLY = 2.8 V, AUDIO_L or AUDIO R, DM or DP 0.1 0.25 Ω VI or VO OFF leakage current (1) VI = 0 V, VO = 1.3 V or VI = 1.3 V, VO = 0.3 V, Switch OFF IIO(OFF) 25 400 nA IIO(ON) VI = OPEN, VO = ±1.3 V, VSUPPLY = 4.4 V, Switch ON 25 400 nA VO ON leakage current (1) AUDIO_L or AUDIO R, DM or DP 1.3 VI = ±1.3 V, IO = –20 mA, VSUPPLY = 2.8 V, Dynamic Turn-ON time tON VI or VO = VSUPPLY, RL = 50 Ω, CL = 35 pF From receipt of I2C ACK bit 1 ms Turn-OFF time tOFF VI or VO = VSUPPLY, RL = 50 Ω, CL = 35 pF From receipt of I2C ACK bit 1 ms (1) CI(OFF) DC bias = 0 V or 2.6 V, f = 10 MHz, Switch OFF 4.5 pF VO OFF capacitance (1) CO(OFF) DC bias = 0 V or 2.6 V , f = 10 MHz, Switch OFF 6.5 pF VI, VO ON capacitance CI(ON), CO(ON) DC bias = 0 V or 2.6 V, f = 10 MHz, Switch ON 9 pF VI OFF capacitance (1) Bandwidth BW RL = 50 Ω, Switch ON 788 MHz OFF Isolation OISO f = 20 kHz, RL = 50 Ω, Switch OFF –100 dB Crosstalk XTALK f = 20 kHz, RL = 50 Ω, Switch ON –120 dB Total harmonic distortion THD RL = 16 Ω, CL = 20 pF, f = 20 Hz to 20 kHz, 2.6 Vpp 0.087 (1) 0.12 % VO = voltage asserted on DP and DM pins. VI = voltage asserted on AUDIO_R and AUDIO_L pins. IO = current on the DP and DM pins. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 9 TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com MIC SWITCH ELECTRICAL CHARACTERISTICS FOR 2.8 V to 4.4 V SUPPLY TA = –40°C to 85°C, typical values are at VSUPPLY = 3.6 V, VBUS = 5 V, TA = 25°C (unless otherwise noted) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Analog Switch Analog signal range VMICIO 0 ON-state resistance rON VI = 2.3 V, IO = –2 mA, VSUPPLY = 2.8 V, ON-state resistance flatness rON(flat) VI = 2.3 V , IO = –2 mA, VSUPPLY = 2.8 V MIC ID IIO(OFF) VI = 0.3 V, VO = 2.3 V or VI = 2.3 V, VO = 0.3 V, VSUPPLY = 4.4 V Switch OFF VI or VO OFF leakage current (1) VI = OPEN VO = 0.3 V or 2.5 V VSUPPLY = 4.4 V Switch ON IIO(ON) VO ON leakage current (1) MIC ID 2.3 V 9 12 Ω 0.5 1 Ω 5 200 nA 2 200 nA Dynamic Turn-ON time tON VI or VO = VSUPPLY, RL = 50 Ω, CL = 35 pF From receipt of I2C ACK bit 1 ms Turn-OFF time tOFF VI or VO = VSUPPLY, RL = 50 Ω, CL = 35 pF From receipt of I2C ACK bit 1 ms (1) CI(OFF) DC bias = 0 V or 3.6 V, f = 10 MHz, Switch OFF 6 pF VO OFF capacitance (1) CO(OFF) DC bias = 0 V or 3.6 V , f = 10 MHz, Switch OFF 6 pF VI, VO ON capacitance CI(ON), CO(ON) DC bias = 0 V or 3.6 V, f = 10 MHz, Switch ON 12 pF VI OFF capacitance (1) Bandwidth BW RL = 50 Ω, Switch ON 573 MHz OFF Isolation OISO f = 20 kHz, RL = 50 Ω, Switch OFF –37 dB Crosstalk XTALK f = 20 kHz to audio input, RL = 50 Ω, Switch ON –125 dB Total harmonic distortion THD RL = 600 Ω, CL = 20 pF, f = 20 Hz to 20 kHz, 2.6 Vpp (1) 10 0.07 0.075 % VI = voltage asserted on the ID pin. VO = voltage asserted on MIC pin. IO = current on the MIC pin. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 DIGITAL SIGNALS TA = –40°C to 85°C (unless otherwise noted), typical values are at VSUPPLY = 3.6 V, VBUS = 5 V, TA = 25°C PARAMETER SYMBOL TEST CONDITIONS MIN MAX UNIT DSS High-level input logic VIH Low-level input logic VIL Input leakage current IINLEAK VI = 0 V to VSUPPLY VSUPPLY × 0.7 VSUPPLY V 0 VSUPPLY × 0.3 V –1 1 mA SCL, SDA High-level input logic VIH Low-level input logic VIL 1.4 Input leakage current IINLEAK VI = 0 V to VSUPPLY VODOL IODL = 4 mA –1 V 0.4 V 1 mA 0.4 V INT, ISET Open-drain low Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 11 TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com APPLICATION INFORMATION Default Switch Position The default switch state (DSS) pin determines if the USB switches or UART switches are selected at startup. An internal pulldown resistor is present on the DSS pin, which selects the USB switches as the default at start-up. If the user wants to default to the UART switches at startup, the DSS pin must be pulled high. If the user wants to disable the switches, this must be done using an I2C write to the SW_Control register after initialization is complete. The default configuration with VBAT power disables the switches. If the user wants to use the switches, this must be done using an I2C write to the SW_Control register after initialization is complete. VBUS PRESENT ON POWER UP DSS Yes SWITCH STATES OPEN / PD USB PU UART x Disable No ID Impedance Detection The TSU5511 features impedance detection for identification of various accessories that are attached to the microUSB port. Each accessory is identified by a unique resistor value on the ID pin to ground. During ID detection, the device auto-calibrates an internal current source, using an external 2.21K ±1% resistor. The current source is then applied to the ID pin while an internal voltage reference is incremented until it matches the ID pin voltage. This produces a 4-bit ADC value corresponding to the ID resistance found. 2.6 V ID Resistor Tolerance ID No. ADC Value 0W 1% 0 0000 24 kW 1% 1 0001 56 kW 1% or 20% 2 0010 100 kW 1% 3 0011 130 kW 1% 4 0100 180 kW 1% 5 0101 240 kW 1% 6 0110 330 kW 1% 7 0111 430 kW 1% 8 1000 620 kW 1% 9 1001 910 kW 1% 10 1010 Open N/A 11 1011 R2.2k Pin 2.21 kW ±1% ID Resistor Figure 1. Figure 1. Impedance Detection Circuitry 12 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 Supply Detection The TSU5511 can be powered by either VSUPPLY or VBUS. The TSU5511 will select VBUS as the power source when present and otherwise will select VSUPPLY as the power source when VSUPPLY is present and VBUS is not. Supply Selection and Shutdown Sequence VSUPPLY HANDSET STATUS MUIC STATUS POWER SUPPLY Yes ON Active VSUPPLY Yes OFF (S/W off) Shutdown Yes ON Active No OFF Shutdown No OFF Shutdown No ON (VBUS) Active VBUS Yes (charging) ON (VBUS) Active VBUS NORMAL CASE SUDDEN POWER LOSS NO BATTERY USB CHARGING VSUPPLY I2C Controlled Internal Comparator Operation Internal Comparator Logic Table I2C CONTROL REGISTER BIT COMPARATORS USB_DET_DI S ADC_EN SEMREN VBUS SE MR LDO 0 0 0 ON OFF OFF OFF 0 0 1 ON ON ON ON 0 1 0 ON OFF ON ON 0 1 1 ON ON ON ON 1 0 0 OFF OFF OFF OFF 1 0 1 ON ON ON ON 1 1 0 ON OFF ON ON 1 1 1 ON ON ON ON Software Flowchart Initialization Write Reg .03=3 Fh (DP/DM Open ) Write Reg .01=14h (2 .6V ,200 K,SEMREN ) Write Reg .02=02h (CHG _TYP ) Wait 250 ms Write Reg .02=42h ( INT_EN,CHG _TYP) IDLE Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 13 TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com Interrupt Handler Read Reg .04 N N VBUS =1 MR_ COMP =0 Y Y Charger Type = None N N Y Y SEND /END=1 or IDNO =0000 (0K)? Read Reg .05 N EAR/MIC MODE ? IDLE_MODE ? CHGDET =1? Y Write Reg .03=3Fh (DP/DM Open ) Write Reg .01=14h (2.6 V,200 K,SEMREN ) Write Reg .02=42h (INT_EN,CHG_ TYP) N Y Charger Type = Dedicated Charger Y Write Reg .01 = 4Ch (2 .3V ,2.2K,SEMREN ) Write Reg .02 = 02h (disable INT ) Wait 70 msec Read Reg . 04 DCPORT =1? N Charger Type = Charging Host Y IDLE Other Accessories CHPORT =1? Y N SEND /END=1? Charger Type = Invalid Charger SHORT Write Reg .02 = 42 h N EAR/MIC Mode OTG Invalid Device Y Write Reg .01 = 4Dh (2 .3V ,2.2K,SEMREN ,CP_EN) Write Reg .02 = 42h (INT_EN,CHG _TYP) Write Reg .03 =52 h IDNO=0000 (0K )? N Factory UART Y Write Reg .01=44 h Write Reg .03=09 h (MIC,Audio SW On) IDNO=0100 (130 K)? N SEND /END=1? Y Key Pressed N Factory USB Key Released Y Write Reg .01=45 h Write Reg .03=00 h IDNO=0010 (56K)? N TA Write Reg .01=44 h Write Reg .03 =3Fh Y IDNO = 0101 (180 K)? N USB Mode Write Reg .01=45h Write Reg .03=00h Wait for INT 14 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 FACTORY MODE FLOWCHART Factory Mode Write Reg. 01 = 15h (200K, 2.6V) Write Reg. 03 = 00h Enable USB path AUDIO_MODE Change N Y Write Reg. 03 = 12h Enable Audio Path MP3 Test N N Call Test Other Test Y Y N N SEND/END =1 * Y Write Reg. 03 = 00h USB path SEND/END =1 * Y CALL CONNECT N SEND/END =1 * Y CALL DISCONNECT SEND/END =1 * Y Write Reg. 03 = 00h (USB Path) * = 10ms debounce for this decision Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 15 TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com I2C Register Map ADDRESS (xxh) NAME TYPE RESET VALUE 0 Device ID R TBD 1 Control 1 R/W X0000000 2 Control 2 3 (1) SW Control R/W INT_Status R 5 Status R RFU (1) See b6 b5 b4 b3 VENDOR ID BITS (TI=0001) 0000XX01 R/W 4 b7 00000000 ( ID_2P2 ID_620 MIC_LP ID_200 VLDO INT_EN RFU MIC_ON DP[2:0] VBUS IDNO[3: 0] RFU RFU 1) CHGDET MR_COMP 00XXXXXX DCPORT CHPORT RFU b1 b0 REVISION BITS INTPOL SEND/EN D b2 CP_AUD RFU SEMREN ADC_EN CP_EN CHG_TYP USB_DET _DIS RFU RFU RFU RFU DM[2:0] Refer INT_Status Slave Address DESCRIPTION NAME SIZE (BITS) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Slave address 8 1 0 0 0 1 0 0 R/W Register Descriptions Device ID Address: 00H Reset Value: N/A Type: Read NAME SIZE (BITS) Device ID 8 DESCRIPTION A unique number for chip version 00000000 bits 0–3 = chip revision, bits 4–7 = Vendor ID (TI = 1xh, Maxim = 2xh) Control 1 Address: 01H Reset Value: x0000000 Type: Read/Write 16 NAME SIZE (BITS) ID_2P2 1 0: 2.21 kΩ switch open 1: Connect LDO to ID through 2.21 kΩ external resistor ID_620 1 0: 620 Ω switch open 1: Connect LDO to ID through 620 Ω internal resistor (used for video) ID_200 1 0: 200 kΩ switch open 1: Connect LDO to ID through 200 kΩ internal resistor VLDO 1 0: LDO voltage = 2.6 V (if manual switching mode) 1: LDO voltage = 2.3 V (if manual switching mode) SEMREN 1 0: Disable send/end and MIC removal comparators and LDO 1: Enable send/end and MIC removal comparators and LDO DESCRIPTION Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 NAME SIZE (BITS) ADC_EN 1 0: ADC and LDO disabled 1: ADC and LDO enabled CP_EN 1 0: charge pump disabled 1: charge pump enabled DESCRIPTION Control 2 Address: 02H ADDRESS (xxh) NAME TYPE b7 b6 b5 b4 b3 b2 b1 b0 2 Control 2 R/W INTPOL INT_EN MIC_LP CP_AUD RFU RFU CHG_TYP USB_DET _DIS 0 0 0 0 X X 0 1 b2 b1 b0 Reset Value NAME SIZE (BITS) INT_POL 1 0: Interrupt polarity = active low 1: interrupt polarity = active high INT_EN 1 0: All interrupts disabled (masked) 1: All interrupts enabled MIC_LP 1 0: Low power mode - MIC power pulsing disabled 1: Low power mode - MIC power pulsing enabled CP_AUD 1 0: Click/pop resistors on AUDIO_L and AUDIO_R disabled 1: Click/pop resistors on AUDIO_L and AUDIO_R enabled CHG_TYP 1 0: Charger type detection disabled 1: Charger type detection enabled USB_DET_DIS 1 0: USB detection enabled 1: USB detection disabled DESCRIPTION SW_Control Address: 03H ADDRESS (xxh) NAME TYPE b7 b6 03 SW Control R/W RFU MIC_ON X 0 Reset Value (1) b5 b4 b3 DP[2:0] See (1) DM[2:0] See (1) The reset value depends on VBUS status at power up. If VBUS presents, the default value depends on DSS pin state (refer to Default Switch Position section). If VBUS does not present, the default value is 111b (DM/DP switch is open). NAME SIZE (BITS) MIC_ON 1 0: MIC switching path open 1: MIC switching path connected to ID line 3 000: 001: 010: 011: DP DESCRIPTION DP connected to USB_DP DP connected to UART_TX DP connected to AUDIO_R Future Use (right Audio for Video) Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 17 TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com SIZE (BITS) NAME DM DESCRIPTION 000: DM connected to USB_DM 001: DM connected to UART_RX 010: DM connected to AUDIO_L 011: Future Use (left Audio for Video) 100–111: DM switching path open 3 INT_Status Address: 04H ADDRESS (xxh) NAME TYPE b7 b6 b5 b4 04 INT_Statu s R CHGDET MR_COM P SEND/EN D VBUS 0 0 0 0 Reset Value (1) b3 b2 b1 b0 IDNO[3:0] See (1) ADC value of the ID pin NAME SIZE (BITS) CHGDET 1 0: High-current charger not detected 1: High-current charger detected MR_COMP 1 0: MIC removal comparator low 1: MIC removal comparator high SEND/END 1 0: ID line not grounded 1: ID line grounded (send/end button pressed) VBUS 1 0: No power detected on VBUS 1: Power detected on VBUS 1 0000: 0001: 0010: 0011: 0100: 0101: 0110: 0111: 1000: 1001: 1010: 1011: IDNO DESCRIPTION ADC ADC ADC ADC ADC ADC ADC ADC ADC ADC ADC ADC determined determined determined determined determined determined determined determined determined determined determined determined ID ID ID ID ID ID ID ID ID ID ID ID impedance impedance impedance impedance impedance impedance impedance impedance impedance impedance impedance impedance = 0 Ω (grounded) = 24 kΩ = 56 kΩ = 100 kΩ = 130 kΩ = 180 kΩ = 240 kΩ = 330 kΩ = 430 kΩ = 620 kΩ = 910 kΩ = open Status Address: 05H ADDRESS (xxh) NAME TYPE b7 b6 b5 b4 b3 b2 b1 b0 5 Status R DCPORT CHPORT RFU RFU RFU RFU RFU RFU 0 0 X X X X X X Reset Value 18 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 NAME SIZE (BITS) DCPORT 1 0: Dedicated charger not detected 1: Dedicated charger detected CHPORT 1 0: Charging host port not detected 1: Charging host port detected DESCRIPTION Power Consumption Operating Modes Summary (with estimated power consumption) BAND GAP UVLO I2C DETECTION PLUG Z DETECTION CHARGE PUMP CHARGE PUMP (LOW CURRENT) TOTAL ICC (µA) Audio ON ON ON ON ON ON OFF 59 Audio (no active signal) ON ON ON ON ON OFF ON 14 UART ON ON ON ON ON OFF OFF 9 USB ON ON ON ON ON ON OFF 59 Travel Adapter ON ON ON ON OFF OFF OFF 8 IDLE ON ON ON ON OFF OFF OFF 8 Sleep OFF OFF OFF OFF OFF OFF OFF 0 ICC (µA) 3 2 1 2 1 50 5 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 19 TSU5511 SCDS304 – SEPTEMBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION VDD VSUPPLY Enter 2.6 V mode VOUT-26 = VMIC VMIC 100 nF R2 .2 K 4.7 µF 0 mA Enter 2.3 V mode VOUT-23 = VMIC CLDO GND 10 nF Figure 2. LDO Output Voltage VDD VSUPPLY Enter 2.6 V mode Sweep IO 0 -> 200 µA IO-26 = IO VMIC 100 nF R2 .2 K IO 4.7 µF CLDO Enter 2.3 V mode Sweep IO 0 -> 2 mA IO-23 = IO GND 10 nF Figure 3. Max Output Current VDD Enter 2.6 V mode tSU = t90% – t10% VSUPPLY VMIC 100 nF R2 .2 K 4.7 µF Enter 2.3 V mode Enter 2.6 V mode tr = t90% – t10% Enter 2.3 V mode Enter 2.6 V mode tf = t90% – t10% CLDO GND 10 nF Figure 4. LDO Rise/Fall Time A. 20 IO can be set with a resistor. Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 TSU5511 www.ti.com SCDS304 – SEPTEMBER 2010 PARAMETER MEASUREMENT INFORMATION (continued) VSUPPLY VPP = 100 mV VMIC R2 .2 K fPP 4.7 µF VDD = 3.2 V RL Enter 2.3 V mode RL = 15 kΩ and 5.1 kΩ fPP = 217 Hz PSR217 = 20*log10(VMIC/VSUPPLY) fPP = 1 kHz PSR1k = 20*log10(VMIC/VSUPPLY) CLDO GND 10 nF Figure 5. Power Supply Rejection A. VMIC should be V2.2K; add 200 pF on VSUPPLY in LDO output noise. VDD VSUPPLY VMIC R2 .2 K 4.7 µF RL Enter 2.3 V mode RL = 15 kΩ and 5.1 kΩ en-OUT = VMIC integrated noise 20 Hz to 20 kHz CLDO GND 10 nF Figure 6. Integrated Output Noise Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TSU5511 21 PACKAGE OPTION ADDENDUM www.ti.com 20-Sep-2010 PACKAGING INFORMATION Orderable Device TSU5511YZPR Status (1) ACTIVE Package Type Package Drawing DSBGA YZP Pins Package Qty 20 3000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) Level-1-260C-UNLIM Request Free Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Jun-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device TSU5511YZPR Package Package Pins Type Drawing SPQ DSBGA 3000 YZP 20 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 178.0 9.2 Pack Materials-Page 1 2.02 B0 (mm) K0 (mm) P1 (mm) 2.52 0.63 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Jun-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TSU5511YZPR DSBGA YZP 20 3000 220.0 220.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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