VISHAY SI4378DY-T1-E3

Si4378DY
New Product
Vishay Siliconix
N-Channel 20-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
20
rDS(on) (W)
ID (A)
0.0027 @ VGS = 4.5 V
25
0.0042 @ VGS = 2.5 V
22
D Ultra Low On-Resistance Using High Density
TrenchFETr Gen II Power MOSFET Technology
D Qg Optimized
D 100% Rg Tested
APPLICATIONS
D Synchronous Rectification
D Point-Of-Load
D
SO-8
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
G
Top View
S
Ordering Information: Si4378DY—E3
Si4378DY-T1—E3 (with Tape and Reel)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
20
Gate-Source Voltage
VGS
"12
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Continuous Source Current (Diode Conduction)a
IS
L = 0.1 mH
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
19
20
13
Operating Junction and Storage Temperature Range
70
A
2.9
IAS
PD
V
25
IDM
Pulsed Drain Current (10 ms Pulse Width)
Avalanche Current
ID
Unit
1.3
40
3.5
1.6
2.2
1
TJ, Tstg
−55 to 150
W
_C
THERMAL RESISTANCE RATINGS
Parameter
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Symbol
t v 10 sec
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
29
35
67
80
13
16
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 72918
S-40854—Rev. A, 03-May-04
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Si4378DY
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = 250 mA
0.6
IGSS
Typ
Max
Unit
1.8
V
VDS = 0 V, VGS = "12 V
"100
nA
VDS = 20 V, VGS = 0 V
1
VDS = 20 V, VGS = 0 V, TJ = 55_C
5
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
Diode Forward Voltagea
30
VDS w 5 V, VGS = 4.5 V
rDS(on)
mA
A
VGS = 4.5 V, ID = 25 A
0.0022
0.0027
VGS = 2.5 V, ID = 22 A
0.0034
0.0042
gfs
VDS = 10 V, ID = 25 A
150
VSD
IS = 2.9 A, VGS = 0 V
0.72
W
S
1.1
V
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
650
Total Gate Charge
Qg
55
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
8500
VDS = 10 V, VGS = 0 V, f = 1 MHz
VDS = 10 V, VGS = 4.5 V, ID = 25 A
10
0.8
td(on)
Rise Time
tr
Turn-Off Delay Time
VDD = 10 V, RL = 10 W
ID ^ 1 A, VGEN = 4.5 V, Rg = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
nC
16
Rg
Turn-On Delay Time
pF
1250
IF = 2.9 A, di/dt = 100 A/ms
1.3
2.0
85
130
65
100
140
210
50
80
50
80
W
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
60
60
50
40
40
I D − Drain Current (A)
I D − Drain Current (A)
VGS = 5 thru 2.5 V
50
30
20
2V
10
30
20
TC = 125_C
10
25_C
−55_C
0
0
1
2
3
4
VDS − Drain-to-Source Voltage (V)
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2
5
0
0.0
0.5
1.0
1.5
2.0
2.5
VGS − Gate-to-Source Voltage (V)
Document Number: 72918
S-40854—Rev. A, 03-May-04
Si4378DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
0.006
Capacitance
10000
0.005
8000
C − Capacitance (pF)
r DS(on) − On-Resistance ( W )
Ciss
VGS = 2.5 V
0.004
0.003
VGS = 4.5 V
0.002
6000
4000
0.000
0
0
10
20
30
40
50
0
60
4
Gate Charge
VDS = 10 V
ID = 25 A
5
12
16
20
On-Resistance vs. Junction Temperature
1.8
VGS = 4.5 V
ID = 25 A
1.6
rDS(on) − On-Resiistance
(Normalized)
V GS − Gate-to-Source Voltage (V)
6
8
VDS − Drain-to-Source Voltage (V)
ID − Drain Current (A)
4
3
2
1
1.4
1.2
1.0
0.8
0
0
10
20
30
40
50
60
0.6
−50
70
−25
0
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.015
r DS(on) − On-Resistance ( W )
50
TJ = 150_C
10
TJ = 25_C
0.012
ID = 25 A
0.009
0.006
0.003
0.000
1
0.00
25
TJ − Junction Temperature (_C)
Qg − Total Gate Charge (nC)
I S − Source Current (A)
Crss
Coss
2000
0.001
0.2
0.4
0.6
0.8
VSD − Source-to-Drain Voltage (V)
Document Number: 72918
S-40854—Rev. A, 03-May-04
1.0
1.2
0
2
4
6
8
10
VGS − Gate-to-Source Voltage (V)
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Si4378DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.4
60
ID = 250 mA
50
40
−0.0
Power (W)
V GS(th) Variance (V)
0.2
−0.2
30
−0.4
20
−0.6
10
−0.8
−50
−25
0
25
50
75
100
125
0
10−2
150
10−1
TJ − Temperature (_C)
1
10
100
600
Time (sec)
100
Safe Operating Area, Junction-to-Case
Limited by rDS(on)
10
10 ms
100 ms
1
1s
10 s
0.1
TC = 25_C
Single Pulse
dc
0.01
10
0.01
0.1
1
10
100
VDS − Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 67_C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10−4
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4
10−3
10−2
10−1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72918
S-40854—Rev. A, 03-May-04
Si4378DY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10−4
Document Number: 72918
S-40854—Rev. A, 03-May-04
10−3
10−2
10−1
Square Wave Pulse Duration (sec)
1
10
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