VISHAY SI9410BDY-T1

Si9410BDY
New Product
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (W)
ID (A)
0.024 @ VGS = 10 V
8.1
0.033 @ VGS = 4.5 V
6.9
D TrenchFETr Power MOSFETS
D
SO-8
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
G
Top View
S
Ordering Information: Si9410BDY
Si9410BDY-T1 (with Tape and Reel)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current (10 ms Pulse Width)
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
6.2
6.5
IDM
Continuous Source Current (Diode Conduction)a
V
8.1
ID
5.0
A
30
2.1
1.2
2.5
1.5
1.6
0.9
TJ, Tstg
Unit
W
_C
- 55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
40
50
70
85
20
24
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 72269
S-31409—Rev. A, 07-Jul-03
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Si9410BDY
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = 250 mA
1.0
IGSS
Typ
Max
Unit
3.0
V
VDS = 0 V, VGS = "20 V
"100
nA
VDS = 24 V, VGS = 0 V
1
VDS = 24 V, VGS = 0 V, TJ = 55_C
5
Static
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
VDS w 5 V, VGS = 10 V
rDS(on)
Forward Transconductancea
Diode Forward Voltagea
mA
30
A
VGS = 10 V, ID = 8.1 A
0.019
0.024
VGS = 4.5 V, ID = 6.9 A
0.026
0.033
gfs
VDS = 15 V, ID = 8.1 A
20
VSD
IS = 2.1 A, VGS = 0 V
0.8
1.2
15
23
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
2.5
Turn-On Delay Time
td(on)
10
15
15
25
30
45
11
20
25
50
Rise Time
VDS = 15 V, VGS = 10 V, ID = 8.1 A
tr
Turn-Off Delay Time
VDD = 15 V, RL = 15 W
ID ^ 1 A, VGEN = 10 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
3.2
IF = 2.1 A, di/dt = 100 A/ms
nC
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
30
30
VGS = 10 thru 5 V
4V
24
I D - Drain Current (A)
I D - Drain Current (A)
24
18
12
6
18
12
TC = - 125_C
6
3V
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VDS - Drain-to-Source Voltage (V)
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2
25_C
3.5
4.0
0
0.0
0.5
1.0
1.5
2.0
- 55_C
2.5
3.0
3.5
4.0
4.5
VGS - Gate-to-Source Voltage (V)
Document Number: 72269
S-31409—Rev. A, 07-Jul-03
Si9410BDY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
On-Resistance vs. Drain Current
Capacitance
1200
0.035
1000
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
0.040
0.030
VGS = 4.5 V
0.025
0.020
VGS = 10 V
0.015
Ciss
800
600
400
Coss
0.010
200
0.005
0.000
Crss
0
0
5
10
15
20
25
30
0
5
10
ID - Drain Current (A)
Gate Charge
25
30
On-Resistance vs. Junction Temperature
1.6
VDS = 15 V
ID = 8.1 A
r DS(on) - On-Resistance (W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
20
VDS - Drain-to-Source Voltage (V)
10
8
6
4
2
VGS = 10 V
ID = 8.1 A
1.4
1.2
1.0
0.8
0
0
3
6
9
12
0.6
- 50
15
- 25
0
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.10
r DS(on) - On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
1
0.0
25
TJ - Junction Temperature (_C)
30
I S - Source Current (A)
15
0.08
ID = 8.1 A
0.06
0.04
0.02
0.00
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Document Number: 72269
S-31409—Rev. A, 07-Jul-03
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
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Si9410BDY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Threshold Voltage
Single Pulse Power
0.4
50
40
ID = 250 mA
- 0.0
Power (W)
V GS(th) Variance (V)
0.2
- 0.2
30
20
- 0.4
10
- 0.6
- 0.8
- 50
- 25
0
25
50
75
100
125
0
10 -3
150
10 -2
10 -1
TJ - Temperature (_C)
1
10
100
600
Time (sec)
Safe Operating Area
100
IDM Limited
rDS(on) Limited
P(t) = 0.0001
I D - Drain Current (A)
10
P(t) = 0.001
1
ID(on)
Limited
P(t) = 0.01
P(t) = 0.1
0.1
P(t) = 1
TA = 25_C
Single Pulse
P(t) = 10
dc
BVDSS Limited
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 70_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 -4
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4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72269
S-31409—Rev. A, 07-Jul-03
Si9410BDY
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
Document Number: 72269
S-31409—Rev. A, 07-Jul-03
10 -3
10 -2
10 -1
Square Wave Pulse Duration (sec)
1
10
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