VISHAY SI6911DQ

Si6911DQ
New Product
Vishay Siliconix
Dual P-Channel 12-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
-12
D TrenchFETr Power MOSFETS
rDS(on) (W)
ID (A)
0.026 @ VGS = -4.5 V
-5.1
0.035 @ VGS = -2.5 V
-4.5
0.046 @ VGS = -1.8 V
-3.9
APPLICATIONS
D Load Switch
D Battery Switch
S1
S2
TSSOP-8
D1
1
S1
2
S1
3
G1
4
G1
8 D2
7 S2
D
G2
6 S2
5 G2
Top View
D1
Ordering Information: Si6911DQ T-1
D2
P-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
10 secs
Steady State
Drain-Source Voltage
VDS
-12
Gate-Source Voltage
VGS
"8
Continuous Drain Current (TJ = 150_C)a
TA = 25_C
TA = 70_C
Pulsed Drain Current (10 ms Pulse Width)
IS
TA = 25_C
Maximum Power Dissipationa
TA = 70_C
Operating Junction and Storage Temperature Range
PD
-4.3
-4.1
IDM
Continuous Source Current (Diode Conduction)a
V
-5.1
ID
-3.5
A
-30
-1.0
-0.7
1.14
0.83
0.73
0.53
TJ, Tstg
Unit
W
_C
-55 to 150
THERMAL RESISTANCE RATINGS
Parameter
Symbol
t v 10 sec
M i
Maximum
JJunction-to-Ambient
ti t A bi ta
Maximum Junction-to-Foot (Drain)
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
86
110
124
150
59
75
Unit
_C/W
C/W
Notes
a. Surface Mounted on 1” x 1” FR4 Board.
Document Number: 72231
S-31064—Rev. A, 26-May-03
www.vishay.com
1
Si6911DQ
New Product
Vishay Siliconix
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
VGS(th)
VDS = VGS, ID = -300 mA
-0.4
Typ
Max
Unit
-0.9
V
"100
nA
Static
Gate Threshold Voltage
Gate-Body Leakage
IGSS
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
VDS = 0 V, VGS = "8 V
Diode Forward Voltagea
-1
-25
VDS = -5 V, VGS = -4.5 V
rDS(on)
Forward Transconductancea
VDS = -9.6 V, VGS = 0 V
VDS = -9.6 V, VGS = 0 V, TJ = 70_C
mA
-20
A
VGS = -4.5 V, ID = -5.1 A
0.021
0.026
VGS = -2.5 V, ID = -4.5 A
0.028
0.035
VGS = -1.8 V, ID = -3.9 A
0.037
0.046
gfs
VDS = -5 V, ID = -5.1 A
20
VSD
IS = -1.0 A, VGS = 0 V
-0.65
-1.1
16
24
VDS = -6 V, VGS = -4.5 V, ID = -5.1 A
1.9
W
W
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
nC
Gate-Drain Charge
Qgd
3.9
Turn-On Delay Time
td(on)
35
55
tr
62
100
120
180
70
110
65
100
Rise Time
Turn-Off Delay Time
VDD = -6 V, RL = 6 W
ID ^ -1 A, VGEN = -4.5 V, RG = 6 W
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
IF = -1.0 A, di/dt = 100 A/ms
ns
Notes
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
30
30
TC = -55_C
VGS = 5 thru 2.5 V
2V
18
12
6
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
www.vishay.com
125_C
18
12
6
1.5 V
0
2
25_C
24
I D - Drain Current (A)
I D - Drain Current (A)
24
5
0
0.0
0.5
1.0
1.5
2.0
2.5
VGS - Gate-to-Source Voltage (V)
Document Number: 72231
S-31064—Rev. A, 26-May-03
Si6911DQ
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Capacitance
2500
0.08
2000
C - Capacitance (pF)
r DS(on) - On-Resistance ( W )
On-Resistance vs. Drain Current
0.10
0.06
VGS = 1.8 V
0.04
VGS = 2.5 V
0.02
Ciss
1500
1000
Coss
500
Crss
VGS = 4.5 V
0.00
0
0
6
12
18
24
30
0
2
ID - Drain Current (A)
Gate Charge
8
10
12
On-Resistance vs. Junction Temperature
1.6
VDS = 6 V
ID = 5.1 A
5
r DS(on) - On-Resistance ( W)
(Normalized)
V GS - Gate-to-Source Voltage (V)
6
VDS - Drain-to-Source Voltage (V)
6
4
3
2
VGS = 4.5 V
ID = 5.1 A
1.4
1.2
1.0
0.8
1
0
0
4
8
12
16
0.6
-50
20
Qg - Total Gate Charge (nC)
Source-Drain Diode Forward Voltage
0
25
50
75
100
125
150
On-Resistance vs. Gate-to-Source Voltage
0.10
r DS(on) - On-Resistance ( W )
TJ = 150_C
10
TJ = 25_C
1
0.2
0.0
-25
TJ - Junction Temperature (_C)
40
I S - Source Current (A)
4
0.08
ID = 5.1 A
0.06
0.04
0.02
0.00
0.2
0.4
0.6
0.8
1.0
1.2
VSD - Source-to-Drain Voltage (V)
Document Number: 72231
S-31064—Rev. A, 26-May-03
1.4
1.6
0
2
4
6
8
VGS - Gate-to-Source Voltage (V)
www.vishay.com
3
Si6911DQ
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Single Pulse Power, Junction-to-Ambient
200
0.3
160
0.2
ID = 300 mA
Power (W)
V GS(th) Variance (V)
Threshold Voltage
0.4
0.1
120
80
0.0
40
-0.1
-0.2
-50
-25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
1
10
Time (sec)
TJ - Temperature (_C)
Safe Operating Area, Junction-to-Case
100
I D - Drain Current (A)
10
Limited
by rDS(on)
1 ms
10 ms
1
100 ms
0.1
TC = 25_C
Single Pulse
1s
10 s
dc
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 124_C/W
3. TJM - TA = PDMZthJA(t)
4. Surface Mounted
Single Pulse
0.01
10 - 4
www.vishay.com
4
10 - 3
10 - 2
10 - 1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72231
S-31064—Rev. A, 26-May-03
Si6911DQ
New Product
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Thermal Transient Impedance, Junction-to-Foot
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 - 4
Document Number: 72231
S-31064—Rev. A, 26-May-03
10 - 3
10 - 2
10 - 1
Square Wave Pulse Duration (sec)
1
10
www.vishay.com
5