TPIC71008-Q1 SLVSAX3 – JUNE 2011 www.ti.com Eight-Channel Squib Drivers Check for Samples: TPIC71008-Q1 FEATURES 1 • • • • • • • • • • • • • • • • • • • Eight-channel squib drivers for airbag application Loop diagnostics monitor and reporting Two logic inputs providing independent safing logic for enabling/disabling deployment Eight independent thermally protected High Side drivers that can source deployment or diagnostic current level to each squib load Eight independent avalanche voltage and thermally protected Low Side drivers that can sink deployment or diagnostic current level from each squib load Each output capable of 1.2A/1.75A firing current for typical 2ms/0.5ms SPI Slave Interface for serial bus communication with parity check Firing VZx voltage range 10V to 35V, transients up to 40V Programmable firing time up to 8.2 ms Common Load current settings for all deployment loops, using registers Individual firing current timer limit set for each deployment loop, using registers Firing current timer to monitor firing current over deployment time for each deployment loop Independent switch control for both high and low side switches Diagnostic mode for fault checking Internal fault monitoring for safe operation A multiplex-able output buffer for analog voltage measurements Use of external clamping devices on squib pins is not required to protect the deployment ASIC against substrate injection effects during deployment due to dynamic shorts to ground An external pin connection to the microprocessor ADC supply for ratio-metric squib resistance measurement. 40V pin capability on all pins (except GNDx, AGND, DGND, VCC5, VDDIO, AMX_OUT) Operating ambient temperature range: -40°C to 105°C • Thermally enhanced 48-pin TSSOP DCA PowerPad package APPLICATIONS • Squib Drivers for Airbag Application Z6 1 ZM6 2 GND0 GND3 48 Z7 47 ZM7 VZ0 3 46 VZ3 Z0 4 45 Z3 ZM0 5 44 ZM3 GND0 6 43 GND3 TEST1 7 42 DGND2 VCC5 8 41 SOMI IWD 9 40 SOMO AMX_OUT 10 39 SCLK Z6 Z7 DIAG SPI/ Digital DGND1 11 38 CS_N AGND1 12 37 TZ SQREF1 13 36 RESET_N SQREF2 14 35 VDDIO VADC 15 34 AGND TEST2 16 33 VA1 VA2 17 32 TEST4 TEST2 18 31 NC GND1 19 30 GND2 ZM1 20 29 ZM2 BIAS Z1 21 28 Z2 VZ1 22 27 VZ2 ZM4 23 26 ZM5 Z4 24 25 Z5 Z4 GND1 GND2 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2011, Texas Instruments Incorporated PRODUCT PREVIEW • TPIC71008-Q1 SLVSAX3 – JUNE 2011 www.ti.com DESCRIPTION The TPIC71008 is an eight channel squib driver for airbags deployment in automotive applications. Each channel consists of a high side and low side switch with independent control logic for protection against inadvertent deployment. Both the high and the low side switches have internal current limit and over-temperature protection. The IC registers are used for eight channel configuration, control and status monitoring. To prevent inadvertent deployment, the high and the low side switches are turned on only if the proper configuration sequence is used, two independent arming/safing inputs are active and multiple inputs to the deploy controller logic are at the correct level. The registers are programmed using a serial communications interface. To prevent excessive power dissipation the maximum active ON time for each channel is limited by programmable Firing Time Out Timer. In addition, a current limit register is used to program the maximum current through the switches during a deployment. The current limitation on the low side switch is larger than the corresponding current limitation on the high side switch. During deployment, the low side switch is fully enhanced and operates with RDS_ON mode, while the high side switch is in current regulation mode. IC diagnostic functions monitor deployment pin voltages to facilitate High Side switch test, Low Side switch test, squib resistance measurements, squib leakage measurement to battery or ground or leakage between any squib channels. The squib leakage measurement does not require the squib load to be present and covers both Zx and ZMx pins. Diagnostic information is communicated through the AMX_OUT pin (for analog signals) and SPI mapped status registers (for status signals latched in digital core). PRODUCT PREVIEW The high-side and low-side squib drivers have a diagnostic level current limit and a deployment level current limit. The default current limit for high-side and low-side squib drivers is the diagnostic level current limit. The high-side switch deployment current limit for all high-side drivers can be set to either 1.2 A min or 1.75 A min (see Table 1) through SPI mapped registers and device EEPROM settings (see Table 2). The low-side switch deployment current limit is not programmable and is fixed to a level greater than the high-side driver current limit. The ON time duration for each individual squib driver can be programmed through SPI mapped registers. The deployment sequence requires a specific set of software commands combined with external hardware arming/safing logic inputs (TZ=H, IWD=L) to provide deployment capability. The turn-on sequence of the high-side and low-side drivers is software controlled via SPI commands. The turn-off procedure is automatically controlled by the deployment ASIC for the high side drivers, while the low side drivers turn-off procedure can be controlled by the deployment ASIC or by software via SPI commands. After the programmed ON time deployment has been achieved, the high-side driver is deactivated first. It is followed by the low-side driver deactivation after approximately 100usec (in case of hardware control turn-off sequence device configuration), or after SPI command for low side driver turn-off has been received from an external microcontroller (in case of software control turn-off sequence device configuration). The RESET_N is an active low input reset signal. This input will be released high by the power supply unit and/or the external microcontroller once the external voltage supplies are within the specified limits. The external microcontroller is required to configure and control device through the serial communication interface. Reliable software is critical for the system operation. Table 1. Potential Deployment Settings for Typical Firing Current FIRING VOLTAGE MAXIMUM AVERAGE FIRING VOLTAGE BETWEEN VZx AND Zx PINS TO ACHIEVE DEPLOYMENT TYPICAL FIRING CURRENT DWELL (FIRING) TIME 35 V 32.56 V 1.2 A 2 ms (1) 35 V 35.0 V 1.75 A 0.5 ms (1) (1) For programming desired dwell (firing) time Extended deployment duration activates the over-temperature protection circuit and terminates deployment. If short-to-ground condition occurs during deployment, 35-V firing voltage is completely dropped across the HS_FET, thereby thermal shut down protection kicks in to protect the device. 2 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPIC71008-Q1 TPIC71008-Q1 SLVSAX3 – JUNE 2011 www.ti.com Table 2. Potential Deployment Settings for Maximum Firing Current FIRING VOLTAGE MAXIMUM AVERAGE FIRING VOLTAGE BETWEEN VZX AND ZX PINS TO ACHIEVE DEPLOYMENT MAX FIRING CURRENT (1) DWELL (FIRING)TIME 35 V 30 V 2.6 A (for 1.75 A current setting) 0.7 ms (2) 35 V 31 V 2. 0 A (for 1.2 A current setting) 2.0 ms (2) to uC Z6 squib ZM6 VZ0 Z0 1 2 GND0 Z6 GND3 Z6 3 48 47 46 VDDIO VA1 VCC5 The max firing current levels are set through device EEPROM setting For programming desired dwell (firing) time VA2 (1) (2) Z7 ZM7 squib VZ3 Z3 4 45 5 44 6 43 GND3 TEST1 7 42 DGND2 VCC5 8 41 SOMI IWD 9 40 SOMO AMX_OUT 10 DGND1 11 38 12 37 TZ0 36 RESET_N squib GND0 AGND1 SQREF1 SQREF2 squib BIAS SCLK CS_N 14 35 VDDIO 15 34 AGND TEST2 16 33 17 32 TEST4 TEST2 18 31 NC GND1 19 30 GND2 20 29 21 28 Z2 27 VZ2 26 ZM5 ZM1 Z1 VZ1 ZM4 squib 13 39 VADC VA2 squib DIAG SPI/ Digital ZM3 Z4 PRODUCT PREVIEW squib ZM0 VA1 ZM2 squib 22 23 Z4 Z5 25 24 GND1 Z5 squib GND2 Figure 1. Functional Block Diagram For the full version of this document, please contact [email protected] . Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPIC71008-Q1 3 TPIC71008-Q1 SLVSAX3 – JUNE 2011 www.ti.com ORDERING INFORMATION –40°C to 105°C ORDERABLE PART NUMBER PACKAGE (1) TA HTSSOP – DCA Tape and reel TPIC71008TDCAQ1 TOP-SIDE MARKING TPIC71008 TPIC71008TDCARQ1 (1) “Pb-Free” is defined to be compliant with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials unless exempt. Where designed to be soldered at high temperatures, TI "Pb-Free" and "RoHS Compliant" products are suitable for use in specified lead-free processes. PRODUCT PREVIEW 4 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TPIC71008-Q1 PACKAGE OPTION ADDENDUM www.ti.com 9-Jul-2011 PACKAGING INFORMATION Orderable Device TPIC71008TDCARQ1 Status (1) ACTIVE Package Type Package Drawing HTSSOP DCA Pins Package Qty 48 2000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPIC71008TDCARQ1 Package Package Pins Type Drawing SPQ HTSSOP 2000 DCA 48 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 24.4 Pack Materials-Page 1 8.6 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.8 1.8 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPIC71008TDCARQ1 HTSSOP DCA 48 2000 367.0 367.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated