SLVS312A – JULY 2000 – REVISED DECEMBER 2002
D Overvoltage Protection and Lockout for
D
D
D
D
D
D
D
D
D
D OR P PACKAGE
(TOP VIEW)
12 V, 5 V, 3.3 V
Undervoltage Protection and Lockout for
5 V and 3.3 V
Fault Protection Output With Open-Drain
Output Stage
Open-Drain Power Good Output Signal for
Power Good Input, 3.3 V and 5 V
Power Good Delay; 300-ms TPS3510,
150-ms TPS3511
75-ms Delay for 5-V and 3.3-V Power
Supply Short-Circuit Turnon Protection
2.3-ms PSON Control to FPO Turnoff Delay
38-ms PSON Control Debounce
73-µs Width Noise Deglitches
Wide Supply Voltage Range From 4 V
to 15 V
PGI
GND
FPO
PSON
1
8
2
7
3
6
4
5
PGO
VDD
VS5
VS33
description
The TPS3510/1 is designed to minimize external components of personal-computer switching power supply
systems. It provides protection circuits, power good indicator, fault protection output (FPO) and PSON control.
Overvoltage protection (OVP) monitors 3.3 V, 5 V, and 12 V (12-V signal detects via VDD pin). Undervoltage
protection (UVP) monitors 3.3 V and 5 V. When an OV or UV condition is detected, the power good output (PGO)
is set to low and FPO is latched high. PSON from low to high resets the protection latch. UVP function is enabled
75 ms after PSON is set low and debounced. Furthermore, there is a 2.3-ms delay (and an additional 38-ms
debounce) at turnoff. There is no delay during turnon.
Power good feature monitors PGI, 3.3 V and 5 V and issues a power good signal when the output is ready.
The TPS3510/1 is characterized for operation from –40°C to 85°C.
typical application
5 VSB
PGI
PGO
12 V
PSON
(From Motherboard)
1
8
PGO
PGI
2
7
VDD
GND
3
6
VS5
FPO
4
5
PSON VS33
0.5 V
Drop
VSB
5V
3.3 V
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2002, Texas Instruments Incorporated
!" #!$% &"'
&! #" #" (" " ") !"
&& *+' &! # ", &" " "%+ %!&"
", %% #""'
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1
SLVS312A – JULY 2000 – REVISED DECEMBER 2002
FUNCTION TABLE
PGI
PSON
UV CONDITION
(3.3 V OR 5 V)
<0.95 V
L
no
<0.95 V
L
no
OV CONDITION
(3.3 V, 5 V, OR 12 V)
FPO
PGO
no
L
L
yes
H
L
<0.95 V
L
yes
no
L
L
0.95 V<PGI<1.15 V
L
no
no
L
L
0.95 V<PGI<1.15 V
L
no
yes
H
L
0.95 V<PGI<1.15 V
L
yes
no
H
L
PGI > 1.15 V
L
no
no
L
H
PGI > 1.15 V
L
no
yes
H
L
PGI > 1.15 V
L
yes
no
H
L
x
H
x
x
H
L
x = don’t care
FPO = L means: fault IS NOT latched
FPO = H means: fault IS latched
PGO = L means: fault
PGO = H means: NO fault
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLVS312A – JULY 2000 – REVISED DECEMBER 2002
functional block diagram
VDD
12 V OV
+
_
POR
VS5
R
5 V OV
+
_
S
73-µs
Debounce
FPO
Q
VS33
2.3-ms
Delay
73-µs
Debounce
VDD
3.3 V OV
38-ms
Debounce
+
_
3.3 V UV
+
_
75-ms
Delay
VDD
5 V UV
+
_
+
_
PGO
PGI1
Band-Gap
Reference
1.15 V
PGI
PSON
150-µs
Debounce
Delay†
PGI2
+
_
150-µs Debounce
and
4.8-ms Delay
Band-Gap
Reference
0.95 V
† 300 ms for TPS3510 and 150 ms for TPS3511
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3
SLVS312A – JULY 2000 – REVISED DECEMBER 2002
timing diagram
VDD
PSON
FPO
PGI
3.3 V, 5 V
12 V
PGO
td1
td1
tb
PG OFF
Delay
td1
td2
Protect
Occur
PSON
On
PSON
On
PSON Off
Terminal Functions
TERMINAL
4
NAME
NO.
FPO
3
GND
2
I/O
O
DESCRIPTION
Inverted fault protection output, open drain output stage
Ground
PGI
1
I
Power good input
PGO
8
O
Power good output, open drain output stage
PSON
4
I
ON/OFF control
VDD
VS33
7
I
Supply voltage/12 V overvoltage protection input pin
5
I
3.3 V over/undervoltage protection
VS5
6
I
5 V over/undervoltage protection
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AC Off
SLVS312A – JULY 2000 – REVISED DECEMBER 2002
detailed description
power good and power good delay
A PC power supply is commonly designed to provide a power-good signal, which is defined by the computer
manufacturers. PGO is a power-good signal and should be asserted high by the PC power supply to indicate
that the 5-V and 3.3-V outputs are above the under-voltage threshold limit. At this time the converter should be
able to provide enough power to ensure continuous operation within the specification. Conversely, when either
the 5-V or the 3.3-V output voltages fall below the under-voltage threshold, or when ac power has been removed
for a time sufficiently long so that power supply operation is no longer ensured, PGO should be de-asserted to
a low state.
Figure 1 represents the timing characteristics of the power good (PGO), dc enable (PSON), and the 5 V/3.3 V
supply rails.
PSON
On
Off
75%
5-V/3.3-V
Output
10%
PGO
t5
t4
t3
t2
Figure 1. Timing of PSON and PGO
Although there is no requirement to meet specific timing parameters, the following signal timings are
recommended:
2 ms ≤ t2 ≤ 20 ms, 100 ms < t3 < 2000 ms, t4 > 1 ms, t5 ≤ 10 ms
Furthermore motherboards should be designed to comply with the previously recommended timing. If timings
other than these are implemented or required, this information should be clearly specified.
The TPS3510/1 family of power-supply supervisors provides a power-good output (PGO) for the 3.3-V and 5-V
supply voltage rails and a separate power-good input (PGI). An internal timer is used to generate a power-good
delay. If the voltage signals at PGI, VS33, and VS5 rise above the under-voltage threshold, the open-drain
power-good output (PGO) goes high after a delay of 150 ms or 300 ms. When the PGI voltage or either the 3.3-V
and 5-V power rails drops below the under-voltage threshold, PGO is disabled immediately (after 150-µs
debounce).
power supply remote on/off (PSON) and fault protect output (FPO)
Since the latest personal computer generation focuses on easy turnon and power saving functions, the PC
power supply requires two characteristics. One is a dc power supply remote on/off function, the other is standby
voltage to achieve very low power consumption of the PC system. Thus the main power needs to be shut down.
The power supply remote on/off (PSON) is an active low signal that turns on all of the main power rails including
3.3 V, 5 V, –5 V, 12 V, and –12 V power rails. When this signal is held high by the PC motherboard or left open
circuited, the signal of the fault protect output (FPO) also goes high. Thus, the main power rails should not deliver
current and should be held at 0 V.
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5
SLVS312A – JULY 2000 – REVISED DECEMBER 2002
power supply remote on/off (PSON) and fault protect output (FPO)(continued)
When the FPO signal is held high due to an occurring fault condition, the fault status is latched and the outputs
of the main power rails should not deliver current but are held at 0 V. Toggling the power supply remote on/off
(PSON) from low to high resets the fault-protection latch. During this fault condition only the standby power is
not affected.
When PSON goes from high to low or low to high, the 38-ms debounce block is active to avoid a glitch on the
input that disables/enables the FPO output. During this period the under-voltage function is disabled for 75 ms
to prevent turnon failure. At turnoff, there is an additional delay of 2.3 ms from PSON to FPO.
Power should be delivered to the rails only if the PSON signal is held at ground potential, thus FPO is active-low.
The FPO pin can be connected to 5 V (or up to 15 V) through a pullup resistor.
undervoltage protection
The TPS3510/1 provides under-voltage protection (UVP) for the 3.3-V and 5-V rails. When an undervoltage
condition appears at either one of the 3.3-V (VS33) or 5-V (VS5) input pins for more than 146 µs, the FPO output
goes high and PGO goes low. Also, this fault condition is latched until PSON is toggled from low to high or VDD
is removed.
The need for undervoltage protection is often overlooked in off-line switching power supply system design. But
it is very important in battery-powered or hand-held equipment since the TTL or CMOS logic often results in
malfunction.
In flyback or forward-type off-line switching power supplies, usually designed for low power, the overload
protection design is very simple. Most of these types of power supplies are only sensing the input current for
an overload condition. The trigger point needs to be set much higher than the maximum load in order to prevent
false turnon.
However, this causes one critical problem. If the connected load is larger than the maximum allowable load but
smaller than the trigger point, the system always becomes overheated with failure and damage occurring.
overvoltage protection
The overvoltage protection (OVP) of TPS3510/1 monitors 3.3 V, 5 V, and 12 V (12 V is sensed via the VDD pin).
When an overvoltage condition appears at one of the 3.3-V, 5-V, or 12-V input pins for more than 73 µs, the FPO
output goes high and PGO goes low. Also, this fault condition is latched until PSON is toggled from low to high
or VDD is removed. During fault conditions, most power supplies have the potential to deliver higher output
voltages than those normally specified or required. In unprotected equipment, it is possible for output voltages
to be high enough to cause internal or external damage of the system. To protect the system under these
abnormal conditions, it is common practice to provide overvoltage protection within the power supply.
Because TTL and CMOS circuits are very vulnerable to overvoltages, it is becoming industry standard to provide
overvoltage protection on all 3.3-V and 5-V outputs. However, not only the 3.3-V and 5-V rails for the logic circuits
on the motherboard need to be protected, but also the 12-V peripheral devices such as the hard disk, floppy
disk, and CD-ROM players etc., need to be protected.
short-circuit power supply turnon
During safety testing the power supply might have tied the output voltage direct to ground. If this happens during
the normal operating, this is called a short-circuit or over-current condition. When it happens before the power
supply turns on, this is called a short-circuit power supply turnon. It can happen during the design period, in the
production line, at quality control inspection or at the end user. The TPS3510/1 provides an undervoltage
protection function with a 75-ms delay after PSON is set low.
6
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SLVS312A – JULY 2000 – REVISED DECEMBER 2002
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VDD (see Note1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 V
Output voltage VO: FPO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 V
PGO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V
All other pins (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 16 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Soldering temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values are with respect to GND.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
P
1092 mW
8.74 mW/°C
699 mW
568 mW
D
730 mW
5.84 mW/°C
467 mW
379 mW
recommended operating conditions at specified temperature range
MIN
Supply voltage, VDD
4
PSON, VS5, VS33
Input voltage, VI
voltage VO
Output voltage,
NOM
MAX
15
UNIT
V
7
VDD + 0.3 V
(max = 7 V)
PGI
FPO
15
PGO
7
FPO
20
O tp t sink ccurrent,
Output
rrent IO,sink
PGO
10
Supply voltage rising time, tr
See Note 2
1
Operating free-air temperature range, TA
–40
V
V
mA
ms
85
°C
NOTE 2: VDD rising and falling slew rate must be less than 14 V/ms.
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7
SLVS312A – JULY 2000 – REVISED DECEMBER 2002
electrical characteristics over recommended operating conditions (unless otherwise noted)
overvoltage protection
PARAMETER
TEST CONDITIONS
Overvoltage threshold
ILKG
VOL
MIN
TYP
MAX
VS33
3.7
3.9
4.1
VS5
5.7
6.1
6.5
VDD
13.2
13.8
14.4
Leakage current (FPO)
V(FPO) = 5 V
Low-level output voltage (FPO)
VDD = 5 V,
VDD = 5 V
Noise deglitch time OVP
5
Isink = 20 mA
UNIT
V
µA
0.7
V
35
73
110
µs
PGI and PGO
PARAMETER
MIN
TYP
MAX
PGI1
TEST CONDITIONS
1.1
1.15
1.2
PGI2
0.9
0.95
1
2
2.2
2.4
3.3
3.5
3.7
VPGI
Inp t threshold voltage
Input
oltage (PGI)
VIT
Under oltage threshold
Undervoltage
ILKG
VOL
Leakage current (PGO)
PGO = 5 V
Low-level output voltage (PGO)
VDD = 4 V,
VS33
VS5
Short-circuit protection delay
Isink = 10 mA
3.3 V, 5 V
td1
TP3511
Delay time
V
ms
75
114
450
100
150
225
3.2
4.8
7.2
PGI to PGO
88
150
225
PGI to FPO
180
296
445
82
146
220
PGI to FPO
Noise deglitch time
µA
300
VDD = 5 V
VDD = 5 V
UVP to FPO
V
5
49
PGI to PGO
V
0.4
200
TP3510
UNIT
ms
µs
PSON control
PARAMETER
II
VIH
Input pullup current
VIL
tb
Low-level input voltage
td2
Delay time (PSON to FPO)
TEST CONDITIONS
MIN
PSON = 0 V
High-level input voltage
TYP
MAX
2.4
Debounce time (PSON)
VDD = 5 V
VDD = 5 V
UNIT
µA
120
V
1.2
V
24
38
57
ms
tb+1.1
tb+2.3
tb+4
ms
MAX
UNIT
total device
PARAMETER
IDD
8
TEST CONDITIONS
Supply current
PSON = 5 V
POST OFFICE BOX 655303
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MIN
TYP
1
mA
SLVS312A – JULY 2000 – REVISED DECEMBER 2002
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
INPUT CURRENT (PSON)
vs
INPUT VOLTAGE (PSON)
400
20
VDD = 4 V
TA = –40°C
0
TA = 85°C
TA = 25°C
200
I I – Input Current – µ A
I DD – Supply Current – µ A
300
100
TA = 0°C
0
–100
–20
–40
–60
–80
TA = –40°C
TA = 0°C
TA = 25°C
TA = 85°C
–100
–200
PGI = 1.4 V
PSON = 5 V
–120
–300
0
2.5
5
10
7.5
12.5
–140
15
0
1
VDD – Supply Voltage – V
2
Figure 2
7
800
VOL– Low-Level Output Voltage – mV
VOL – Low-Level Output Voltage – V
6
LOW-LEVEL OUTPUT VOLTAGE (FPO)
vs
LOW-LEVEL OUTPUT CURRENT (FPO)
VDD = 4 V
PSON = GND
3
TA = 85°C
2
TA = 25°C
TA = –40°C
1
TA = 0°C
VDD = 4 V
PSON = GND
Exploded View
700
600
TA = 85°C
500
400
300
0
20
40
60
80
100
IOL – Low-Level Output Current – mA
120
TA = –40°C
TA = 25°C
200
TA = 0°C
100
0
5
Figure 3
LOW-LEVEL OUTPUT VOLTAGE (FPO)
vs
LOW-LEVEL OUTPUT CURRENT (FPO)
4
4
3
VI – Input Voltage – V
0
0
5
10
15
20
IOL – Low-Level Output Current – mA
Figure 4
25
Figure 5
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9
SLVS312A – JULY 2000 – REVISED DECEMBER 2002
TYPICAL CHARACTERISTICS
LOW-LEVEL OUTPUT VOLTAGE (PGO)
vs
LOW-LEVEL OUTPUT CURRENT (PGO)
LOW-LEVEL OUTPUT VOLTAGE (PGO)
vs
LOW-LEVEL OUTPUT CURRENT (PGO)
4
600
VOL – Low-Level Output Voltage – mV
VOL – Low-Level Output Voltage – V
VDD = 4 V
PSON = GND
TA = 85°C
3
2
TA = –40°C
TA = 25°C
1
TA = 0°C
0
0
25
50
75
100
125
IOL – Low-Level Output Current – mA
VDD = 4 V
PSON = GND
Exploded View
500
400
TA = 85°C
300
TA = 25°C
200
TA = –40°C
100
TA = 0°C
0
150
0
5
10
15
IOL – Low-Level Output Current – mA
Normalized Input Threshold Voltage – VIT(TA)/VIT(25 °C)
Figure 6
Figure 7
NORMALIZED SENSE THRESHOLD VOLTAGE
vs
FREE-AIR TEMPERATURE AT VDD
1.001
VDD = 4 V
PSON = GND
1
0.999
0.998
0.997
0.996
0.995
0.994–40
–15
10
35
60
TA – Free-Air Temperature – °C
Figure 8
10
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85
20
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS3510D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3510DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3510DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3510DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3510P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TPS3510PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TPS3511D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3511DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3511DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3511DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPS3511P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TPS3511PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPS3510DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TPS3511DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPS3510DR
SOIC
D
8
2500
340.5
338.1
20.6
TPS3511DR
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 2
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