WS1M32-XXX White Electronic Designs 1Mx32 SRAM MODULE FEATURES ■ Access Times of 17, 20, 25ns ■ Commercial, Industrial and Military Temperature Ranges ■ Packaging 84 lead, 28mm CQFP, (Package 511) ■ TTL Compatible Inputs and Outputs 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP (Package 402)* ■ Low Power CMOS ■ 5 Volt Power Supply ■ Organized as two banks of 512Kx32, User Configurable as 2Mx16 or 4Mx8 ■ Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation ■ Weight WS1M32-XH2X* - 13 grams (typical) WS1M32-XG3X - 20 grams (typical) * Package to be developed. PIN CONFIGURATION FOR WS1M32-XH2X* PIN DESCRIPTION TOP VIEW 1 12 23 WE2 I/O8 34 I/O15 45 VCC I/O24 56 I/O0-31 Data Inputs/Outputs I/O31 A0-18 Address Inputs WE1-4 Write Enables I/O9 OE2 I/O14 I/O25 OE4 I/O30 I/O10 GND I/O13 I/O26 WE4 I/O29 A13 I/O11 I/O12 A6 I/O27 A14 A10 OE1 A7 A3 CS1-2 Chip Selects OE1-4 Output Enable I/O28 VCC Power Supply A0 GND Ground NC Not Connected CS2 A4 A1 WE1 A8 A5 A2 VCC I/O7 A9 WE3 I/O23 I/O0 CS1 I/O6 I/O16 OE3 I/O22 I/O1 NC I/O5 I/O17 GND I/O21 A15 A11 A18 A16 A12 A17 BLOCK DIAGRAM OE 1 W E 1 OE 2 W E 2 OE 3 W E 3 OE 4 W E 4 CS 1 A0-18 I/O4 I/O3 I/O2 11 22 33 I/O20 I/O19 I/O18 44 55 2Mxx88 512K 2Mxx88 512K 66 8 2Mxx88 512K 8 512K x 8 2M x 8 512K 512K x 8 512K x 8 8 512K x 8 8 CS 2 I/O0-7 I/O8-15 I/O16-23 I/O24-31 NOTE: CS 1 & CS 2 are used as bank select July 2002 Rev. 4 1 White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com WS1M32-XXX White Electronic Designs PIN CONFIGURATION FOR WS1M32-XG3X PIN DESCRIPTION GND I/O31 I/O30 I/O29 I/O28 I/O27 I/O26 I/O25 I/O24 NC NC NC I/O23 I/O22 I/O21 I/O20 I/O19 I/O18 I/O17 I/O16 VCC TOP VIEW 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 VCC A0 A1 A2 A3 A4 A5 A6 OE1 OE2 OE3 OE4 NC A7 A8 A9 A10 A11 A12 A13 GND 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 GND NC NC NC NC NC NC NC NC WE4 WE3 WE2 WE1 NC NC A18 A17 A16 A15 A14 VCC I/O0-31 Data Inputs/Outputs A0-18 Address Inputs WE1-4 Write Enables CS1-2 Chip Selects OE1-4 Output Enables VCC Power Supply GND Ground NC Not Connected BLOCK DIAGRAM OE 1 W E 1 OE 2 W E 2 OE 3 W E 3 OE 4 W E 4 CS 1 A0-18 2Mxx88 512K 2Mxx88 512K 2Mxx88 512K 512K x 8 2M x 8 512K 512K x 8 512K x 8 512K x 8 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 VCC I/O0 I/O1 I/O2 I/O3 I/O4 I/O5 I/O6 I/O7 CS1 NC CS2 I/O8 I/O9 I/O10 I/O11 I/O12 I/O13 I/O14 I/O15 GND 8 8 8 I/O0-7 I/O8-15 I/O16-23 NOTE: CS 1 & CS 2 are used as bank select The WEDC 84 lead G3 CQFP fills the same fit and function as the JEDEC 84 lead CQFJ or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the CQFP form. 1.146" White Electronic Designs Corporation Phoenix AZ (602) 437-1520 8 CS 2 2 I/O24-31 WS1M32-XXX White Electronic Designs CAPACITANCE (TA=+25°C) ABSOLUTE MAXIMUM RATINGS Parameter Symbol Min Max Unit TA -55 +125 °C Parameter Operating Temperature TSTG -65 +150 °C Signal Voltage Relative to GND VG -0.5 Vcc + 0.5 V Junction Temperature TJ 150 °C Supply Voltage VCC 7.0 V Storage Temperature -0.5 RECOMMENDED OPERATING CONDITIONS Parameter Max Symbol Conditions Max Unit OE1-4 capacitance COE VIN = 0 V, f = 1.0 MHz 30 pF WE1-4 capacitance CWE VIN = 0 V, f = 1.0 MHz 30 pF CS1-2 capacitance CCS VIN = 0 V, f = 1.0 MHz 30 pF Data I/O capacitance CI/O VI/O = 0 V, f = 1.0 MHz 30 pF Address input capacitance CAD VIN = 0 V, f = 1.0 MHz 75 pF This parameter is guaranteed by design but not tested. Symbol Min Unit Supply Voltage VCC 4.5 5.5 V Input High Voltage VIH 2.2 V CC + 0.3 V Input Low Voltage VIL -0.5 +0.8 V Operating Temp (Mil) TA -55 +125 °C Operating Temp (Ind.) TA -40 +85 °C TRUTH TABLE CS1 CS2 OE WE H L L L H H H L H H H H L L L L X L H X L H X X X H H L H H L X Mode Data I/O Power Standby High Z Standby Read Data Out Active Out Disable High Z Active Write Data In Active Read Data Out Active Out Disable High Z Active Write Data In Active Invalid State Invalid State Invalid State DC CHARACTERISTICS (VCC = 5.0V, GND = 0V, TA = -55°C to +125°C) Parameter Symbol Conditions Min Max 10 Units Input Leakage Current ILI VCC = 5.5, VIN = GND to VCC Output Leakage Current I LO CS = VIH, OE = VIH, VOUT = GND to V CC 10 µA I CC x 32 CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5 720 mA Standby Current I SB CS = VIH, OE = VIH , f = 5MHz, Vcc = 5.5 120 mA Output Low Voltage VOL I OL = 8mA, Vcc = 4.5 0.4 Output High Voltage VOH I OH = -4.0mA, Vcc = 4.5 Operating Supply Current x 32 Mode 2.4 µA V V NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V 3 White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com WS1M32-XXX White Electronic Designs AC CHARACTERISTICS (VCC=5.0V,GND=0V,TA=-55°Cto+125°C) Parameter Symbol Read Cycle -17 Min -20 Max 17 Min -25 Max Min 20 Units Max Read Cycle Time t RC Address Access Time t AA 25 Output Hold from Address Change t OH Chip Select Access Time t ACS 17 20 25 Output Enable to Output Valid t OE 10 10 12 Chip Select to Output in Low Z t CLZ 1 2 Output Enable to Output in Low Z t OLZ 1 0 Chip Disable to Output in High Z t CHZ 1 12 12 12 ns Output Disable to Output in High Z t OHZ 1 12 12 12 ns 17 ns 20 0 25 0 ns 0 2 ns ns ns 2 0 ns 0 ns 1. This parameter is guaranteed by design but not tested. AC CHARACTERISTICS (VCC=5.0V,GND=0V,TA=-55°Cto+125°C) Parameter Symbol Write Cycle -17 Min -20 Max Min -25 Max Min Units Max Write Cycle Time t WC 17 20 25 ns Chip Select to End of Write t CW 15 15 17 ns Address Valid to End of Write t AW 15 15 17 ns Data Valid to End of Write t DW 11 12 13 ns Write Pulse Width t WP 15 15 17 ns Address Setup Time t AS 2 2 2 ns Address Hold Time t AH 0 0 0 ns Output Active from End of Write t OW1 2 3 4 Write Enable to Output in High Z t WHZ 1 Data Hold Time t DH 9 ns 11 0 0 13 ns 0 ns 1. This parameter is guaranteed by design but not tested. AC TEST CIRCUIT AC TEST CONDITIONS Parameter I OL Current Source VZ D.U.T. 1.5V (Bipolar Supply) C eff = 50 pf I OH Current Source White Electronic Designs Corporation Phoenix AZ (602) 437-1520 4 Typ Unit Input Pulse Levels VIL = 0, VIH = 3.0 V Input Rise and Fall 5 ns Input and Output Reference Level 1.5 V Output Timing Reference Level 1.5 V NOTES: V Z is programmable from -2V to +7V. I OL & I OH programmable from 0 to 16mA. Tester Impedance Z0 = 75 W . V Z is typically the midpoint of V OH and V OL . I OL & IOH are adjusted to simulate a typical resistive load circuit. ATE tester includes jig capacitance. WS1M32-XXX White Electronic Designs TIMING WAVEFORM - READ CYCLE tRC ADDRESS tAA CS tRC tCHZ tACS ADDRESS tCLZ tAA OE tOE tOLZ tOH DATA I/O PREVIOUS DATA VALID DATA I/O DATA VALID tOHZ DATA VALID HIGH IMPEDANCE READ CYCLE 1 (CS = OE = VIL, WE = VIH) READ CYCLE 2 (WE = VIH) WRITE CYCLE - WE CONTROLLED tWC ADDRESS tAW tAH tCW CS tAS tWP WE tOW tWHZ tDW DATA I/O tDH DATA VALID WRITE CYCLE 1, WE CONTROLLED WRITE CYCLE - CS CONTROLLED tWC WS32K32-XHX ADDRESS tAS tAW tAH tCW CS tWP WE tDW DATA I/O tDH DATA VALID WRITE CYCLE 2, CS CONTROLLED 5 White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com WS1M32-XXX White Electronic Designs PACKAGE 402: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H2) 35.2 (1.385) ± 0.38 (0.015) SQ PIN 1 IDENTIFIER SQUARE PAD ON BOTTOM 25.4 (1.0) TYP 5.7 (0.223) MAX 3.81 (0.150) ± 0.1 (0.005) 1.27 (0.050) ± 0.1 (0.005) 0.76 (0.030) ± 0.1 (0.005) 2.54 (0.100) TYP 15.24 (0.600) TYP 1.27 (0.050) TYP DIA 0.46 (0.018) ± 0.05 (0.002) DIA 25.4 (1.0) TYP ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES White Electronic Designs Corporation Phoenix AZ (602) 437-1520 6 WS1M32-XXX White Electronic Designs PACKAGE 511: 84 LEAD, CERAMIC QUAD FLAT PACK (G3) 30.23 (1.190) ± 0.25 (0.010) SQ 4.29 (0.169) ± 0.28 (0.011) 27.18 (1.070) ± 0.25 (0.010) SQ 4.12 (0.162) ± 0.20 (0.008) 0.25 (0.010) ± 0.03 (0.002) Pin 1 R 0.127 (0.005) MIN 29.11 (1.146) ± 0.25 (0.010) 1 /7 + 0.19 (0.008) ± 0.06 (0.003) 1.02 (0.040) ± 0.12 (0.005) DETAIL A 1.27 (0.050) TYP 0.38 (0.015) ± 0.05 (0.002) 25.40 (1.000) TYP SEE DETAIL "A" 0.27 (0.011) ± 0.04 (0.001) The WEDC 84 lead G3 CQFP fills the same fit and function as the JEDEC 84 lead CQFJ or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the CQFP form. 1.146" ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES 7 White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com WS1M32-XXX White Electronic Designs ORDERING INFORMATION W S 1M32 - XX X X X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads DEVICE GRADE: M = Military Screened I = Industrial C = Commercial -55°C to +125°C -40°C to +85°C 0°C to +70°C PACKAGE TYPE: H2 = Ceramic Hex-In-line Package, HIP (Package 402)* G3 = 28 mm Ceramic Quad Flatpack, CQFP (Package 511) ACCESS TIME (ns) ORGANIZATION, two banks of 512Kx32 User configurable as 2Mx16 or 4Mx8 SRAM WHITE ELECTRONIC DESIGNS CORP. * Package to be developed. White Electronic Designs Corporation Phoenix AZ (602) 437-1520 8