ETC WS1M32-G3M

WS1M32-XXX
White Electronic Designs
1Mx32 SRAM MODULE
FEATURES
■ Access Times of 17, 20, 25ns
■ Commercial, Industrial and Military Temperature
Ranges
■ Packaging
• 84 lead, 28mm CQFP, (Package 511)
■ TTL Compatible Inputs and Outputs
• 66 pin PGA Type, 1.385" sq., Hermetic Ceramic HIP
(Package 402)*
■ Low Power CMOS
■ 5 Volt Power Supply
■ Organized as two banks of 512Kx32, User
Configurable as 2Mx16 or 4Mx8
■ Built-in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
■ Weight
WS1M32-XH2X* - 13 grams (typical)
WS1M32-XG3X - 20 grams (typical)
* Package to be developed.
PIN CONFIGURATION FOR WS1M32-XH2X*
PIN DESCRIPTION
TOP VIEW
1
12
23
WE2
I/O8
34
I/O15
45
VCC
I/O24
56
I/O0-31
Data Inputs/Outputs
I/O31
A0-18
Address Inputs
WE1-4
Write Enables
I/O9
OE2
I/O14
I/O25
OE4
I/O30
I/O10
GND
I/O13
I/O26
WE4
I/O29
A13
I/O11
I/O12
A6
I/O27
A14
A10
OE1
A7
A3
CS1-2
Chip Selects
OE1-4
Output Enable
I/O28
VCC
Power Supply
A0
GND
Ground
NC
Not Connected
CS2
A4
A1
WE1
A8
A5
A2
VCC
I/O7
A9
WE3
I/O23
I/O0
CS1
I/O6
I/O16
OE3
I/O22
I/O1
NC
I/O5
I/O17
GND
I/O21
A15
A11
A18
A16
A12
A17
BLOCK DIAGRAM
OE 1 W E 1
OE 2 W E 2
OE 3 W E 3
OE 4 W E 4
CS 1
A0-18
I/O4
I/O3
I/O2
11
22
33
I/O20
I/O19
I/O18
44
55
2Mxx88
512K
2Mxx88
512K
66
8
2Mxx88
512K
8
512K x 8
2M x 8
512K
512K x 8
512K x 8
8
512K x 8
8
CS 2
I/O0-7
I/O8-15
I/O16-23
I/O24-31
NOTE: CS 1 & CS 2 are used as bank select
July 2002 Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS1M32-XXX
White Electronic Designs
PIN CONFIGURATION FOR WS1M32-XG3X
PIN DESCRIPTION
GND
I/O31
I/O30
I/O29
I/O28
I/O27
I/O26
I/O25
I/O24
NC
NC
NC
I/O23
I/O22
I/O21
I/O20
I/O19
I/O18
I/O17
I/O16
VCC
TOP VIEW
11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75
VCC
A0
A1
A2
A3
A4
A5
A6
OE1
OE2
OE3
OE4
NC
A7
A8
A9
A10
A11
A12
A13
GND
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
GND
NC
NC
NC
NC
NC
NC
NC
NC
WE4
WE3
WE2
WE1
NC
NC
A18
A17
A16
A15
A14
VCC
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE1-4
Write Enables
CS1-2
Chip Selects
OE1-4
Output Enables
VCC
Power Supply
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
OE 1 W E 1
OE 2 W E 2
OE 3 W E 3
OE 4 W E 4
CS 1
A0-18
2Mxx88
512K
2Mxx88
512K
2Mxx88
512K
512K x 8
2M x 8
512K
512K x 8
512K x 8
512K x 8
33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53
VCC
I/O0
I/O1
I/O2
I/O3
I/O4
I/O5
I/O6
I/O7
CS1
NC
CS2
I/O8
I/O9
I/O10
I/O11
I/O12
I/O13
I/O14
I/O15
GND
8
8
8
I/O0-7
I/O8-15
I/O16-23
NOTE: CS 1 & CS 2 are used as bank select
The WEDC 84 lead G3 CQFP fills
the same fit and function as the
JEDEC 84 lead CQFJ or 84
PLCC. But the G3 has the TCE
and lead inspection advantage of
the CQFP form.
1.146"
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
8
CS 2
2
I/O24-31
WS1M32-XXX
White Electronic Designs
CAPACITANCE
(TA=+25°C)
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Max
Unit
TA
-55
+125
°C
Parameter
Operating Temperature
TSTG
-65
+150
°C
Signal Voltage Relative to GND
VG
-0.5
Vcc + 0.5
V
Junction Temperature
TJ
150
°C
Supply Voltage
VCC
7.0
V
Storage Temperature
-0.5
RECOMMENDED OPERATING CONDITIONS
Parameter
Max
Symbol
Conditions
Max Unit
OE1-4 capacitance
COE
VIN = 0 V, f = 1.0 MHz
30
pF
WE1-4 capacitance
CWE
VIN = 0 V, f = 1.0 MHz
30
pF
CS1-2 capacitance
CCS
VIN = 0 V, f = 1.0 MHz
30
pF
Data I/O capacitance
CI/O
VI/O = 0 V, f = 1.0 MHz
30
pF
Address input capacitance
CAD
VIN = 0 V, f = 1.0 MHz
75
pF
This parameter is guaranteed by design but not tested.
Symbol
Min
Unit
Supply Voltage
VCC
4.5
5.5
V
Input High Voltage
VIH
2.2
V CC + 0.3
V
Input Low Voltage
VIL
-0.5
+0.8
V
Operating Temp (Mil)
TA
-55
+125
°C
Operating Temp (Ind.)
TA
-40
+85
°C
TRUTH TABLE
CS1
CS2
OE
WE
H
L
L
L
H
H
H
L
H
H
H
H
L
L
L
L
X
L
H
X
L
H
X
X
X
H
H
L
H
H
L
X
Mode
Data I/O
Power
Standby
High Z
Standby
Read
Data Out
Active
Out Disable
High Z
Active
Write
Data In
Active
Read
Data Out
Active
Out Disable
High Z
Active
Write
Data In
Active
Invalid State Invalid State Invalid State
DC CHARACTERISTICS
(VCC = 5.0V, GND = 0V, TA = -55°C to +125°C)
Parameter
Symbol
Conditions
Min
Max
10
Units
Input Leakage Current
ILI
VCC = 5.5, VIN = GND to VCC
Output Leakage Current
I LO
CS = VIH, OE = VIH, VOUT = GND to V CC
10
µA
I CC x 32
CS = VIL, OE = VIH, f = 5MHz, Vcc = 5.5
720
mA
Standby Current
I SB
CS = VIH, OE = VIH , f = 5MHz, Vcc = 5.5
120
mA
Output Low Voltage
VOL
I OL = 8mA, Vcc = 4.5
0.4
Output High Voltage
VOH
I OH = -4.0mA, Vcc = 4.5
Operating Supply Current x 32 Mode
2.4
µA
V
V
NOTE: DC test conditions: VIH = VCC -0.3V, VIL = 0.3V
3
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS1M32-XXX
White Electronic Designs
AC CHARACTERISTICS
(VCC=5.0V,GND=0V,TA=-55°Cto+125°C)
Parameter
Symbol
Read Cycle
-17
Min
-20
Max
17
Min
-25
Max
Min
20
Units
Max
Read Cycle Time
t RC
Address Access Time
t AA
25
Output Hold from Address Change
t OH
Chip Select Access Time
t ACS
17
20
25
Output Enable to Output Valid
t OE
10
10
12
Chip Select to Output in Low Z
t CLZ 1
2
Output Enable to Output in Low Z
t OLZ 1
0
Chip Disable to Output in High Z
t CHZ 1
12
12
12
ns
Output Disable to Output in High Z
t OHZ 1
12
12
12
ns
17
ns
20
0
25
0
ns
0
2
ns
ns
ns
2
0
ns
0
ns
1. This parameter is guaranteed by design but not tested.
AC CHARACTERISTICS
(VCC=5.0V,GND=0V,TA=-55°Cto+125°C)
Parameter
Symbol
Write Cycle
-17
Min
-20
Max
Min
-25
Max
Min
Units
Max
Write Cycle Time
t WC
17
20
25
ns
Chip Select to End of Write
t CW
15
15
17
ns
Address Valid to End of Write
t AW
15
15
17
ns
Data Valid to End of Write
t DW
11
12
13
ns
Write Pulse Width
t WP
15
15
17
ns
Address Setup Time
t AS
2
2
2
ns
Address Hold Time
t AH
0
0
0
ns
Output Active from End of Write
t OW1
2
3
4
Write Enable to Output in High Z
t WHZ 1
Data Hold Time
t DH
9
ns
11
0
0
13
ns
0
ns
1. This parameter is guaranteed by design but not tested.
AC TEST CIRCUIT
AC TEST CONDITIONS
Parameter
I OL
Current Source
VZ
D.U.T.
1.5V
(Bipolar Supply)
C eff = 50 pf
I OH
Current Source
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
4
Typ
Unit
Input Pulse Levels
VIL = 0, VIH = 3.0
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
NOTES:
V Z is programmable from -2V to +7V.
I OL & I OH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 W .
V Z is typically the midpoint of V OH and V OL .
I OL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
WS1M32-XXX
White Electronic Designs
TIMING WAVEFORM - READ CYCLE
tRC
ADDRESS
tAA
CS
tRC
tCHZ
tACS
ADDRESS
tCLZ
tAA
OE
tOE
tOLZ
tOH
DATA I/O
PREVIOUS DATA VALID
DATA I/O
DATA VALID
tOHZ
DATA VALID
HIGH IMPEDANCE
READ CYCLE 1 (CS = OE = VIL, WE = VIH)
READ CYCLE 2 (WE = VIH)
WRITE CYCLE - WE CONTROLLED
tWC
ADDRESS
tAW
tAH
tCW
CS
tAS
tWP
WE
tOW
tWHZ
tDW
DATA I/O
tDH
DATA VALID
WRITE CYCLE 1, WE CONTROLLED
WRITE CYCLE - CS CONTROLLED
tWC
WS32K32-XHX
ADDRESS
tAS
tAW
tAH
tCW
CS
tWP
WE
tDW
DATA I/O
tDH
DATA VALID
WRITE CYCLE 2, CS CONTROLLED
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS1M32-XXX
White Electronic Designs
PACKAGE 402: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H2)
35.2 (1.385) ± 0.38 (0.015) SQ
PIN 1 IDENTIFIER
SQUARE PAD
ON BOTTOM
25.4 (1.0) TYP
5.7 (0.223)
MAX
3.81 (0.150)
± 0.1 (0.005)
1.27 (0.050) ± 0.1 (0.005)
0.76 (0.030) ± 0.1 (0.005)
2.54 (0.100)
TYP
15.24 (0.600) TYP
1.27 (0.050) TYP DIA
0.46 (0.018) ± 0.05 (0.002) DIA
25.4 (1.0) TYP
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
6
WS1M32-XXX
White Electronic Designs
PACKAGE 511:
84 LEAD, CERAMIC QUAD FLAT PACK (G3)
30.23 (1.190) ± 0.25 (0.010) SQ
4.29 (0.169)
± 0.28 (0.011)
27.18 (1.070) ± 0.25 (0.010) SQ
4.12 (0.162) ± 0.20 (0.008)
0.25 (0.010)
± 0.03 (0.002)
Pin 1
R 0.127
(0.005) MIN
29.11 (1.146)
± 0.25 (0.010)
1 /7
+
0.19 (0.008)
± 0.06 (0.003)
1.02 (0.040)
± 0.12 (0.005)
DETAIL A
1.27 (0.050) TYP
0.38 (0.015)
± 0.05 (0.002)
25.40 (1.000) TYP
SEE DETAIL "A"
0.27 (0.011)
± 0.04 (0.001)
The WEDC 84 lead G3
CQFP fills the same fit
and function as the
JEDEC 84 lead CQFJ or
84 PLCC. But the G3 has
the TCE and lead inspection advantage of the
CQFP form.
1.146"
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
7
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS1M32-XXX
White Electronic Designs
ORDERING INFORMATION
W S 1M32 - XX X X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
PACKAGE TYPE:
H2 = Ceramic Hex-In-line Package, HIP (Package 402)*
G3 = 28 mm Ceramic Quad Flatpack, CQFP (Package 511)
ACCESS TIME (ns)
ORGANIZATION, two banks of 512Kx32
User configurable as 2Mx16 or 4Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
* Package to be developed.
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
8