ETC WS128K32NV-XH1X

WS128K32V-XXX
White Electronic Designs
128Kx32 3.3V SRAM MODULE
PRELIMINARY*
FEATURES
„
Access Times of 15**, 17, 20, 25, 35ns
„
MIL-STD-883 Compliant Devices Available
„
Low Voltage Operation
„
Packaging
• 66-pin, PGA Type, 1.075 inch square Hermetic
Ceramic HIP (Package 400)
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880
inch) square (Package 510), 3.56mm (0.140
inch) high.
„
Organized as 128Kx32; User Configurable as
256Kx16 or 512Kx8
„
Commercial, Industrial and Military Temperature
Ranges
„
3.3 Volt Power Supply
„
Low Power CMOS
„
TTL Compatible Inputs and Outputs
„
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
„
Weight
WS128K32V-XG2UX - 8 grams typical
WS128K32NV-XH1X - 13 grams typical
*This data sheet describes a product under development, not fully characterized, and is subject to
change without notice.
**Commercial and Industrial only.
FIG. 1 PIN CONFIGURATION FOR WS128K32NV-XH1X
TOP VIEW
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-16
Address Inputs
WE 1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
January 2004 Rev. 5
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS128K32V-XXX
White Electronic Designs
FIG. 2 PIN CONFIGURATION FOR WS128K32V-XG2UX
PIN DESCRIPTION
TOP VIEW
I/O0-31 Data Inputs/Outputs
A0-16
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
Note 1: Package Not Recommended For New Design
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
2
WS128K32V-XXX
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature
TRUTH TABLE
Symbol
Min
Max
Unit
CS
OE
WE
Mode
Data I/O
Power
TA
-55
+125
°C
°C
H
L
L
L
X
L
X
H
X
H
L
H
Standby
Read
Write
Out Disable
High Z
Data Out
Data In
High Z
Standby
Active
Active
Active
TSTG
-65
+150
Signal Voltage Relative to GND
VG
-0.5
4.6
V
Junction Temperature
TJ
150
°C
5.5
V
Storage Temperature
Supply Voltage
-0.5
VCC
RECOMMENDED OPERATING CONDITIONS
Parameter
CAPACITANCE
(TA = +25°C VIN = OV, F =1.0 MHZ)
Symbol
Min
Max
Unit
Supply Voltage
VCC
3.0
3.6
V
Parameter
Symbol
Max
Unit
Input High Voltage
VIH
2.2
V CC + 0.3
V
OE capacitance
COE
50
pF
Input Low Voltage
VIL
-0.3
+0.8
V
WE1-4 capacitance
HIP (PGA)
CQFP G2U
CWE
pF
20
20
CS1-4 capacitance
CCS
20
pF
Data I/O capacitance
CI/O
20
pF
Address input capacitance
CAD
50
pF
This parameter is guaranteed by design but not
tested.
DC CHARACTERISTICS
(VCC = 3.3V ±0.3V, VSS = 0V, TA = -55°C TO +125°C)
Parameter
Sym
Conditions
Units
Min
Max
10
Input Leakage Current
I LI
VIN = GND to V CC
Output Leakage Current
I LO
CS = VIH , OE = VIH, V OUT = GND to V CC
10
µA
I CC x 32
CS = VIL, OE = V IH, f = 5MHz
500
mA
Standby Current
I SB
CS = VIH, OE = VIH , f = 5MHz
32
mA
Output Low Voltage
VOL
IOL = 8mA
0.4
Output High Voltage
VOH
IOH = -4.0mA
Operating Supply Current (x 32 Mode)
2.4
3
µA
V
V
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS128K32V-XXX
White Electronic Designs
AC CHARACTERISTICS
(VCC = 3.3V, TA = -55°C TO +125°C)
Parameter
Symbol
Read Cycle
Read Cycle Time
t RC
Address Access Time
tAA
Output Hold from Address Change
t OH
Chip Select Access Time
-15*
Min
-17
Max
15
Min
-20
Max
17
Min
ns
35
ns
35
ns
20
ns
0
20
11
Units
Max
35
25
0
17
10
-35
Max
20
0
15
Min
25
17
0
t ACS
-25
Max
20
15
0
Min
ns
25
Output Enable to Output Valid
tOE
Chip Select to Output in Low Z
t CLZ 1
5
5
5
12
5
15
5
Output Enable to Output in Low Z
t OLZ 1
5
5
5
5
5
Chip Disable to Output in High Z
tCHZ1
8
9
10
12
15
ns
Output Disable to Output in High Z
t OHZ 1
8
9
10
12
15
ns
ns
ns
1. This parameter is guaranteed by design but not tested.
* Commercial and Industrial only.
AC CHARACTERISTICS
(VCC= 3.3V, TA = -55°C TO +125°C)
Parameter
Symbol
Write Cycle
-15*
Min
-17
Max
Min
-20
Max
Min
-25
Max
Min
-35
Max
Min
Units
Max
Write Cycle Time
tWC
15
17
20
25
35
ns
Chip Select to End of Write
tCW
13
14
15
20
30
ns
Address Valid to End of Write
tAW
13
14
15
20
30
ns
Data Valid to End of Write
tDW
10
11
12
15
18
ns
Write Pulse Width
tWP
13
14
15
20
30
ns
Address Setup Time
t AS
0
0
0
0
0
ns
Address Hold Time
tAH
0
0
0
0
0
ns
Output Active from End of Write
tOW1
5
5
5
5
5
Write Enable to Output in High Z
t WHZ1
Data Hold Time
t DH
8
0
9
0
10
0
ns
10
0
15
0
ns
ns
1. This parameter is guaranteed by design but not tested.
* Commercial and Industrial only.
FIG. 3 AC TEST CIRCUIT
AC TEST CONDITIONS
Parameter
Typ
Unit
Input Pulse Levels
VIL = 0, V IH = 3.0
V
Input Rise and Fall
5
ns
Input and Output Reference Level
1.5
V
Output Timing Reference Level
1.5
V
Notes:
VZ is programmable from -2V to +7V.
I OL & I OH programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
VZ is typically the midpoint of VOH and V OL.
I OL & IOH are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
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WS128K32V-XXX
White Electronic Designs
FIG. 4 TIMING WAVEFORM - READ CYCLE
tRC
ADDRESS
tAA
tOH
DATA I/O
PREVIOUS DATA VALID
DATA VALID
READ CYCLE 1 (CS = OE = VIL, WE = VIH)
FIG. 5
WRITE CYCLE - WE CONTROLLED
tWC
ADDRESS
tAW
tAH
tCW
CS
tAS
tWP
WE
tOW
tWHZ
tDW
DATA I/O
tDH
DATA VALID
WRITE CYCLE 1, WE CONTROLLED
FIG. 6 WRITE CYCLE - CS CONTROLLED
tWC
ADDRESS
tAS
WS32K32-XHX
tAW
tAH
tCW
CS
tWP
WE
tDW
DATA I/O
tDH
DATA VALID
WRITE CYCLE 2, CS CONTROLLED
5
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
White Electronic Designs
WS128K32V-XXX
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
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White Electronic Designs
WS128K32V-XXX
PACKAGE 510: 68 LEAD, LOW PROFILE CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
7
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
WS128K32V-XXX
White Electronic Designs
W S 128K 32 X V - XXX X X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
ACCESS TIME (ns)
LOW VOLTAGE SUPPLY 3.3V ± 10%
IMPROVEMENT MARK:
N = No Connect at pins 8, 21, 28, 39 in HIP for upgrade. (H1 only)
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
White Electronic Designs Corporation • Phoenix AZ • (602) 437-1520
8