3.5x2.8 mm SMD CHIP LED LAMP APED3528EC Features HIGH EFFICIENCY RED Description !SINGLE COLOR. The High Efficiency Red source color devices are made ! SUITABLE with Gallium Arsenide Phosphide on Gallium Phosphide FOR ALL SMT ASSEMBLY AND "SOLDER PROCESS. Orange Light Emitting Diode. !IDEAL FOR BACKLIGHTING. ! AVAILABLE !PACKAGE ON TAPE AND REEL. : 500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e A P E D 3528E C Iv (m c d ) @ 20 m A L en s Ty p e HIGH EFFICIENCY RED (GaAsP/ GaP ) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 18 50 40° Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er λpeak Peak Wavelength High Efficiency Red λD Dominate Wavelength High Efficiency Red ∆λ1/2 D ev i c e Spectral Line Half-width High Efficiency Red Ty p . Un it s Tes t Co n d it io n s 6 27 nm I F =20mA 6 25 nm I F =20mA 45 nm I F =20mA pF VF=0V;f=1MHz 2.5 V I F =20mA 10 uA V R = 5V C Capacitance High Efficiency Red 15 VF Forward Voltage High Efficiency Red 2.0 IR Reverse Current High Efficiency Red Max . Absolute Maximum Ratings at T)=25°°C Par am et er H i g h E f f i c i en c y R ed Un it s Power dissipation 105 mW DC Forward Current 30 mA Peak Forward Current [1] 16 0 mA 5 V Reverse Voltage -40°C To +85°C Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 2 OF 4 High Efficiency Red SPEC NO: DSAD1054 APPROVED : J. Lu APED3528EC REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 3 OF 4 APED3528EC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 4 OF 4