Hardware Documentation Data Sheet ® HAL 401 Linear Hall-Effect Sensor IC Edition Dec. 8, 2008 DSH000018_002EN HAL401 DATA SHEET Copyright, Warranty, and Limitation of Liability Micronas Trademarks The information and data contained in this document are believed to be accurate and reliable. The software and proprietary information contained therein may be protected by copyright, patent, trademark and/or other intellectual property rights of Micronas. All rights not expressly granted remain reserved by Micronas. – HAL Micronas assumes no liability for errors and gives no warranty representation or guarantee regarding the suitability of its products for any particular purpose due to these specifications. By this publication, Micronas does not assume responsibility for patent infringements or other rights of third parties which may result from its use. Commercial conditions, product availability and delivery are exclusively subject to the respective order confirmation. Micronas Patents Choppered Offset Compensation protected by Micronas patents no. US5260614A, US5406202A, EP052523B1, and EP0548391B1. Third-Party Trademarks All other brand and product names or company names may be trademarks of their respective companies. Any information and data which may be provided in the document can and do vary in different applications, and actual performance may vary over time. All operating parameters must be validated for each customer application by customers technical experts. Any new issue of this document invalidates previous issues. Micronas reserves the right to review this document and to make changes to the documents content at any time without obligation to notify any person or entity of such revision or changes. For further advice please contact us directly. Do not use our products in life-supporting systems, aviation and aerospace applications! Unless explicitly agreed to otherwise in writing between the parties, Micronas products are not designed, intended or authorized for use as components in systems intended for surgical implants into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the product could create a situation where personal injury or death could occur. No part of this publication may be reproduced, photocopied, stored on a retrieval system or transmitted without the express written consent of Micronas. 2 Micronas HAL401 DATA SHEET Contents Page Section Title 4 4 4 4 4 5 1. 1.1. 1.2. 1.3. 1.4. 1.5. Introduction Features Marking Code Operating Junction Temperature Range Hall Sensor Package Codes Solderability and Welding 6 2. Functional Description 7 7 8 8 8 8 9 10 3. 3.1. 3.2. 3.3. 3.4. 3.4.1. 3.5. 3.6. Specifications Outline Dimensions Dimensions of Sensitive Area Positions of Sensitive Area Absolute Maximum Ratings Storage and Shelf Life Recommended Operating Conditions Characteristics 18 18 18 18 4. 4.1. 4.2. 4.3. Application Notes Ambient Temperature EMC and ESD Application Circuit 20 5. Data Sheet History Micronas 3 HAL401 Linear Hall Effect Sensor IC in CMOS technology Release Notes: Revision bars indicate significant changes to the previous edition. 1. Introduction The HAL 401 is a Linear Hall Effect Sensors produced in CMOS technology. The sensor includes a temperaturecompensated Hall plate with choppered offset compensation, two linear output stages, and protection devices (see Fig. 2–1). DATA SHEET 1.2. Marking Code Type Temperature Range A HAL401 401A K 401K 1.3. Operating Junction Temperature Range The Hall sensors from Micronas are specified to the chip temperature (junction temperature TJ). The output voltage is proportional to the magnetic flux density through the hall plate. The choppered offset compensation leads to stable magnetic characteristics over supply voltage and temperature. A: TJ = –40 °C to +170 °C The HAL 401 can be used for magnetic field measurements, current measurements, and detection of any mechanical movement. Very accurate angle measurements or distance measurements can also be done. The sensor is very robust and can be used in electrical and mechanical hostile environments. Note: Due to power dissipation, there is a difference between the ambient temperature (TA) and junction temperature. Please refer to section 4.1. on page 18 for details. The sensor is designed for industrial and automotive applications and operates in the ambient temperature range from –40 °C up to 150 °C and is available in the SMD-package SOT89B-1. 1.4. Hall Sensor Package Codes 1.1. Features: K: TJ = –40 °C to +140 °C HALXXXPA-T Temperature Range: A or K Package: SF for SOT89B-1 Type: 401 – switching offset compensation at 147 kHz Example: HAL401SF-K – low magnetic offset → Type: 401 → Package: SOT89B-1 → Temperature Range: TJ = –40 °C to +140 °C – extremely sensitive – operates from 4.8 to 12 V supply voltage – wide temperature range TA = –40 °C to +150 °C – overvoltage protection – reverse voltage protection of VDD-pin Hall sensors are available in a wide variety of packaging versions and quantities. For more detailed information, please refer to the brochure: “Hall Sensors: Ordering Codes, Packaging, Handling”. – differential output – accurate absolute measurements of DC and low frequency magnetic fields – on-chip temperature compensation 4 Micronas HAL401 DATA SHEET 1.5. Solderability and Welding Soldering During soldering reflow processing and manual reworking, a component body temperature of 260 °C should not be exceeded. Welding Device terminals should be compatible with laser and resistance welding. Please note that the success of the welding process is subject to different welding parameters which will vary according to the welding technique used. A very close control of the welding parameters is absolutely necessary in order to reach satisfying results. Micronas, therefore, does not give any implied or express warranty as to the ability to weld the component. 1 VDD 2 3 4 OUT1 OUT2 GND Fig. 1–1: Pin configuration Micronas 5 HAL401 DATA SHEET External filtering or integrating measurement can be done to eliminate the AC component of the signal. Resultingly, the influence of mechanical stress and temperature cycling is suppressed. No adjustment of magnetic offset is needed. 2. Functional Description GND 4 Chopper Oscillator Temp. Dependent Bias The sensitivity is stabilized over a wide range of temperature and supply voltage due to internal voltage regulation and circuits for temperature compensation. Offset Compensation; Hallplate Switching Matrix Offset Compensation (see Fig. 2–2) The Hall Offset Voltage is the residual voltage measured in absence of a magnetic field (zero-field residual voltage). This voltage is caused by mechanical stress and can be modeled by a displacement of the connections for voltage measurement and/or current supply. Protection Device VDD OUT1 OUT2 1 2 3 Compensation of this kind of offset is done by cyclic commutating the connections for current flow and voltage measurement. Fig. 2–1: Block diagram of the HAL 401 (top view) – First cycle: The hall supply current flows between points 4 and 2. In the absence of a magnetic field, V13 is the Hall Offset Voltage (+VOffs). In case of a magnetic field, V13 is the sum of the Hall voltage (VH) and VOffs. V13 = VH + VOffs The Linear Hall Sensor measures constant and low frequency magnetic flux densities accurately. The differential output voltage VOUTDIF (difference of the voltages on pin 2 and pin 3) is proportional to the magnetic flux density passing vertically through the sensitive area of the chip. The common mode voltage VCM (average of the voltages on pin 2 and pin 3) of the differential output amplifier is a constant 2.2 V. – Second cycle: The hall supply current flows between points 1 and 3. In the absence of a magnetic field, V24 is the Hall Offset Voltage with negative polarity (–VOffs). In case of a magnetic field, V24 is the difference of the Hall voltage (VH) and VOffs. V24 = VH – VOffs The differential output voltage consists of two components due to the switching offset compensation technique. The average of the differential output voltage represents the magnetic flux density. This component is overlaid by a differential AC signal at a typical frequency of 147 kHz. The AC signal represents the internal offset voltages of amplifiers and hall plates that are influenced by mechanical stress and temperature cycling. In the first cycle, the output shows the sum of the Hall voltage and the offset; in the second, the difference of both. The difference of the mean values of VOUT1 and VOUT2 (VOUTDIF) is equivalent to VHall. for Bu0 mT V 1 1 4 VOffs IC VOUT1 IC Note: The numbers do not represent pin numbers. VOffs 2 VCM VOUTDIF/2 VOUTDIF VOUTDIF/2 VOUTAC 2 3 4 3 V a) Offset Voltage 1/fCH = 6.7 μs VOUT2 V b) Switched Current Supply c) Output Voltage t Fig. 2–2: Hall Offset Compensation 6 Micronas DATA SHEET HAL401 3. Specifications 3.1. Outline Dimensions Fig. 3–1: SOT89B-1: Plastic Small Outline Transistor package, 4 leads Weight approximately 0.034 g Micronas 7 HAL401 DATA SHEET 3.2. Dimensions of Sensitive Area 0.37 mm x 0.17 mm 3.3. Position of Sensitive Area SOT89B-1 y 0.95 mm nominal 3.4. Absolute Maximum Ratings Stresses beyond those listed in the “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only. Functional operation of the device at these conditions is not implied. Exposure to absolute maximum rating conditions for extended periods will affect device reliability. This device contains circuitry to protect the inputs and outputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than absolute maximum-rated voltages to this circuit. All voltages listed are referenced to ground (GND). Symbol Parameter Pin No. Min. Max. Unit VDD Supply Voltage 1 –12 12 V VO Output Voltage 2, 3 –0.3 12 V IO Continuous Output Current 2, 3 –5 5 mA TJ Junction Temperature Range –40 170 °C TA Ambient Temperature at VDD = 5 V at VDD = 12 V – – 150 125 °C °C 3.4.1. Storage and Shelf Life The permissible storage time (shelf life) of the sensors is unlimited, provided the sensors are stored at a maximum of 30 °C and a maximum of 85% relative humidity. At these conditions, no Dry Pack is required. Solderability is guaranteed for one year from the date code on the package. 8 Micronas HAL401 DATA SHEET 3.5. Recommended Operating Conditions Functional operation of the device beyond those indicated in the “Recommended Operating Conditions” of this specification is not implied, may result in unpredictable behavior of the device and may reduce reliability and lifetime. All voltages listed are referenced to ground (GND). Symbol Parameter Pin No. Min. Max. Unit Remarks IO Continuous Output Current 2, 3 –2.25 2.25 mA TJ = 25 °C IO Continuous Output Current 2, 3 –1 1 mA TJ = 170 °C CL Load Capacitance 2, 3 – 1 nF VDD Supply Voltage 1 4.8 12 V B Magnetic Field Range –50 50 mT see Fig. 3–2 ÈÈÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈÈÈ ÈÈÈÈÈÈÈÈÈÈÈÈ VDD power dissipation limit 12 V 11.5 V 8.0 V 6.8 V 4.8 V 4.5 V –40 °C min. VDD for specified sensitivity 25 °C 125 °C 150 °C TA Fig. 3–2: Recommended Operating Supply Voltage Micronas 9 HAL401 DATA SHEET 3.6. Characteristics at TJ = –40 °C to +170 °C , VDD = 4.8 V to 12 V, GND = 0 V at Recommended Operation Conditions (Fig. 3–2 for TA and VDD) as not otherwise specified in the column “Conditions”. Typical characteristics for TJ = 25 °C, VDD = 6.8 V and –50 mT < B < 50 mT Symbol Parameter Pin No. Min. Typ. Max. Unit Conditions IDD Supply Current 1 11 14.5 17.1 mA TJ = 25 °C, IOUT1,2 = 0 mA IDD Supply Current over Temperature Range 1 9 14.5 18.5 mA IOUT1,2 = 0 mA VCM Common Mode Output Voltage VCM = (VOUT1 + VOUT2 ) / 2 2, 3 2.1 2.2 2.3 V IOUT1,2 = 0 mA, CMRR Common Mode Rejection Ratio 2, 3 –2.5 0 2.5 mV/V IOUT1,2 = 0 mA, CMRR is limited by the influence of power dissipation. SB Differential Magnetic Sensitivity 2–3 42 48.5 55 mV/mT –50 mT < B < 50 mT TJ = 25 °C SB Differential Magnetic Sensitivity over Temperature Range 2–3 37.5 46.5 55 mV/mT –50 mT < B < 50 mT Boffset Magnetic Offset over Temperature 2–3 –1.5 –0.2 1.5 mT B = 0 mT, IOUT1,2 = 0 mA ΔBOFFSET/ ΔT Magnetic Offset Change –25 0 25 μT/K B = 0 mT, IOUT1,2 = 0 mA BW Bandwidth (–3 dB) 2–3 – 10 – kHz without external Filter1) NLdif Non-Linearity of Differential Output 2–3 – 0.5 2 % –50 mT < B < 50 mT NLsingle Non-Linearity of Single Ended Output 2, 3 – 2 – % fCH Chopper Frequency over Temp. 2, 3 – 147 – kHz VOUTACpp Peak-to-Peak AC Output Voltage 2, 3 – 0.6 1.3 V nmeff Magnetic RMS Differential Broadband Noise 2–3 – 10 – μT BW = 10 Hz to 10 kHz fCflicker Corner Frequency of 1/f Noise 2–3 – 10 – Hz B = 0 mT fCflicker Corner Frequency of 1/f Noise 2–3 – 100 – Hz B = 50 mT ROUT Output Impedance 2, 3 – 30 50 Ω IOUT1,2 v 2.5 mA, TJ = 25 °C, VDD = 6.8 V ROUT Output Impedance over Temperature 2, 3 – 30 150 Ω IOUT1,2 v 2.5 mA RthJSB case SOT89B-1 Thermal Resistance Junction to Substrate Backside – 150 200 K/W Fiberglass Substrate 30 mm x 10 mm x 1.5 mm pad size (see Fig. 3–3) 1) 10 with external 2 pole filter (f3db = 5 kHz), VOUTAC is reduced to less than 1 mV by limiting the bandwith Micronas HAL401 DATA SHEET 1.80 1.05 1.45 2.90 1.05 0.50 1.50 Fig. 3–3: Recommended footprint SOT89B, Dimensions in mm Note: All dimensions are for reference only. The pad size may vary depending on the requirements of the soldering process. Micronas 11 HAL401 DATA SHEET V 5 VOUT1 VOUT2 V 0.05 TA = 25 °C VDD = 6.8 V B = 0 mT 0.04 TA = –40 °C VOFFS 0.03 4 VOUT1 VOUT2 TA = 25 °C TA = 125 °C 0.02 TA = 150 °C 3 0.01 0.00 2 –0.01 –0.02 1 –0.03 –0.04 0 –150 –100 –50 0 50 100 150 mT –0.05 2 4 6 8 B 14 V Fig. 3–6: Typical differential output offset voltage versus supply voltage mT 2.0 mT 2.0 B = 0 mT 1.5 B = 0 mT 1.5 TA = –40 °C BOFFS BOFFS TA = 25 °C 1.0 VDD = 4.8 V 1.0 TA = 125 °C 0.5 0.0 0.0 –0.5 –0.5 –1.0 –1.0 –1.5 –1.5 2 4 6 8 10 VDD = 6.0 V VDD = 12 V TA = 150 °C 0.5 12 14 V VDD Fig. 3–5: Typical magnetic offset of differential output versus supply voltage 12 12 VDD Fig. 3–4: Typical output voltages versus magnetic flux density –2 10 –2 –50 –25 0 25 50 75 100 125 150 °C TA Fig. 3–7: Typical magnetic offset of differential output versus ambient temperature Micronas HAL401 DATA SHEET mV/mT 60 B = ±50 mT mV/mT 60 55 SB B = ±50 mT 55 SB 50 50 45 45 40 40 35 35 30 30 TA = –40 °C TA = 25 °C 25 VDD = 4.8 V 25 VDD = 6.0 V TA = 125 °C TA = 150 °C 20 15 2 4 6 8 10 VDD = 12 V 20 12 15 –50 –25 14 V 0 25 50 75 100 125 150 °C VDD TA Fig. 3–8: Typical differential magnetic sensitivity versus supply voltage % 1.5 % 1.5 TA = 25 °C VDD = 6.8 V 1.0 NLdif Fig. 3–10: Typical differential magnetic sensitivity versus ambient temperature NLdif 1.0 0.5 0.5 0.0 0.0 –0.5 –0.5 TA = –40 °C VDD = 4.8 V –1.0 VDD = 6.0 V –1.0 VDD = 12 V TA = 25 °C TA = 125 °C TA = 150 °C –1.5 –80 –60 –40 –20 0 20 40 60 80 mT B Fig. 3–9: Typical non-linearity of differential output versus magnetic flux density Micronas –1.5 –80 –60 –40 –20 0 20 40 60 80 mT B Fig. 3–11: Typical non-linearity of differential output versus magnetic flux density 13 HAL401 DATA SHEET % 3 NLsingle % 3 TA = 25 °C VDD = 6.0 V 2 NLsingle 2 1 1 0 0 –1 –1 VDD = 4.8 V TA = –40 °C VDD = 12 V –2 TA = 25 °C –2 TA = 125 °C TA = 150 °C –3 –80 –60 –40 –20 0 20 40 60 –3 –80 –60 –40 –20 80 mT 0 40 60 80 mT B B Fig. 3–12: Typical single-ended non-linearity versus magnetic flux density fCH 20 Fig. 3–14: Typical non-linearity of singleended output versus magnetic flux density kHz 200 kHz 200 180 180 fCH 160 160 140 140 120 120 100 100 80 80 TA = –40 °C 60 60 TA = 25 °C VDD = 4.8 V TA = 125 °C 40 40 VDD = 6.0 V TA = 150 °C 20 0 2 4 6 8 10 12 14 V VDD Fig. 3–13: Typical chopper frequency versus supply voltage 14 VDD = 12 V 20 0 –50 –25 0 25 50 75 100 125 150 °C TA Fig. 3–15: Typical chopper frequency versus ambient temperature Micronas HAL401 DATA SHEET V 2.25 V 2.4 2.24 2.2 VCM VCM 2.23 2.0 2.22 2.21 1.8 VDD = 4.8 V 2.20 1.6 VDD = 12 V 2.19 TA = –40 °C 1.4 2.18 TA = 25 °C 2.17 TA = 150 °C 1.2 2.16 1 2 4 6 8 10 12 14 V 2.15 –50 –25 0 25 50 TA VDD Fig. 3–16: Typical common mode output voltage versus supply voltage mV 1000 VOUT1pp, VOUT2pp 75 100 125 150 °C Fig. 3–18: Typical common mode output voltage versus ambient temperature mV 1000 TA = 25 °C VOUT1pp, VOUT2pp 800 800 VDD = 4.8 V VDD = 6.0 V 600 600 400 400 200 200 0 2 4 6 8 10 12 VDD Fig. 3–17: Typical output AC voltage versus supply voltage Micronas 14 V 0 –50 –25 VDD = 12 V 0 25 50 75 100 125 150 °C TA Fig. 3–19: Typical output AC voltage versus ambient temperature 15 HAL401 DATA SHEET mA 25 mA 20 IOUT1,2 = 0 mA IOUT1,2 = 0 mA 20 IDD 15 IDD 15 10 5 0 10 –5 TA = –40 °C –10 TA = 25 °C TA = 125 °C –15 TA = –40 °C 5 TA = 25 °C TA = 150 °C TA = 125 °C –20 –25 –15 TA = 150 °C –10 –5 0 5 10 15 V 0 2 3 4 5 6 7 VDD VDD Fig. 3–20: Typical supply current versus supply voltage Fig. 3–22: Typical supply current versus supply voltage mA 20 8 V mA 25 B = 0 mT B = 0 mT IDD IDD 20 15 15 10 10 VDD = 4.8 V VDD = 12 V 5 VDD = 4.8 V 5 VDD = 6.0 V VDD = 12 V 0 –50 –25 0 25 50 75 100 125 150 °C TA Fig. 3–21: Typical supply current versus temperature 16 0 –6 –4 –2 0 2 4 6 mA IOUT1,2 Fig. 3–23: Typical supply current versus output current Micronas HAL401 DATA SHEET dBT rms ǸHz Ω 200 –100 TA = 25 °C B = 0 mT 180 VDD = 4.8 V ROUT 160 nmeff –110 VDD = 6.0 V VDD = 12 V 140 B = 0 mT B = 65 mT 120 –120 100 80 –130 60 40 –140 83 nT ǸHz 20 0 –50 –25 0 25 50 75 100 125 150 °C f TA Fig. 3–24: Typical dynamic differential output resistance versus temperature dB 20 sB –150 0.1 10.0 1000000.0 0.1 1.0 1 10 100.0 100 1000.0 1k 10000.0 10k 100000.0 100k 1M Hz Fig. 3–26: Typical magnetic noise spectrum TA = 25 °C 0 dB = 42.5 mV/mT 10 0 –10 –20 –30 –40 10 10 100 100 1000 1k 10000 10 k 100000 100 k fB Fig. 3–25: Typical magnetic frequency response Micronas 17 HAL401 DATA SHEET 4. Application Notes 4.3. Application Circuit Mechanical stress on the device surface (caused by the package of the sensor module or overmolding) can influence the sensor performance. The normal integrating characteristics of a voltmeter is sufficient for signal filtering. The parameter VOUTACpp (see Fig. 2–2) increases with external mechanical stress. This can cause linearity errors at the limits of the recommended operation conditions. VDD 4.7n 1 VDD 47 n 330 p Oscilloscope HAL 401 OUT1 4.1. Ambient Temperature Due to internal power dissipation, the temperature on the silicon chip (junction temperature TJ) is higher than the temperature outside the package (ambient temperature TA). TJ = TA + ΔT At static conditions and continuous operation, the following equation applies: 2 Ch1 3.3 k 6.8 n 3.3 k 1k OUT2 3 1k Ch2 47 n 330 p GND 4 Do not connect OUT1 or OUT2 to Ground. Fig. 4–1: Filtering of output signals ΔT = IDD * VDD * RthJSB For all sensors, the junction temperature range TJ is specified. The maximum ambient temperature TAmax can be calculated as: TAmax = TJmax – ΔT For typical values, use the typical parameters. For worst case calculation, use the max. parameters for IDD and Rth, and the max. value for VDD from the application. Display the difference between channel 1 and channel 2 to show the Hall voltage. Capacitors 4.7 nF and 330 pF for electromagnetic immunity are recommended. VDD 1 VDD Voltage Meter HAL 401 OUT1 2 High 4.2. EMC and ESD Please contact Micronas for detailed information on EMC and ESD results. OUT2 3 Low GND 4 Do not connect OUT1 or OUT2 to Ground. Fig. 4–2: Flux density measurement with voltmeter 18 Micronas HAL401 DATA SHEET VCC VDD 4.7n 1 VDD 1.33 C 330 p R+ΔR 0.75 R HAL 401 OUT1 OUT2 ADC 1.5 R 2 – R 3 0.22 R CMOS OPV + 330 p 4.4 C R–ΔR GND 4 3C Do not connect OUT1 or OUT2 to Ground. Fig. 4–3: Differential HAL 401 output to single-ended output R = 10 kΩ, C = 7.5 nF, ΔR for offset adjustment, BW–3dB = 1.3 kHz VCCy6 V VDD 2.2 n 1 4.7 n 330 p VDD 4.7 k HAL 401 OUT1 2 – 4.7 k OUT2 3 CMOS OPV + 4.7 k 330 p 4.7 k 4.7 n 1n 4.7 k – 4.7 k 3.0 k 8.2 n CMOS OPV + OUT GND 4 Do not connect OUT1 or OUT2 to Ground. VEEx*6 V Fig. 4–4: Differential HAL 401 output to single-ended output (referenced to ground), filter – BW–3dB = 14.7 kHz Micronas 19 HAL401 DATA SHEET 5. Data Sheet History 1. Final Data Sheet: “HAL 401 Linear Hall Effect Sensor IC”, June 26, 2002, 6251-470-1DS. First release of the final data sheet. 2. Final Data Sheet: “HAL 401 Linear Hall Effect Sensor IC”, Sept. 14, 2004, 6251-470-2DS. Second release of the final data sheet. Major changes: – new package diagram for SOT89-1 3. Final Data Sheet: “HAL 401 Linear Hall Effect Sensor IC”, Dec. 8, 2008, DSH000018_002EN Third release of the final data sheet. Major changes: – Section 1.5. “Solderability and Welding” updated – package diagrams updated – Fig. 3–3: “Recommended footprint SOT89B” added Micronas GmbH Hans-Bunte-Strasse 19 · D-79108 Freiburg · P.O. Box 840 · D-79008 Freiburg, Germany Tel. +49-761-517-0 · Fax +49-761-517-2174 · E-mail: [email protected] · Internet: www.micronas.com 20 Micronas