NEC UPG2158T5K-E2

DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG2158T5K
L, S-BAND SPDT SWITCH
DESCRIPTION
The µPG2158T5K is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which was developed
for mobile phone and another L, S-band application.
This device can operate 2 control switching by control voltage 1.8 to 5.3 V. This device can operate frequency from
0.05 to 3.0 GHz, having the low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) package. And this
package is able to high-density surface mounting.
FEATURES
• Switch control voltage
•
•
•
•
: Vcont (H) = 1.8 to 5.3 V (2.7 V TYP.)
: Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
Low insertion loss
: LINS1 = 0.40 dB TYP. @ f = 0.05 to 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: LINS2 = 0.45 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: LINS3 = 0.47 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: LINS4 = 0.53 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
High isolation
: ISL1 = 27 dB TYP. @ f = 0.05 to 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: ISL2 = 19 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: ISL3 = 17 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: ISL4 = 17 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
Handling power
: Pin (0.1 dB) = +29.0 dBm TYP. @ f = 2.0/2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
: Pin (1 dB) = +30.5 dBm TYP. @ f = 2.0/2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V
High-density surface mounting : 6-pin plastic TSSON package (1.0 × 1.0 × 0.37 mm)
APPLICATIONS
• L, S-band digital cellular or cordless telephone
TM
• W-LAN, WLL and Bluetooth etc.
ORDERING INFORMATION
Part Number
µPG2158T5K-E2
Order Number
µPG2158T5K-E2-A
Package
6-pin plastic TSSON
(Pb-Free)
Note
Marking
G2
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPG2158T5K
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PG10578EJ02V0DS (2nd edition)
Date Published December 2005 CP(K)
Printed in Japan
The mark  shows major revised points.
 NEC Compound Semiconductor Devices, Ltd. 2005
µPG2158T5K
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
1
G2
2
(Bottom View)
(Top View)
6
1
6
6
1
5
2
5
5
2
4
3
4
3
4
3
Pin No.
Pin Name
1
OUTPUT1
2
GND
3
OUTPUT2
4
Vcont2
5
INPUT
6
Vcont1
TRUTH TABLE
Vcont1
Vcont2
INPUT−OUTPUT1
INPUT−OUTPUT2
Low
High
OFF
ON
High
Low
ON
OFF
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Switch Control Voltage
Symbol
Ratings
Vcont
+6.0
Unit
Note
V
Input Power
Pin
+31
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note Vcont1 − Vcont2 ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
1.8
2.7
5.3
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
+0.2
V
2
Data Sheet PG10578EJ02V0DS
µPG2158T5K
ELECTRICAL CHARACTERISTICS 1
(TA = +25°C, Vcont (H) = 2.7 V, Vcont (L) = 0 V, DC cut capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
Note 1
MIN.
TYP.
MAX.
Unit
−
0.40
0.45
dB
Insertion Loss 1
LINS1
f = 0.05 to 1.0 GHz
Insertion Loss 2
LINS2
f = 1.0 to 2.0 GHz
−
0.45
0.50
Insertion Loss 3
LINS3
f = 2.0 to 2.5 GHz
−
0.47
0.55
Insertion Loss 4
LINS4
f = 2.5 to 3.0 GHz
−
0.53
0.60
Isolation 1
ISL1
f = 0.05 to 1.0 GHz
23
27
−
Isolation 2
ISL2
f = 1.0 to 2.0 GHz
16
19
−
Isolation 3
ISL3
f = 2.0 to 2.5 GHz
14
17
−
Isolation 4
ISL4
f = 2.5 to 3.0 GHz
Note 1
14
17
−
15
20
−
dB
15
20
−
dB
+26.0
+29.0
−
dBm
f = 0.5 to 3.0 GHz
−
+29.0
−
f = 0.5 to 3.0 GHz
−
+30.5
−
dBm
Input Return Loss
RLin
f = 0.05 to 3.0 GHz
Note 1
Output Return Loss
RLout
f = 0.05 to 3.0 GHz
Note 1
0.1 dB Loss Compression
Input Power
f = 2.0/2.5 GHz
Note 2
1 dB Loss Compression
Input Power
Pin (0.1 dB)
dB
Pin (1 dB)
Note 3
2nd Harmonics
2f0
f = 2.0/2.5 GHz, Pin = +20 dBm
65
75
−
dBc
3rd Harmonics
3f0
f = 2.0/2.5 GHz, Pin = +20 dBm
65
75
−
dBc
Input 3rd Order Distortion
IIP3
f = 0.5 to 3.0 GHz
−
+60
−
dBm
Intercept Point
2 tone 5 MHz spacing
Switch Control Current
Icont
No signal
−
0.2
20
µA
Switch Control Speed
tSW
50% CTL to 90/10% RF
−
50
500
ns
Notes 1. DC cut capacitors = 1 000 pF at f = 0.05 to 0.5 GHz
2. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of
linear range.
3. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC cut capacitors.
The value of DC cut capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system. The range of
recommended DC cut capacitor value is less than 100 pF.
Data Sheet PG10578EJ02V0DS
3
µPG2158T5K
ELECTRICAL CHARACTERISTICS 2
(TA = +25°C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, DC cut capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
Note 1
MIN.
TYP.
MAX.
Unit
−
0.40
0.47
dB
Insertion Loss 1
LINS1
f = 0.05 to 1.0 GHz
Insertion Loss 2
LINS2
f = 1.0 to 2.0 GHz
−
0.46
0.52
Insertion Loss 3
LINS3
f = 2.0 to 2.5 GHz
−
0.48
0.57
Insertion Loss 4
LINS4
f = 2.5 to 3.0 GHz
−
0.54
0.62
Isolation 1
ISL1
f = 0.05 to 1.0 GHz
23
27
−
Isolation 2
ISL2
f = 1.0 to 2.0 GHz
16
19
−
Isolation 3
ISL3
f = 2.0 to 2.5 GHz
14
17
−
Isolation 4
ISL4
f = 2.5 to 3.0 GHz
Note 1
14
17
−
15
20
−
dB
15
20
−
dB
+19.0
+22.0
−
dBm
f = 0.5 to 3.0 GHz
−
+22.0
−
f = 0.5 to 3.0 GHz
−
+25.0
−
dBm
Input Return Loss
RLin
f = 0.05 to 3.0 GHz
Note 1
Output Return Loss
RLout
f = 0.05 to 3.0 GHz
Note 1
0.1 dB Loss Compression
Input Power
f = 2.0/2.5 GHz
Note 2
1 dB Loss Compression
Input Power
Pin (0.1 dB)
dB
Pin (1 dB)
Note 3
Switch Control Current
Icont
No signal
−
0.2
20
µA
Switch Control Speed
tSW
50% CTL to 90/10% RF
−
50
500
ns
Notes 1. DC cut capacitors = 1 000 pF at f = 0.05 to 0.5 GHz
2. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of
linear range.
3. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC cut capacitors.
The value of DC cut capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system. The range of
recommended DC cut capacitor value is less than 100 pF.
4
Data Sheet PG10578EJ02V0DS
µPG2158T5K
EVALUATION CIRCUIT
Vcont1
INPUT
Vcont2
1 000 pF
1 000 pF
C0
6
5
4
1
2
3
C0
OUTPUT1
Remark
GND
C0
OUTPUT2
C0 : 0.05 to 0.5 GHz 1 000 pF
: 0.5 to 3.0 GHz 56 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PG10578EJ02V0DS
5
µPG2158T5K
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Vcont2
INPUT
G2
C
3
C
5
OUTPUT2
C1
C
2
C
4
OUTPUT1
Vcont1
USING THE NEC EVALUATION BOARD
Symbol
C1, C2, C3
C4, C5
6
Values
56 pF
1 000 pF
Data Sheet PG10578EJ02V0DS
µPG2158T5K
TYPICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.7 V, Vcont (L) = 0 V, DC cut capacitors = 56 pF,
using test fixture, unless otherwise specified)
INPUT-OUTPUT1
INSERTION LOSS vs. FREQUENCY
2:
1.5
3:
1.0
4:
0.5
5:
0
1
–0.5
2
3
–1.0
4
5
2.5
1:
–0.380 dB
2.0
2:
–0.413 dB
1.5
3:
–0.446 dB
1.0
4:
–0.468 dB
0.5
5:
–0.511 dB
0
–2.0
2.3
2.9
3.5
2.5 GHz
3.0 GHz
1
2
3
4
5
1.1
1.7
2.3
2.9
3.5
Frequency f (GHz)
Frequency f (GHz)
INPUT-OUTPUT1
ISOLATION vs. FREQUENCY
INPUT-OUTPUT2
ISOLATION vs. FREQUENCY
2:
3:
20
4:
10
5:
0
–27.327 dB
1.0 GHz
–23.924 dB
1.5 GHz
–21.519 dB
2.0 GHz
–19.691 dB
2.5 GHz
–18.176 dB
3.0 GHz
–10
1
–30
5
4
3
2
Isolation ISL (dB)
1:
30
–20
2.0 GHz
–1.5
–2.5
0.5
1.7
1.5 GHz
–1.0
–2.0
1.1
1.0 GHz
–0.5
–2.5
0.5
40
Isolation ISL (dB)
1.0 GHz
–0.411 dB
1.5 GHz
–0.442 dB
2.0 GHz
–0.468 dB
2.5 GHz
–0.513 dB
3.0 GHz
–1.5
50
50
1:
–27.239 dB
40
2:
–23.849 dB
30
3:
–21.47 dB
20
4:
–19.834 dB
10
5:
–18.109 dB
–20
–40
2.3
2.9
2.0 GHz
2.5 GHz
3.0 GHz
1
–30
–50
0.5
1.7
1.5 GHz
–10
–40
1.1
1.0 GHz
0
–50
0.5
3.5
1.1
2.9
2.3
1.7
5
4
3
2
3.5
Frequency f (GHz)
Frequency f (GHz)
INPUT-OUTPUT1
INPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT2
INPUT RETURN LOSS vs. FREQUENCY
50
Input Return Loss RLin (dB)
–0.380 dB
Insertion Loss LINS (dB)
1:
2.0
1:
40
2:
30
3:
20
4:
10
5:
0
–24.828 dB
50
1:
–25.098 dB
1.0 GHz
–27.749 dB
1.5 GHz
–29.57 dB
2.0 GHz
–29.588 dB
2.5 GHz
–27.86 dB
3.0 GHz
40
2:
–27.928 dB
30
3:
–28.894 dB
20
4:
–28.293 dB
10
5:
–26.879 dB
–10
–20
1
–30
2
–40
–50
0.5
1.1
3
1.7
4
2.3
5
2.9
Input Return Loss RLin (dB)
Insertion Loss LINS (dB)
2.5
INPUT-OUTPUT2
INSERTION LOSS vs. FREQUENCY
1.0 GHz
1.5 GHz
2.0 GHz
2.5 GHz
3.0 GHz
0
–10
–20
1
–30
2
3
–40
3.5
–50
0.5
1.1
1.7
4
2.3
5
2.9
3.5
Frequency f (GHz)
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PG10578EJ02V0DS
7
µPG2158T5K
INPUT-OUTPUT2
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT1
OUTPUT RETURN LOSS vs. FREQUENCY
1:
40
2:
30
3:
20
4:
10
5:
0
–24.907 dB
50
1:
–25.825 dB
1.0 GHz
–27.235 dB
1.5 GHz
–27.784 dB
2.0 GHz
–26.52 dB
2.5 GHz
–24.38 dB
3.0 GHz
40
2:
–28.812 dB
30
3:
–28.916 dB
20
4:
–26.585 dB
10
5:
–23.762 dB
–10
1
–20
–30
2
–40
–50
0.5
1.1
4
3
1.7
5
2.9
2.3
3.5
Output Return Loss RLout (dB)
Output Return Loss RLout (dB)
50
–20
Output Power Pout (dBm)
+25
+20
+15
+10
+28
+32
+36
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
8
1
2
1.1
4
3
1.7
2.3
Frequency f (GHz)
f = 2.0 GHz
+24
3.0 GHz
–40
–50
0.5
+30
+20
2.5 GHz
–30
+35
+16
2.0 GHz
–10
OUTPUT POWER vs. INPUT POWER
+12
1.5 GHz
0
Frequency f (GHz)
+5
+8
1.0 GHz
Data Sheet PG10578EJ02V0DS
5
2.9
3.5
µPG2158T5K
PACKAGE DIMENSIONS
6-PIN PLASTIC TSSON (UNIT: mm)
(Top View)
1.0±0.1
1.0±0.1
(Bottom View)
0.15+0.07
–0.05
0.45 ±0.1
0.35±0.06
0.35±0.06
1.0±0.1
0.15+0.07
–0.05
1.0±0.1
0.13±0.07
0.175±0.075
0.37+0.03
–0.05
0.23±0.07
Data Sheet PG10578EJ02V0DS
9
µPG2158T5K
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Caution Do not use different soldering methods together (except for partial heating).
10
Data Sheet PG10578EJ02V0DS
HS350
µPG2158T5K
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority
having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license.
• The information in this document is current as of December, 2005. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4 - 0110
Data Sheet PG10578EJ02V0DS
11
µPG2158T5K
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: [email protected] (sales and general)
[email protected] (technical)
Sales Division TEL: +81-44-435-1573 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: [email protected] (sales, technical and general)
FAX: +852-3107-7309
TEL: +852-3107-7303
Hong Kong Head Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Taipei Branch Office
FAX: +82-2-558-5209
TEL: +82-2-558-2120
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
0504