NEC UPG2408TK-E2

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2408TK
0.05 to 3.0 GHz SPDT SWITCH
DESCRIPTION
The μPG2408TK is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch for 2.4 GHz wireless
LAN, mobile phone and other L, S-band applications.
This device operates with dual control switching voltages of 2.5 to 5.3 V. This device can operate at frequencies
from 0.05 to 3.0 GHz, with low insertion loss and high isolation.
This device is housed in a 6-pin lead-less minimold package (1511 PKG) and is suitable for high-density surface
mounting.
FEATURES
• Switch control voltage
: Vcont (H) = 3.0 V TYP.
: Vcont (L) = 0 V TYP.
• Low insertion loss
: Lins = 0.40 dB TYP. @ f = 1.0 GHz
: Lins = 0.50 dB TYP. @ f = 2.5 GHz
• High isolation
: ISL = 27 dB TYP. @ f = 1.0 GHz
: ISL = 18 dB TYP. @ f = 2.5 GHz
• Handling power
: Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz
• High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm)
APPLICATIONS
• L, S-band digital cellular or cordless telephone
• W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number
μPG2408TK-E2
Order Number
μPG2408TK-E2-A
Package
6-pin lead-less minimold
(1511 PKG) (Pb-Free)
Marking
G5X
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 5 kpcs/reel
Remark To order evaluation samples, please contact your nearby sales office.
Part number for sample order: μPG2408TK
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may
easily produce potentials of several kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD precautions must be employed at all times.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10771EJ01V0DS (1st edition)
Date Published July 2009 NS
Printed in Japan
2009
μPG2408TK
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
G5X
1
2
3
(Top View)
(Bottom View)
6
RF1
1
Vcont1
6
6
1
5
GND
2
RFC
5
5
2
4
RF2
3
Vcont2
4
4
Pin No.
Pin Name
1
RF1
2
GND
3
RF2
4
Vcont2
5
RFC
6
Vcont1
3
SW TRUTH TABLE
ON Path
Vcont1
Vcont2
RFC-RF1
Low
High
RFC-RF2
High
Low
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Symbol
Switch Control Voltage
Ratings
Vcont
+6.0
Unit
Note
V
Input Power
Pin
+33.0
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
f
0.05
−
3.0
GHz
Switch Control Voltage (H)
Vcont (H)
2.5
3.0
5.3
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
0.2
V
Control Voltage Difference
ΔVcont (H),
ΔVcont (L)Note
−0.1
0
0.1
V
Operating Frequency
Note ΔVcont (H) = Vcont1 (H) − Vcont2 (H)
ΔVcont (L) = Vcont1 (L) − Vcont2 (L)
2
Data Sheet PG10771EJ01V0DS
μPG2408TK
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
Note 1
MIN.
TYP.
MAX.
Unit
−
0.40
0.55
dB
Insertion Loss 1
Lins1
f = 0.05 to 0.5 GHz
Insertion Loss 2
Lins2
f = 0.5 to 1.0 GHz
−
0.40
0.55
dB
Insertion Loss 3
Lins3
f = 1.0 to 2.0 GHz
−
0.48
0.63
dB
Insertion Loss 4
Lins4
f = 2.0 to 2.5 GHz
−
0.50
0.65
dB
Insertion Loss 5
Lins5
f = 2.5 to 3.0 GHz
−
0.56
0.70
dB
24
27
−
dB
Note 1
Isolation 1
ISL1
f = 0.05 to 0.5 GHz
Isolation 2
ISL2
f = 0.5 to 1.0 GHz
24
27
−
dB
Isolation 3
ISL3
f = 1.0 to 2.0 GHz
16
19
−
dB
Isolation 4
ISL4
f = 2.0 to 2.5 GHz
15
18
−
dB
Isolation 5
ISL5
f = 2.5 to 3.0 GHz
14
17
−
dB
15
20
−
dB
15
20
−
dB
15
20
−
dB
15
20
−
dB
+27.0
+29.0
−
dBm
f = 0.5 to 3.0 GHz
−
+29.0
−
dBm
f = 0.5 to 3.0 GHz, 2 tone,
−
+60
−
dBm
Input Return Loss 1
RLin1
f = 0.05 to 0.5 GHz
Input Return Loss 2
RLin2
f = 0.5 to 3.0 GHz
Output Return Loss 1
RLout1
f = 0.05 to 0.5 GHz
Output Return Loss 2
RLout2
f = 0.5 to 3.0 GHz
0.1 dB Loss Compression
Input Power
Pin (0.1 dB)
Note 2
Input 3rd Order Intercept Point
IIP3
Note 1
Note 1
f = 2.0/2.5 GHz
5 MHz spicing
Switch Control Current
Icont
No RF input
−
0.3
20
μA
Switch Control Speed
tSW
50% CTL to 90/10% RF
−
50
500
ns
Notes 1. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz
2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of
linear range.
Caution It is necessary to use DC blocking capacitors with this device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of
operation, bandwidth, switching speed and the condition with actual board of your system. The
range of recommended DC blocking capacitor value is less than 100 pF for frequencies above 0.5
GHz, and 1 000pF for frequencies above 0.5 GHz.
Data Sheet PG10771EJ01V0DS
3
μPG2408TK
EVALUATION CIRCUIT
C2
C1
1
Vcont1
RF1
6
2
RFC
5
C1 Note
3
Vcont2
RF2
4
C1
C2
Note C1 : 0.05 to 0.5 GHz
: 0.5 to 3.0 GHz
1 000 pF
56 pF
C2 : 1 000 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
APPLICATION INFORMATION
C1
Switch
C1
LESD
C1
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
• The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground
for best performance.
4
Data Sheet PG10771EJ01V0DS
μPG2408TK
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Vcont1
Vc1
RF1
OUT 1
C2
C
1
IN
C1
C
2
C1
G5X
RFC
C1
C2
C
1
C1
C2
OUT 2
RF2
Vc2
6pin L2MM SPDT SW
Vcont2
USING THE NEC EVALUATION BOARD
Symbol
C1
C2
Test Conditions
Values
f = 0.05 to 0.5 GHz
1 000 pF
f = 0.5 to 3.0 GHz
56 pF
1 000 pF
Data Sheet PG10771EJ01V0DS
5
μPG2408TK
TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 56 pF, unless otherwise specified)
RFC-RF1/RF2
ISOLATION vs. FREQUENCY
RFC-RF1/RF2
INSERTION LOSS vs. FREQUENCY
0
–0.1
Vcont (H) = 3.0 V
–5
–0.2
Isolation ISL (dB)
Insertion Loss Lins (dB)
Vcont (H) = 3.0 V
–0.3
–0.4
–10
–15
–20
–25
–30
–0.5
–35
–0.6
0.0
0.5
1.0
1.5
2.0
2.5
–40
0.0
3.0
2.0
2.5
3.0
RFC-RF1/RF2
INPUT RETURN LOSS vs. FREQUENCY
RFC-RF1/RF2
OUTPUT RETURN LOSS vs. FREQUENCY
0
Output Return Loss RLout (dB)
–5
–10
–15
–20
–25
–30
0.0
0.5
1.0
1.5
2.0
2.5
Vcont (H) = 3.0 V
–5
–10
–15
–20
–25
–30
0.0
3.0
0.5
1.0
1.5
2.0
2.5
Frequency f (GHz)
Frequency f (GHz)
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. SWITCH CONTROL VOLTAGE (H)
RFC-RF1/RF2 ISOLATION vs.
SWITCH CONTROL VOLTAGE (H)
6
f = 2.5 GHz
Icont: No RF Input
–0.3
f = 2.5 GHz
5
4
–0.4
Lins
–0.5
3
–0.6
2
Icont
1
–0.7
–0.8
2.0
2.5
3.0
3.5
4.0
4.5
3.0
0
0
5.0
–5
Isolation ISL (dB)
–0.2
Switch Control Current Icont (μA)
Input Return Loss RLin (dB)
1.5
Frequency f (GHz)
Vcont (H) = 3.0 V
Insertion Loss Lins (dB)
1.0
Frequency f (GHz)
0
–10
–15
–20
–25
–30
–35
–40
2.0
2.5
3.0
3.5
4.0
4.5
Switch Control Voltage (H) Vcont (H) (V)
Switch Control Voltage (H) Vcont (H) (V)
Remark The graphs indicate nominal characteristics.
6
0.5
Data Sheet PG10771EJ01V0DS
5.0
μPG2408TK
RFC-RF1/RF2 OUTPUT RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
RFC-RF1/RF2 INPUT RETURN LOSS vs.
SWITCH CONTROL VOLTAGE (H)
0
f = 2.5 GHz
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
–10
–15
–20
–25
–30
–35
–40
–45
0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm)
2.5
3.0
3.5
4.0
4.5
–10
–15
–20
–25
–30
–35
–40
–45
–50
2.0
5.0
2.5
3.0
3.5
4.0
4.5
Switch Control Voltage (H) Vcont (H) (V)
Switch Control Voltage (H) Vcont (H) (V)
RFC-RF1/RF2 Pin (0.1 dB) vs.
SWITCH CONTROL VOLTAGE (H)
RFC-RF1/RF2 INSERTION LOSS,
Icont vs. INPUT POWER
5.0
6
0
36
f = 2.5 GHz
–0.5
34
Insertion Loss Lins (dB)
0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm)
–50
2.0
f = 2.5 GHz
–5
32
30
28
f = 2.5 GHz
Vcont (H) = 3.0 V
Lins
–1.0
4
–1.5
3
–2.0
2
1
–2.5
26
5
Switch Control Current Icont (μA)
0
–5
Icont
24
2.0
2.5
3.0
3.5
4.0
4.5
5.0
–3.0
15
20
25
30
0
35
Input Power Pin (dBm)
Switch Control Voltage (H) Vcont (H) (V)
RFC-RF1/RF2
Pin (0.1 dB) vs. FREQUENCY
38
DC blocking capacitors:
f = 0.5 to 3.0 GHz 56 pF
f < 0.5 GHz
1 000 pF
36
34
32
Vcont (H) = 3.0 V
30
28
26
24
22
20
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
Data Sheet PG10771EJ01V0DS
7
μPG2408TK
MOUNTING PAD LAYOUT DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm)
1.10
0.45
0.26
0.48
0.48
Remark The mounting pad layout in this document is for reference only.
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
bridge and so on, in order to optimize the design.
8
Data Sheet PG10771EJ01V0DS
μPG2408TK
PACKAGE DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm)
(Bottom View)
0.16±0.05
0.48±0.05 0.48±0.05
1.1±0.1
*1
0.2±0.1
a
0.9±0.1
b
1.3±0.05
c
*2
0.11+0.1
–0.05
0.55±0.03
1.5±0.1
(Top View)
*1
*2
*2
Remark Dimension is bigger than dimension (dimension = a + b + c).
Data Sheet PG10771EJ01V0DS
9
μPG2408TK
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Caution Do not use different soldering methods together (except for partial heating).
10
Data Sheet PG10771EJ01V0DS
HS350
μPG2408TK
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
• The information in this document is current as of July, 2009. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets,
etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or
types are available in every country. Please check with an NEC Electronics sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E0904E
Data Sheet PG10771EJ01V0DS
11
μPG2408TK
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.