TSS721A www.ti.com SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 METER-BUS TRANSCEIVER Check for Samples: TSS721A FEATURES 1 • • • • • • • • • • Meter-Bus Transceiver (for Slave) Meets Standard EN1434-3 Receiver Logic With Dynamic Level Recognition Adjustable Constant-Current Sink via Resistor Polarity Independent Power-Fail Function Module Supply Voltage Switch 3.3-V Constant Voltage Source Remote Powering Up to 9600 Baud in Half Duplex for UART Protocol Slave Power Support – Supply From Meter-Bus via Output VDD – Supply From Meter-Bus via Output VDD or From Backup Battery – Supply From Battery – Meter-Bus Active for Data Transmission Only D PACKAGE (TOP VIEW) BUSL2 1 16 BUSL1 VB 2 15 GND STC 3 14 RIS RIDD 4 13 RXI PF 5 12 RX SC 6 11 VDD TXI 7 10 VS TX 8 9 BAT DESCRIPTION TSS721A is a single chip transceiver developed for Meter-Bus standard (EN1434-3) applications. The TSS721A interface circuit adjusts the different potentials between a slave system and the Meter- Bus master. The connection to the bus is polarity independent and supports full galvanic slave isolation with optocouplers. The circuit is supplied by the master via the bus. Therefore, this circuit offers no additional load for the slave battery. A power-fail function is integrated. The receiver has dynamic level recognition, and the transmitter has a programmable current sink. A 3.3-V voltage regulator, with power reserve for a delayed switch off at bus fault, is integrated. Table 1. ORDERING INFORMATION (1) (2) TA 0°C to 70°C (1) (2) PACKAGE SOIC – D ORDERABLE PART NUMBER Reel of 2500 TSS721ADR For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2010, Texas Instruments Incorporated TSS721A SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 www.ti.com FUNCTIONAL DESCRIPTION CS1 VB IBUS ICI2 PF TC2 RIDD ICS3 BAT VF ISTC STC ISTC_use BUSL1 BR ICI1 BUSL2 CS2 TX TC3 TXI SC VS TC1 IMS VDD IVDD VVDD 3.3 V REF2 1.3 V REF1 7V CS3 ECHO RX TC4 RVS RXI RIS GND Figure 1. Functional Schematic Table 2. Terminal Functions TERMINAL DESCRIPTION NAME NO. BUSL2 1 Meter-Bus VB 2 Differential bus voltage after rectifier STC 3 Support capacitor RIDD 4 Current adjustment input PF 5 Power fail output SC 6 Sampling capacitor TXI 7 Data output inverted TX 8 Data output BAT 9 Logic level adjust VS 10 Switch for bus or battery supply output VDD 11 Voltage regulator output RX 12 Data input RXI 13 Data input inverted RIS 14 Adjust input for modulation current GND 15 Ground BUSL1 16 Meter-Bus 2 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): TSS721A TSS721A www.ti.com SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 Data Transmission, Master to Slave The mark level on the bus lines VBUS = MARK is defined by the difference of BUSL1 and BUSL2 at the slave. It is dependent on the distance of Master to Slave, which affects the voltage drop on the wire. To make the receiver independent, a dynamic reference level on the SC pin is used for the voltage comparator TC3 (see Figure 2). IBUS VB to IC VBUS IBUS VMARK = 20.8 V to 42 V VT BUSL1 BUSL2 TC3 BR ISCcharge VSPACE = VMARK – 10 V TX IBUS = Constant TXI SC VTX ISCdischarge CSC GND VTXI CBUSL1-BUSL2 = 30 pF typ VB = 25 V, fmeas = 1 MHz Figure 2. Data Transmission, Master to Slave A capacitor CSC at pin SC is charged by a current ISCcharge and is discharged with a current ISCdischarge where: ISCcharge ISCdisharge = 40 (typ) (1) This ratio is necessary to run any kind of UART protocol independent of the data contents. (for example, if an 11-bit UART protocol is transmitted with all data bits at 0 and only the stop bit at 1). There must be sufficient time to recharge the capacitor CSC. The input level detector TC3 detects voltage modulations from the master, VBUS = SPACE/MARK conditions, and switches the inverted output TXI and the non-inverted output TX. Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): TSS721A 3 TSS721A SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 www.ti.com Data Transmission, Slave to Master The device uses current modulation to transmit information from the slave to the master while the bus voltage remains constant. The current source CS3 modulates the bus current and the master detects the modulation. The constant current source CS3 is controlled by the inverted input RXI or the non-inverted input RX. The current source CS3 can be programmed by an external resistor RRIS. The modulation supply current IMS flows in addition to the current source CS3 during the modulation time. VRX IBUS VB to IC ICS3 IMS VRXI CS3 BUSL1 BUSL2 BR TC4 RX RXI RIS VBUS IBUS VBUS = Constant RRIS GND IMC ISPACE IMARK IMC = IMS + ICS3 Figure 3. Data Transmission, Slave to Master Because the TSS721A is configured for half-duplex only, the current modulation from RX or RXI is repeated concurrently as ECHO on the outputs TX and TXI. If the slave, as well as the master, is trying to send information via the lines, the added signals appear on the outputs TX and TXI, which indicates the data collision to the slave (see Figure 1). The bus topology requires a constant current consumption by each connected slave. To calculate the value of the programming resistor RRIS, use the formula shown in Figure 4. IMC (mA) RRIS = 20 VRIS VRIS = ICS3 IMC – IMS VRIS = Voltage on pin RIS RRIS = Programming resistor ICS3 = Programmable current IMC = Modulation current IMS = Modulation supply current (220 µA typ) 15 10 Typical 5 0 0.1 0.2 0.5 1 RRIS (kW) Figure 4. Calculate Programming Resistor RRIS 4 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): TSS721A TSS721A www.ti.com SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 Slave Supply, 3.3 V The TSS721A has an internal 3.3-V voltage regulator. The output power of this voltage regulator is supplied by the storage capacitor CSTC at pin STC. The storage capacitor CSTC at pin STC is charged with constant current ISTC_use from the current source CS1. The maximum capacitor voltage is limited to REF1. The charge current ISTC has to be defined by an external resistor at pin RIDD. The adjustment resistor RRIDD can be calculated using Equation 2. V VRIDD RRID = 25 RIDD = 25 ISTC ISTC_use + IIC1 (2) Where, ISTC = current from current source CS1 ISTC_use = charge current for support capacitor ICI = internal current VRIDD = voltage on pin RIDD RRIDD = value of adjustment resistor The voltage level of the storage capacitor CSTC is monitored with comparator TC1. Once the voltage VSTC reaches VVDD_on, the switch SVDD connects the stabilized voltage VVDD to pin VDD. VDD is turned off if the voltage VSTC drops below the VVDD_off level. Voltage variations on the capacitor CSTC create bus current changes (see Figure 5). IBUS (mA) 916 914 912 910 1 2 3 4 5 6 7 8 VSTC (V) Figure 5. Single Mode Bus Load At a bus fault the shut down time of VDD (toff) in which data storage can be performed depends on the system current IVDD and the value of capacitor CSTC. See Figure 6, which shows a correlation between the shutdown of the bus voltage VBUS and VDD_off and toff for dimensioning the capacitor. The output VS is meant for slave systems that are driven by the bus energy, as well as from a battery should the bus line voltage fail. The switching of VS is synchronized with VDD and is controlled by the comparator TC1. An external transistor at the output VS allows switching from the Meter-Bus remote supply to battery. Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): TSS721A 5 TSS721A SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 www.ti.com Power On/Off VBUS VVB =VSTC + 0.6 V typical threshold voltage for power fail PF ton VSTC VDDon VDDoff VVS VVDD toff VPF V – VVDDoff toff = CSTC STC IVDD + ICI1 Figure 6. Power On/Off Timing Power Fail Function Because of the rectifier bridge BR at the input, BUSL1, and BUSL2, the TSS721A is polarity independent. The pin VB to ground (GND) delivers the bus voltage VVB less the voltage drop over the rectifier BR. The voltage comparator TC2 monitors the bus voltage. If the voltage VVB > VSTC + 0.6 V, then the output PF = 1. The output level PF = 0 (power fail) provides a warning of a critical voltage drop to the microcontroller to save the data immediately. 6 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): TSS721A TSS721A www.ti.com SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) VMB Voltage, BUSL1 to BUSL2 ±50 V RX and RXI –0.3 V to 5.5 V VI Input voltage range TJ Operating junction temperature range TA Operating free-air temperature range –25°C to 85°C TSTG Storage temperature range –65°C to 150°C BAT –0.3 V to 5.5 V –25°C to 150°C Power derating factor, junction to ambient 8 mW/°C RECOMMENDED OPERATING CONDITIONS (1) MIN MAX 10.8 42 Transmitter 12 42 VB (receive mode) 9.3 BAT (2) 2.5 3.8 13 80 Receiver VMB Bus voltage, |BUSL2 – BUSL1| VI Input voltage RRIDD RIDD resistor RRIS RIS resistor 100 TA Operating free-air temperature –25 85 TYP MAX (1) (2) UNIT V V kΩ Ω °C All voltage values are measured with respect to the GND terminal unless otherwise noted. VBAT(max) ≤ VSTC – 1 V ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN UNIT ΔVBR Voltage drop at rectifier BR IBUS = 3 mA 1.5 V ΔVCS1 Voltage drop at current source CS1 RRIDD = 13 kΩ 1.8 V IBUS BUS current VSTC = 6.5 V, IMC = 0 mA ΔIBUS BUS current accuracy ΔVBUS = 10 V, IMC = 0 mA, RRIDD = 13 kΩ to 30 kΩ ICC RRIDD = 13 kΩ 3 RRIDD = 30 kΩ 1.5 VSTC = 6.5 V, IMC = 0 mA, VBAT = 3.8 V, RRIDD = 13 kΩ ICI1 CI1 current VSTC = 6.5 V, IMC = 0 mA, VBAT = 3.8 V, RRIDD = 13 kΩ, VBUS = 6.5 V, RX/RXI = off (2) IBAT BAT current IBAT + IVDD BAT plus VDD current VBUS = 0 V, VSTC = 0 V VVDD VDD voltage –IVDD = 1 mA, VSTC = 6.5 V RVDD VDD resistance –IVDD = 2 to 8 mA, VSTC = 4.5 V VSTC STC voltage µA 350 µA –0.5 0.5 µA –0.5 0.5 µA 3.1 3.4 V 5 Ω 5.6 6.4 3.8 4.3 IVDD < ISTC_use 6.5 7.5 RRIDD = 30 kΩ 0.65 1.1 RRIDD = 13 kΩ 1.85 2.4 VSTC = 5 V VRIDD RIDD voltage RRIDD = 30 kΩ VVS VS voltage VDD = on, IVS = –5 µA RVS VS resistance VDD = off VSTC = 6.5 V V mA 1.23 1.33 V VSTC – 0.4 VSTC V 0.3 1 VBAT – 0.6 VBAT VVB = VSTC + 0.3 V, IPF = 1 µA 0 0.6 VVB = VSTC + 0.3 V, IPF = 5 µA 0 0.9 VVB = VSTC + 0.8 V, IPF = –100 µA (1) (2) 650 VDD = off, VS = off STC current PF voltage % VDD = on, VS = on ISTC_use VPF 2 (2) Supply current mA MΩ V All voltage values are measured with respect to the GND terminal, unless otherwise noted. Inputs RX/RXI and outputs TX/TXI are open, ICC = ICI1 + ICI2 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): TSS721A 7 TSS721A SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS(1) (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER ton Turn-on time TEST CONDITIONS MIN TYP CSTC = 50 µF, Bus voltage slew rate: 1 V/µs MAX 3 UNIT s RECEIVER SECTION ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER VT TEST CONDITIONS MIN See Figure 2 VSC SC voltage ISCcharge SC charge current TYP MAX MARK – 8.2 VSC = 24 V, VVB = 36 V V VVB V –15 –40 µA 0.3 –0.033 × ISCcharge µA VBAT – 0.6 VBAT V ISCdischarge SC discharge current VSC = VVB = 24 V VOH High-level output voltage (TX, TXI) ITX/ITXI = –100 µA (see Figure 2) VOL Low-level output voltage (TX, TXI) ITX/ITXI = 100 µA 0 0.5 ITX = 1.1 mA 0 1.5 ITX ITXI TX, TXI current VTX = 7.5, VVB = 12 V, VSTC = 6 V, VBAT = 3.8 V (1) UNIT MARK – 5.7 10 V µA All voltage values are measured with respect to the GND terminal, unless otherwise noted. TRANSMITTER SECTION ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER IMC MC voltage TEST CONDITIONS MAX UNIT mA 11.5 19.5 RRIS = 100 Ω 1.4 1.7 RRIS = 1000 Ω 1.5 1.8 VBAT – 0.8 5.5 V 0 0.8 V RIS voltage VIH High-level input voltage (RX, RXI) See Figure 3, see VIL Low-level input voltage (RX, RXI) See Figure 3 IRX RX current IRXI RXI current 8 TYP RRIS = 100 Ω VRIS (1) (2) MIN (2) VRX = VBAT = 3 V, VVB = VSTC = 0 V -0.5 0.5 VRX = 0 V, VBAT = 3 V, VSTC = 6.5 V -10 -40 VRXI = VBAT = 3 V, VVB = VSTC = 0 V 10 40 VRXI = VBAT = 3 V, VSTC = 6.5 V 10 40 V µA µA All voltage values are measured with respect to the GND terminal, unless otherwise noted. VIH(max) = 5.5 V is valid only when VSTC > = 6.5 V. Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): TSS721A TSS721A www.ti.com SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 APPLICATION INFORMATION Remote Supply 11 9 10 5 12 13 8 7 CST Sensor System (e.g., MSP430) VDD BAT VS PF RX RXI TX TXI RIS BUSL2 RL1 1 220 2 VB TSS721A BUSL1 RL2 16 220 SC GND RIDD 6 14 15 STC 4 3 T1 RRIS RRIDD + CSTC CSC Meter-Bus RRIDD = 30 kW CSTC =< 220 µF single load 1UL RRIDD = 13 kW CSTC =< 470 µF double load 2UL NOTE: Transistor T1 should be a BSS84. Figure 7. Basic Application Circuit Using Support Capacitor CSTC > 50 µF 11 9 10 5 12 13 8 7 + BAT CSSC Sensor System (e.g., MSP430) VDD BAT VS PF RX RXI TX TXI BUSL2 CVDD RL1 220 VB TSS721A BUSL1 2 16 RL2 220 14 RRIS Rload 1 6 15 CSC 4 RRIDD 3 + CSTC Meter-Bus CSSC - system stabilising capacitor CSTC - support capacitor CSC - sampling capacitor CVDD - stabilising capacitor (100 nF) CSTC:CVDD >= 4:1 RRIDD - slave-current adjustment resistor RRIS - modulation-current resistor RL1,RL2 - protection resistors Rload - discharge resistor (100 kW recommended) Figure 8. Basic Application Circuit for Supply From Battery Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): TSS721A 9 TSS721A SLAS222B – APRIL 1999 – REVISED NOVEMBER 2010 www.ti.com Remote Supply 11 9 10 5 12 13 8 7 Sensor System (e.g., MSP430) CSSC RL1 BUSL2 1 VDD BAT VS PF RX RXI TX TXI RIS 220 VB 2 TSS721A RL2 BUSL1 16 220 SC GND RIDD STC 6 14 15 RRIS 4 3 RRIDD CSC + CSTC Remote Supply/Battery Support 11 9 10 5 12 13 8 7 T1 + BAT Sensor System (e.g., MSP430) CSSC SC Sensor System (e.g., MSP430) CSSC 15 4 3 RRIDD + CSTC RL1 BUSL2 1 VDD BAT VS PF RX RXI TX TXI RIS 220 VB 2 TSS721A RL2 BUSL1 16 220 SC 14 GND RIDD STC 6 15 RRIS Rload 220 GND RIDD STC 6 CSC + BAT RL2 BUSL1 16 RRIS 11 9 10 5 12 13 8 7 220 VB 2 TSS721A 14 Battery Supply RL1 BUSL2 1 VDD BAT VS PF RX RXI TX TXI RIS 4 RRIDD CSC CVDD 3 + CSTC Meter-Bus NOTE: RDSon of the transistor T1 (BSS84) at low battery voltage must be considered during application design. Figure 9. Basic Applications for Different Supply Modes R3 RXI OC2 R1 + BAT C SSC Sensor System (e.g., MSP430) TXI R4 11 9 10 5 12 13 8 7 OC1 VDD BAT VS PF RX RXI TX TXI RIS 14 R2 Rload BUSL2 1 220 VB 2 TSS721A BUSL1 16 RL2 220 SC GND RIDD STC 6 R RIS C VDD RL1 15 4 3 RRIDD C SC + C STC Meter-Bus Figure 10. Basic Optocoupler Application 10 Submit Documentation Feedback Copyright © 1999–2010, Texas Instruments Incorporated Product Folder Link(s): TSS721A PACKAGE OPTION ADDENDUM www.ti.com 21-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TSS721AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TSS721ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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