SEMIHOW HTB1-600

HTB1-600
HTB1-600
BI-DIRECTIONAL TRIODE THYRISTOR
(TRIAC)
VDRM
= 600 V
IT(RMS) = 1.0A
FEATURES
3.T2
Symbol
‰ Repetitive Peak Off-State Voltage: 600V
‰ R.M.S On-state Current (IT(RMS)=1A)
‰ High Commutation dv/dt
2.Gate
1.T1
TO-92
1. T1
2. Gate
3. T2
General Description
The TRIAC HTB1-600 is suitable for AC switching application, phase
control application such as heater control, motor control, lighting control,
and static switching relay.
Absolute Maximum Ratings
1
2
3
(Ta=25℃)
Symbol
Parameter
Value
Units
VDRM
Repetitive Peak Off-State Voltage
600
V
IT(RMS)
R.M.S On-State Current (Ta = 95℃)
1
A
ITSM
Surge On-State Current
(One Cycle, 50/60Hz, Peak, Non Repetitive)
9.1/10
A
VGM
Peak Gate Voltage
6
V
IGM
Peak Gate Current
0.5
A
PG(AV)
Average Gate Power Dissipation
0.1
W
PGM
Peak Gate Power Dissipation
1
W
TSTG
Storage Temperature Range
-40 to +125
℃
Tj
Operating Temperature
-40 to +125
℃
◎ SEMIHOW REV.1.0 Jan 2006
Symbol
Parameter
(Ta=25℃)
Test Conditions
Min
Typ
Max
Units
1+, 1-, 3-
5
mA
3+
1+, 1-, 3-
10
1.8
mA
V
3+
2.0
V
IGT
Gate Trigger Current
VD=6V, RL=10Ω
VGT
Gate Trigger Voltage
VD=6V, RL=10Ω
VGD
Non Trigger Gate
Voltage
Tj=125℃, VD=1/2VDRM
0.2
V
Critical Rate of Rise of
Tj=125℃, VD=2/3VDRM
Off-State Voltage at
(di/dt)c=-0.5A/ms
Communication
2.0
V/uS
(dv/dt)c
IH
Holding Current
4.0
VD=VDRM, Single Phase, Half Wave,
IDRM
Repetitive Peak OffState Current
VTM
Peak On-State Voltage IT=6A, Inst, Measurement
Tj=125℃
mA
0.5
mA
1.6
V
Thermal Characteristics
S ymbol
Parameter
Test Conditions
Min
Typ
Max
Units
RTH(j -c)
Thermal Resistance
Junction to Case
50
℃/ W
RTH(j -a)
Thermal Resistance
Junction to Ambient
120
℃/ W
◎ SEMIHOW REV.1.0 Jan 2006
HTB1-600
Electrical Characteristics
HTB1-600
Performance Curves
Fig 1. Gate Characteristics
Fig 2.On-State Voltage
101
On-state Current (A)
Gate Voltage (V)
101
100
100
10-1
10-1
100
101
102
0.5
103
1.0
2.5
3.0
3.5
4.0
4.5
5.0
Fig 4. On State Current
vs. Maximum Power Dissipation
Fig 3. Gate Trigger Voltage
vs. Junction Temperature
1.5
Power Dissipation (W)
10
VGT(t℃)
VGT(25℃)
2.0
On-state Voltage (V)
Gate Current (mA)
V+GT1
V-GT1
V+GT1
V-GT3
1
1.2
0.9
0.6
0.3
0.0
0.1
-50
0
50
100
0.0
150
0.2
0.4
0.6
0.8
1.0
1.2
RMS On-State Current (A)
Junction Temperature (℃)
Fig 6. Surge On-State Current
Rating (Non-Repetitive)
Fig 5. On State Current
vs. Allowable Case Temperature
12
Surge On-State Current (A)
130
Allowable Case Temp (℃)
1.5
120
110
100
90
80
70
60
50
40
10
8
6
4
2
0
0.0
0.2
0.4
0.6
0.8
RMS On-State Current (A)
1.0
1.2
100
101
102
Time (Cycles)
◎ SEMIHOW REV.1.0 Jan 2006
103
Transient Thermal
Impedance (℃/W)
10
IGT(t℃)
IGT(25℃)
HTB1-600
Fig8. Transient Thermal
Impedance
Fig 7. Gate Trigger Current
vs. Junction Temperature
I+GT1
I-GT1
I-GT3
1
I+GT3
102
101
100
0.1
-50
0
50
100
150
10-2
10-1
Junction Temperature (℃)
100
101
102
103
Time (Sec)
Fig 7. Gate Trigger Characteristics Test Circuit
10Ω
10Ω
A
RG
A
6V
RG
6V
V
V
Test Procedure I
Test Procedure II
10Ω
10Ω
A
6V
RG
A
6V
V
Test Procedure III
RG
V
Test Procedure IV
◎ SEMIHOW REV.1.0 Jan 2006