FAIRCHILD FGPF50N33BTTU

FGPF50N33BT
tm
330V, 50A PDP IGBT
Features
General Description
• High current capability
Using Novel Trench IGBT Technology, Fairchild’s new series of
trench IGBTs offer the optimum performance for PDP applications where low conduction and switching losses are essential.
• Low saturation voltage: VCE(sat) =1.6V @ IC = 50A
• High input impedance
• Fast switching
Applications
• PDP System
GC E
TO-220F
Absolute Maximum Ratings
Symbol
Description
VCES
Collector to Emitter Voltage
Ratings
Units
330
V
VGES
Gate to Emitter Voltage
± 30
V
IC
Collector Current
@ TC =
25oC
50
A
ICpulse (1)*
Pulsed Collector Current
@ TC = 25oC
120
A
ICpulse (2)*
Pulsed Collector Current
@ TC = 25oC
160
A
43
W
PD
o
Maximum Power Dissipation
@ TC = 25 C
Maximum Power Dissipation
o
@ TC = 100 C
17.2
Operating Junction Temperature
TJ
Tstg
Storage Temperature Range
TL
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds
W
-55 to +150
o
C
-55 to +150
o
C
300
o
C
Thermal Characteristics
Symbol
RθJC(IGBT)
RθJA
Parameter
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Typ.
Max.
-
2.9
o
C/W
62.5
o
C/W
-
Units
Notes:
1: Repetitive test , Pulse width=100usec , Duty=0.1
2: Half Sine Wave, D < 0.01, pluse width < 10usec
*Ic_pluse limited by max Tj
©2009 Fairchild Semiconductor Corporation
FGPF50N33BT Rev. A
1
www.fairchildsemi.com
FGPF50N33BT 330V, 50A PDP Trench IGBT
April 2009
Device Marking
Device
Package
FGPF50N33BT
FGPF50N33BTTU
TO-220F
Eco Status
Packaging
Type
Qty per Tube
Tube
50ea
RoHS
For Fairchild’s definition of “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Electrical Characteristics of the IGBT
Symbol
Parameter
TC = 25°C unless otherwise noted
Test Conditions
Min.
Typ.
Max.
Units
Off Characteristics
BVCES
Collector to Emitter Breakdown Voltage VGE = 0V, IC = 250µA, Tc=25oC
VGE = 0V, IC = 250µA, Tc=125oC
330
-
-
V
340
-
-
V
-
0.2
-
V/oC
∆BVCES
∆TJ
Temperature Coefficient of Breakdown
Voltage
VGE = 0V, IC = 250µA
ICES
Collector Cut-Off Current
VCE = VCES, VGE = 0V, Tc=25oC
-
-
20
µA
VCE = VCES, VGE = 0V, Tc=125oC
-
-
200
µA
VGE = VGES, VCE = 0V
-
-
±200
nA
IC = 250µA, VCE = VGE
2.3
3.3
4.3
V
IC = 20A, VGE = 15V,
-
1.2
1.5
V
IC = 30A, VGE = 15V,
-
1.3
-
V
IC = 50A, VGE = 15V,
TC = 25oC
-
1.6
-
V
IC = 50A, VGE = 15V,
TC = 125oC
-
1.7
-
V
-
980
-
pF
VCE = 30V, VGE = 0V,
f = 1MHz
-
70
-
pF
-
40
-
pF
-
9
-
ns
IGES
G-E Leakage Current
On Characteristics
VGE(th)
VCE(sat)
G-E Threshold Voltage
Collector to Emitter Saturation Voltage
Dynamic Characteristics
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
td(on)
VCC = 200V, IC = 20A,
RG = 5Ω, VGE = 15V,
Resistive Load, TC = 25oC
-
33
-
ns
-
32
-
ns
Fall Time
-
202
-
ns
Turn-On Delay Time
-
9
-
ns
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Qg
Qge
Gate to Emitter Charge
Qgc
Gate to Collector Charge
VCC = 200V, IC = 20A,
RG = 5Ω, VGE = 15V,
Resistive Load, TC = 125oC
-
37
-
ns
-
33
-
ns
Fall Time
-
332
-
ns
Total Gate Charge
-
35
-
nC
-
6
-
nC
-
14
-
nC
FGPF50N33BT Rev. A
VCE = 200V, IC = 20A,
VGE = 15V
2
www.fairchildsemi.com
FGPF50N33BT 330V, 50A PDP Trench IGBT
Package Marking and Ordering Information
Figure 1. Typical Output Characteristics
160
o
TC = 25 C
20V
Figure 2. Typical Output Characteristics
160
15V
o
TC = 125 C
20V
15V
120
Collector Current, IC [A]
Collector Current, IC [A]
12V
10V
80
VGE = 8V
40
0
0.0
1.5
3.0
4.5
Collector-Emitter Voltage, VCE [V]
12V
120
10V
80
VGE = 8V
40
0
0.0
6.0
Figure 3. Typical Saturation Voltage
Characteristics
160
Common Emitter
VCE = 20V
Common Emitter
VGE = 15V
o
o
TC = 25 C
120
Collector Current, IC [A]
Collector Current, IC [A]
6.0
Figure 4. Transfer Characteristics
160
o
TC = 125 C
80
40
TC = 25 C
120
0
0
1
2
3
4
Collector-Emitter Voltage, VCE [V]
80
40
0
3
6
9
12
Gate-Emitter Voltage,VGE [V]
15
Figure 6. Saturation Voltage vs. VGE
2.0
20
Collector-Emitter Voltage, VCE [V]
Common Emitter
VGE = 15V
1.8
1.6
o
TC = 125 C
0
5
Figure 5. Saturation Voltage vs. Case
Temperature at Variant Current Level
Collector-Emitter Voltage, VCE [V]
1.5
3.0
4.5
Collector-Emitter Voltage, VCE [V]
50A
1.4
30A
1.2
IC = 20A
1.0
Common Emitter
o
TC = 25 C
16
12
8
50A
4
30A
IC = 20A
0.8
25
FGPF50N33BT Rev. A
50
75
100
o
Case Temperature, TC [ C]
0
125
3
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
20
www.fairchildsemi.com
FGPF50N33BT 330V, 50A PDP Trench IGBT
Typical Performance Characteristics
Figure 7. Saturation Voltage vs. VGE
Figure 8. Capacitance Characteristics
20
1500
Common Emitter
Common Emitter
VGE = 0V, f = 1MHz
Cies
16
Capacitance [pF]
Collector-Emitter Voltage, VCE [V]
o
TC = 125 C
12
8
o
TC = 25 C
1000
Coes
500
30A
4
IC = 20A
50A
Cres
0
0
4
8
12
16
Gate-Emitter Voltage, VGE [V]
0
20
1
Figure 9. Gate charge Characteristics
10
Collector-Emitter Voltage, VCE [V]
30
Figure 10. SOA Characteristics
15
500
Common Emitter
10µs
100
12
VCC = 100V
Collector Current, Ic [A]
Gate-Emitter Voltage, VGE [V]
o
TC = 25 C
200V
9
6
3
10
20
30
Gate Charge, Qg [nC]
10
1
DC
Single Nonrepetitive
Pulse TC = 25oC
Curves must be derated
linearly with increase
in temperature
0.1
0.01
0.1
0
0
100µs
40
Figure 11. Turn-on Characteristics vs.
Gate Resistance
400
Figure 12. Turn-off Characteristics vs.
Gate Resistance
4000
100
Common Emitter
VCC = 200V, VGE = 15V
IC = 20A
1000
tr
Switching Time [ns]
Switching Time [ns]
1
10
100
Collector-Emitter Voltage, VCE [V]
10
td(on)
Common Emitter
VCC = 200V, VGE = 15V
IC = 20A
o
TC = 25 C
tf
o
TC = 125 C
100
td(off)
o
TC = 25 C
o
TC = 125 C
10
1
0
FGPF50N33BT Rev. A
10
20
30
40
Gate Resistance, RG [Ω ]
0
50
10
20
30
40
50
Gate Resistance, RG [Ω]
4
www.fairchildsemi.com
FGPF50N33BT 330V, 50A PDP Trench IGBT
Typical Performance Characteristics
Figure 13. Turn-on Characteristics vs.
Collector Current
Figure 14. Turn-off Characteristics vs.
Collector Current
5000
200
Common Emitter
VGE = 15V, RG = 5Ω
Common Emitter
VGE = 15V, RG = 5Ω
o
o
TC = 25 C
tr
o
Switching Time [ns]
TC = 125 C
1000
Switching Time [ns]
100
td(on)
TC = 25 C
o
TC = 125 C
tf
100
td(off)
10
5
10
20
30
40
10
10
50
20
Figure 15. Switching Loss vs. Gate Resistance
20000
10000
Common Emitter
VCC = 200V, VGE = 15V
TC = 25 C
o
TC = 125 C
Switching Loss [mJ]
Switching Loss [mJ]
Common Emitter
VGE = 15V, RG = 5Ω
TC = 25 C
o
Eoff
100
Eon
0
50
o
IC = 20A
10
40
Figure 16. Switching Loss vs. Collector Current
5000
1000
30
Collector Current, IC [A]
Collector Current, IC [A]
10
20
30
40
Gate Resistance, RG [Ω]
1000
Eoff
100
Eon
10
1
10
50
o
TC = 125 C
20
30
40
50
Collector Current, IC [A]
Figure 17. Turn off Switching SOA Characteristics
200
Collector Current, IC [A]
100
10
Safe Operating Area
o
VGE = 15V, TC = 125 C
1
1
10
100
500
Collector-Emitter Voltage, VCE [V]
FGPF50N33BT Rev. A
5
www.fairchildsemi.com
FGPF50N33BT 330V, 50A PDP Trench IGBT
Typical Performance Characteristics
FGPF50N33BT 330V, 50A PDP Trench IGBT
Typical Performance Characteristics
Figure 18.Transient Thermal Impedance of IGBT
Thermal Response [Zthjc]
0.5
1
0.3
0.1
0.1
0.05
0.02
0.01
PDM
0.01
t1
t2
single pulse
1E-3
1E-5
1E-4
Duty Factor, D = t1/t2
Peak Tj = Pdm x Zthjc + TC
1E-3
0.01
0.1
1
10
100
Rectangular Pulse Duration [sec]
FGPF50N33BT Rev. A
6
www.fairchildsemi.com
FGPF50N33BT 330V, 50A PDP Trench IGBT
Mechanical Dimensions
3.30 ±0.10
TO-220F
10.16 ±0.20
2.54 ±0.20
ø3.18 ±0.10
(7.00)
(1.00x45°)
15.87 ±0.20
15.80 ±0.20
6.68 ±0.20
(0.70)
9.75 ±0.30
MAX1.47
0.80 ±0.10
)
0°
(3
#1
+0.10
0.50 –0.05
2.54TYP
[2.54 ±0.20]
2.76 ±0.20
2.54TYP
[2.54 ±0.20]
9.40 ±0.20
4.70 ±0.20
0.35 ±0.10
Dimensions in Millimeters
FGPF50N33BT Rev. A
7
www.fairchildsemi.com
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not
intended to be an exhaustive list of all such trademarks.
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSWITCH™*
™*
®
Fairchild®
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FETBench™
FlashWriter®*
FPS™
F-PFS™
FRFET®
SM
Global Power Resource
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
OPTOPLANAR®
®
PDP SPM™
Power-SPM™
®
PowerTrench
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
™
Saving our world, 1mW/W/kW at a time™
SmartMax™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
Sync-Lock™
®
*
®
The Power Franchise
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
μSerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of
counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are
listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have
full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information.
Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide
any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our
customers to do their part in stopping this practice by buying direct or from authorized distributors.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I40
© 2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com