STF8A80 Bi-Directional Triode Thyristor Symbol ○ 2.T2 Features ▼▲ ◆ Repetitive Peak Off-State Voltage : 800V ◆ R.M.S On-State Current ( IT(RMS)= 8 A ) ○ 1.T1 ◆ High Commutation dv/dt ◆ Isolation Voltage ( VISO = 1500V AC ) 3.Gate ○ TO-220F General Description This device is fully isolated package suitable for AC switching application, phase control application such as fan speed and temperature modulation control, lighting control and static switching relay. This device is approved to comply with applicable requirements by Underwriters Laboratories Inc. Absolute Maximum Ratings Symbol VDRM 1 2 3 ( TJ = 25°C unless otherwise specified ) Parameter Condition Repetitive Peak Off-State Voltage Ratings Units 800 V 8.0 A 80/88 A I2 t 32 A2 s Peak Gate Power Dissipation 5.0 W Average Gate Power Dissipation 0.5 W IGM Peak Gate Current 2.0 A VGM Peak Gate Voltage 10 V VISO Isolation Breakdown Voltage(R.M.S.) 1500 V Operating Junction Temperature - 40 ~ 125 °C Storage Temperature - 40 ~ 150 °C 2.0 g IT(RMS) R.M.S On-State Current TC = 89 °C ITSM Surge On-State Current One Cycle, 50Hz/60Hz, Peak, Non-Repetitive I2 t PGM PG(AV) TJ TSTG A.C. 1 minute Mass Aug, 2008. Rev. A 1/5 copyright@Winsemi Semiconductor Co., Ltd., All rights reserved. STF8A80 Electrical Characteristics Ratings Symbol Conditions Unit Min. Typ. Max. IDRM Repetitive Peak Off-State Current VD = VDRM, Single Phase, Half Wave TJ = 125 °C ─ ─ 2.0 mA VTM Peak On-State Voltage IT = 12 A, Inst. Measurement ─ ─ 1.4 V ─ ─ 30 ─ ─ 30 I+GT1 Ⅰ I -GT1 Ⅱ I -GT3 Ⅲ ─ ─ 30 V+GT1 Ⅰ ─ ─ 1.5 V-GT1 Ⅱ ─ ─ 1.5 V-GT3 Ⅲ ─ ─ 1.5 VGD (dv/dt)c IH Rth(j-c) 2/5 Items Gate Trigger Current Gate Trigger Voltage VD = 6 V, RL=10 Ω VD = 6 V, RL=10 Ω mA V Non-Trigger Gate Voltage TJ = 125 °C, VD = 1/2 VDRM 0.2 ─ ─ V Critical Rate of Rise Off-State Voltage at Commutation TJ = 125 °C, [di/dt]c = -4.0 A/ms, VD=2/3 VDRM 10 ─ ─ V/㎲ ─ 15 ─ mA ─ ─ 3.7 °C/W Holding Current Thermal Impedance Junction to case STF8A80 Fig 1. Gate Characteristics Fig 2. On-State Voltage 10 2 VGM (10V) 10 1 PGM (5W) Gate Voltage [V] o On-State TJ = 125 C Current [A] 1 10 PG(AV) (0.5W) 25 ℃ 10 IGM (2A) 0 o TJ = 25 C 10 0 VGD (0.2V) 10 -1 10 1 10 2 10 0.5 3 1.0 1.5 10 π 2π θ = 90 o θ = 60 o θ = 30 o 360° 6 3.5 Allowable Case Temperature [ oC]120 θ = 150 oθ = 120 o θ 3.0 130 o θ = 180 8 Power θ Dissipation [W] 7 2.5 Fig 4. On State Current vs. Allowable Case Temperature Fig 3. On State Current vs. Maximum Power Dissipation 9 2.0 On-State Voltage [V] Gate Current [mA] θ : Conduction Angle 5 110 o θ = 30 θ π 100 4 θ = 90 oθ = 120 oθ = 150 o o θ 3 360° θ = 180 90 2 o θ = 60 2π θ : Conduction Angle 1 80 0 0 1 2 3 4 5 6 7 RMS On-State Current [A] 8 9 10 0 1 2 3 4 5 6 7 8 9 10 RMS On-State Current [A] Fig 6. Gate Trigger Voltage vs. Junction Temperature Fig 5. Surge On-State Current Rating ( Non-Repetitive ) 10 100 80 Surge On-State Current [A] V 60Hz V VC) GT (25 C) VGT (t o 60 o + GT1 _ V 1 GT1 _ GT3 50Hz 40 20 0.1 0 0 10 10 1 Time (cycles) 10 2 -50 0 50 100 150 o Junction Temperature [ C] 3/5 STF8A80 Fig 7. Gate Trigger Current vs. Junction Temperature Fig 8. Transient Thermal Impedance 10 10 Transient Thermal oImpedance [ C/W] GT (25 C) IGT (t IC) o o I 1 I I + GT1 _ 1 GT1 _ GT3 0.1 0.1 -50 0 50 100 150 -2 10 10 -1 o 10 0 10 Time (sec) Junction Temperature [ C] Fig 9. Gate Trigger Characteristics Test Circuit 10Ω 10Ω ▼▲ 6V ● ● Test Procedure Ⅰ 4/5 ▼▲ A V 10Ω RG 6V ● ▼▲ A V ● Test Procedure Ⅱ RG 6V ● A V ● Test Procedure Ⅲ RG 1 10 2 STF8A80 TO-220F Package Dimension Dim. mm Typ. Min. 10.4 6.18 9.55 13.47 6.05 1.26 3.17 1.87 2.57 A B C D E F G H I J K L M N O Max. 10.6 6.44 9.81 13.73 6.15 1.36 3.43 2.13 2.83 Inch Typ. Min. 0.409 0.243 0.376 0.530 0.238 0.050 0.125 0.074 0.101 2.54 5.08 0.100 0.200 2.51 1.25 0.45 0.6 2.62 1.55 0.63 1.0 0.099 0.049 0.018 0.024 0.103 0.061 0.025 0.039 3.7 3.2 1.5 φ φ1 φ2 0.146 0.126 0.059 A E F Max. 0.417 0.254 0.386 0.540 0.242 0.054 0.135 0.084 0.111 I H B φ φ1 C φ2 L G M 1 2 D 1. T1 2. T2 3. Gate 3 J N O K 5/5