WINSEMI WFF5N60

WFF5N60
Silicon N-Channel MOSFET
Features
■ 4.5A,600V,RDS(on)(Max 2.2Ω)@VGS=10V
■ Ultra-low Gate Charge(Typical 16nC)
■ Fast Switching Capability
■ 100%Avalanche Tested
■ Maximum Junction Temperature Range(150℃)
General Description
This Power MOSFET is produced using Winsemi’s
advanced Planar
stripe, VDMOS technology. This latest technology has been especially
designed to minimize on-state resistance, have a high rugged avalanche
characteristics. This devices is specially well suited for half bridge and full
bridge resonant topology line a electronic lamp ballast.
Absolute Maximum Ratings
Symbol
VDSS
Value
Units
Drain Source Voltage
Parameter
600
V
Continuous Drain Current(@Tc=25℃)
4.5*
A
Continuous Drain Current(@Tc=100℃)
3.1*
A
16*
A
±30
V
ID
IDM
Drain Current Pulsed
(Note1)
VGS
Gate to Source Voltage
EAS
Single Pulsed Avalanche Energy
(Note 2)
240
mJ
EAR
Repetitive Avalanche Energy
(Note 1)
10
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
4.5
V/ns
33
W
0.26
W/℃
-55~150
℃
300
℃
Total Power Dissipation(@Tc=25℃)
PD
Derating Factor above 25℃
TJ, Tstg
TL
Junction and Storage Temperature
Channel Temperature
*Drain current limited by junction temperature
Thermal Characteristics
Symbol
Parameter
RQJC
RQJA
Value
Units
Min
Typ
Max
Thermal Resistance, Junction-to-Case
-
-
3.79
℃/W
Thermal Resistance, Junction-to-Ambient
-
-
62.5
℃/W
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WFF5N60
C)
Electrical Characteristics (Tc = 25
25°C)
Characteristics
Symbol
Min
Type
Max
Unit
IGSS
VGS = ±30 V, VDS = 0 V
-
-
±100
nA
V(BR)GSS
IG = ±10 μA, VDS = 0 V
±30
-
-
V
VDS = 600 V, VDS = 0 V
-
-
10
μA
VDS = 480 V, Tc = 125℃
-
-
100
μA
Gate leakage current
Gate−source breakdown voltage
Test Condition
Drain cut−off current
IDSS
Drain−source breakdown voltage
V(BR)DSS
ID = 250 μA, VGS = 0 V
600
-
-
V
Gate threshold voltage
VGS(th)
VDS = 10 V, ID =250 μA
2
-
4
V
Drain−source ON resistance
RDS(ON)
VGS = 10 V, ID = 2.2A
-
1.8
2.5
Ω
Input capacitance
Ciss
VDS = 25 V,
-
545
670
Reverse transfer capacitance
Crss
VGS = 0 V,
-
70
90
Output capacitance
Coss
f = 1 MHz
-
8
11
VDD =300 V,
-
10
30
ton
ID =4.4 A
-
35
80
tf
RG=25 Ω
-
45
100
-
20
50
-
16
20
-
3.4
-
-
7
-
Rise time
tr
Turn−on time
Switching time
pF
ns
Fall time
Turn−off time
(Note4,5)
toff
Total gate charge (gate−source
VDD = 480 V,
Qg
plus gate−drain)
VGS = 10 V,
Gate−source charge
Qgs
Gate−drain (“miller”) Charge
Qgd
ID = 4.4 A
(Note4,5)
nC
−Drain Ratings and Characteristics (Ta = 25
C)
Source
Source−
25°C)
Characteristics
Symbol
Test Condition
Min
Type
Max
Unit
Continuous drain reverse current
IDR
-
-
-
4.5
A
Pulse drain reverse current
IDRP
-
-
-
17.6
A
Forward voltage (diode)
VDSF
IDR = 4.4 A, VGS = 0 V
-
-
1.4
V
Reverse recovery time
Trr
IDR = 4.4 A, VGS = 0 V,
-
390
-
ns
Reverse recovery charge
Qrr
dIDR / dt = 100 A / μs
-
2.2
-
μC
Note 1.Repeativity rating :pulse width limited by junction temperature
2.L=18.5mH,IAS=4.4A,VDD=50V,RG=0Ω,Starting TJ=25℃
3.ISD≤4.5A,di/dt≤200A/us, VDD<BVDSS,STARTING TJ=25℃
4.Pulse Test: Pulse Width≤300us,Duty Cycle≤2%
5.Essentially independent of operating temperature.
This transistor is an electrostatic sensitive device
Please handle with caution
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WFF5N60
3/7
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WFF5N60
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WFF5N60
Fig.10 Gate Test Circuit & Waveform
Fig.11 Resistive Switching Test Circuit & Waveform
Fig.12 Unclamped Inductive Switching Test Circuit & Waveform
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WFF5N60
Fig.13 Peak Diode Recovery dv/dt Test Circuit & Waveform
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WFF5N60
TO-220F Package Dimension
Unit:mm
7/7
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